CN104513644A - 一种透明灌封胶及其用途 - Google Patents
一种透明灌封胶及其用途 Download PDFInfo
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- CN104513644A CN104513644A CN201410758778.9A CN201410758778A CN104513644A CN 104513644 A CN104513644 A CN 104513644A CN 201410758778 A CN201410758778 A CN 201410758778A CN 104513644 A CN104513644 A CN 104513644A
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- Prior art keywords
- polysiloxane
- vinyl
- ethylene based
- branched ethylene
- agent
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- 239000000565 sealant Substances 0.000 title claims abstract description 7
- -1 polysiloxane Polymers 0.000 claims abstract description 69
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 69
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000001257 hydrogen Substances 0.000 claims abstract description 42
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 42
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 40
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 35
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 17
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 15
- 239000003112 inhibitor Substances 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 32
- 239000005977 Ethylene Substances 0.000 claims description 32
- 238000005266 casting Methods 0.000 claims description 31
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 31
- 239000003292 glue Substances 0.000 claims description 31
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 26
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 24
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 238000010792 warming Methods 0.000 claims description 10
- 238000010992 reflux Methods 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 5
- 239000000706 filtrate Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000003921 oil Substances 0.000 claims description 5
- 238000005406 washing Methods 0.000 claims description 5
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920002545 silicone oil Polymers 0.000 claims description 4
- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 claims description 3
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 claims description 3
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- RSNQKPMXXVDJFG-UHFFFAOYSA-N tetrasiloxane Chemical compound [SiH3]O[SiH2]O[SiH2]O[SiH3] RSNQKPMXXVDJFG-UHFFFAOYSA-N 0.000 claims description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical class OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 150000002825 nitriles Chemical class 0.000 claims description 2
- 239000012454 non-polar solvent Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- 239000002994 raw material Substances 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010010 raising Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
实施例 | 实施例1 | 实施例2 | 实施例3 |
拉伸强度MPa | 1.2 | 0.9 | 1.3 |
断裂伸长率,% | 360 | 210 | 400 |
撕裂强度MPa | 0.8 | 0.9 | 0.7 |
Claims (10)
Priority Applications (1)
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CN201410758778.9A CN104513644B (zh) | 2014-12-10 | 2014-12-10 | 一种透明灌封胶及其用途 |
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CN201410758778.9A CN104513644B (zh) | 2014-12-10 | 2014-12-10 | 一种透明灌封胶及其用途 |
Publications (2)
Publication Number | Publication Date |
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CN104513644A true CN104513644A (zh) | 2015-04-15 |
CN104513644B CN104513644B (zh) | 2017-05-10 |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105131900A (zh) * | 2015-08-24 | 2015-12-09 | 深圳市盛康泰有机硅材料有限公司 | 加成型透明阻燃灌封胶配方 |
CN105367797A (zh) * | 2015-10-26 | 2016-03-02 | 山东东岳有机硅材料有限公司 | 一种可用作低折led液体封装胶交联剂的甲基含氢硅树脂及其制备方法 |
CN106243737A (zh) * | 2016-08-23 | 2016-12-21 | 中山市鼎立森电子材料有限公司 | 一种高透明硅胶保护套用双组份硅胶 |
CN108003830A (zh) * | 2017-12-23 | 2018-05-08 | 苏州赛源微电子有限公司 | 一种大规模集成电路芯片的高耐候性封装 |
CN108641669A (zh) * | 2018-05-25 | 2018-10-12 | 唐山三友硅业有限责任公司 | 高强度阻燃灌封胶及其制备方法 |
CN109705351A (zh) * | 2018-12-28 | 2019-05-03 | 广州市白云化工实业有限公司 | 枝状聚硅氧烷及其制备方法和加成型液体有机硅平面密封胶及其制备方法 |
CN109735300A (zh) * | 2018-12-29 | 2019-05-10 | 浙江炬泰新材料科技有限公司 | 一种高强度防水密封硅橡胶及其制备方法 |
CN110903657A (zh) * | 2019-12-13 | 2020-03-24 | 成都拓利科技股份有限公司 | 可快速就地发泡成型的组合物及其制备的大尺寸发泡硅橡胶材料 |
CN113403023A (zh) * | 2021-07-16 | 2021-09-17 | 苏州桐力光电股份有限公司 | 一种双组份有机硅类结构胶及其使用方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102634026A (zh) * | 2012-04-01 | 2012-08-15 | 北京康美特科技有限公司 | 一种含三官能团链节的氢基硅树脂及其制备方法 |
CN103627365A (zh) * | 2013-11-26 | 2014-03-12 | 烟台德邦先进硅材料有限公司 | 一种高粘性高强度光学用透明有机硅粘接剂及其制备方法 |
-
2014
- 2014-12-10 CN CN201410758778.9A patent/CN104513644B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102634026A (zh) * | 2012-04-01 | 2012-08-15 | 北京康美特科技有限公司 | 一种含三官能团链节的氢基硅树脂及其制备方法 |
CN103627365A (zh) * | 2013-11-26 | 2014-03-12 | 烟台德邦先进硅材料有限公司 | 一种高粘性高强度光学用透明有机硅粘接剂及其制备方法 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105131900A (zh) * | 2015-08-24 | 2015-12-09 | 深圳市盛康泰有机硅材料有限公司 | 加成型透明阻燃灌封胶配方 |
CN105367797A (zh) * | 2015-10-26 | 2016-03-02 | 山东东岳有机硅材料有限公司 | 一种可用作低折led液体封装胶交联剂的甲基含氢硅树脂及其制备方法 |
CN106243737A (zh) * | 2016-08-23 | 2016-12-21 | 中山市鼎立森电子材料有限公司 | 一种高透明硅胶保护套用双组份硅胶 |
CN108003830A (zh) * | 2017-12-23 | 2018-05-08 | 苏州赛源微电子有限公司 | 一种大规模集成电路芯片的高耐候性封装 |
CN108641669A (zh) * | 2018-05-25 | 2018-10-12 | 唐山三友硅业有限责任公司 | 高强度阻燃灌封胶及其制备方法 |
CN109705351A (zh) * | 2018-12-28 | 2019-05-03 | 广州市白云化工实业有限公司 | 枝状聚硅氧烷及其制备方法和加成型液体有机硅平面密封胶及其制备方法 |
CN109705351B (zh) * | 2018-12-28 | 2022-04-05 | 广州市白云化工实业有限公司 | 枝状聚硅氧烷及其制备方法和加成型液体有机硅平面密封胶及其制备方法 |
CN109735300A (zh) * | 2018-12-29 | 2019-05-10 | 浙江炬泰新材料科技有限公司 | 一种高强度防水密封硅橡胶及其制备方法 |
CN109735300B (zh) * | 2018-12-29 | 2022-03-11 | 浙江炬泰新材料科技有限公司 | 一种高强度防水密封硅橡胶及其制备方法 |
CN110903657A (zh) * | 2019-12-13 | 2020-03-24 | 成都拓利科技股份有限公司 | 可快速就地发泡成型的组合物及其制备的大尺寸发泡硅橡胶材料 |
CN113403023A (zh) * | 2021-07-16 | 2021-09-17 | 苏州桐力光电股份有限公司 | 一种双组份有机硅类结构胶及其使用方法 |
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Address after: Two street 523233 Guangdong province Dongguan City Chudo Zhen Dong Bo Cun Da Xin Wei Lu Daxin Road No. 1 Applicant after: Dongguan million Shun's organosilicon Science and Technology Co., Ltd. Address before: Two street 523233 Guangdong province Dongguan City Chudo Zhen Dong Bo Cun Da Xin Wei Lu Daxin Road No. 1 Applicant before: Dongguan Zhaoshun Organosilicon New Material Technology Co., Ltd . |
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Free format text: CORRECT: APPLICANT; FROM: DONGGUAN ZHAOSHUN ORGANOSILICON NEW MATERIAL TECHNOLOGY CO., LTD . TO: DONGGUAN MEGASUN SILICONE TECHNOLOGY CO., LTD. |
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Denomination of invention: Transparent pouring sealant and use thereof Effective date of registration: 20181025 Granted publication date: 20170510 Pledgee: LED One (Hangzhou) Co.,Ltd. Pledgor: Dongguan million Shun's organosilicon Science and Technology Co., Ltd. Registration number: 2018990000978 |
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Date of cancellation: 20190604 Granted publication date: 20170510 Pledgee: LED One (Hangzhou) Co.,Ltd. Pledgor: Dongguan million Shun's organosilicon Science and Technology Co., Ltd. Registration number: 2018990000978 |
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Address after: Two street 523233 Guangdong province Dongguan City Chudo Zhen Dong Bo Cun Da Xin Wei Lu Daxin Road No. 1 Patentee after: Zhaoshun Technology (Guangdong) Co., Ltd Address before: Two street 523233 Guangdong province Dongguan City Chudo Zhen Dong Bo Cun Da Xin Wei Lu Daxin Road No. 1 Patentee before: Dongguan million Shun's organosilicon Science and Technology Co., Ltd. |
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