CN104485383A - 一种铜锌锡硫薄膜太阳电池器件及其制备方法 - Google Patents
一种铜锌锡硫薄膜太阳电池器件及其制备方法 Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims abstract description 53
- WILFBXOGIULNAF-UHFFFAOYSA-N copper sulfanylidenetin zinc Chemical compound [Sn]=S.[Zn].[Cu] WILFBXOGIULNAF-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 239000010409 thin film Substances 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 229920001721 polyimide Polymers 0.000 claims abstract description 17
- 239000004642 Polyimide Substances 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 229910052717 sulfur Inorganic materials 0.000 claims description 24
- 229910052718 tin Inorganic materials 0.000 claims description 24
- 239000011701 zinc Substances 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 17
- 238000001704 evaporation Methods 0.000 claims description 16
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 12
- 230000008020 evaporation Effects 0.000 claims description 12
- 229910052725 zinc Inorganic materials 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 5
- 229910052950 sphalerite Inorganic materials 0.000 claims description 5
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000010025 steaming Methods 0.000 claims description 4
- 238000000137 annealing Methods 0.000 claims 1
- 238000002207 thermal evaporation Methods 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract description 9
- 238000006243 chemical reaction Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 5
- 230000003287 optical effect Effects 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 44
- 238000001755 magnetron sputter deposition Methods 0.000 description 20
- 239000000243 solution Substances 0.000 description 18
- 238000004062 sedimentation Methods 0.000 description 12
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 12
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 9
- 239000005695 Ammonium acetate Substances 0.000 description 9
- 239000004411 aluminium Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 229940043376 ammonium acetate Drugs 0.000 description 9
- 235000019257 ammonium acetate Nutrition 0.000 description 9
- LHQLJMJLROMYRN-UHFFFAOYSA-L cadmium acetate Chemical compound [Cd+2].CC([O-])=O.CC([O-])=O LHQLJMJLROMYRN-UHFFFAOYSA-L 0.000 description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 9
- 239000011787 zinc oxide Substances 0.000 description 9
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 8
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 8
- 229910052750 molybdenum Inorganic materials 0.000 description 8
- 239000011733 molybdenum Substances 0.000 description 8
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 7
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- 239000011259 mixed solution Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- KYRUBSWVBPYWEF-UHFFFAOYSA-N copper;iron;sulfane;tin Chemical compound S.S.S.S.[Fe].[Cu].[Cu].[Sn] KYRUBSWVBPYWEF-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Abstract
一种基于聚酰亚胺柔性衬底的铜锌锡硫薄膜太阳电池器件。1.聚酰亚胺柔性衬底薄膜太阳电池具有较高的重量比功率;具有柔性、可折叠性和不怕摔碰的优势;成本降低潜能大,适合大规模生产的卷-卷工艺。2.铜锌锡硫各组成元素储量丰富且对环境无污染,制备成本低;禁带宽度在1.45eV左右,非常接近光伏电池的理想带隙1.4eV;是一种直接带隙p型半导体材料,光学吸收系数超过104cm-1,非常适合作为薄膜太阳电池的吸收层材料;电池转换效率高,从理论上将可达到单结电池的最高转换效率。本发明的优点是电池制备方法简单、易于实施,有利于大规模的推广应用,尤其在太空及特殊场合中具有极其重要的应用前景。
Description
技术领域
本发明涉及薄膜太阳电池领域技术,特别是一种基于聚酰亚胺柔性衬底的铜锌锡硫薄膜太阳电池器件及其制备。
背景技术
铜锌锡硫材料(CZTS)属于I 2-III-IV-VI4族四元化合物半导体,主要具有锌黄锡矿、黄锡矿和铜金合金结构。其中,锌黄锡矿结构比起其他结构类型在热力学上有着更好的稳定性。
铜锌锡硫电池的特点:铜锌锡硫各组成元素储量丰富且对环境无污染,制备成本低;铜锌锡硫的禁带宽度在1.45eV左右,非常接近光伏电池的理想带隙1.4eV;铜锌锡硫是一种直接带隙p型半导体材料,光学吸收系数超过104cm-1,非常适合作为薄膜太阳电池的吸收层材料;电池转换效率高,从理论上将可达到单结电池的最高转换效率。2013年Solar Frontier公司与IBM、东京应化工业(TOK)合组的共同研发的CZTS薄膜太阳电池转换效率提高至12.6%(电池尺寸0.42cm2)。
航空航天领域需要太阳电池有较高的质量比功率,即希望单位质量的太阳电池能发出更多的电量。对于地面光伏建筑物的曲面造型和移动式的光伏电站等要求太阳电池具有柔性、可折叠性和不怕摔碰,这就促进了柔性太阳电池的发展。由于相对较强的耐高温能力和较为适合的膨胀系数,聚酰亚胺(PI)在其中脱颖而出。
发明内容:
本发明提供了一种基于聚酰亚胺衬底的铜锌锡硫薄膜太阳电池器件的制备方案。以柔性的聚酰亚胺膜作为衬底,在其表面依次制备背接触层、铜锌锡硫吸收层、硫化镉缓冲层、透明窗口层和铝上电极。
本发明的技术方案
一种基于聚酰亚胺柔性衬底的铜锌锡硫薄膜太阳电池,所用聚酰亚胺膜的厚度为25-30μm;钼背接触层生长于聚酰亚胺膜衬底之上,分为高阻层和低阻层,其中高阻层的厚度为80-120nm,低阻层的厚度为600-700nm,采用直流磁控溅射系统制备;铜锌锡硫吸收层生长于钼薄膜之上,化学分子式为Cu2ZnSnS4,导电类型为p型,厚度为1-2μm,采用DM-700型镀膜机,应用共蒸发制备工艺;硫化镉缓冲层生长于铜锌锡硫吸收层表面,化学分子式为CdS,导电类型为n型,厚度为45-50nm,采用化学水浴法制备工艺;透明窗口层生长于硫化镉缓冲层之上,分为高阻本征氧化锌薄膜和低阻氧化锌铝薄膜,导电类型为n型,其中本征氧化锌薄膜的厚度为50-100nm,氧化锌铝薄膜的厚度为0.4-0.6μm,分别采用射频磁控溅射制备系统和直流磁控溅射制备系统制备;铝上电极薄膜生长于透明窗口层之上,其厚度为0.8-1.5μm,采用共蒸发制备系统制备。
钼背接触层的制备步骤如下:
在直流磁控溅射沉积系统的沉积室中,以纯度为99.99%的Mo为靶材,采用射频磁控溅射制备系统在衬底表面分别沉积一层高阻和低阻的钼薄膜。
所述在衬底表面沉积一层高阻薄膜的工艺参数为:本底真空:3.0×10-4Pa,工作气压为1-2Pa,衬底温度为室温25-50℃,射频功率为500-700W,Ar气流量为30-50sccm,基靶行走速度为4-6mm/s,沉积时间(基靶的往复次数)为2-4次。
所述在衬底表面沉积一层低阻薄膜的工艺参数为:工作气压为0-0.5Pa,衬底温度为室温25-50℃,射频功率为1500-2000W,Ar气流量为15-20sccm,基靶行走速度为4-6mm/s,沉积时间(基靶的往复次数)为4-6次。
铜锌锡硫吸收层薄膜的制备步骤如下:
①本底真空为3.0×10-4Pa,衬底温度为450-500℃,Cu蒸发源温度为1200-1400℃,ZnS蒸发源温度为1100-1200℃,Sn蒸发源温度为1100-1200℃,S蒸发源温度为80-90℃,共蒸发Cu、ZnS、Sn、S四种元素,蒸发时间为10-15min;
②将衬底温度升至550-580℃,在Sn和S的气氛下退火5min;
③将衬底冷却,保持Sn和S蒸发温度不变,蒸发Sn和S两种元素,当衬底温度降至300℃时,关闭Sn和S蒸发源,再将衬底冷却至室温。得到的薄膜为p型直接带隙半导体,锌黄锡矿结构。通过调整衬底、各蒸发源温度及共蒸时间,控制铜锌锡硫薄膜贫铜富锌,其中Cu/(Zn+Sn)=0.8-1.0,Zn/Sn=1.0-1.2,S/(Cu+Zn+Sn)约等于1。
硫化镉缓冲层的制备步骤如下:
1)配置溶液,制备硫脲SC(NH2)2溶液1L,浓度为0.01mol/L;醋酸镉(CH3COO)2Cd和醋酸氨CH3COONH4混合溶液1L,其中醋酸镉溶液浓度为0.001mol/L,醋酸氨溶度为0.003mol/L;氨水NH3·H2O溶度为1.3×10-3mol/L。
2)配置反应溶液1L,取第一步中所配置的各种溶液;其中硫脲溶液25mL,醋酸镉和醋酸氨混合溶液25mL,氨水溶液4滴。搅拌均匀。
3)将样品放入烧杯中,并将烧杯放入水浴锅内。水浴温度设置为78-80℃,制备时间为50-60min。
4)制备完成后,将样品用去离子水冲洗干净。
本征氧化锌薄膜的制备步骤如下:
在直流磁控溅射沉积系统的沉积室中,以纯度为99.99%的i-ZnO为靶材,采用射频磁控溅射制备系统在衬底表面沉积一层本征氧化锌薄膜。
所述在衬底表面沉积一层氧化锌铝薄膜的工艺参数为:本底真空:3.0×10-4Pa,衬底温度为室温25-50℃,射频功率为800-1000W,Ar气流量为10-20sccm,O2气流量为2-6sccm,基靶行走速度为2-6mm/s,沉积时间(基靶的往复次数)为6-10次。
氧化锌铝薄膜的制备步骤如下:
在直流磁控溅射沉积系统的沉积室中,以纯度为99.99%的ZnO:Al为靶材,采用直流磁控溅射工艺在衬底表面沉积一层ZnO:Al薄膜。
所述在衬底表面沉积一层氧化锌铝薄膜的工艺参数为:本底真空:3.0×10-4Pa,衬底温度为25-50℃,直流功率为1000-1200W,Ar气流量为12-18sccm,基靶行走速度为2-6mm/s,沉积时间(基靶的往复次数)为10-15次。
铝上电极的制备步骤如下:
1)本底真空:3.0×10-4Pa,给予加热丝20A电流,持续1-2min;给予加热丝50A电流,持续1-2min;给予加热丝80A电流,持续1-2min;给予加热丝120A电流,持续5-8min。
2)待观察窗玻璃被铝膜完全覆盖之后,停止加热,缓慢降低给予加热丝电流,之后冷却。
附图说明
附图1为基于聚酰亚胺柔性衬底的铜锌锡硫薄膜太阳电池器件结构的示意图。
具体实施方式
为了使本技术领域的人员更好地理解本发明方案,下面结合附图和实施方式对本发明作进一步的详细说明。
实施例1
基于聚酰亚胺柔性衬底的铜锌锡硫薄膜太阳电池的制备,其制备步骤如下:
1)钼背接触层的制备
在直流磁控溅射沉积系统的沉积室中,以纯度为99.99%的Mo为靶材,采用射频磁控溅射制备系统在衬底表面分别沉积一层高阻和低阻的钼薄膜。①本底真空:3.0×10-4Pa,工作气压为1Pa,衬底温度为室温25℃,射频功率为600W,Ar气流量为40sccm,基靶行走速度为4mm/s,沉积时间(基靶的往复次数)为2次。②工作气压为0.1Pa,衬底温度为室温25℃,射频功率为1500W,Ar气流量为15sccm,基靶行走速度为4mm/s,沉积时间(基靶的往复次数)为6次。
2)铜锌锡硫吸收层的制备
①本底真空为3.0×10-4Pa,衬底温度为450℃,Cu蒸发源温度为1200℃,ZnS蒸发源温度为1100℃,Sn蒸发源温度为1100℃,S蒸发源温度为80℃,共蒸发Cu、ZnS、Sn、S四种元素,蒸发时间为10min;
②将衬底温度升至550-580℃,在Sn和S的气氛下退火5min;
③将衬底冷却,保持Sn和S蒸发温度不变,蒸发Sn和S两种元素,当衬底温度降至300℃时,关闭Sn和S蒸发源,再将衬底冷却至室温。得到的薄膜为p型直接带隙半导体,锌黄锡矿结构。通过调整衬底、各蒸发源温度及共蒸时间,控制铜锌锡硫薄膜贫铜富锌,其中Cu/(Zn+Sn)=0.8-1.0,Zn/Sn=1.0-1.2,S/(Cu+Zn+Sn)约等于1。
3)硫化镉缓冲层薄膜的制备
①配置溶液,制备硫脲SC(NH2)2溶液1L,浓度为0.01mol/L;醋酸镉(CH3COO)2Cd和醋酸氨CH3COONH4混合溶液1L,其中醋酸镉溶液浓度为0.001mol/L,醋酸氨溶度为0.003mol/L;氨水NH3·H2O溶度为1.3×10-3mol/L。
②配置反应溶液1L,取第一步中所配置的各种溶液;其中硫脲溶液25mL,醋酸镉和醋酸氨混合溶液25mL,氨水溶液4滴。搅拌均匀。③将样品放入烧杯中,并将烧杯放入水浴锅内。水浴温度设置为78℃,制备时间为60min。④制备完成后,将样品用去离子水冲洗干净。
4)本征氧化锌薄膜的制备
在直流磁控溅射沉积系统的沉积室中,以纯度为99.99%的i-ZnO为靶材,采用射频磁控溅射制备系统在衬底表面沉积一层本征氧化锌薄膜。工艺参数为:本底真空:3.0×10-4Pa,衬底温度为室温35℃,射频功率为800W,Ar气流量为10sccm,O2气流量为3sccm,基靶行走速度为4mm/s,沉积时间(基靶的往复次数)为8次。
5)氧化锌铝薄膜的制备
在直流磁控溅射沉积系统的沉积室中,以纯度为99.99%的ZnO:Al为靶材,采用直流磁控溅射工艺在衬底表面沉积一层ZnO:Al薄膜。工艺参数为:本底真空:3.0×10-4Pa,衬底温度为室温25℃,直流功率为1000W,Ar气流量为15sccm,基靶行走速度为6mm/s,沉积时间(基靶的往复次数)为10次。
6)铝上电极的制备
①本底真空:3.0×10-4Pa,给予加热丝20A电流,持续2min;给予加热丝50A电流,持续2min;给予加热丝80A电流,持续2min;给予加热丝120A电流,持续6min。②待观察窗玻璃被铝膜完全覆盖之后,停止加热,缓慢降低给予加热丝电流,之后冷却。
附图1为基于聚酰亚胺柔性衬底的铜锌锡硫薄膜太阳电池器件结构的示意图
实施例2
基于聚酰亚胺柔性衬底的铜锌锡硫薄膜太阳电池的制备,其制备步骤如下:
1)钼背接触层的制备
在直流磁控溅射沉积系统的沉积室中,以纯度为99.99%的Mo为靶材,采用射频磁控溅射制备系统在衬底表面分别沉积一层高阻和低阻的钼薄膜。①本底真空:3.0×10-4Pa,工作气压为1Pa,衬底温度为室温25℃,射频功率为600W,Ar气流量为40sccm,基靶行走速度为4mm/s,沉积时间(基靶的往复次数)为2次。②工作气压为0.1Pa,衬底温度为室温25℃,射频功率为1500W,Ar气流量为15sccm,基靶行走速度为4mm/s,沉积时间(基靶的往复次数)为6次。
2)铜锌锡硫吸收层的制备
①本底真空为3.0×10-4Pa,衬底温度为500℃,Cu蒸发源温度为1400℃,ZnS蒸发源温度为1200℃,Sn蒸发源温度为1200℃,S蒸发源温度为80-90℃,共蒸发Cu、ZnS、Sn、S四种元素,蒸发时间为15min;
②将衬底温度升至550-580℃,在Sn和S的气氛下退火10min;
③将衬底冷却,保持Sn和S蒸发温度不变,蒸发Sn和S两种元素,当衬底温度降至300℃时,关闭Sn和S蒸发源,再将衬底冷却至室温。得到的薄膜为p型直接带隙半导体,锌黄锡矿结构。通过调整衬底、各蒸发源温度及共蒸时间,控制铜锌锡硫薄膜贫铜富锌,其中Cu/(Zn+Sn)=0.8-1.0,Zn/Sn=1.0-1.2,S/(Cu+Zn+Sn)约等于1。
3)硫化镉缓冲层薄膜的制备
①配置溶液,制备硫脲SC(NH2)2溶液1L,浓度为0.01mol/L;醋酸镉(CH3COO)2Cd和醋酸氨CH3COONH4混合溶液1L,其中醋酸镉溶液浓度为0.001mol/L,醋酸氨溶度为0.003mol/L;氨水NH3·H2O溶度为1.3×10-3mol/L。
②配置反应溶液1L,取第一步中所配置的各种溶液;其中硫脲溶液25mL,醋酸镉和醋酸氨混合溶液25mL,氨水溶液4滴。搅拌均匀。③将样品放入烧杯中,并将烧杯放入水浴锅内。水浴温度设置为78℃,制备时间为60min。④制备完成后,将样品用去离子水冲洗干净。
4)本征氧化锌薄膜的制备
在直流磁控溅射沉积系统的沉积室中,以纯度为99.99%的i-ZnO为靶材,采用射频磁控溅射制备系统在衬底表面沉积一层本征氧化锌薄膜。工艺参数为:本底真空:3.0×10-4Pa,衬底温度为室温35℃,射频功率为800W,Ar气流量为10sccm,O2气流量为3sccm,基靶行走速度为4mm/s,沉积时间(基靶的往复次数)为8次。
5)氧化锌铝薄膜的制备
在直流磁控溅射沉积系统的沉积室中,以纯度为99.99%的ZnO:Al为靶材,采用直流磁控溅射工艺在衬底表面沉积一层ZnO:Al薄膜。工艺参数为:本底真空:3.0×10-4Pa,衬底温度为室温25℃,直流功率为1000W,Ar气流量为15sccm,基靶行走速度为6mm/s,沉积时间(基靶的往复次数)为10次。
6)铝上电极的制备
①本底真空:3.0×10-4Pa,给予加热丝20A电流,持续2min;给予加热丝50A电流,持续2min;给予加热丝80A电流,持续2min;给予加热丝120A电流,持续6min。②待观察窗玻璃被铝膜完全覆盖之后,停止加热,缓慢降低给予加热丝电流,之后冷却。
检测结果与实施例1相同。
综上所述,本发明提供了一种基于聚酰亚胺柔性衬底铜锌锡硫薄膜太阳电池器件的制备方案,以柔性的聚酰亚胺膜作为衬底,在其表面依次制备背接触层、铜锌锡硫吸收层、硫化镉缓冲层、透明窗口层和铝上电极。该制备方法工艺条件方便易行,有利于大规模的推广应用,尤其在太空及特殊场合中具有极其重要的应用前景。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。
Claims (2)
1.一种聚酰亚胺柔性衬底的铜锌锡硒薄膜的制备方法,其特征在于:采用共蒸发薄膜制备系统,应用快速热蒸发后退火的制备工艺。
2.一种如权利要求1所述的铜锌锡硫薄膜的制备方法,其特征在于:采用共蒸发薄膜制备系统,应用高温一步共蒸发的制备工艺,制备步骤如下:
①本底真空为3.0×10-4Pa,衬底温度为450-500℃,Cu蒸发源温度为1200-1400℃,ZnS蒸发源温度为1100-1200℃,Sn蒸发源温度为1100-1200℃,S蒸发源温度为80-90℃,共蒸发Cu、ZnS、Sn、S四种元素,蒸发时间为10-15min
②将衬底温度升至550-580℃,在Sn和S的气氛下退火5min
③将衬底冷却,保持Sn和S蒸发温度不变,蒸发Sn和S两种元素,当衬底温度降至300℃时,关闭Sn和S蒸发源,再将衬底冷却至室温。得到的薄膜为p型直接带隙半导体,锌黄锡矿结构。通过调整衬底、各蒸发源温度及共蒸时间,控制铜锌锡硫薄膜贫铜富锌,其中Cu/(Zn+Sn)=0.8-1.0,Zn/Sn=1.0-1.2,S/(Cu+Zn+Sn)约等于1。
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