CN104465458B - 电子束支持的电气部件生产 - Google Patents
电子束支持的电气部件生产 Download PDFInfo
- Publication number
- CN104465458B CN104465458B CN201410565745.2A CN201410565745A CN104465458B CN 104465458 B CN104465458 B CN 104465458B CN 201410565745 A CN201410565745 A CN 201410565745A CN 104465458 B CN104465458 B CN 104465458B
- Authority
- CN
- China
- Prior art keywords
- electron beam
- electrical component
- contact element
- cutting
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010894 electron beam technology Methods 0.000 title claims abstract description 98
- 238000004519 manufacturing process Methods 0.000 title description 18
- 238000000034 method Methods 0.000 claims abstract description 85
- 239000000463 material Substances 0.000 claims description 49
- 238000005520 cutting process Methods 0.000 claims description 40
- 230000035939 shock Effects 0.000 claims 1
- 238000007796 conventional method Methods 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 238000004080 punching Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0006—Electron-beam welding or cutting specially adapted for particular articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/002—Devices involving relative movement between electronbeam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0033—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/06—Electron-beam welding or cutting within a vacuum chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/08—Removing material, e.g. by cutting, by hole drilling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/31—Electron-beam or ion-beam tubes for localised treatment of objects for cutting or drilling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/31—Processing objects on a macro-scale
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013217068.8A DE102013217068A1 (de) | 2013-08-27 | 2013-08-27 | Elektronenstrahlunterstützte Herstellung von elektrischen Bauelementen |
| DE102013217068.8 | 2013-08-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104465458A CN104465458A (zh) | 2015-03-25 |
| CN104465458B true CN104465458B (zh) | 2020-05-26 |
Family
ID=51421853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410565745.2A Active CN104465458B (zh) | 2013-08-27 | 2014-08-27 | 电子束支持的电气部件生产 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9937584B2 (enExample) |
| EP (1) | EP2843780A1 (enExample) |
| JP (1) | JP2015062178A (enExample) |
| CN (1) | CN104465458B (enExample) |
| DE (1) | DE102013217068A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015210460B4 (de) * | 2015-06-08 | 2021-10-07 | Te Connectivity Germany Gmbh | Verfahren zur Veränderung mechanischer und/oder elektrischer Eigenschaften zumindest eines Bereichs eines elektrischen Kontaktelements |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3629864A1 (de) * | 1985-09-02 | 1987-03-05 | Hitachi Ltd | Vorrichtung und verfahren zum schweissen von draehten geringer dicke |
| CN102326460A (zh) * | 2009-02-20 | 2012-01-18 | 大日本印刷株式会社 | 导电性基板 |
| DE102011006899A1 (de) * | 2011-04-06 | 2012-10-11 | Tyco Electronics Amp Gmbh | Verfahren zur Herstellung von Kontaktelementen durch mechanisches Aufbringen von Materialschicht mit hoher Auflösung sowie Kontaktelement |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE876419C (de) * | 1951-09-09 | 1953-05-11 | Licentia Gmbh | Verfahren zum Herstellen von elektrischen und/oder mechanischen Verbindungen |
| NL257531A (enExample) * | 1960-03-30 | |||
| US3375342A (en) * | 1963-03-04 | 1968-03-26 | Sprague Electric Co | Electron beam milling of electrical coatings |
| US3267250A (en) * | 1963-04-19 | 1966-08-16 | United Aircraft Corp | Adaptive positioning device |
| US3294951A (en) * | 1963-04-30 | 1966-12-27 | United Aircraft Corp | Micro-soldering |
| US3402278A (en) * | 1965-06-14 | 1968-09-17 | United Aircraft Corp | Electron beam cutting of printing plates |
| DE1804646B2 (de) * | 1968-10-18 | 1973-03-22 | Siemens AG, 1000 Berlin u. 8000 München | Korpuskularstrahl-bearbeitungsgeraet |
| US4510371A (en) * | 1982-03-18 | 1985-04-09 | Toshiba Kikai Kabushiki Kaisha | Metallic scales and method of manufacturing the same |
| US4470945A (en) * | 1982-03-25 | 1984-09-11 | United Technologies Corporation | Method and apparatus for applying an electron beam drilling backer to a metal sheet |
| US4670636A (en) * | 1984-09-19 | 1987-06-02 | General Electric Company | Heat assisted parting of amorphous alloys |
| JP2875914B2 (ja) * | 1991-07-18 | 1999-03-31 | 田中貴金属工業株式会社 | コネクター |
| US7105764B2 (en) * | 2005-01-13 | 2006-09-12 | Eaton Corporation | Monolithic stationary conductor and current limiting power switch incorporating same |
| CN200993927Y (zh) * | 2006-11-16 | 2007-12-19 | 中国振华(集团)科技股份有限公司宇光分公司 | 一种真空灭弧室用的新型触头 |
| JP5073761B2 (ja) * | 2007-01-31 | 2012-11-14 | マルチ−ホールディング アクチェンゲゼルシャフト | コンタクト要素及び差し込み接続部におけるコンタクト要素の使用方法 |
| PL2899812T3 (pl) * | 2008-12-03 | 2023-01-30 | Würth Elektronik Ics Gmbh & Co. Kg | Układ połączeń na płytkach drukowanych |
| CN201590510U (zh) * | 2009-12-16 | 2010-09-22 | 艾默生网络能源有限公司 | 接线装置及电子电气设备 |
| CN102714369B (zh) * | 2009-12-23 | 2015-09-16 | 富加宜汽车控股公司 | 功率触头 |
| CN102709856B (zh) * | 2012-05-21 | 2016-01-20 | 中国电力科学研究院 | 一种特高压输电线路用十字形联板 |
| US20140097003A1 (en) * | 2012-10-05 | 2014-04-10 | Tyco Electronics Amp Gmbh | Electrical components and methods and systems of manufacturing electrical components |
-
2013
- 2013-08-27 DE DE102013217068.8A patent/DE102013217068A1/de active Pending
-
2014
- 2014-08-27 EP EP14182361.7A patent/EP2843780A1/en active Pending
- 2014-08-27 US US14/470,190 patent/US9937584B2/en active Active
- 2014-08-27 CN CN201410565745.2A patent/CN104465458B/zh active Active
- 2014-08-27 JP JP2014172117A patent/JP2015062178A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3629864A1 (de) * | 1985-09-02 | 1987-03-05 | Hitachi Ltd | Vorrichtung und verfahren zum schweissen von draehten geringer dicke |
| CN102326460A (zh) * | 2009-02-20 | 2012-01-18 | 大日本印刷株式会社 | 导电性基板 |
| DE102011006899A1 (de) * | 2011-04-06 | 2012-10-11 | Tyco Electronics Amp Gmbh | Verfahren zur Herstellung von Kontaktelementen durch mechanisches Aufbringen von Materialschicht mit hoher Auflösung sowie Kontaktelement |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104465458A (zh) | 2015-03-25 |
| US20150060416A1 (en) | 2015-03-05 |
| DE102013217068A1 (de) | 2015-03-19 |
| EP2843780A1 (en) | 2015-03-04 |
| US9937584B2 (en) | 2018-04-10 |
| JP2015062178A (ja) | 2015-04-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| CB02 | Change of applicant information |
Address after: German Bensheim Applicant after: TYCO ELECTRONICS AMP GMBH Address before: German Bensheim Applicant before: Tyco Electronics AMP GmbH |
|
| COR | Change of bibliographic data | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |