CN104396034B - 发光二极管封装 - Google Patents

发光二极管封装 Download PDF

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Publication number
CN104396034B
CN104396034B CN201380030136.0A CN201380030136A CN104396034B CN 104396034 B CN104396034 B CN 104396034B CN 201380030136 A CN201380030136 A CN 201380030136A CN 104396034 B CN104396034 B CN 104396034B
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CN
China
Prior art keywords
surface portion
lead frame
light emitting
light
light source
Prior art date
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Active
Application number
CN201380030136.0A
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English (en)
Chinese (zh)
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CN104396034A (zh
Inventor
吴南锡
曹永准
崔广奎
文永玟
文善美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
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LG Innotek Co Ltd
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Publication of CN104396034A publication Critical patent/CN104396034A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
CN201380030136.0A 2012-06-08 2013-06-07 发光二极管封装 Active CN104396034B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020120061289A KR101944409B1 (ko) 2012-06-08 2012-06-08 발광 소자 패키지
KR10-2012-0061289 2012-06-08
PCT/KR2013/005005 WO2013183950A1 (ko) 2012-06-08 2013-06-07 발광 소자 패키지

Publications (2)

Publication Number Publication Date
CN104396034A CN104396034A (zh) 2015-03-04
CN104396034B true CN104396034B (zh) 2018-03-06

Family

ID=49712284

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380030136.0A Active CN104396034B (zh) 2012-06-08 2013-06-07 发光二极管封装

Country Status (6)

Country Link
US (1) US9391117B2 (https=)
EP (1) EP2860775B1 (https=)
JP (1) JP6230600B2 (https=)
KR (1) KR101944409B1 (https=)
CN (1) CN104396034B (https=)
WO (1) WO2013183950A1 (https=)

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* Cited by examiner, † Cited by third party
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KR101871374B1 (ko) 2012-04-09 2018-06-27 엘지이노텍 주식회사 발광 램프
JP6275399B2 (ja) * 2012-06-18 2018-02-07 エルジー イノテック カンパニー リミテッド 照明装置
TWI597863B (zh) * 2013-10-22 2017-09-01 晶元光電股份有限公司 發光元件及其製造方法
KR102285432B1 (ko) 2014-11-18 2021-08-04 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
WO2017091051A1 (ko) * 2015-11-27 2017-06-01 엘지이노텍 주식회사 발광소자 패키지 및 조명 장치
JP7126949B2 (ja) * 2016-05-04 2022-08-29 エルジー イノテック カンパニー リミテッド 照明モジュール及びこれを備える照明装置
JP6717079B2 (ja) * 2016-06-29 2020-07-01 日亜化学工業株式会社 発光装置及びその製造方法、並びにパッケージの製造方法
WO2018131097A1 (ja) * 2017-01-11 2018-07-19 オリンパス株式会社 照明装置及び照明装置を含む内視鏡システム
JP6971052B2 (ja) * 2017-04-20 2021-11-24 京セラ株式会社 半導体装置の製造方法および半導体装置
DE102019134904A1 (de) * 2019-12-18 2021-06-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement und verfahren zum betreiben eines optoelektronischen halbleiterbauelements
KR102179692B1 (ko) * 2020-08-03 2020-11-17 장희관 리드갭을 구비한 전장용 사이드뷰 led 패키지
KR20220114910A (ko) * 2021-02-09 2022-08-17 엘지이노텍 주식회사 발광소자 패키지 및 이를 구비한 조명 장치
US12104755B2 (en) * 2021-03-30 2024-10-01 Lumileds Llc Patterned reflective grids for LED arrays and displays

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101469817A (zh) * 2007-12-27 2009-07-01 丰田合成株式会社 发光装置
WO2011136250A1 (ja) * 2010-04-27 2011-11-03 ローム株式会社 Ｌｅｄモジュール

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US4912532A (en) 1988-08-26 1990-03-27 Hewlett-Packard Company Electro-optical device with inverted transparent substrate and method for making same
EP1004145B1 (de) * 1997-07-29 2005-06-01 Osram Opto Semiconductors GmbH Optoelektronisches bauelement
JP2002314100A (ja) * 2001-04-19 2002-10-25 Yazaki Corp 樹脂封止型半導体装置の製造方法
JP2006024794A (ja) * 2004-07-08 2006-01-26 Sanyo Electric Co Ltd フルカラー発光ダイオード装置
JP4922555B2 (ja) * 2004-09-24 2012-04-25 スタンレー電気株式会社 Ｌｅｄ装置
JP5119621B2 (ja) 2006-04-21 2013-01-16 日亜化学工業株式会社 発光装置
JP4922663B2 (ja) * 2006-05-18 2012-04-25 スタンレー電気株式会社 半導体光学装置
KR100801621B1 (ko) * 2007-06-05 2008-02-11 서울반도체 주식회사 Ｌｅｄ 패키지
JP2009152268A (ja) * 2007-12-19 2009-07-09 Sony Corp 発光ダイオード、表示装置及び電子機器
US8507929B2 (en) * 2008-06-16 2013-08-13 Koninklijke Philips Electronics N.V. Semiconductor light emitting device including graded region
JP2010034221A (ja) * 2008-07-28 2010-02-12 Sony Corp 端面発光型半導体レーザおよびその製造方法
KR100993903B1 (ko) * 2008-07-31 2010-11-11 알티전자 주식회사 사이드 뷰 발광 다이오드 패키지
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
JP5678434B2 (ja) * 2010-02-12 2015-03-04 東芝ライテック株式会社 反射型ｌｅｄ照明装置
KR20120019750A (ko) * 2010-08-26 2012-03-07 엘지이노텍 주식회사 발광 소자
US9240395B2 (en) * 2010-11-30 2016-01-19 Cree Huizhou Opto Limited Waterproof surface mount device package and method
KR101871374B1 (ko) * 2012-04-09 2018-06-27 엘지이노텍 주식회사 발광 램프

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Publication number Priority date Publication date Assignee Title
CN101469817A (zh) * 2007-12-27 2009-07-01 丰田合成株式会社 发光装置
WO2011136250A1 (ja) * 2010-04-27 2011-11-03 ローム株式会社 Ｌｅｄモジュール

Also Published As

Publication number Publication date
WO2013183950A1 (ko) 2013-12-12
US9391117B2 (en) 2016-07-12
CN104396034A (zh) 2015-03-04
EP2860775A1 (en) 2015-04-15
KR20130137772A (ko) 2013-12-18
KR101944409B1 (ko) 2019-04-17
EP2860775B1 (en) 2020-04-29
EP2860775A4 (en) 2016-01-20
US20150155330A1 (en) 2015-06-04
JP2015520518A (ja) 2015-07-16
JP6230600B2 (ja) 2017-11-15

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Effective date of registration: 20210818

Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Leyu Semiconductor Co.,Ltd.

Address before: Seoul, South Kerean

Patentee before: LG INNOTEK Co.,Ltd.

TR01 Transfer of patent right
CP03 Change of name, title or address

Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Liyu Semiconductor Co.,Ltd.

Country or region after: China

Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee before: Suzhou Leyu Semiconductor Co.,Ltd.

Country or region before: China

CP03 Change of name, title or address