CN104385115A - Double-side copper disc grinding process for sapphire panel - Google Patents

Double-side copper disc grinding process for sapphire panel Download PDF

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Publication number
CN104385115A
CN104385115A CN201410490084.1A CN201410490084A CN104385115A CN 104385115 A CN104385115 A CN 104385115A CN 201410490084 A CN201410490084 A CN 201410490084A CN 104385115 A CN104385115 A CN 104385115A
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CN
China
Prior art keywords
copper dish
double
sapphire
grinding
rotating speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410490084.1A
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Chinese (zh)
Inventor
周群飞
饶桥兵
傅亮
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Lens Technology Co Ltd
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Lens Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lens Technology Co Ltd filed Critical Lens Technology Co Ltd
Priority to CN201410490084.1A priority Critical patent/CN104385115A/en
Publication of CN104385115A publication Critical patent/CN104385115A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention discloses a double-side copper disc grinding process for a sapphire panel. The double-side copper disc grinding process comprises the following steps that 1, a sapphire product is placed into a pinion gear die cavity of a double-side copper disc grinding machine, gear teeth arranged on a pinion gear are respectively engaged with a gear ring and a sun wheel of the double-side copper disc grinding machine, and in addition, grinding cutting liquid is smeared on the upper and lower surfaces of the sapphire product; 2, an upper copper disc of the double-side copper disc grinding machine is controlled to downwards move to a position so that the upper copper disc and a lower copper disc are respectively in contact with the upper surface and the lower surface of the sapphire product; 3, the upper copper disc is pressurized, meanwhile, the upper and lower copper discs are controlled to rotate in opposite directions, and the simultaneous grinding on the upper surface and the lower surface of the sapphire product is realized. The double-side copper disc grinding process has the advantages that the two surfaces of the sapphire panel are ground in one step, the processing time of the grinding process is shortened, the processing process steps are simplified, the production cost is reduced, the production efficiency is improved, meanwhile, the resin synthesis copper grinding disc is adopted for grinding, the precision is high, the grinding efficiency is high, and the processing qualification rate of a product is improved.

Description

A kind of double-side copper dish grinding technics of sapphire panel
Technical field
The present invention relates to sapphire processing technology, be specifically related to a kind of double-side copper dish grinding technics of sapphire panel.
Background technology
Existing sapphire industry is all the thickness adopting traditional one side grinding technics processing sapphire panel, existing single-sided process process efficiency is low, the difference in thickness on 5, surface is larger, and need sapphire sheet solid wax to be pasted onto above fixing ceramic disk before processing, need after processing by high temperature, sapphire sheet to be pulled up above ceramic disk, therefore, the processing technology of one side grinding is complicated, working (machining) efficiency is low, change in the process of lapping of face in transhipment, existence due to shift error causes the difference in thickness of grinding rear surface, two sides large, the fraction defective produced is high, even easily fall down above ceramic disk in transport process adding man-hour sapphire sheet, sapphire sheet is caused to be scrapped.
Example is ground to the sapphire sheet panel of 4 cun, one side grinding once can only produce 24, and complete grinding step and need two sides to process in 2 times (each 1 time of A, B face), the difference in thickness of usual surperficial 5 is at 0.015-0.020mm, and the 5 dot thickness differences (between 0.003-0.005mm) that separating process requires require very large.In addition, existing grinding technics is mostly the cast iron abrasive disk adopted, and cast iron plate grinding causes the surface roughness of sapphire panel comparatively large, does not often reach optical requirement, and this is also produce a bad key factor during grinding is produced.Along with industrialized development, the continuous progress of society, in order to cost-saving, enhance productivity and improve the TTV (surface smoothness) of product, to sapphire working (machining) efficiency and precision more and more higher, existing one side copper dish grinding technics can not meet sapphire production.
Summary of the invention
Technical problem to be solved by this invention is: the double-side copper dish grinding technics providing a kind of sapphire panel, solves production capacity deficiency, complex process, defect that fraction defective is high that existing sapphire panel attrition process exists.
The present invention adopts following technical scheme: a kind of double-side copper dish grinding technics of sapphire panel, sapphire panel is placed between upper and lower two pieces of abrasive disks and grinds, described abrasive disk adopts shaggy copper dish, coordinate and select DI9002-3um Liquid diamond, rotate backward between two pieces of copper dishes, wherein going up copper dish rotating speed is 15-22r/min, and the tonnage simultaneously going up copper dish remains on 150-220g/cm 2, lower copper dish rotating speed is 34-45r/min.
The double-side copper dish grinding technics of a kind of sapphire panel of the present invention specifically comprises the steps: the first step, is placed on by sapphire product in erratic star wheel an actor's rendering of an operatic tune of double-side copper dish grinder, the gear teeth on erratic star wheel engage with the gear ring of double-side copper dish grinder and sun gear respectively, and smear Liquid diamond in sapphire product upper and lower surface; The upper copper dish of second step, control double-side copper dish grinder is displaced downwardly to the upper and lower surface contacting sapphire product with lower copper dish respectively; 3rd step, 170-200g/cm is forced into upper copper dish 2control upper and lower copper dish to rotate backward realization and grind the upper and lower surface of sapphire product simultaneously simultaneously, described gear ring and sun gear is driven to rotate, the erratic star wheel engaged with gear ring and sun gear respectively and lower copper dish revolve round the sun in the same way, gear ring rotating speed is 8-15r/min, and sun gear rotating speed is 7-15r/min.
Further, in described 3rd step, described upper copper dish rotating speed is 22r/min, lower copper dish rotating speed is 40r/min, and gear ring rotating speed is 13r/min, sun gear rotating speed is 15r/min, the tonnage of upper copper dish remains on 200g/cm 2.
Further, in described 3rd step, continue to pass into Liquid diamond between described upper and lower copper dish and sapphire product, increase lubrication and the cutting force of upper and lower copper dish.
Further, the flow-control of described Liquid diamond is at 7ml/min.
In the present invention, described upper and lower copper dish adopts resins synthesis grinding copper dish.
Further, the finished surface of described upper and lower copper dish is provided with the spiral lines improving grinding efficiency.
In the present invention, erratic star wheel mainly plays the effect of fixed product, because the thickness of product declines gradually in process, so the thickness of the selection of erratic star wheel thickness and sapphire product is closely bound up, generally we require that erratic star wheel thickness compares the thin 0.15mm of sapphire thickness, avoid the change due to card in process like this, occur the situation of upper and lower card mill erratic star wheel.
Compared with prior art, beneficial effect of the present invention is: adopt two faces of once grinding sapphire panel, shorten the process time of grinding technics, simplify processing technology step, also save the subsides wax in traditional handicraft, the technique of paddle and the cost of use ceramic disk, improve production efficiency; Adopt resins synthesis copper abrasive disk to grind, compare traditional cast iron mill, have precision high, the advantage that grinding efficiency is high, the copper panel surface roughness after grinding and flatness all can reach technological requirement, improve Product processing yield.
Below in conjunction with detailed description of the invention, the present invention will be further described.
Detailed description of the invention
The double-side copper dish grinding technics of sapphire panel comprises the steps: in concrete production
The first step, sapphire product is placed in erratic star wheel an actor's rendering of an operatic tune of double-side copper dish grinder, the gear teeth on erratic star wheel engage with the gear ring of double-side copper dish grinder and sun gear respectively, form planet circular system, erratic star wheel rotation and revolution is driven by the rotation of gear ring and sun gear, improve the grinding efficiency on sapphire panel two sides, and smear grinding cutting liquid in sapphire product upper and lower surface, grinding cutting liquid can adopt Liquid diamond;
The upper copper dish of second step, control double-side copper dish grinder is displaced downwardly to the upper and lower surface contacting sapphire product with lower copper dish respectively;
3rd step, to the pressurization of upper copper dish, to remain on the pressure on sapphire panel at 150-220g/cm 2, further preferable range is at 170-200g/cm 2control upper and lower copper dish to rotate backward realization and grind the upper and lower surface of sapphire product simultaneously, drive described gear ring and sun gear to rotate backward, according to the feature of planet circular system, the erratic star wheel that realization is engaged with gear ring and sun gear and lower copper dish revolve round the sun in the same way simultaneously.Concrete, upper copper dish rotating speed is 15-22r/min, lower copper dish rotating speed is 34-45r/min, and gear ring rotating speed is 8-15r/min, sun gear rotating speed is 7-15r/min, and gear ring is different with the rotating speed of sun gear, makes erratic star wheel produce certain revolution.In above-mentioned 3rd step, continuing to pass into flow between upper and lower copper dish and sapphire product is that the Liquid diamond of 7ml/min is in order to increase lubrication and the cutting force of upper and lower copper dish.
In the present invention, upper and lower copper dish adopts resins synthesis grinding copper dish, and its Surface Machining is improved the spiral lines of grinding efficiency.
Embodiment one
Sapphire product erratic star wheel fixture is fixed on card under copper dish, the upper and lower surface of upper and lower copper dish to sapphire product is ground simultaneously, select the DI9002-3um Liquid diamond of Diamond Lnnovations company, during grinding, the flow-control of Liquid diamond is flow between copper dish and sapphire product at 7ml/min, increase lubrication and the cutting force of upper and lower card.On machined parameters is, copper dish rotating speed is set to 17r/min, lower copper dish rotating speed is set to 35r/min, gear ring rotating speed is set to 11r/min, sun gear rotating speed is set to 12r/min, erratic star wheel rotation between gear ring and sun gear of clamping sapphire product, can produce simultaneously and revolve round the sun slowly, both combine and improve grinding efficiency further, and the tonnage of upper copper dish keeps 150-220g/cm to sapphire panel 2state, under this state of the art, the removing efficiency and can reach of sapphire double-side copper dish grinding technics: 0.8um/min, after finally reaching grinding thickness, 5 dot thickness differences of sapphire panel surface can reach between 0.003-0.005mm, and surface roughness Ra value can reach between 6-8nm.
Embodiment two
Sapphire product erratic star wheel fixture is fixed on card under copper dish, the upper and lower surface of upper and lower copper dish to sapphire product is ground simultaneously, select the DI9002-3um Liquid diamond of Diamond Lnnovations company, during grinding, the flow-control of Liquid diamond is flow between copper dish and sapphire product at 7ml/min, increase lubrication and the cutting force of upper and lower card.On machined parameters is, copper dish rotating speed is set to 22r/min, lower copper dish rotating speed is set to 40r/min, gear ring rotating speed is set to 13r/min, sun gear rotating speed is set to 15r/min, erratic star wheel rotation between gear ring and sun gear of clamping sapphire product, can produce simultaneously and revolve round the sun slowly, both combine and improve grinding efficiency further, the tonnage of upper copper dish to sapphire panel stable maintenance at 170-200g/cm 2state, under this state of the art, the removing efficiency and can reach of sapphire double-side copper dish grinding technics: 1um/min, after finally reaching grinding thickness, 5 dot thickness differences of sapphire panel surface can reach between 0.003-0.005mm, and surface roughness Ra value can reach between 5-7nm.
Adopt traditional one side grinding technics, remove efficiency and then only have half of the present invention, for 0.50um/min, adopt traditional cast iron mill, the 5 dot thickness differences on the surface of final sapphire panel can only accomplish 0.015-0.020mm, and contrast the present invention and traditional one side grinding technics, as following table, improve the processing production capacity of more than twice, and improve the yields of product, provide cost savings.
Above-mentioned is the preferred embodiment of the present invention; but those skilled in the art should be understood that; not departing from the spirit and scope of the present invention that appended claims limits, in form and details to the various changes done by the present invention, all belong to protection scope of the present invention.

Claims (8)

1. the double-side copper dish grinding technics of a sapphire panel, it is characterized in that, sapphire panel is placed between upper and lower two pieces of abrasive disks and grinds, described abrasive disk adopts shaggy copper dish, coordinate and select 2-3um Liquid diamond, rotate backward between two pieces of copper dishes, wherein going up copper dish rotating speed is 15-22r/min, and the tonnage simultaneously going up copper dish remains on 150-220g/cm 2, lower copper dish rotating speed is 34-45r/min.
2. the double-side copper dish grinding technics of a kind of sapphire panel according to claim 1, it is characterized in that specifically comprising the steps: the first step, sapphire product being placed in erratic star wheel an actor's rendering of an operatic tune of double-side copper dish grinder, the gear teeth on erratic star wheel engage with the gear ring of double-side copper dish grinder and sun gear respectively, and smear Liquid diamond in sapphire product upper and lower surface; The upper copper dish of second step, control double-side copper dish grinder is displaced downwardly to the upper and lower surface contacting sapphire product with lower copper dish respectively; 3rd step, 170-200g/cm is forced into upper copper dish 2control upper and lower copper dish to rotate backward realization and grind the upper and lower surface of sapphire product simultaneously simultaneously, described gear ring and sun gear is driven to rotate, the erratic star wheel engaged with gear ring and sun gear respectively and lower copper dish revolve round the sun in the same way, gear ring rotating speed is 8-15r/min, and sun gear rotating speed is 7-15r/min.
3. the double-side copper dish grinding technics of a kind of sapphire panel according to claim 2, it is characterized in that: in described 3rd step, described upper copper dish rotating speed is 22r/min, lower copper dish rotating speed is 40r/min, and gear ring rotating speed is 13r/min, sun gear rotating speed is 15r/min, the tonnage of upper copper dish remains on 200g/cm 2.
4. the double-side copper dish grinding technics of a kind of sapphire panel according to claim 3, is characterized in that: in described 3rd step, continues to pass into Liquid diamond between described upper and lower copper dish and sapphire product, increases lubrication and the cutting force of upper and lower copper dish.
5. the double-side copper dish grinding technics of a kind of sapphire panel according to claim 4, is characterized in that: the flow-control of described Liquid diamond is at 7ml/min.
6. the double-side copper dish grinding technics of a kind of sapphire panel according to any one of claim 1-5, is characterized in that: described upper and lower copper dish adopts resins synthesis grinding copper dish.
7. the double-side copper dish grinding technics of a kind of sapphire panel according to claim 6, is characterized in that: the finished surface of described upper and lower copper dish is provided with the spiral lines improving grinding efficiency.
8. the double-side copper dish grinding technics of a kind of sapphire panel according to claim 7, is characterized in that: the thin 0.15mm of sapphire panel described in the Thickness Ratio of described erratic star wheel.
CN201410490084.1A 2014-06-18 2014-09-23 Double-side copper disc grinding process for sapphire panel Pending CN104385115A (en)

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WO2015192814A1 (en) * 2014-06-18 2015-12-23 蓝思科技股份有限公司 Dual copper plate lapping process for sapphire substrate
CN107309784A (en) * 2017-09-03 2017-11-03 湖北天宝光电科技有限公司 A kind of two-sided fine grinding technology of sapphire cover plate
CN113183028A (en) * 2021-04-08 2021-07-30 江西钨业控股集团有限公司 Planet disc clamp, process for machining diamond-shaped blade by using planet disc clamp and diamond-shaped blade

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CN104669106B (en) * 2015-02-10 2017-01-25 盐城工学院 Double-surface grinding and double-surface polishing high-efficiency ultraprecise processing method for large-sized A-directional sapphire mobile phone screen
CN106737128A (en) * 2016-11-23 2017-05-31 东莞市中镓半导体科技有限公司 A kind of single-sided polishing system in Two sides milling and polishing equipment
CN107580417A (en) * 2017-08-30 2018-01-12 奥士康精密电路（惠州）有限公司 Copper-based plate hole prints mechanical lapping minimizing technology
CN107471090A (en) * 2017-09-30 2017-12-15 德清晶生光电科技有限公司 Erratic star wheel with radiator structure
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CN109551304A (en) * 2018-10-30 2019-04-02 广东劲胜智能集团股份有限公司 A kind of ultra-thin ceramic fingerprint slice lapping technique
CN110434681B (en) * 2019-07-24 2021-09-07 中国科学院上海光学精密机械研究所 Double-side high-precision polishing method for large-caliber sapphire window element
CN113231957A (en) * 2021-04-29 2021-08-10 金华博蓝特电子材料有限公司 Wafer grinding process based on double-side grinding equipment and semiconductor wafer
CN114654661B (en) * 2022-03-30 2023-10-24 刘飞扬 Planetary wheel encapsulation process and mold thereof
CN117359435B (en) * 2023-12-05 2024-03-05 福建荣德光电科技有限公司 Numerical control plane precision milling and grinding machine for optical lens processing

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CN107309784A (en) * 2017-09-03 2017-11-03 湖北天宝光电科技有限公司 A kind of two-sided fine grinding technology of sapphire cover plate
CN113183028A (en) * 2021-04-08 2021-07-30 江西钨业控股集团有限公司 Planet disc clamp, process for machining diamond-shaped blade by using planet disc clamp and diamond-shaped blade

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