CN103551957A - Single-sided polishing machine - Google Patents
Single-sided polishing machine Download PDFInfo
- Publication number
- CN103551957A CN103551957A CN201310534409.7A CN201310534409A CN103551957A CN 103551957 A CN103551957 A CN 103551957A CN 201310534409 A CN201310534409 A CN 201310534409A CN 103551957 A CN103551957 A CN 103551957A
- Authority
- CN
- China
- Prior art keywords
- polishing machine
- cylinder
- single side
- grinding platen
- platen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
Abstract
The invention discloses a single-sided polishing machine, which comprises a machine shell, and a polishing disc, a grinding platen, an air cylinder and a rotating motor which are arranged in the machine shell, wherein the grinding platen is arranged above the polishing disc, the air cylinder and the rotating motor are respectively used for controlling the grinding platen to vertically act and rotate, and the interior of the grinding platen is provided with a central air cylinder. The bottom of the grinding platen is enabled to generate a certain amount of deformation by adopting the central air cylinder for pressurizing, so that the consistency of the thicknesses of wafers is improved.
Description
Technical field
The present invention relates to polishing machine, particularly a kind of single side polishing machine.
Background technology
During semiconductor wafer (as silicon chip, GaAs, germanium wafer, sapphire, indium phosphide etc.) polishing, it is the key technology that has influence on wafer polishing precision that the flatness of monolithic polishing machine polishing disk is controlled.Current single side polishing machine, because polishing disk and grinding upper disc different radii linear velocity when the work is different, only depends on single plane to pressurize, and causes inside and outside variable thickness to cause, and affects wafer quality.
Summary of the invention
The invention provides a kind of single side polishing machine, the problem that variable thickness causes when overcoming single side polishing machine polished wafer in prior art.
For solving the problems of the technologies described above, the invention provides a kind of single side polishing machine, comprise: casing, be arranged on and dump, grind platen, cylinder and electric rotating machine in described casing, above dumping described in described grinding platen is arranged on, described cylinder and electric rotating machine are controlled respectively described grinding platen knee-action and rotation, and the inside of described grinding platen is provided with center cylinder.
As preferably, described in dump and be provided with a plurality of rotary cylinders around.
As preferably, described grinding platen also comprises: porcelain dish, top board, take over a business and outer shroud, wherein, described in take over a business to be arranged at the top of described outer shroud affixed with described cylinder, center cylinder is arranged at described outer shroud center and contacts with top board, and described porcelain dish is fixed on outer shroud bottom.
As preferably, described in be provided with the air inlet corresponding with described center cylinder in taking over a business.
As preferably, described grinding platen is provided with two groups.
As preferably, on described casing, be also provided with control panel.
Compared with prior art, the present invention has the following advantages: the present invention adopts the mode of center cylinder pressurization to make the bottom of grinding platen produce a certain amount of deflection, thereby improves the uniformity of wafer thickness.
Accompanying drawing explanation
Fig. 1 is the front view of single side polishing machine in the embodiment of the invention;
Fig. 2 is the structural representation of the grinding platen of single side polishing machine in the embodiment of the invention;
Fig. 3 is the rearview of single side polishing machine in the embodiment of the invention.
In figure: 10-casing, 20-dumps, 30-grinds platen, 301-center cylinder, 302-are taken over a business, 303-top board, 304-porcelain dish, 305-outer shroud, 306-air inlet, 40-cylinder, 50-rotary cylinder, 60-control panel.
The specific embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.It should be noted that, accompanying drawing of the present invention all adopts the form of simplification and all uses non-ratio accurately, only in order to convenient, the object of the aid illustration embodiment of the present invention lucidly.
Please refer to Fig. 1～3, single side polishing machine of the present invention, comprise: casing 10, be arranged on dumping 20, grind platen 30, cylinder 40 and electric rotating machine in described casing 10,20 tops of dumping described in described grinding platen 30 is arranged on, described cylinder 40 and electric rotating machine are controlled respectively described grinding platen 30 knee-actions and rotation, and the inside of described grinding platen 30 is provided with center cylinder 301.Particularly, described electric rotating machine is used for controlling described grinding platen 30 rotations, described cylinder 40 is controlled described grinding platen 30 and is risen or decline, and center cylinder 301 is worked when described grinding platen 30 is pushed down wafer, make to grind platen 30 bottoms and produce deflection, and then make the center of wafer consistent with grinding thickness around.Therefore, the present invention adopts the mode of center cylinder 301 pressurizations to make the bottom of grinding platen 30 produce a certain amount of deflection, thereby improves the uniformity of wafer thickness.
Continue referring to Fig. 1～3, as preferably, described in dump and 20 be provided with a plurality of rotary cylinders 50 around, for 20 rotations of dumping described in controlling, further, described grinding platen 30 is provided with two groups, can carry out while polishing to a plurality of wafers, enhances productivity.
Please emphasis with reference to Fig. 2, described grinding platen 30 also comprises: porcelain dish 304, top board 303, take over a business 302 and outer shroud 305, wherein, describedly take over a business 302 and be arranged at the top of described outer shroud 305 affixed with described cylinder 40, center cylinder 301 is arranged at described outer shroud 305 centers and contacts with top board 303, and described porcelain dish 304 is fixed on outer shroud 305 bottoms.Further, described in, take over a business and in 302, be provided with the air inlet 306 corresponding with described center cylinder 301.As shown in phantom in Figure 2, when grinding platen 30 work, cylinder 40 drives grinding platen 30 to move downwards, center cylinder 301 actions, by 303 pairs of disks of top board 304 action, make disk 304 produce certain deflection (as shown in the dotted line in Fig. 2), guarantee to dump 20 and while grinding platen 30 rotation, the polished amount of center wafer and surrounding, thereby the uniformity of raising wafer thickness.
Please refer to Fig. 3, on described casing 10, be also provided with control panel 60, for regulating the various parameters of described single side polishing machine, and can move by the described single side polishing machine of control panel 60 monitoring.
In sum, single side polishing machine of the present invention, comprise: casing 10, be arranged on dumping 20, grind platen 30, cylinder 40 and electric rotating machine in described casing 10,20 tops of dumping described in described grinding platen 30 is arranged on, described cylinder 40 and electric rotating machine are controlled respectively described grinding platen 30 knee-actions and rotation, and the inside of described grinding platen 30 is provided with center cylinder 301.The present invention adopts the mode of center cylinder 301 pressurizations to make the bottom of grinding platen 30 produce a certain amount of deflection, thereby improves the uniformity of wafer thickness.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention invention.Like this, if within of the present invention these are revised and modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these change and modification.
Claims (6)
1. a single side polishing machine, it is characterized in that, comprise: casing, be arranged on and dump, grind platen, cylinder and electric rotating machine in described casing, above dumping described in described grinding platen is arranged on, described cylinder and electric rotating machine are controlled respectively described grinding platen knee-action and rotation, and the inside of described grinding platen is provided with center cylinder.
2. single side polishing machine as claimed in claim 1, is characterized in that, described in dump and be around provided with a plurality of rotary cylinders.
3. single side polishing machine as claimed in claim 1, it is characterized in that, described grinding platen also comprises: porcelain dish, top board, take over a business and outer shroud, wherein, the described top of taking over a business to be arranged at described outer shroud is also affixed with described cylinder, center cylinder is arranged at described outer shroud center and contacts with top board, and described porcelain dish is fixed on outer shroud bottom.
4. single side polishing machine as claimed in claim 3, is characterized in that, described in be provided with the air inlet corresponding with described center cylinder in taking over a business.
5. single side polishing machine as claimed in claim 1, is characterized in that, described grinding platen is provided with two groups.
6. single side polishing machine as claimed in claim 1, is characterized in that, is also provided with control panel on described casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310534409.7A CN103551957B (en) | 2013-11-01 | 2013-11-01 | Single side polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310534409.7A CN103551957B (en) | 2013-11-01 | 2013-11-01 | Single side polishing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103551957A true CN103551957A (en) | 2014-02-05 |
| CN103551957B CN103551957B (en) | 2016-04-20 |
Family
ID=50006394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310534409.7A Active CN103551957B (en) | 2013-11-01 | 2013-11-01 | Single side polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103551957B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106041721A (en) * | 2016-07-26 | 2016-10-26 | 苏州赫瑞特电子专用设备科技有限公司 | Upper plate and lower plate self-balance mechanism of grinding machine or polishing machine |
| CN114871941A (en) * | 2022-04-25 | 2022-08-09 | 季华实验室 | Polishing head and polishing machine |
| CN116175305A (en) * | 2023-04-26 | 2023-05-30 | 北京特思迪半导体设备有限公司 | Platen structure for processing flat workpiece, apparatus and attitude control method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5400548A (en) * | 1992-07-23 | 1995-03-28 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh | Process for manufacturing semiconductor wafers having deformation ground in a defined way |
| CN1271306A (en) * | 1997-09-26 | 2000-10-25 | Memc电子材料有限公司 | Wafer processing apparatus |
| JP2009107097A (en) * | 2007-10-31 | 2009-05-21 | Disco Abrasive Syst Ltd | Machining apparatus |
| CN201632921U (en) * | 2010-01-28 | 2010-11-17 | 湖南永创机电设备有限公司 | High-accuracy oversized single side polishing machine |
| CN203003663U (en) * | 2012-11-30 | 2013-06-19 | 长沙永凯科技设备有限公司 | Dual-driven single-sided polishing machine |
| CN203003626U (en) * | 2012-12-10 | 2013-06-19 | 长沙永凯科技设备有限公司 | High-precision super large size single face polishing machine |
-
2013
- 2013-11-01 CN CN201310534409.7A patent/CN103551957B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5400548A (en) * | 1992-07-23 | 1995-03-28 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh | Process for manufacturing semiconductor wafers having deformation ground in a defined way |
| CN1271306A (en) * | 1997-09-26 | 2000-10-25 | Memc电子材料有限公司 | Wafer processing apparatus |
| JP2009107097A (en) * | 2007-10-31 | 2009-05-21 | Disco Abrasive Syst Ltd | Machining apparatus |
| CN201632921U (en) * | 2010-01-28 | 2010-11-17 | 湖南永创机电设备有限公司 | High-accuracy oversized single side polishing machine |
| CN203003663U (en) * | 2012-11-30 | 2013-06-19 | 长沙永凯科技设备有限公司 | Dual-driven single-sided polishing machine |
| CN203003626U (en) * | 2012-12-10 | 2013-06-19 | 长沙永凯科技设备有限公司 | High-precision super large size single face polishing machine |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106041721A (en) * | 2016-07-26 | 2016-10-26 | 苏州赫瑞特电子专用设备科技有限公司 | Upper plate and lower plate self-balance mechanism of grinding machine or polishing machine |
| CN106041721B (en) * | 2016-07-26 | 2019-01-08 | 苏州赫瑞特电子专用设备科技有限公司 | A kind of upper lower burrs self-balancing mechanism of grinder or polishing machine |
| CN114871941A (en) * | 2022-04-25 | 2022-08-09 | 季华实验室 | Polishing head and polishing machine |
| CN114871941B (en) * | 2022-04-25 | 2024-04-05 | 季华实验室 | Polishing head and polishing machine |
| CN116175305A (en) * | 2023-04-26 | 2023-05-30 | 北京特思迪半导体设备有限公司 | Platen structure for processing flat workpiece, apparatus and attitude control method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103551957B (en) | 2016-04-20 |
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Address after: 215129 No. 39 Middle Road, Suzhou Industrial Park, Suzhou, Jiangsu, China Applicant after: Suzhou Chenxuan Photoelectric Technology Co., Ltd. Address before: 3 factory building, Shishan industrial corridor, No. 855, Zhujianglu Road hi tech Zone, Jiangsu, Suzhou 215129 Applicant before: Suzhou Chenxuan Photoelectric Technology Co., Ltd. |
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| GR01 | Patent grant |