CN104364974B - 板上连接器的散热 - Google Patents

板上连接器的散热 Download PDF

Info

Publication number
CN104364974B
CN104364974B CN201280073506.4A CN201280073506A CN104364974B CN 104364974 B CN104364974 B CN 104364974B CN 201280073506 A CN201280073506 A CN 201280073506A CN 104364974 B CN104364974 B CN 104364974B
Authority
CN
China
Prior art keywords
radiator
connector
cooling air
angle
electronics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280073506.4A
Other languages
English (en)
Other versions
CN104364974A (zh
Inventor
U·凯尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amphenol FCI Asia Pte Ltd
Original Assignee
Amphenol FCI Asia Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amphenol FCI Asia Pte Ltd filed Critical Amphenol FCI Asia Pte Ltd
Publication of CN104364974A publication Critical patent/CN104364974A/zh
Application granted granted Critical
Publication of CN104364974B publication Critical patent/CN104364974B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20154Heat dissipaters coupled to components
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • G02B6/4269Cooling with heat sinks or radiation fins
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4292Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/38Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807Dismountable connectors, i.e. comprising plugs
    • G02B6/3873Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
    • G02B6/3885Multicore or multichannel optical connectors, i.e. one single ferrule containing more than one fibre, e.g. ribbon type
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/38Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807Dismountable connectors, i.e. comprising plugs
    • G02B6/389Dismountable connectors, i.e. comprising plugs characterised by the method of fastening connecting plugs and sockets, e.g. screw- or nut-lock, snap-in, bayonet type
    • G02B6/3893Push-pull type, e.g. snap-in, push-on
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/627Snap or like fastening
    • H01R13/6275Latching arms not integral with the housing
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40Transceivers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

电子或光电子板上连接器(1,30)和从这种连接器散热的方法。连接器被定位在冷却空气流的范围(A)内。该部件包括带散热器底座(21,34)的散热器(20,33),该散热器底座承载着多个向上延伸的元件,比如插针(22)或翅片(35)。散热器底座和冷却空气流的流动方向(A)形成一角度(α)。

Description

板上连接器的散热
技术领域
本发明涉及板上连接器比如电或光学连接器的散热领域。
背景技术
对电子或光电子部件进行适当的热管理直接影响它们的可靠性和性能。电子或光电子部件通常具有用于最佳操作的严格的温度要求。(光)电子系统中的电子或光电子部件过热可能影响整个系统。
同时,光学收发器需要被冷却以提升它们的性能。光学收发器代表性地被配置用于通过光学有源装置、比如光发射装置和光接收装置来传递和接收发至和来自互补光学连接器的光学信号。这类收发器总体上包括包裹住电子部件的主体、电子电路和接纳光学连接器的插座。
这类电或光电部件通常被用于带有冷却空气源的配置中,比如服务器,更具体为高密度服务器和可机架安装的服务器,所述冷却空气源代表性地被提供一个或多各冷却风扇。
为了从电子或光电子部件散热,散热器可以被使用,特别是如果可用空间有限的话。散热器通常包括连接至电子或光电子部件的散热器底座,和从散热器底座向上延伸的多个平行的散热插针或散热翅片。散热器底座用作电子部件产生的热量的主要传导路径。散热插针或散热翅片散热并且在吹过散热插针的空气中形成湍流。
尽管此类散热器的使用可能会取得很好的效果,仍然把进一步提升通过电子或光电子组件产生的热的散逸作为目标。
发明内容
本申请的一个方面,提供了一种从电子或光电子连接器散热的方法,该电子或光电子连接器包括带有承载着多个向上延伸元件的散热器底座的散热器。当在侧视图中看时,冷却空气被在与散热器底座形成一角度的方向上吹向散热器。换句话说,在平行于空气流动方向的竖直平面内,空气流动方向与散热器底座的表面平面形成一角度。
该元件可以例如是插针,比如与散热器底座成直角延伸的销钉阵列。可选地,或者另外地,散热元件可以包括散热翅片和/或类似元件。
已经发现,如果相对于散热器的空气流动角度从0度增大到大约30度,散热会得到实质提升了,比如大约双倍。相应地,如果,在侧视图中,空气流动方向和散热器底座之间的角度是45度或者更小,比如30度或更小,则会获得良好的效果。优选地,在侧视图中,空气流动方向和散热器底座之间的角度是至少4度。
另外,一种组件被公开,其包括在冷却空气流范围内的位于基板上的至少一个板连接器。所述板连接器具有至少部分被散热器覆盖的顶表面,该散热器包括承载着多个向上延伸的散热元件比如插针的散热底座。散热器底座被朝向空气流以一角度倾斜。
空气流源可以是任何空气移动装置,比如吹风机或风扇,更具体地是服务器比如高密度服务器中的常规冷却风扇。
通过倾斜空气流动和/或通过倾斜散热器,空气流动角度可以被增大。如果该板连接器和该顶表面一起使用,使得在侧视图中该顶表面和基板构成0-30度的顶表面角度,会获得良好的效果。
所述板连接器可以比如是被配置用以接收互补的光缆连接器的光学收发器。为进一步提升散热,收发器可以比如包括位于该收发器内的产热部件和收发器的顶表面之间的至少一个导热桥部。
附图说明
附图通过举例的方法示出了光学收发器的实施例,接下来将对附图进行更详细的解释。
图1示意性示出了带散热器的光学收发器和空气冷却源;
图2以立体图的形式示出了图1的收发器;
图3以立体图的形式示出了可选的收发器;
图4示出了作为空气流动角度的函数的热组的图线。
具体实施方式
图1示出了带光学收发器2的板上连接器1。该光学收发器2被接纳入板4上的插槽3。收发器2包括用于接收连接到包含多个光纤的缆线7上的互补缆线连接器6的接收开口5。缆线连接器6有接触面8,用于将这些光纤的光纤末端呈现到包裹在收发器2内的耦合元件11的互补接触面9。来自光纤末端的光学信号被耦合元件11的互补接触面9接收并向下引导至光电子元件12,所述光电子元件12将光学信号转换成电子信号。收发器2包括导热顶面13和位于顶面与收发器2的产生热量的电子元件16之间的导热桥部14。
收发器2的顶面13从位于缆线入口5那一侧的高边缘17倾斜至相反侧的较低边缘18。在侧视图中,顶面13和板4的平面构成了角度α,比如大约5-10度,比如大约7度。
散热器20覆盖收发器2的顶面13。散热器20包括均匀厚度的平坦的散热器底座21,其承载着等距布置的向上延伸的散热器插针22的阵列(见图2)。在图示的实施例中,插针22大致垂直于散热器底座21。
散热器20可以比如由金属或类似的散热材料构成。散热器底座可以通过导热粘合剂比如被附接到收发器的顶面13。
图1示意性示出了产生在箭头A指示的流动方向上的空气流的冷却空气源25。冷却空气源25通常是常规的冷却风扇,或典型地与和高密度或可机架安装的服务器一起使用的类似产品。可选地,该源可以包括被定位于距收发器一定距离处的面对着倾斜表面13的较低边缘18的任何其它类型的吹风机或空气散热装置。冷却空气被从冷却空气源25吹出穿过多个插针22以带走过多的热量。在图中示出的具体实施例中,方向A是大致水平的,所以空气流动方向A和散热器底座21之间的角度等于顶面13的倾斜角度,就是7度。
收发器2中的各种光电子部件12,16产生热量。产生的热量被通过导热桥部14和顶面13散至散热器20。散热器20经由插针22将热量散至周围空气中。通过迫使冷却空气流经插针22的阵列,散热能力得到实质地提升。
图3示出了带有底表面31和倾斜的顶表面32的收发器30的可选实施例。顶表面32被包含散热器底座34的散热器33覆盖,散热器底座34为收发器30的顶表面32增加了衬板,并且承载着一行平行且等距离间隔开的散热翅片35。任何其它类型或者结构的向上延伸的冷却元件可以被使用,如果需要的话。大体上,底表面31平行于基板并且平行于冷却空气的流动方向。收发器30的顶表面32和散热器底座34与底表面31并且相应地与空气流动方向构成一角度。
图4中的图线示出了散热器的热阻,其是空气流动A与散热器底座21之间的角度的函数。更精确地,图示中的空气流动角度是在平行于空气流动方向A的竖直平面内空气流动方向A与散热器底座21之间的角度。热阻是物体或材料抵抗热流动的温度差的计量(开尔文/瓦特),并且表示横跨热界面的温度差,该温度差是在该界面一侧上的散热功率的函数。热阻与热导成反比。较低的热阻导致成比例变化地较高的散热。
图3中的图表清晰地示出了当空气流动角度从0度增大至大约30度时热阻被降低了几乎50%。这意味着空气和散热器之间的温差被减半。
进一步增大空气流动角度α对热阻没有实质的影响。
图1的具体实施例中,空气流动方向A是大致水平的,并且散热器底座21和空气流之间的角度α通过使用带有倾斜顶面13的收发器2来获得。可选地,或另外地,空气流和散热器底座21之间的角度α还可以通过产生与水平构成一角度的非水平空气流和/或通过使收发器2作为一个整体倾斜而增大。

Claims (5)

1.一种从板上电子或光电子部件(1,30)散热的方法,所述方法包括操作冷却空气源(25)以产生流动方向上的冷却空气流(A),其中,所述电子或光电子部件被定位在冷却空气流(A)的范围内,所述电子或光电子部件包括带有承载着多个向上延伸的元件(22,35)的散热器底座(21,34)的散热器(20,33),所述散热器底座和冷却空气流的流动方向形成角度(α),所述角度(α)在4度和30度之间,至少一个导热桥部(14)位于所述板上电子或光电子部件内的产热部件与所述板上电子或光电子部件的顶表面(13,32)之间。
2.根据权利要求1所述的方法,其中,所述散热器(20,33)的向上延伸的元件包含插针(22)和/或翅片(35)。
3.根据权利要求2所述的方法,其中,所述插针(22)和/或翅片(35)与散热器底座(21,34)成直角。
4.一种组件,包括基板(4)上的至少一个板连接器(1,30)和产生在流动方向(A)上的冷却空气流的冷却空气源(25),其中,所述板连接器具有至少部分被散热器(20,33)覆盖的顶表面(13,32),所述散热器包括承载着多个向上延伸的散热元件(22,35)的散热器底座(21,34),并且其中,所述冷却空气源被定位成与所述板连接器的顶表面成一角度(α)地引导空气流,所述角度(α)在4度和30度之间,所述组件还包括位于所述连接器内的产热部件与所述连接器的顶表面(13,32)之间的至少一个导热桥部(14)。
5.根据权利要求4所述的组件,包括被配置以便接纳互补的光缆连接器的光学收发器。
CN201280073506.4A 2012-06-12 2012-10-17 板上连接器的散热 Active CN104364974B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IBPCT/IB2012/001644 2012-06-12
PCT/IB2012/001644 WO2013186587A1 (en) 2012-06-12 2012-06-12 Connector assembly
PCT/IB2012/002419 WO2013186589A1 (en) 2012-06-12 2012-10-17 Heat dissipation with an on-board connector

Publications (2)

Publication Number Publication Date
CN104364974A CN104364974A (zh) 2015-02-18
CN104364974B true CN104364974B (zh) 2018-06-19

Family

ID=47010642

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201280073837.8A Active CN104471799B (zh) 2012-06-12 2012-06-12 连接器组件
CN201280073506.4A Active CN104364974B (zh) 2012-06-12 2012-10-17 板上连接器的散热

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201280073837.8A Active CN104471799B (zh) 2012-06-12 2012-06-12 连接器组件

Country Status (4)

Country Link
US (2) US9277673B2 (zh)
EP (2) EP2859623B1 (zh)
CN (2) CN104471799B (zh)
WO (2) WO2013186587A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2522840B (en) * 2013-12-20 2019-08-28 Thorpe F W Plc Improvements in or relating to electrical connection arrangements
EP3155465B1 (en) 2014-06-16 2020-02-19 Finisar Corporation Pluggable connector
CN104994703B (zh) * 2014-07-23 2018-06-19 深圳市盛弘电气股份有限公司 一种防尘散热器及其电源
CN104793300A (zh) * 2015-04-30 2015-07-22 东南大学 一种具有内部散热通道的光模块组件级复合散热结构
US9692158B1 (en) * 2015-05-15 2017-06-27 Ardent Concepts, Inc. Connector assembly for attaching cables to a planar electrical device
US9645323B2 (en) * 2015-08-27 2017-05-09 Senko Advanced Components, Inc. Micro hybrid LC duplex adapter
US9899761B2 (en) * 2016-01-21 2018-02-20 Te Connectivity Corporation Connector system with connector position assurance
KR101794007B1 (ko) * 2016-04-06 2017-11-07 (주)휴맥스 방열모듈 조립체 및 이를 갖는 셋탑박스
US10454579B1 (en) * 2016-05-11 2019-10-22 Zephyr Photonics Inc. Active optical cable for helmet mounted displays
US10598871B2 (en) 2016-05-11 2020-03-24 Inneos LLC Active optical cable for wearable device display
WO2018110548A1 (ja) * 2016-12-13 2018-06-21 株式会社村田製作所 コネクタセット及び光伝送モジュール
CN108281831B (zh) 2018-01-23 2020-05-12 泰科电子(上海)有限公司 插座组件和传热组件
KR20210087806A (ko) * 2020-01-03 2021-07-13 주식회사 쏠리드 광 모듈 어셈블리
US11799239B2 (en) * 2020-09-03 2023-10-24 Molex, Llc Receptacle module and connector assembly

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101052288A (zh) * 2006-04-06 2007-10-10 乐金电子(昆山)电脑有限公司 电子设备的冷却装置
CN101394731A (zh) * 2008-09-27 2009-03-25 南京莱斯大型电子系统工程有限公司 散热器
CN202205906U (zh) * 2011-07-27 2012-04-25 温州意华通讯接插件有限公司 用于热插拔式电连接器的散热模块

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5858510A (ja) 1981-10-01 1983-04-07 Sumitomo Electric Ind Ltd 光コネクタ
US5760333A (en) * 1992-08-06 1998-06-02 Pfu Limited Heat-generating element cooling device
US5436798A (en) * 1994-01-21 1995-07-25 Wakefield Engineering, Inc. Spring clip and heat sink assembly for electronic components
EP0717465B1 (en) * 1994-10-10 1998-12-09 Molex Incorporated Electrical connector with position assurance system.
JPH0963694A (ja) * 1995-08-21 1997-03-07 Honda Tsushin Kogyo Kk ロック機構を有するコネクタ
US5709263A (en) * 1995-10-19 1998-01-20 Silicon Graphics, Inc. High performance sinusoidal heat sink for heat removal from electronic equipment
JP2001185307A (ja) * 1999-12-28 2001-07-06 Jst Mfg Co Ltd モジュール用コネクタ
US6450251B1 (en) * 2000-12-28 2002-09-17 Foxconn Precision Components Co., Ltd. Heat removal system
US6346002B1 (en) * 2001-04-17 2002-02-12 Wieson Electronic Co., Ltd. Connector equipped with snap latching structure
JP2002368468A (ja) * 2001-06-07 2002-12-20 Matsushita Electric Ind Co Ltd ヒートシンクとその製造方法およびそれを用いた冷却装置
US6845013B2 (en) * 2002-03-04 2005-01-18 Incep Technologies, Inc. Right-angle power interconnect electronic packaging assembly
US6890206B2 (en) * 2002-03-05 2005-05-10 Jds Uniphase Corporation Optical transceiver latch
AU2003223221A1 (en) * 2002-03-06 2003-09-22 Tyco Electronics Corporation Pluggable electronic module and receptacle with heat sink
US20030168208A1 (en) * 2002-03-11 2003-09-11 Kaoru Sato Electronic component cooling apparatus
US7371965B2 (en) * 2002-05-09 2008-05-13 Finisar Corporation Modular cage with heat sink for use with pluggable module
WO2004036262A2 (en) * 2002-10-16 2004-04-29 Finisar Corporation, Llc Transceiver latch mechanism
US7082032B1 (en) * 2003-08-25 2006-07-25 Hewlett-Packard Development Company, L.P. Heat dissipation device with tilted fins
US6860750B1 (en) * 2003-12-05 2005-03-01 Hon Hai Precision Ind. Co., Ltd. Cable end connector assembly having locking member
US7084496B2 (en) * 2004-01-14 2006-08-01 International Business Machines Corporation Method and apparatus for providing optoelectronic communication with an electronic device
US7145773B2 (en) * 2004-02-26 2006-12-05 Nortel Networks Limited Pluggable electronic module
US20050254208A1 (en) * 2004-05-17 2005-11-17 Belady Christian L Air flow direction neutral heat transfer device
US7364063B2 (en) * 2004-08-09 2008-04-29 Intel Corporation Thermally coupling an integrated heat spreader to a heat sink base
US7187552B1 (en) * 2005-03-04 2007-03-06 Sun Microsystems, Inc. Self-installing heat sink
US7213636B2 (en) * 2005-03-15 2007-05-08 Delphi Technologies, Inc. Cooling assembly with impingement cooled heat sink
CN101371406A (zh) * 2005-11-28 2009-02-18 Fci公司 具有改进的闩锁机构的连接器
TWI308050B (en) * 2006-02-14 2009-03-21 Asustek Comp Inc Heat-sink with slant fins
CN100574597C (zh) * 2006-07-21 2009-12-23 鸿富锦精密工业(深圳)有限公司 散热器
JP4998249B2 (ja) * 2007-12-21 2012-08-15 住友電気工業株式会社 光トランシーバの放熱装置
EP2101351B1 (de) * 2008-03-13 2016-08-17 Siemens Aktiengesellschaft Kühlvorrichtung zur Kühlung eines Bauteils
US8155520B1 (en) * 2008-04-16 2012-04-10 Cyan, Inc. Multi-fabric shelf for a transport network
US8083547B2 (en) * 2008-10-01 2011-12-27 Amphenol Corporation High density pluggable electrical and optical connector
US20110090649A1 (en) * 2009-10-16 2011-04-21 Lien Chang Electronic Enterprise Co., Ltd. Tilt-type heat-dissipating module for increasing heat-dissipating efficiency and decreasing length of solder pin
KR101824038B1 (ko) * 2011-07-22 2018-01-31 엘지이노텍 주식회사 디스플레이 장치
US8817469B2 (en) * 2011-09-23 2014-08-26 Infinera Corporation Heat transfer using a durable low-friction interface

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101052288A (zh) * 2006-04-06 2007-10-10 乐金电子(昆山)电脑有限公司 电子设备的冷却装置
CN101394731A (zh) * 2008-09-27 2009-03-25 南京莱斯大型电子系统工程有限公司 散热器
CN202205906U (zh) * 2011-07-27 2012-04-25 温州意华通讯接插件有限公司 用于热插拔式电连接器的散热模块

Also Published As

Publication number Publication date
CN104471799A (zh) 2015-03-25
US20150125118A1 (en) 2015-05-07
US20150139662A1 (en) 2015-05-21
CN104471799B (zh) 2017-10-17
CN104364974A (zh) 2015-02-18
WO2013186589A1 (en) 2013-12-19
EP2859623B1 (en) 2017-03-29
EP2859623A1 (en) 2015-04-15
EP2859624A1 (en) 2015-04-15
WO2013186587A1 (en) 2013-12-19
EP2859624B1 (en) 2018-08-01
US9277673B2 (en) 2016-03-01

Similar Documents

Publication Publication Date Title
CN104364974B (zh) 板上连接器的散热
KR101161949B1 (ko) 발광 장치
KR102541949B1 (ko) 방열 어셈블리 및 통신 모듈
CN111751804B (zh) 激光雷达装置
KR101602833B1 (ko) 적외선 led 감시카메라
JP2012503306A (ja) 発光装置
US9759418B2 (en) Optical lens structures for light emitting diode (LED) array
US8721359B1 (en) Heat sink socket
CN105799340A (zh) 光照射装置
CN108897006A (zh) 一种一体式激光测风雷达
KR20170005664A (ko) 광원모듈
CN108508625A (zh) 结构光投射器、图像获取装置和电子设备
CN105992501B (zh) 一种摄像头
CN104160213B (zh) 发光装置及用于制造发光装置的方法
JP2015087508A (ja) 投写型表示装置
CN108490577A (zh) 结构光投射器、图像获取装置和电子设备
CN106714504B (zh) 射频拉远单元、安装件及射频通信系统
CN210954345U (zh) 深度相机
CN108227360A (zh) 芯片嵌入装置
KR102230492B1 (ko) 영상촬영장치
CN208384179U (zh) 一种小型高速率光模块的散热装置
EP3450323B1 (en) High intensity airfield lighting system
CN104972742A (zh) 光照射装置
CN110753854A (zh) 激光雷达及智能感应设备
JP2563617B2 (ja) 屋外型光送信器

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: Singapore Singapore

Applicant after: Amphenol fujiayi (Asia) Pte Ltd

Address before: Singapore Singapore

Applicant before: FRAMATOME CONNECTORS INT

CB02 Change of applicant information
GR01 Patent grant
GR01 Patent grant