CN104360211B - 用于检测用于电流的柔性连接中断的配置及其方法 - Google Patents

用于检测用于电流的柔性连接中断的配置及其方法 Download PDF

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Publication number
CN104360211B
CN104360211B CN201410485836.5A CN201410485836A CN104360211B CN 104360211 B CN104360211 B CN 104360211B CN 201410485836 A CN201410485836 A CN 201410485836A CN 104360211 B CN104360211 B CN 104360211B
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CN
China
Prior art keywords
detection circuit
connector
current
flexible connector
circuit configuration
Prior art date
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CN201410485836.5A
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English (en)
Chinese (zh)
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CN104360211A (zh
Inventor
赛义德·贾法·雅法良-特哈妮
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/34—Details, e.g. electrodes, nozzles
    • H05H1/36—Circuit arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/52—Testing for short-circuits, leakage current or ground faults
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/54—Testing for continuity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Plasma Technology (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Drying Of Semiconductors (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
CN201410485836.5A 2009-04-28 2010-04-26 用于检测用于电流的柔性连接中断的配置及其方法 Active CN104360211B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/431,593 US8466697B2 (en) 2009-04-28 2009-04-28 Arrangements for detecting discontinuity of flexible connections for current flow and methods thereof
US12/431,593 2009-04-28
CN201080017788.7A CN102415221B (zh) 2009-04-28 2010-04-26 用于检测用于电流的柔性连接中断的配置及其方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201080017788.7A Division CN102415221B (zh) 2009-04-28 2010-04-26 用于检测用于电流的柔性连接中断的配置及其方法

Publications (2)

Publication Number Publication Date
CN104360211A CN104360211A (zh) 2015-02-18
CN104360211B true CN104360211B (zh) 2017-11-24

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN201410485836.5A Active CN104360211B (zh) 2009-04-28 2010-04-26 用于检测用于电流的柔性连接中断的配置及其方法
CN201080017788.7A Active CN102415221B (zh) 2009-04-28 2010-04-26 用于检测用于电流的柔性连接中断的配置及其方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201080017788.7A Active CN102415221B (zh) 2009-04-28 2010-04-26 用于检测用于电流的柔性连接中断的配置及其方法

Country Status (7)

Country Link
US (1) US8466697B2 (enExample)
JP (1) JP5781064B2 (enExample)
KR (1) KR101617231B1 (enExample)
CN (2) CN104360211B (enExample)
SG (1) SG175164A1 (enExample)
TW (1) TWI489117B (enExample)
WO (1) WO2010129229A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102018733B1 (ko) 2013-06-13 2019-09-06 삼성디스플레이 주식회사 플렉서블 표시장치
CN105116271B (zh) * 2015-08-07 2019-04-26 深圳一电航空技术有限公司 桨叶检测装置及方法、桨叶组件、飞行器及其控制方法
KR102417178B1 (ko) * 2015-09-03 2022-07-05 삼성전자주식회사 마이크로파 탐침, 그 탐침을 구비한 플라즈마 모니터링 시스템, 및 그 시스템을 이용한 반도체 소자 제조방법
US20210073610A1 (en) * 2017-12-27 2021-03-11 Semiconductor Energy Laboratory Co., Ltd. Thin film manufacturing apparatus and thin film manufacturing apparatus using neural network
CN115825529B (zh) * 2022-12-25 2023-11-17 北京屹唐半导体科技股份有限公司 射频探头、射频匹配器、射频电源及射频测量仪

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2100135C (en) * 1992-07-10 1997-11-04 Makoto Kawakami Dc current sensor
JPH09257861A (ja) * 1996-03-21 1997-10-03 Toshiba Corp 心線損傷検出装置
JPH1079350A (ja) 1996-09-04 1998-03-24 Kokusai Electric Co Ltd プラズマ処理装置
US6221221B1 (en) * 1998-11-16 2001-04-24 Applied Materials, Inc. Apparatus for providing RF return current path control in a semiconductor wafer processing system
JP2002202328A (ja) * 2000-12-28 2002-07-19 Japan System Engineering Kk 磁界型電流センサ
US7271580B1 (en) * 2001-10-26 2007-09-18 Schweitzer Engineering Laboratories, Inc. Apparatus and method for programmable trip settings in a faulted circuit indicator
JP3773189B2 (ja) 2002-04-24 2006-05-10 独立行政法人科学技術振興機構 窓型プローブ、プラズマ監視装置、及び、プラズマ処理装置
KR100483355B1 (ko) 2002-11-14 2005-04-15 학교법인 성균관대학 자장강화된 외장형 선형 안테나를 구비하는 대면적 처리용유도 결합 플라즈마 소오스
US6876205B2 (en) * 2003-06-06 2005-04-05 Advanced Energy Industries, Inc. Stored energy arc detection and arc reduction circuit
US7145345B2 (en) * 2003-12-23 2006-12-05 General Electric Company Current transformers for partial discharge detection on aircraft cables and wires
JP4359521B2 (ja) * 2004-02-20 2009-11-04 東京エレクトロン株式会社 プラズマ処理装置及びその制御方法
US8004293B2 (en) * 2006-11-20 2011-08-23 Applied Materials, Inc. Plasma processing chamber with ground member integrity indicator and method for using the same
US7972470B2 (en) * 2007-05-03 2011-07-05 Applied Materials, Inc. Asymmetric grounding of rectangular susceptor
US8343305B2 (en) * 2007-09-04 2013-01-01 Lam Research Corporation Method and apparatus for diagnosing status of parts in real time in plasma processing equipment

Also Published As

Publication number Publication date
US8466697B2 (en) 2013-06-18
KR101617231B1 (ko) 2016-05-02
WO2010129229A3 (en) 2011-02-03
CN102415221B (zh) 2014-11-19
KR20120020104A (ko) 2012-03-07
TW201126179A (en) 2011-08-01
US20100271040A1 (en) 2010-10-28
CN102415221A (zh) 2012-04-11
TWI489117B (zh) 2015-06-21
JP5781064B2 (ja) 2015-09-16
CN104360211A (zh) 2015-02-18
SG175164A1 (en) 2011-11-28
WO2010129229A2 (en) 2010-11-11
JP2012525683A (ja) 2012-10-22

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