CN104349590A - 电子装置的连接结构 - Google Patents
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/771—Details
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
Abstract
本发明公开了一种电子装置的连接结构,包括一电路板、多个导电接触垫以及一导电图案。导电接触垫与导电图案设置在电路板上。各导电接触垫彼此电分离。导电图案与导电接触垫电分离,且导电图案至少围绕导电接触垫的三周侧,用以对导电接触垫形成静电防护效果。
Description
技术领域
本发明涉及一种电子装置的连接结构,特别涉及一种具有导电图案四面围绕导电接触垫用以形成静电防护效果的连接结构。
背景技术
如图1所示,在一般的柔性电路板(flexible printed circuit,FPC)的插卡端(ZIP-connector)100中,导电接触垫120(一般也称金手指)是并排设置在电路板110上。插卡端100上的导电接触垫120是用以插入一连接器(connector,图未示)以与其接触而形成电连接。在电路板110上,导电接触垫120是连接到例如一集成电路(integrated circuit,IC,图未示)内,因此当导电接触垫120受到静电攻击时会直接导致IC受损而无法正常运作。由于在插卡端100中,电接地的接地接触垫130一般仅设置在导电接触垫120的两侧,故对于当操作人员手拿插卡端100时所产生的外来静电保护效果有限。此外,基于成本以及设计考量,并无法针对每一个导电接触垫120分别设计静电防护电路,且随着柔性电路板中的电路设计变得复杂,导电接触垫120的设置密度需跟着提高,而与导电接触垫120对应的导电线路也需要变得细小而不利于静电破坏防护。
发明内容
本发明的目的在提供一种电子装置的连接结构,利用导电图案至少三面围绕导电接触垫的设计,对连接结构中的导电接触垫形成静电防护效果。
本发明提供一种电子装置的连接结构,包括一电路板、多个导电接触垫以及一导电图案。导电接触垫与导电图案设置在电路板上。各导电接触垫彼此电分离。导电图案与导电接触垫电分离,且导电图案至少围绕在导电接触垫的三周侧,用以对导电接触垫形成静电防护效果。
本发明的电子装置的连接结构是利用导电图案至少三面围绕导电接触垫的设计,对连接结构中的导电接触垫以及其他组件形成静电防护效果。此外,本发明可在原有的连接结构下利用导电图案的设置来加强静电破坏防护的效果,故可不须大幅改变设计或增加额外的成本来达到提高静电防护的目的。
附图说明
图1所示为传统的柔性电路板的插卡端的示意图;
图2所示为本发明的第一优选实施例的电子装置的连接结构的示意图;
图3所示为本发明的第二优选实施例的电子装置的连接结构的示意图;
图4所示为本发明的第三优选实施例的电子装置的连接结构的示意图;
图5所示为本发明的第四优选实施例的电子装置的连接结构的示意图;
图6所示为本发明的第五优选实施例的电子装置的连接结构的示意图;
图7所示为本发明的第六优选实施例的电子装置的连接结构的示意图;
图8所示为本发明的第七优选实施例的电子装置的连接结构的示意图。
其中,附图标记说明如下:
具体实施方式
为使熟悉本发明所属技术领域的一技术人员能进一步了解本发明,下文特列举本发明的数个优选实施例,并配合附图,详细说明本发明的构成内容。
如图2所示,本发明的第一优选实施例的电子装置的连接结构200包括一电路板210、多个导电接触垫220以及一导电图案230。导电接触垫220与导电图案230是设置在电路板210上。本发明的电路板210可包括柔性电路板、硬式电路板或其他适合材料所形成的电路板。各导电接触垫220彼此电分离,且导电图案230与导电接触垫220电分离。导电图案230围绕导电接触垫220,用以对导电接触垫220形成静电防护效果。导电接触垫220与导电图案230优选是均由导电能力比较好的金属材料例如裸铜所形成,但并不以此为限。举例来说,导电图案230也可视需要使用例如铝、铜、银、铬、钛、钼的其中至少一种、上述材料的复合层、上述材料的合金或其他具有导电能力的材料。在本实施例中,导电图案230可为一U字形(图2中未示)或口字形导电图案,至少围绕在导电接触垫220的三周侧,如图2中导电图案230是四面围绕导电接触垫220,但本发明并不以此为限。在本发明的其他优选实施例中也可视需要使用其他图案形状的导电图案230四面围绕导电接触垫220。换句话说,导电图案230可包括一具有一中空区230H的封闭图案,且导电接触垫220是设置在中空区230H内。通过导电图案230四面围绕导电接触垫220的设计,可有效提高导电接触垫220对于外来静电的静电保护效果。换句话说,本发明的导电图案230可视为一静电防护导电图案。此外,在本实施例中,导电图案230的面积优选是大于导电接触垫220的总面积,用以确保导电图案230所产生的静电防护效果,但并不以此为限。
如图2所示,本实施例的电子装置的连接结构200可还包括多条信号线220S以及一定位结构240。信号线220S是分别与导电接触垫220电连接,且信号线220S是与导电图案230电分离。信号线220S的一端与导电接触垫220相连,而信号线220S的另外一端是与电路板210上的其他部件例如集成电路(图未示)相连,但并不以此为限。明确地说,各信号线220S优选是设置在电路板210的下层,并通过电路板210中的贯穿孔220P与各导电接触垫220电连接。值得说明的是,本实施例的电子装置的连接结构200可视为电路板210的插卡端(ZIP-connector),而定位结构240可用以控制连接结构200插入一连接器(connector,图未示)的深度,避免插入深度过深或过浅而导致连接器中的接触点与导电图案230接触而影响正常运作。此外,本实施例的电子装置的连接结构200可在原有的结构下利用导电图案230的设置来加强静电破坏防护的效果,故可不须大幅改变设计或增加额外的成本来达到提高静电防护的目的。
如图3所示,本发明的第二优选实施例的电子装置的连接结构300可还包括至少一接地线230G与导电图案230电连接。换句话说,本实施例的导电图案230可为电接地状态,借此进一步提高导电图案230对于导电接触垫220所形成的静电防护效果。根据实际测试结果,一般无设置导电图案的连接结构的抗静电破坏能力约在2到4千伏(KV),而在此连接结构下设置导电图案则可将抗静电破坏能力提高到约9到13千伏。本实施例的电子装置的连接结构300除了接地线230G之外,其余各部件的特征、设置位置以及材料特性与上述第一优选实施例相似,故在此并不再赘述。
如图4所示,本发明的第三优选实施例的电子装置的连接结构400可还包括至少一接地接触垫250,且导电图案230是与接地接触垫250接触而形成电连接。值得说明的是,本实施例的连接结构400可如同一般传统的连接结构具有两个接地接触垫250分别设置在导电接触垫220的两侧,而导电图案230可直接与导电接触垫220两侧的接地接触垫250接触而具有电接地状态,也就是说本发明可在原本的连接结构上加设导电图案230即可达到提高静电防护的效果。此外,接地接触垫250可分别与接地线230G电连接,但并不以此为限。
如图5所示,本发明的第四优选实施例的电子装置的连接结构500还包括一连接器(connector)260以及一集成电路(IC)270设置在电路板210上。导电图案230是与连接器260以及集成电路270电分离,且导电图案230是四面围绕连接器260。换句话说,连接器260与导电接触垫220是设置在导电图案230的中空区230H内,通过导电图案230的设置可对连接器260以及导电接触垫220提供静电防护效果。集成电路270设置在中空区230H之外,并通过电路板210而与导电接触垫220电连接,但并不以此为限。本实施例的连接器260可为一板对板连接器(board to board connector),而电路板210优选为一柔性电路板(flexible printed circuit,FPC),但并不以此为限。
如图6所示,本发明的第五优选实施例的电子装置的连接结构600还包括多个接地接触垫250以及多个导线250S设置在导电图案230的中空区230H内。接地接触垫250与导电接触垫220电分离,导电图案230四面围绕导电接触垫220以及接地接触垫250。此外,导电图案230是通过导线250S与接地接触垫250电连接而可具有电接地状态,借此进一步提高导电图案230的静电防护效果。
如图7所示,本发明的第六优选实施例的电子装置的连接结构700与上述第四优选实施例不同的地方在于,集成电路270是设置在导电图案230的中空区230H内。导电接触垫220是围绕集成电路270的四周并与集成电路270电连接。换句话说,本实施例的导电图案230四面围绕集成电路270以及导电接触垫220,通过导电图案230的设置来提高集成电路270以及导电接触垫220的静电防护效果。值得说明的是,本实施例的导电图案230也可视需要如同上述实施例的设计与接地线或接地接触垫电连接用以具有电接地状态,借此进一步提高导电图案230的静电防护效果,但并不以此为限。
如图8所示,本实施例的电子装置的连接结构800包括电路板210、多个导电接触垫220以及一导电图案830。导电接触垫220与导电图案830设置在电路板210上。导电图案830与导电接触垫220电分离。导电图案830围绕导电接触垫220,用以对导电接触垫220形成静电防护效果。导电图案830可视需要使用例如铝、铜、银、铬、钛、钼的其中至少一种、上述材料的复合层、上述材料的合金或其他具有导电能力的材料所形成。与上述第一优选实施例不同的地方在于,本实施例的导电图案830优选为一U字形导电图案,且三面围绕导电接触垫220。换句话说,在图8中,导电接触垫220朝上的方向可未被导电图案830围绕,故本实施例的导电接触垫220可不须通过上述的信号线以及贯穿孔来进行信号的传递,且本实施例的导电接触垫220可直接连接到电路板210上的其他部件例如集成电路(图未示)。通过导电图案830至少围绕在导电接触垫220的三周侧的设计,可有效提高导电接触垫220对于外来静电的静电保护效果。此外,在本实施例中,导电图案830的面积优选是大于导电接触垫220的总面积,用以确保导电图案830所产生的静电防护效果,但并不以此为限。值得说明的是,本实施例的导电图案830也可视需要如同上述实施例的设计与接地线或接地接触垫电连接用以具有电接地状态,借此进一步提高导电图案830的静电防护效果,但并不以此为限。
综合以上所述,本发明的电子装置的连接结构是利用导电图案四面围绕导电接触垫的设计,对连接结构中的导电接触垫以及其他组件形成静电防护效果。此外,导电图案可与接地线或接地接触垫电连接以具有电接地状态,借此进一步提高导电图案所产生的静电防护效果。本发明可在原有的连接结构下利用导电图案的设置来加强静电破坏防护的效果,故可不须大幅改变设计或增加额外的成本来达到提高静电防护的目的。
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (11)
1.一种电子装置的连接结构,其特征在于,包括:
一电路板;
多个导电接触垫,设置在所述电路板上,其中各所述导电接触垫彼此电分离;以及
一导电图案,设置在所述电路板上,其中所述导电图案与所述导电接触垫电分离,且所述导电图案至少围绕所述导电接触垫的三周侧,用以对所述导电接触垫形成静电防护效果。
2.根据权利要求1所述的连接结构,其特征在于,所述导电图案是四面围绕所述导电接触垫。
3.根据权利要求2所述的连接结构,其特征在于,所述导电图案包括一具有一中空区的封闭图案,且所述导电接触垫设置在所述中空区内。
4.根据权利要求1所述的连接结构,其特征在于,所述导电图案的面积大于所述导电接触垫的总面积。
5.根据权利要求1所述的连接结构,其特征在于,还包括多条信号线,分别与所述导电接触垫电连接,其中所述信号线与所述导电图案电分离。
6.根据权利要求1所述的连接结构,其特征在于,还包括至少一接地线,与所述导电图案电连接。
7.根据权利要求1所述的连接结构,其特征在于,还包括至少一接地接触垫,其中所述导电图案与所述接地接触垫接触而形成电连接。
8.根据权利要求1所述的连接结构,其特征在于,还包括至少一接地接触垫,与所述导电接触垫电分离,其中所述导电图案四面围绕所述导电接触垫以及所述接地接触垫。
9.根据权利要求8所述的连接结构,其特征在于,所述导电图案与所述接地接触垫电连接。
10.根据权利要求1所述的连接结构,其特征在于,还包括一连接器,设置在所述电路板上,其中所述连接器与所述导电接触垫电连接,所述导电图案四面围绕所述连接器。
11.根据权利要求1所述的连接结构,其特征在于,还包括一集成电路,设置在所述电路板上,其中所述集成电路与所述导电接触垫电连接,且所述导电图案四面围绕所述集成电路。
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US10057980B2 (en) * | 2016-03-15 | 2018-08-21 | Cisco Technology, Inc. | Method and apparatus for reducing corrosion in flat flexible cables and flexible printed circuits |
EP3918635A4 (en) * | 2019-05-03 | 2022-04-06 | Samsung Electronics Co., Ltd. | LIGHT EMITTING DIODE MODULE |
CN111818724A (zh) * | 2020-09-10 | 2020-10-23 | 武汉精测电子集团股份有限公司 | 一种用于静电防护器件布线的pcb板结构及信号测试设备 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4532419A (en) * | 1982-09-09 | 1985-07-30 | Sony Corporation | Memory card having static electricity protection |
US6650546B2 (en) * | 2001-02-27 | 2003-11-18 | 3Com Corporation | Chip component assembly |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5315472A (en) * | 1991-07-23 | 1994-05-24 | Hewlett Packard Company | Ground ring/spark gap ESD protection of tab circuits |
KR100633883B1 (ko) * | 1998-12-14 | 2006-10-16 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 포토마스크 |
KR100582497B1 (ko) * | 2004-02-24 | 2006-05-23 | 삼성전자주식회사 | 정전기 방전 보호 패턴을 포함하는 인쇄회로기판을 갖는 메모리 카드 |
US7479680B2 (en) * | 2005-11-30 | 2009-01-20 | California Micro Devices | Method and apparatus that provides differential connections with improved ESD protection and routing |
TWI419631B (zh) * | 2011-12-05 | 2013-12-11 | Au Optronics Corp | 多層電路板以及靜電放電保護結構 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4532419A (en) * | 1982-09-09 | 1985-07-30 | Sony Corporation | Memory card having static electricity protection |
US6650546B2 (en) * | 2001-02-27 | 2003-11-18 | 3Com Corporation | Chip component assembly |
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CN106304630A (zh) * | 2015-06-09 | 2017-01-04 | 南京瀚宇彩欣科技有限责任公司 | 软性电路板及显示装置 |
CN106304630B (zh) * | 2015-06-09 | 2019-12-27 | 南京瀚宇彩欣科技有限责任公司 | 软性电路板及显示装置 |
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