CN104349576A - 电路板 - Google Patents

电路板 Download PDF

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Publication number
CN104349576A
CN104349576A CN201310331799.8A CN201310331799A CN104349576A CN 104349576 A CN104349576 A CN 104349576A CN 201310331799 A CN201310331799 A CN 201310331799A CN 104349576 A CN104349576 A CN 104349576A
Authority
CN
China
Prior art keywords
copper foil
circuit board
hole
solder mask
insulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310331799.8A
Other languages
English (en)
Inventor
冯梦龙
魏小丛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201310331799.8A priority Critical patent/CN104349576A/zh
Priority to TW102128078A priority patent/TW201507551A/zh
Priority to US14/102,472 priority patent/US20150034372A1/en
Publication of CN104349576A publication Critical patent/CN104349576A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Abstract

本发明提供一种电路板，包括一绝缘基材、多个设置在绝缘基材上的铜箔环，该绝缘基材包括一底面，该绝缘基材开设有至少一列通孔，该多个铜箔环设置于该底面上，且每个铜箔环与一个通孔同轴设置，每个铜箔环的内直径与对应通孔的直径相同.该电路板还包括：一绝缘阻焊层，覆盖在该底面及该多个铜箔环上，该阻焊层开设有多个阻焊开窗，每个阻焊开窗呈圆孔状，并与一个通孔同轴设置。该电路板增加一绝缘阻焊层，使绝缘阻焊层覆盖在铜箔上，从而使铜箔与基材的附着力增强，并避免焊接时插件的金属端子之间出现短路。

Description

电路板
技术领域
本发明涉及一种电路板。
背景技术
电路板上的铜箔与基材的附着力较差，因此，插件的金属端子容易将电路板上的铜箔带起，导致电路板报废，且焊接插件时，金属端子之间容易出现短路。
发明内容
本发明提供一种电路板。
一种电路板，包括一绝缘基材、多个设置在绝缘基材上的铜箔环，该绝缘基材包括一底面，该绝缘基材开设有至少一列通孔，该多个铜箔环设置于该底面上，且每个铜箔环与一个通孔同轴设置，每个铜箔环的内直径与对应通孔的直径相同.该电路板还包括：一绝缘阻焊层，覆盖在该底面及该多个铜箔环上，该阻焊层开设有多个阻焊开窗，每个阻焊开窗呈圆孔状，并与一个通孔同轴设置。
本发明的电路板，增加一绝缘阻焊层，使绝缘阻焊层覆盖在铜箔上，从而使铜箔与基材的附着力增强，并避免焊接时插件的金属端子之间出现短路。
附图说明
图1是本发明较佳实施方式下的电路板的结构示意图。
图2是图1中的电路板沿II-IV线的截面图。
主要元件符号说明
电路板 1
绝缘基材 10
铜箔环 20
绝缘阻焊层 30
底面 11
通孔 12
阻焊开窗 31
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1及图2，电路板1包括一绝缘基材10、多个设置在绝缘基材10上的铜箔环20、及一绝缘阻焊层30。
该绝缘基材10包括一底面11。该绝缘基材10开设有至少一列通孔12。每个通孔12的直径为0.4mm。同一列通孔12中，相邻两个通孔12的间隔为2mm。
多个铜箔环20设置于该底面11上。每个铜箔环20的内直径为0.4mm，外直径为1.75mm。每个铜箔环20与一个通孔12同轴设置，且每个铜箔环20的内直径与对应通孔12的直径相同。
绝缘阻焊层30覆盖在该底面11及该多个铜箔环20上。该绝缘阻焊层30开设有多个阻焊开窗31，每个阻焊开窗31呈圆孔状，并与一个通孔12同轴设置。每个阻焊开窗31的直径为1.25mm。
通过该绝缘阻焊层30覆盖在铜箔环20上，从而使铜箔与绝缘基材10之间的附着力增强。且由于绝缘阻焊层30不导电，避免了焊接时插件的金属端子之间出现短路。

Claims (4)

1.一种电路板，包括一绝缘基材、多个设置在绝缘基材上的铜箔环，该绝缘基材包括一底面，该绝缘基材开设有至少一列通孔，该多个铜箔环设置于该底面上，且每个铜箔环与一个通孔同轴设置，每个铜箔环的内直径与对应通孔的直径相同，其特征在于，该电路板还包括：
一绝缘阻焊层，覆盖在该底面及该多个铜箔环上，该绝缘阻焊层开设有多个阻焊开窗，每个阻焊开窗呈圆孔状，并与一个通孔同轴设置。
2.如权利要求1所述的电路板，其特征在于每个通孔的直径为0.4mm，同一列通孔中，相邻两个通孔的间隔为2mm。
3.如权利要求1所述的电路板，其特征在于，每个铜箔环的内直径为0.4mm，外直径为1.75mm。
4.如权利要求1所述的电路板，其特征在于，每个阻焊开窗的直径为1.25mm。
CN201310331799.8A 2013-08-01 2013-08-01 电路板 Pending CN104349576A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201310331799.8A CN104349576A (zh) 2013-08-01 2013-08-01 电路板
TW102128078A TW201507551A (zh) 2013-08-01 2013-08-06 電路板
US14/102,472 US20150034372A1 (en) 2013-08-01 2013-12-10 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310331799.8A CN104349576A (zh) 2013-08-01 2013-08-01 电路板

Publications (1)

Publication Number Publication Date
CN104349576A true CN104349576A (zh) 2015-02-11

Family

ID=52426629

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310331799.8A Pending CN104349576A (zh) 2013-08-01 2013-08-01 电路板

Country Status (3)

Country Link
US (1) US20150034372A1 (zh)
CN (1) CN104349576A (zh)
TW (1) TW201507551A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107182166A (zh) * 2017-06-14 2017-09-19 鹤山市中富兴业电路有限公司 一种可拉伸的fpc及其制作工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3775970B2 (ja) * 2000-03-27 2006-05-17 新光電気工業株式会社 電子部品実装用基板の製造方法
TWM435797U (en) * 2011-12-20 2012-08-11 Msi Computer Shenzhen Co Ltd Circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107182166A (zh) * 2017-06-14 2017-09-19 鹤山市中富兴业电路有限公司 一种可拉伸的fpc及其制作工艺

Also Published As

Publication number Publication date
US20150034372A1 (en) 2015-02-05
TW201507551A (zh) 2015-02-16

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Application publication date: 20150211

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