CN104335363A - 电子设备及电子设备的制造方法 - Google Patents
电子设备及电子设备的制造方法 Download PDFInfo
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- CN104335363A CN104335363A CN201380029092.XA CN201380029092A CN104335363A CN 104335363 A CN104335363 A CN 104335363A CN 201380029092 A CN201380029092 A CN 201380029092A CN 104335363 A CN104335363 A CN 104335363A
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000000034 method Methods 0.000 title claims description 9
- 239000011347 resin Substances 0.000 claims abstract description 86
- 229920005989 resin Polymers 0.000 claims abstract description 86
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000007787 solid Substances 0.000 description 13
- 239000012535 impurity Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010008 shearing Methods 0.000 description 4
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Abstract
电子设备包括:电子部件,其在背面具有电极;布线基板,其在绝缘性可挠基体材料的表面形成有布线。所述电子部件使用绝缘性树脂固定在所述布线基板上。所述树脂的外缘形状在所述布线上的部分具有角度为90度以下的角部。
Description
技术领域
本发明涉及一种包括在背面具有电极的电子部件以及在绝缘性可挠基体材料上形成有布线的布线基板的电子设备及该电子设备的制造方法。
背景技术
在绝缘性基体材料的至少一个主表面上形成有布线的布线基板的布线形成面上配置电子部件,将该电子部件的电极与布线基板的布线连接,并且使用树脂等接着剂将电子部件与布线基板固定的技术已为公知。例如,在专利文献1中,公开了使用接着剂将在背面具有电极的太阳能电池单元(电子部件的一例)与布线基板固定的太阳能电池。
现有技术文献
专利文献
专利文献1:(日本)特开2009-88145号公报
发明内容
发明要解决的技术问题
在专利文献1中,为了向外部取出太阳能电池单元的输出,将布线基板的布线与太阳能电池单元的电极连接,并将该布线引出到太阳能电池单元的外侧(专利文献1的图4的纸面的上下方向)。另外,通过在太阳能电池单元的电极形成面与布线基板的布线形成面之间配置接着剂,使太阳能电池单元接着固定在布线基板上。因此,布线分成了与接着剂接触的部分和与接着剂不接触的部分,从而在布线上出现了有无接着剂的分界线。
利用该接着剂,布线强力地接着固定在布线基板的绝缘性基体材料上和太阳能电池单元上,因此与接着剂接触的部分的布线和与接着剂接触的部分的布线相对应部分的绝缘性基体材料由温度变化、应力等造成的伸缩、变形得以抑制。另一方面,未与接着剂接触的部分的布线和未与接着剂接触的部分的布线所对应部分的绝缘基体材料因为未被接着剂固定在太阳能电池单元上,所以,由于温度变化、应力等而比较自由地伸缩、变形。
因此,在由于温度变化、应力等而造成布线伸缩、变形的情况下,布线不均匀地变形,特别是应变集中在有无接着剂的分界线部分,有可能在该分界线部分发生布线断线。
本发明鉴于上述状况而提出,目的在于提供一种耐久性高的电子设备及该电子设备的制造方法。
用于解决技术问题的技术方案
为了达到上述目的,本发明的电子设备构成为包括:电子部件,其在背面具有电极;布线基板,其在绝缘性可挠基体材料的表面形成有布线;所述电子部件使用绝缘性树脂固定在所述布线基板上,所述树脂的外缘形状在所述布线上的部分具有角度为90度以下的角部(第一结构)。
另外,优选上述第一结构的电子设备构成为所述树脂的外缘线与所述布线的外缘线倾斜地交叉(第二结构)。
另外,优选上述第二结构的电子设备构成为所述布线为带状,所述树脂的外缘形状在所述布线的宽度方向的中央部上的部分具有所述角部(第三结构)。
另外,优选上述第一结构至第三结构中任一结构的电子设备构成为所述角部形成为弧状(第四结构)。
另外,优选上述第一结构至第四结构中任一结构的电子设备构成为所述树脂全部配置在所述电子部件的背面区域内(第五结构)。
另外,优选上述第五结构的电子设备构成为具有多个所述电子部件,从所述电子部件的表面侧看,邻接的所述电子部件之间存在形成有所述布线基板的所述布线的部分(第六结构)。
为了达到上述目的,本发明的电子设备的制造方法制造上述第一结构至第六结构中任一结构的电子设备,包括:通过印刷在电子部件的背面配置树脂的工序;使印刷有所述树脂的所述电子部件的树脂配置面与在绝缘性可挠基体材料的表面形成有布线的布线基板的布线面贴合,从而将所述电子部件固定在所述布线基板上的工序。
为了达到上述目的,本发明的电子设备的其他制造方法制造上述第一结构至第六结构中任一结构的电子设备,包括:通过印刷在布线基板的布线面上配置树脂的工序,所述布线基板在绝缘性可挠基体材料的表面形成有布线;使电子部件的背面与印刷有所述树脂的所述布线基板的树脂配置面贴合,从而将所述电子部件固定在所述布线基板上的工序。
发明效果
根据本发明,由于树脂的外缘线所在的布线的部分难以断线,因此能够实现耐久性高的电子设备及该电子设备的制造方法。
附图说明
图1是表示电子部件固定于布线基板之前的状态下的本发明第一实施方式的电子设备的俯视图。
图2是表示电子部件固定于布线基板之前的状态下的本发明第一实施方式的电子设备的剖面图。
图3是表示电子部件固定于布线基板之后的状态下的本发明第一实施方式的电子设备的俯视图。
图4是表示电子部件固定于布线基板之后的状态下的本发明第一实施方式的电子设备的剖面图。
图5是表示电子部件固定于布线基板之后的状态下的比较例的电子设备的俯视图。
图6是表示电子部件固定于布线基板之后的状态下的本发明其他例的电子设备的俯视图。
图7是表示在布线基板侧设置树脂之后将电子设备固定于布线基板的情况下,电子部件固定于布线基板之前的状态下的本发明另一例的电子设备的俯视图。
图8是表示在布线基板侧设置树脂之后将电子设备固定于布线基板的情况下,电子部件固定于布线基板之前的状态下的本发明另一例的电子设备的剖面图。
图9是表示电子部件固定于布线基板之前的状态下的本发明第二实施方式的电子设备的俯视图。
图10是表示本发明第三实施方式的电子设备所具有的背面电极型太阳能电池单元的纵剖示意图。
图11是表示本发明第三实施方式的电子设备所具有的布线基板的纵剖示意图。
图12是表示具有三个单元配置部的布线基板的一例的俯视示意图。
具体实施方式
以下参照附图说明本发明的实施方式。
<第一实施方式>
图1是表示电子部件固定于布线基板之前的状态下的本发明第一实施方式的电子设备的俯视图。另外,图2是表示在电子部件固定于布线基板之前的状态下的本发明第一实施方式的电子设备的使电子部件的背面与布线基板的表面相对状态下的图1的沿A-A剖开的剖面图。
图3是表示电子部件固定于布线基板之后状态下的本发明第一实施方式的电子设备的俯视图。另外,图4是表示电子部件固定于布线基板之后的状态下的本发明第一实施方式的电子设备的沿图3的A-A剖开的剖面图。需要说明的是,在图3中用虚线表示被电子部件2的主体等隐藏的布线4和树脂6的外缘线。
本发明第一实施方式的电子设备包括:在背面具有电极1的电子部件2、在绝缘性可挠基体材料3的表面形成有布线4的布线基板5。
例如如图1和图2所示,本发明第一实施方式的电子设备通过印刷在电子部件2的背面配置绝缘性树脂6,在电子部件2的背面以覆盖电极1的方式配置焊料等导电性材料7。需要说明的是,为了防止邻接的电极1之间由于导电性材料7而导通,树脂6包围导电性材料7。
在导电性材料7的熔点温度以上的温度条件下,如果使印刷有树脂6的电子部件2的树脂配置面(背面)与布线基板5的布线面(表面)贴合而将电子部件2固定在布线基板5上,则导电性材料7从图1和图2的状态变形而成为图3和图4的状态。
从图3可知,树脂6的外缘形状在布线4上的部分具有角部。这样,通过使树脂6的外缘形状在布线4上的部分具有角部,只要来自以角部为界的至少两个方向以上的应力(例如如图3所示的σ1及σ2)不施加在树脂6的外缘线所在的布线4的部分,布线4就不会完全断线,因此布线4的断线难以发生。
另外,通过使树脂6的外缘形状在布线4上的部分具有角部,使位于布线4上的树脂6的外缘线的长度变长,能够减少单位长度所受到的应力,从而难以发生布线4的断线。此外,像本实施方式那样,通过使布线4形成为带状,并且使树脂6的外缘形状在布线4的宽度方向中央部上的部分具有角部,能够使以角部为界的两个树脂6的外缘线的长度大致相等,从而难以形成对于断线较弱的应力的方向。
如上所述,通过使树脂6的外缘形状在布线4上的部分具有角部,提高了本发明第一实施方式的电子设备的耐久性。
与此相对,如果像图5所示的比较例那样,使树脂6的外缘形状在布线4上的部分不具有角部,则即使来自一个方向的应力(例如图5所示的σ3)施加在树脂6的外缘线所在的布线4的部分,也有可能使布线4完全断线,从而容易发生布线4的断线。
需要说明的是,在本发明的电子设备中,所述树脂的外缘形状在布线上的部分具有的角部的角度为90度以下。在本实施方式中,如图3所示,角度为60度。
在例如角部的角度为90度的情况下,由于相对于形成布线4上的树脂6的外缘线的一边使布线4伸缩的方向与形成布线4上的树脂6的外缘线的另一边平行,因此,相对于形成布线4上的树脂6的外缘线的一边使布线4伸缩的方向上的应力对形成布线4上的树脂6的外缘线的另一边不会成为使布线伸缩的方向的应力,从而能够有效地抑制形成布线4上的树脂6的外缘线的两个边所在的部分断线。另外,如果角部的角度为比90度小的角度,则相对于形成布线4上的树脂6的外缘线的一边使布线4伸缩的方向的应力抵消相对于形成布线4上的树脂6的外缘线的另一边使布线4伸缩的方向的应力的一部分,从而能够有效地抑制形成布线4上的树脂6的外缘线的两个边所在的部分因从各方向向布线4施加的应力而断线。另外,通过角部的角度为比90度更小的角度,则能够使位于布线4上的树脂6的外缘线的长度变得更长,因此能够减少布线4的单位长度所受到的应力,使布线4的断线难以发生。例如,能够使如图3所示的位于布线4上的树脂6的外缘线的长度为如图5所示的位于布线4上的树脂6的外缘线的长度的两倍。实际上,通过对本发明的电子设备和图5所示的比较例实施冷热温度循环试验发现,在图5所示的比较例中,部分样品的布线4完全断线,与此相对,在本发明的电子设备中,则没有发现布线4完全断线的样品。
另外,在本发明的电子设备中,优选树脂6的外缘线与布线4的外缘线倾斜地交叉。为了使角部的角度在90度以下,并且使以角部为界的两个树脂6的外缘线的长度大致相等,优选使树脂6的外缘形状在布线4的宽度方向中央部上的部分具有角部,并且使角部相对于布线4的宽度方向呈左右对称,因此更加优选的是树脂6的外缘线与布线4的外缘线的交叉角度即布线4上未配置有树脂6的部分的交差角度在45度以下。在本实施方式中,树脂6的外缘线与布线4的外缘线的交叉角度即布线4上未配置有树脂6的部分的交叉角度如图3所示为30度。
有可能因施加在树脂6的外缘线与布线4的外缘线交叉的部分上的剪切力而布线4的外缘线产生切纹或裂纹,但是通过使树脂6的外缘线与布线4的外缘线倾斜地(非直角地)交叉,即使剪切力施加在树脂6的外缘线与布线4的外缘线交叉的部分上,因为交叉部分的布线6的截面面积比其他布线6的截面面积小,所以交叉部分的布线6与其他布线6的部分相比易于变形,由于该变形易于吸收施加在树脂6的外缘线与布线4的外缘线交叉的部分上的剪切力,所以能够使切纹或裂纹难以发生。因此,本发明第一实施方式的电子设备与如图6所示的例子相比,在剪切力施加于布线4的情况下,树脂6的外缘线与布线4的外缘线交叉的部分难以发生切纹或裂纹。另一方面,在图6所示的例子中,位于布线4上的树脂6的外缘形状具有多个角部。通过这样设置,能够防止以多个角部为界的来自至少更多方向的应力引起布线4完全断线。因此,关于位于布线4上的树脂6的外缘形状,可以根据施加在布线4上的应力的方向和强度、布线4的弹性系数、加工硬化的难易程度等,适当地确定配置角部的数量、形状以及树脂6的外缘线与布线4的外缘线交叉的角度。另外,为了使位于布线4上的树脂6的外缘形状具有多个角部,并且树脂6的外缘线与布线4的外缘线倾斜地交叉,作为如图6所示的另一变形例,还可以使位于布线4上的树脂6的外缘形状形成W形等。
在将多个电子设备配置在一个布线基板上的情况下,布线基板的尺寸变大,从而难以在布线基板上位置精确地一次性配置树脂,因此像本实施方式那样,优选在电子设备侧设置树脂之后将电子设备固定在布线基板上。
另一方面,如果在布线基板上配置树脂的位置精度不存在问题,则可以与本实施方式不同,在布线基板侧设置树脂之后将电子设备固定在布线基板上。
图7是表示将上述情况的电子部件固定于布线基板之前的状态下的本发明另一例的电子设备的俯视图。另外,图8是表示将上述情况的电子部件固定于布线基板之前的状态下的本发明另一例的电子设备的使电子部件的背面与布线基板的表面相对的状态下的沿图7的A-A剖开的剖面图。
另外,在该情况下,例如能够一边图像识别树脂的形状图案,一边将电子部件配置在布线基板上的规定位置。即,能够将树脂的形状图案用于对位。
<第二实施方式>
图9是表示电子部件固定于布线基板之前的状态下的本发明第二实施方式的电子设备的俯视图。
本发明第二实施方式的电子设备的树脂6的角部形成为弧状,树脂6的连结角部与角部的部分形成为弧状的这一点与本发明第一实施方式的电子设备不同。如果像本发明第一实施方式的电子设备那样角部为尖锐,则在该部位容易集中应力,有可能导致以角部为起点布线容易开裂。对此,通过像本实施方式的电子设备那样使角部为弧状,能够防止应力向角部集中,从而能够更有效地抑制布线4的断线。
<第三实施方式>
电子部件2可以是与基板凸块连接的集成电路芯片等,但是在本实施方式中,电子部件2为背面电极型太阳能电池单元。图10是表示本实施方式的电子设备所具有的背面电极型太阳能电池单元20的纵剖示意图。
背面电极型太阳能电池单元20例如具有:半导体基板21,其为具有n型或p型导电型的硅基板等;防反射膜22,其形成在背面电极型太阳能电池单元20的受光面即半导体基板21的凹凸形状的表面上;绝缘膜23,其形成在背面电极型太阳能电池单元20的背面即半导体基板21的背面上;第一导电型用电极24;第二导电型用电极25。在第一导电型和第二导电型中可以使一方为p型而使另一方为n型。另外,绝缘膜23可以具有作为钝化膜的功能。
在半导体基板21的背面,第一导电型杂质扩散而形成的第一导电型杂质扩散区域26和第二导电型杂质扩散形成的第二导电型杂质扩散区域27隔开规定间隔地交替形成。第一导电型用电极24和第一导电型杂质扩散区域26经由设置在绝缘膜23上的接触孔连接。同样地,第二导电型用电极25和第二导电型杂质扩散区域27经由设置在绝缘膜23上的接触孔电连接。
在本实施方式中,将布线基板作为布线板。图11是本实施方式的电子设备所具有的布线板50的纵剖示意图。
布线板50具有绝缘性可挠基体材料51和配置在绝缘性可挠基体材料51的表面上的第一布线52及第二布线53。第一布线53与第一导电型用电极24对应,第二布线53与第二导电型用电极25对应。这样,在绝缘性可挠基体材料的表面上具有布线的布线板中,由于绝缘性可挠基体材料随着温度变化而伸缩,因此,绝缘性可挠基体材料伸缩时的应力施加在位于树脂的外缘部的布线上的可能性较高。因此,通过将上述实施方式适用于布线板,能够有效地防止布线断线。
需要说明的是,树脂6的外缘形状、导电性材料7等可以与第一实施方式或第二实施方式相同,因此在此省略说明。
<其他>
以上说明了本发明的实施方式,但是本发明的范围不限于此,在不脱离发明主旨的范围内可以实施各种变更。
上述实施方式是对一个布线基板固定一个电子部件的方式,当然,也可以对一个布线基板固定多个电子部件。例如,在一个布线基板上连接三个背面电极型太阳能电池单元的情况下,使布线板像图12所示的例子那样构成为具有三个单元配置部25。在该情况下,从背面电极型太阳能电池单元(电子部件的一例)的表面侧看,在邻接的所述背面电极型太阳能电池单元之间,即在邻接的单元配置部54之间存在形成有布线板的布线的部分。因为在该部分的布线的两侧,单元配置部54中树脂的外缘线在布线上的部分存在,所以与像上述实施方式那样仅在一侧树脂的外缘线在布线上的部分存在的情况相比,抑制断线的本发明的适用更加有效。
符号说明
1 电极
2 电子部件
3 绝缘性可挠基体材料
4 布线
5 布线基板
6 树脂
7 导电性材料
20 背面电极型太阳能电池单元
21 半导体基板
22 防反射膜
23 绝缘膜
24 第一导电型用电极
25 第二导电型用电极
26 第一导电型杂质扩散区域
27 第二导电型杂质扩散区域
50 布线板
51 绝缘性可挠基体材料
52 第一布线
53 第二布线
54 单元配置部
Claims (8)
1.一种电子设备,其特征在于,包括:
电子部件,其在背面具有电极;
布线基板,其在绝缘性可挠基体材料的表面形成有布线;
所述电子部件使用绝缘性树脂固定在所述布线基板上,
所述树脂的外缘形状在所述布线上的部分具有角度为90度以下的角部。
2.如权利要求2所述的电子设备,其特征在于,
所述树脂的外缘线与所述布线的外缘线倾斜地交叉。
3.如权利要求1或2所述的电子设备,其特征在于,
所述布线为带状,
所述树脂的外缘形状在所述布线的宽度方向的中央部上的部分具有所述角部。
4.如权利要去1至3中任一项所述的电子设备,其特征在于,
所述角部形成为弧状。
5.如权利要求1至4中任一项所述的电子设备,其特征在于,
所述树脂全部配置在所述电子部件的背面区域内。
6.如权利要求5所述的电子设备,其特征在于,
具有多个所述电子部件,
从所述电子部件的表面侧看,在邻接的所述电子部件之间存在形成有所述布线基板的所述布线的部分。
7.一种电子设备的制造方法,制造权利要求1至6中任一项所述的电子设备,其特征在于,包括:
通过印刷在电子部件的背面配置树脂的工序;
使印刷有所述树脂的所述电子部件的树脂配置面与在绝缘性可挠基体材料的表面形成有布线的布线基板的布线面贴合,从而将所述电子部件固定在所述布线基板上的工序。
8.一种电子设备的制造方法,制造权利要求1至6中任一项所述的电子设备,其特征在于,包括:
通过印刷在布线基板的布线面上配置树脂的工序,所述布线基板在绝缘性可挠基体材料的表面形成有布线;
使电子部件的背面与印刷有所述树脂的所述布线基板的树脂配置面贴合,从而将所述电子部件固定在所述布线基板上的工序。
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JP2006344616A (ja) * | 2005-06-07 | 2006-12-21 | Yoshiaki Sonoda | 太陽電池ガラス基板実装方法 |
CN101310573A (zh) * | 2005-11-15 | 2008-11-19 | 3M创新有限公司 | 用于连接印刷电路板的方法 |
CN101874305A (zh) * | 2007-09-28 | 2010-10-27 | 夏普株式会社 | 太阳能电池、太阳能电池的制造方法、太阳能电池模块的制造方法及太阳能电池模块 |
WO2012057076A1 (ja) * | 2010-10-29 | 2012-05-03 | シャープ株式会社 | 配線シート付き太陽電池セルの製造方法、太陽電池モジュールの製造方法、配線シート付き太陽電池セルおよび太陽電池モジュール |
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JPH07336030A (ja) * | 1994-06-13 | 1995-12-22 | Sony Corp | プリント配線基板の半田ランドの構造 |
JP3974834B2 (ja) * | 2002-08-26 | 2007-09-12 | 松下電器産業株式会社 | 電子部品の装着方法 |
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JP2006344616A (ja) * | 2005-06-07 | 2006-12-21 | Yoshiaki Sonoda | 太陽電池ガラス基板実装方法 |
CN101310573A (zh) * | 2005-11-15 | 2008-11-19 | 3M创新有限公司 | 用于连接印刷电路板的方法 |
CN101874305A (zh) * | 2007-09-28 | 2010-10-27 | 夏普株式会社 | 太阳能电池、太阳能电池的制造方法、太阳能电池模块的制造方法及太阳能电池模块 |
WO2012057076A1 (ja) * | 2010-10-29 | 2012-05-03 | シャープ株式会社 | 配線シート付き太陽電池セルの製造方法、太陽電池モジュールの製造方法、配線シート付き太陽電池セルおよび太陽電池モジュール |
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