CN104321858A - 用于二维基板的加工站与用于加工二维基板的方法 - Google Patents
用于二维基板的加工站与用于加工二维基板的方法 Download PDFInfo
- Publication number
- CN104321858A CN104321858A CN201380018401.3A CN201380018401A CN104321858A CN 104321858 A CN104321858 A CN 104321858A CN 201380018401 A CN201380018401 A CN 201380018401A CN 104321858 A CN104321858 A CN 104321858A
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- CN
- China
- Prior art keywords
- substrate
- conveyer line
- substrate support
- delivery unit
- linear delivery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 178
- 238000012545 processing Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims description 16
- 238000003754 machining Methods 0.000 claims description 64
- 238000007639 printing Methods 0.000 claims description 42
- 230000033001 locomotion Effects 0.000 claims description 19
- 230000005855 radiation Effects 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 5
- 230000011218 segmentation Effects 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 description 13
- 230000032258 transport Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000005670 electromagnetic radiation Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012205249A DE102012205249A1 (de) | 2012-03-30 | 2012-03-30 | Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten |
DE102012205249.6 | 2012-03-30 | ||
PCT/EP2013/053655 WO2013143795A1 (de) | 2012-03-30 | 2013-02-25 | Bearbeitungsstation für flächige substrate und verfahren zum bearbeiten von flächigen substraten |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104321858A true CN104321858A (zh) | 2015-01-28 |
CN104321858B CN104321858B (zh) | 2016-11-23 |
Family
ID=47827172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380018401.3A Active CN104321858B (zh) | 2012-03-30 | 2013-02-25 | 用于二维基板的加工站与用于加工二维基板的方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9484234B2 (zh) |
EP (1) | EP2831911B1 (zh) |
CN (1) | CN104321858B (zh) |
DE (1) | DE102012205249A1 (zh) |
TW (1) | TWI540667B (zh) |
WO (1) | WO2013143795A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111989221A (zh) * | 2018-04-05 | 2020-11-24 | Ekra自动化系统有限公司 | 印刷设备 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104275916A (zh) * | 2014-10-17 | 2015-01-14 | 杰锐光能(苏州)有限公司 | 带有两套印刷台面的直线传输式晶硅太阳能电池印刷机 |
US20170077342A1 (en) * | 2014-12-02 | 2017-03-16 | Applied Materials Italia S.R.L. | Apparatus for printing on a substrate for the production of a solar cell, and method for transporting a substrate for the production of a solar cell |
KR20170091507A (ko) * | 2014-12-02 | 2017-08-09 | 어플라이드 머티어리얼스 이탈리아 에스.알.엘. | 기판을 프로세싱하기 위한 태양 전지 제조 장치, 및 태양 전지의 제조를 위해 기판을 프로세싱하기 위한 방법 |
JP6269793B1 (ja) * | 2016-12-05 | 2018-01-31 | 千住金属工業株式会社 | 搬送装置 |
DE102017204630A1 (de) | 2017-03-20 | 2018-09-20 | Ekra Automatisierungssysteme Gmbh | Druckvorrichtung |
CN111295767A (zh) * | 2017-10-27 | 2020-06-16 | 应用材料意大利有限公司 | 被配置为确定沉积布置的状态的设备、用于制造太阳能电池的系统、以及用于确定沉积布置的状态的方法 |
EP3762974B1 (en) * | 2018-03-08 | 2024-05-15 | Applied Materials Italia S.R.L. | Apparatus and method for manufacturing a solar cell arrangement |
WO2019170241A1 (en) * | 2018-03-08 | 2019-09-12 | Applied Materials Italia S.R.L. | Apparatus and method for manufacturing a solar cell arrangement |
DE102018205944A1 (de) | 2018-04-18 | 2019-10-24 | Ekra Automatisierungssysteme Gmbh | Drucksystem zum Bedrucken von Substraten, Verfahren zum Betreiben des Drucksystems |
CN115548160A (zh) * | 2021-06-30 | 2022-12-30 | 晶科能源股份有限公司 | 光伏电池串返修装置及维修方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2209096T5 (es) * | 1998-11-20 | 2007-11-01 | Mikron Sa Agno | Dispositivo para la generacion de un movimiento relativo. |
WO2007112454A2 (en) * | 2006-03-28 | 2007-10-04 | Stratusys Inc. | Apparatus and method for processing substrates using one or more vacuum transfer chamber units |
US8225496B2 (en) | 2007-08-31 | 2012-07-24 | Applied Materials, Inc. | Automated integrated solar cell production line composed of a plurality of automated modules and tools including an autoclave for curing solar devices that have been laminated |
DE502008000768D1 (de) * | 2007-11-01 | 2010-07-22 | Ferag Ag | Vorrichtung zum getakteten Umlenken von flächigen Gegenständen |
US8215473B2 (en) | 2008-05-21 | 2012-07-10 | Applied Materials, Inc. | Next generation screen printing system |
ITUD20080141A1 (it) * | 2008-06-19 | 2009-12-20 | Baccini S P A | Sistema di trasporto di precisione per stampa serigrafica |
US20110016739A1 (en) * | 2009-05-06 | 2011-01-27 | Bescorp. Inc. | Multi-directional conveyor and method |
IT1399285B1 (it) | 2009-07-03 | 2013-04-11 | Applied Materials Inc | Sistema di lavorazione substrato |
-
2012
- 2012-03-30 DE DE102012205249A patent/DE102012205249A1/de not_active Ceased
-
2013
- 2013-02-25 US US14/384,295 patent/US9484234B2/en active Active
- 2013-02-25 EP EP13707598.2A patent/EP2831911B1/de active Active
- 2013-02-25 CN CN201380018401.3A patent/CN104321858B/zh active Active
- 2013-02-25 WO PCT/EP2013/053655 patent/WO2013143795A1/de active Application Filing
- 2013-03-20 TW TW102109906A patent/TWI540667B/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111989221A (zh) * | 2018-04-05 | 2020-11-24 | Ekra自动化系统有限公司 | 印刷设备 |
CN111989221B (zh) * | 2018-04-05 | 2022-05-31 | Ekra自动化系统有限公司 | 印刷设备 |
Also Published As
Publication number | Publication date |
---|---|
TW201401410A (zh) | 2014-01-01 |
EP2831911A1 (de) | 2015-02-04 |
EP2831911B1 (de) | 2016-08-24 |
WO2013143795A1 (de) | 2013-10-03 |
US20150030418A1 (en) | 2015-01-29 |
TWI540667B (zh) | 2016-07-01 |
US9484234B2 (en) | 2016-11-01 |
CN104321858B (zh) | 2016-11-23 |
DE102012205249A1 (de) | 2013-10-02 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240816 Address after: Berlin, Germany Patentee after: Jonas and Redman Automation Technology Co.,Ltd. Country or region after: Germany Address before: Maltedingen, Germany Patentee before: JRT PHOTOVOLTAICS GmbH & Co.KG Country or region before: Germany |
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TR01 | Transfer of patent right |
Effective date of registration: 20240827 Address after: Maltedingen, Germany Patentee after: Exentis Innovation Ltd. Country or region after: Germany Address before: Berlin, Germany Patentee before: Jonas and Redman Automation Technology Co.,Ltd. Country or region before: Germany |