CN104272454A - 半导体模块以及半导体装置 - Google Patents

半导体模块以及半导体装置 Download PDF

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CN104272454A
CN104272454A CN201280072900.6A CN201280072900A CN104272454A CN 104272454 A CN104272454 A CN 104272454A CN 201280072900 A CN201280072900 A CN 201280072900A CN 104272454 A CN104272454 A CN 104272454A
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semiconductor module
semiconductor
semiconductor element
fixed
control substrate
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河内勇树
北井清文
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Mitsubishi Electric Corp
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Abstract

为了获得能够实现对模塑树脂施加的负载降低，并且能够在实现进一步的小型化的同时向固定对象固定的半导体模块，半导体模块(7)具备：半导体元件(1)；载置框架(2)，其用于载置半导体元件(1)；控制基板(5)，其用于安装对半导体元件(1)进行控制的控制部件(14)；以及模塑树脂(8)，其用于将半导体元件(1)、载置框架(2)以及控制基板(5)一起模塑起来。在控制基板(5)上设置有固定基部(5a)，该固定基部(5a)从模塑树脂(8)中露出，用于将半导体模块(7)固定在固定对象上。

Description

半导体模块以及半导体装置
技术领域
本发明涉及利用模塑树脂将半导体元件和控制基板一起封装而成的半导体模块以及使用该半导体模块的半导体装置。
背景技术
当前，使用通过利用模塑树脂将半导体元件和控制基板一起封装而实现尺寸的小型化的半导体模块(例如，参照专利文献1)。这样的半导体模块，有时用作在作为固定对象的机架上固定的半导体装置。为了将半导体模块固定在机架上，在模塑树脂上形成螺纹孔。
专利文献1：日本特开2006-54245号公报
发明内容
然而，形成在模塑树脂上的固定用螺纹孔，需要具有某种程度的尺寸。为此，将用于形成螺纹孔的区域设置在模塑树脂部分，由此半导体模块的小型化受到限制。另外，在利用螺钉经由模塑树脂进行固定的情况下，由于对模塑树脂施加长期的负载，因此还需要考虑因蠕变现象引起的变形。
本发明就是鉴于上述问题而提出的，其目的在于获得一种半导体模块，该半导体模块实现对模塑树脂施加的负载的降低，并且能够在实现进一步的小型化的同时向固定对象进行固定。
为了解决上述问题、实现目的，本发明提供一种半导体模块，其具备：半导体元件；载置框架，其用于载置半导体元件；控制基板，其用于安装对半导体元件进行控制的控制部件；以及模塑树脂，其用于将半导体元件、载置框架以及控制基板一起模塑起来，该半导体模块的特征在于，在控制基板上设置有固定基部，该固定基部从模塑树脂中露出，用于将半导体模块固定在固定对象上。
发明的效果
本发明所涉及的半导体模块实现如下效果，通过在控制基板上设置固定基部，从而能够实现对模塑树脂施加的负载的降低，并且能够在实现进一步的小型化的同时向固定对象进行固定。
附图说明
图1是表示本发明的实施方式1所涉及的半导体装置的概略结构的俯视图。
图2是沿着图1所示的A-A线的向视剖面图。
具体实施方式
以下，基于附图详细说明本发明的实施方式所涉及的半导体模块以及半导体装置。此外，本发明并不限定于该实施方式。
实施方式1.
图1是表示本发明的实施方式1所涉及的半导体装置的概略结构的俯视图。图2是沿着图1所示的A-A线的向视剖面图。半导体装置20具备半导体模块7和机架(固定对象)9，半导体模块7固定在机架9上。如图2所示，半导体模块7具备半导体元件1、引线框架(载置框架)2、绝缘片3、屏蔽板4、控制基板5、散热部件6以及模塑树脂8。
半导体元件1载置在引线框架2上。引线框架2的一部分向模塑树脂8的外部露出，与外部配线(未图示)等连接。半导体元件1经由引线框架2与外部配线连接。此外，半导体元件1的载置对象并不限定于与外部配线连接的引线框架2，只要是能够确保半导体元件1的载置位置的部件，也可以是其他部件。
在引线框架2的下部，隔着绝缘片3而设置散热部件6。散热部件6利用热传导性高的部件、例如金属而构成。在半导体元件1以及引线框架2的上方设置控制基板5。在控制基板5上安装用于控制半导体元件的控制部件14。在控制基板5和半导体元件之间，设置屏蔽板4。在本实施方式中，形成在控制基板5的成为半导体元件1侧的1个面上的实心图案作为屏蔽板4起作用。
模塑树脂8以覆盖半导体元件1、引线框架2、绝缘片3、屏蔽板4、控制基板5以及散热部件6的方式，利用树脂进行模塑而形成，构成半导体模块7的外廓。模塑树脂8设置成散热部件的1个面在半导体模块7的底面露出。
控制基板5形成为其一部分从半导体模块7中露出，该露出部分成为用于将半导体模块7固定在机架9上的固定基部5a。在本实施方式中，在4处设置有固定基部5a，但其数量并不限定于此。
在固定基部5a上形成螺纹孔10。半导体模块7经由形成在固定基部5a上的螺纹孔10并利用螺钉11固定在机架9上。以在隔着模塑树脂8的一侧和另一侧这两侧露出的方式设置有固定基部5a，从而使得半导体模块7稳定地固定在机架9上。
如图2所示，半导体模块7固定在机架9上，由此其底面与机架9紧密接触。由此，从半导体模块7的底面露出的散热部件6与机架9紧密接触。此外，也可以在控制基板5的固定基部5a和机架9之间设置衬垫13。衬垫13可以与机架9一体成型。机架9由铝等金属成型。机架9与地线12连接。
如以上所说明，通过使半导体模块7与机架9紧密接触，能够使因半导体元件1进行通断而产生的热从机架9散热。另外，用于将半导体模块7利用螺钉11固定在机架9上的螺纹孔10，未形成在模塑树脂8上，而是形成在控制基板5的固定基部5a上，因此可以不在模塑树脂8上形成螺纹孔10。为此，无需在模塑树脂8上设置用于形成螺纹孔10的多余的区域，因此，能够实现半导体模块7以及半导体装置20的进一步的小型化。另外，能够抑制模塑树脂8的树脂量，实现成本抑制。另外，通过半导体模块7的小型化，还能够实现向机架9进行固定的固定部位的削减。由此，能够实现将半导体模块7固定至机架9时的安装工时及部件的削减。
另外，由于利用螺钉11固定半导体模块7，因此对螺纹孔10部分长期施加负载。如果对模塑树脂8长期施加负载，则有时因蠕变现象而产生变形。在本实施方式中，由于在控制基板5上形成有螺纹孔10，因此不易对模塑树脂8施加用于向机架9进行固定的负载。因此，不易使模塑树脂8产生因蠕变现象引起的变形，能够实现产品的可靠性提高。
此外，作为模塑树脂8而使用环氧类的树脂，从而与使用硅类凝胶状树脂相比，能够实现散热性的提高。由此，能够将从安装于控制基板5的控制部件14产生的热经由模塑树脂8而高效地进行散热，能够在控制基板5上实现部件的高密度安装。
另外，如果使屏蔽板4与机架9连接，则能够使由安装在半导体元件1、控制基板5上的部件所产生的热向机架9散去，因此能够提高散热性，实现半导体模块7的小型化。此外，在本实施方式中，通过作为形成在控制基板5上的实心图案，使屏蔽板4从模塑树脂8露出，从而经由衬垫13与机架9连接。
另外，模塑树脂8由于绝缘耐压较高，因此即使对于栅极信号、栅极驱动电路等电源种类不同的部件来说，也能够将安装间隔、图案设为较窄，能够更进一步实现部件的高密度安装。另外，在现有技术中，在IC等引脚间距较窄的部件的情况下，发生泄漏，引起电路误动作，因此需要利用“ヒューミシール”(HumiSeal注册商标)等涂覆材料进行涂敷。在本实施方式中，利用作为绝缘体的树脂针对每个控制基板5进行模塑而形成模塑树脂8，因此即使在搭载小间距的IC的情况下，也无需进行涂敷。另外，通过使图案之间变窄，高密度安装小型部件，从而能够使控制基板5小型化，也有助于半导体模块7的小型化。
另外，如果半导体元件1使用SiC、GaN等宽带隙半导体元件，则能够实现电力损耗的降低，进一步使芯片尺寸小型化(例如，成为约1/3的芯片尺寸)，因此能够有助于半导体模块7的小型化。另外，由于半导体元件1的耐热性也提高，因此也能够使散热部件6小型化，能够进一步实现小型化。
另外，因半导体元件1的通断而产生的噪声成为控制基板5、其他电子仪器进行误动作的原因。在半导体元件1采用SiC、GaN等宽带隙半导体元件的情况下，开关噪声增加，但如果在控制基板5上作为屏蔽板4而形成实心图案，并与地线12电连接，则能够排出噪声而抑制控制基板5、其他电子仪器的误动作。在本实施方式中，使屏蔽板4与螺钉11接触，从而屏蔽板4经由螺钉11、机架9与地线12连接。
此外，在本实施方式中，列举说明了经由固定基部5a而利用螺钉固定将半导体模块7固定在机架9上的例子，但并不限定于此，只要是向机架9进行固定的固定力施加在固定基部5a上的方式，就能够适用本发明。例如，也可以构成为使固定基部5a向机架9侧弯曲，固定基部5a本身卡止在机架9上。
工业实用性
如上所述，本发明所涉及的半导体模块，对利用树脂将控制基板和半导体元件一起模塑而成的半导体模块是有效的。
标号的说明
1 半导体元件
2 引线框架(载置框架)
3 绝缘片
4 屏蔽板(实心图案)
5 控制基板
5a 固定基部
6 散热部件
7 半导体模块
8 模塑树脂
9 机架(固定对象)
10 螺纹孔
11 螺钉
12 地线
13 衬垫
14 控制部件
20 半导体装置

Claims (7)

1.一种半导体模块，其具备：半导体元件；载置框架，其用于载置所述半导体元件；控制基板，其用于安装对所述半导体元件进行控制的控制部件；以及模塑树脂，其用于将所述半导体元件、所述载置框架以及所述控制基板一起模塑起来，
该半导体模块的特征在于，
在所述控制基板上设置有固定基部，该固定基部从所述模塑树脂中露出，用于将所述半导体模块固定在固定对象上。
2.根据权利要求1所述的半导体模块，其特征在于，
所述固定基部以至少在隔着所述模塑树脂的一侧和另一侧露出的方式设置多个。
3.根据权利要求1或2所述的半导体模块，其特征在于，
在所述固定基部形成螺纹孔。
4.根据权利要求1至3中任一项所述的半导体模块，其特征在于，
所述半导体元件是宽带隙半导体元件。
5.根据权利要求1至4中任一项所述的半导体模块，其特征在于，
所述载置框架配置在所述控制基板的安装所述控制部件的面的相反面侧，
在所述控制基板的安装所述控制部件的面的相反面上，形成实心图案。
6.根据权利要求5所述的半导体模块，其特征在于，
所述实心图案与地线连接。
7.一种半导体装置，其特征在于，
具备：
权利要求1至6中任一项所述的半导体模块；以及
作为所述固定对象的金属制的机架，
通过将所述半导体模块固定在所述机架上，所述模塑树脂与所述机架紧密接触。
CN201280072900.6A 2012-05-17 2012-05-17 半导体模块以及半导体装置 Pending CN104272454A (zh)

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