CN104212997B - Cu‑Mn合金膜和Cu‑Mn合金溅射靶材以及Cu‑Mn合金膜的成膜方法 - Google Patents

Cu‑Mn合金膜和Cu‑Mn合金溅射靶材以及Cu‑Mn合金膜的成膜方法 Download PDF

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Publication number
CN104212997B
CN104212997B CN201410239491.5A CN201410239491A CN104212997B CN 104212997 B CN104212997 B CN 104212997B CN 201410239491 A CN201410239491 A CN 201410239491A CN 104212997 B CN104212997 B CN 104212997B
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alloy films
alloy
films
atom
oxygen
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CN104212997A (zh
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村田英夫
上滩真史
佐藤达也
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Proterial Ltd
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Hitachi Metals Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Conductive Materials (AREA)
CN201410239491.5A 2013-05-31 2014-05-30 Cu‑Mn合金膜和Cu‑Mn合金溅射靶材以及Cu‑Mn合金膜的成膜方法 Active CN104212997B (zh)

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JP2013115232 2013-05-31
JP2013-115232 2013-05-31
JP2013115232 2013-05-31

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CN104212997A CN104212997A (zh) 2014-12-17
CN104212997B true CN104212997B (zh) 2017-06-09

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JP (1) JP6376438B2 (ja)
KR (1) KR101609453B1 (ja)
CN (1) CN104212997B (ja)
TW (1) TWI504772B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104690266A (zh) * 2015-03-18 2015-06-10 宁波广博纳米新材料股份有限公司 用于制备晶片电阻器正面、背面电极的铜锰合金粉
CN107407744B (zh) 2015-03-20 2020-06-09 大日本印刷株式会社 防反射膜、使用了该防反射膜的显示装置、及防反射膜的选择方法
JP6190847B2 (ja) * 2015-06-16 2017-08-30 株式会社神戸製鋼所 平面ディスプレイ又は曲面ディスプレイ向け低反射電極
JP6042520B1 (ja) * 2015-11-05 2016-12-14 デクセリアルズ株式会社 Ｍｎ−Ｚｎ−Ｏ系スパッタリングターゲット及びその製造方法
JP6615407B2 (ja) * 2017-03-17 2019-12-04 富士フイルム株式会社 透明光学膜の製造方法および透明多層膜の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03271359A (ja) * 1990-03-20 1991-12-03 Japan Steel Works Ltd:The 複合酸化物の合成方法
SG88758A1 (en) * 1996-11-20 2002-05-21 Toshiba Kk Sputtering target and anti-ferromagnetic material film formed using thereof and magneto-resistance effect element formed by using the same
ID28206A (id) * 1998-08-13 2001-05-10 Ppg Ind Ohio Inc Komposisi, peralatan dan metode pembentukan lapisan dengan warna pilihan pada substrat dan barang-barang yang dihasilkannya
JP4065959B2 (ja) * 2004-08-31 2008-03-26 国立大学法人東北大学 液晶表示装置、スパッタリングターゲット材および銅合金
JP4851740B2 (ja) * 2005-06-30 2012-01-11 株式会社東芝 半導体装置およびその製造方法
JP4756458B2 (ja) * 2005-08-19 2011-08-24 三菱マテリアル株式会社 パーティクル発生の少ないＭｎ含有銅合金スパッタリングターゲット
JP2008135569A (ja) * 2006-11-28 2008-06-12 Rohm Co Ltd 半導体装置の製造方法および半導体装置
JP2010080607A (ja) * 2008-09-25 2010-04-08 Rohm Co Ltd 半導体装置の製造方法
JP2012189725A (ja) * 2011-03-09 2012-10-04 Kobe Steel Ltd Ｔｉ合金バリアメタルを用いた配線膜および電極、並びにＴｉ合金スパッタリングターゲット
JP5662874B2 (ja) * 2011-05-31 2015-02-04 株式会社神戸製鋼所 光情報記録媒体用記録膜および光情報記録媒体、並びに上記記録膜の形成に用いられるスパッタリングターゲット
KR101323151B1 (ko) * 2011-09-09 2013-10-30 가부시키가이샤 에스에이치 카퍼프로덕츠 구리-망간합금 스퍼터링 타겟재, 그것을 사용한 박막 트랜지스터 배선 및 박막 트랜지스터
JP5632821B2 (ja) * 2011-12-06 2014-11-26 株式会社神戸製鋼所 タッチパネルセンサー用Ｃｕ合金配線膜、及びその製造方法、並びにタッチパネルセンサー

Also Published As

Publication number Publication date
KR20140141493A (ko) 2014-12-10
KR101609453B1 (ko) 2016-04-05
CN104212997A (zh) 2014-12-17
JP6376438B2 (ja) 2018-08-22
TW201447004A (zh) 2014-12-16
JP2015007280A (ja) 2015-01-15
TWI504772B (zh) 2015-10-21

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