CN104209879B - Method for manufacturing soluble fixed soft abrasive-polishing film - Google Patents
Method for manufacturing soluble fixed soft abrasive-polishing film Download PDFInfo
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- CN104209879B CN104209879B CN201410461448.3A CN201410461448A CN104209879B CN 104209879 B CN104209879 B CN 104209879B CN 201410461448 A CN201410461448 A CN 201410461448A CN 104209879 B CN104209879 B CN 104209879B
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- polishing
- abrasive
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- bonding agent
- polishing film
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Abstract
The invention relates to a soluble fixed soft abrasive-polishing film, which comprises an abrasive layer and a substrate layer and has the thickness of 0.3 to 5mm. A soluble high-molecular material is used as a bonding agent of the abrasive layer, and a certain proportion of multilayer particle-diameter soft microfine abrasives are distributed and coated on the elastic substrate according to a certain rule. Small-particle-diameter abrasive particles not only can directly participate in a polishing process, but also can be used as a filling material and achieves the effect of supporting large particles, so that the content of a resin bonding agent in the polishing film is decreased, and the problems of film surface cracking and breakage are effectively solved. A specific nonpoisonous and harmless aqueous solvent is adopted in the machining process to solve the bonding agent on the surface layer of the polishing film, so that the holding force of he bonding agent for the abrasive particles is decreased to enable the bonding agent to fall off; on one hand, the passivated abrasive particles on the surface layer can be removed, so that the polishing film has more lasting polishing performance; on the other hand, the abrasive particles which are fixed on the surface of the polishing film and the abrasive particles which fall off and are dispersed into a polishing solution jointly act on a workpiece, so that the ultra-smooth high-efficiency surface polishing of the workpiece can be realized.
Description
Technical field
The present invention relates to/polishing field is ground, specifically a kind of solubility set mild abrasives polishing film making side
Method.
Background technology
With the continuous improvement of properties of product, machining accuracy and surface quality requirements of the modern optoelectronic information field to material
It is more and more high.Polishing technology always is a kind of topmost method of Ultra-precision Turning, is to reduce surface roughness, remove and damage
Layer, obtains smooth, not damaged surface final processing means.Traditional free abrasive that currently advanced field of ceramic processing is adopted is thrown
Light has that working (machining) efficiency is low, abrasive particle waste is serious, polishing fluid processing cost is high and environmental pollution, how to solve
Problem above, realizes that advanced ceramics device high-quality, polishing efficiently, green have become a weight in Ultra-precision Turning field
The problem wanted.
Fixed abrasive material polishing technology is that the one kind for developing in recent years is expected to realize advanced ceramics device efficient, high-quality processing
New method.But exist between general fixed abrasive material polishing main plane polishing pad, the fixation abrasive grain projection uniform using projection
Groove, is difficult to minor diameter part or the processing of non-flat surface parts.There is resinoid bond and easily stick in existing film polishing grinding tool
The problems such as polished surface, it is impossible to meet the needs of the high-quality batch production of advanced ceramics material components and parts.Therefore, research and develop
It is a kind of to be applied to the efficient of advanced ceramics devices in batches production, high-quality, low cost, the polishing film manufacture method of green particularly
It is necessary.
The content of the invention
To realize that advanced ceramics device efficient, high-quality, low cost, green are finished to target, the present invention proposes one kind
Solubility set mild abrasives polishing film manufacture method.Soft abrasive particle refers to that hardness of the abrasive grain is less than part material hardness.
To achieve these goals, the technical solution used in the present invention is a kind of solubility set mild abrasives polishing film
Manufacture method, using a kind of soluble high-molecular material as the bonding agent of soft fine abrasive, by multilamellar particle diameter a definite proportion is pressed
The soft fine abrasive of example distribution is coated on the mild abrasives layer that polishing film is formed in the film-substrate of elasticity, the soft mill
The bed of material includes following component, below by mass percentage：Bonding agent 10～30%, mild abrasives 50～60%, paraffin wax breast
Agent 1～5%, Sal 3～10%, abrasive material modifiers dispersants 1～5%, each composition mass percent sum is 100%；Making
During polishing film, first by bonding agent stirring and dissolving in water, gluey aqueous solution is made；Add acid stirring 5～20 minutes；Then
Soft fine abrasive, paraffin wax Emulsion, Sal are added, is stirred 5～30 minutes；Formalin is eventually adding, is stirred 5～30 minutes；Will
Ask the slurry after stirring to go out micro- pore foam, and keep certain mobility；The slurry being stirred is evenly laid out in film lining
Basal surface, in being placed in calorstat, 50～80 DEG C of steady temperature, temperature retention time 0.5～3 hour, drying and moulding；
The described soluble high-molecular material as bonding agent is：Polyvinyl alcohol, poly(ethylene oxide), alkyd resin, urea
The salt of urea formaldehyde, melamine resin, resol, polyacrylic acid or polymethylacrylic acid, it is a kind of or several
Plant combination；
Described thin film substrate material is：Dacron cloth, flaxen fiber cloth, non-woven fabrics, paper and cloth constitute complex matrix, carbon
Fiber reinforced resinous material, polyethylene, polypropylene, senior a- olefin polymers, coumarone-indene resin, EP rubbers, butene rubber,
Neoprene, butadiene-styrene rubber, SBS thermoplastic elastomer (TPE)s, SAN, ABS resin, polystyrene, polychlorostyrene
Ethylene, politef, polyvinyl acetate and (methyl) acrylics.
Further, the mild abrasives that mild abrasives layer is used are：Cerium oxide, silicon oxide, ferrum oxide, magnesium oxide, oxygen
One or more of change chromium, aluminium oxide, carborundum, the mixing particle diameter abrasive material prepared by a certain percentage；Described abrasive hardness is low
In workpiece material hardness；Described abrasive material can with workpiece material occur solid state reaction, realize that the nearly not damaged of material is efficiently removed.
Further, the polishing fluid that described mild abrasives layer is used in process is deionized water or pure water, ethanol
What solvent was constituted in proportion.
The present invention technology design be：With a kind of water-soluble high-molecular material, such as polyvinyl alcohol, poly(ethylene oxide), alkyd
Resin etc. will according to certain rules be distributed coating as bonding agent, the such as soft fine abrasive of multilamellar particle diameter, silicon oxide, cerium oxide
In the substrate base of elasticity.Small particle abrasive particle can directly participate in polishing process, can play and prop up as filler again
Oarse-grained effect is supportted, the resin-bonded agent content in polishing film is reduced, so as to effectively prevent existing film polishing mill
Because resinoid bond produces the problem that the physical property such as contraction change the film surface for causing cracking, collapse out in tool.In the course of processing
Using the bonding agent on described polishing fluid dissolving polishing film top layer, reducing bonding agent makes it come off the hold of abrasive particle, and one
Aspect can go skim-coat to be passivated abrasive particle, expose new abrasive particle, realize the self refresh of polishing film Abrasive Grain, gather around polishing film
There is more lasting polishing performance；On the other hand, the abrasive particle anchored on polishing film surface is distributed in polishing fluid with coming off
Abrasive particle to workpiece collective effect, be capable of achieving the efficient polishing of workpiece super-smooth surface.Simultaneously as bonding agent is dissolved, subtract
Pollution of the bonding agent to polished surface is lacked.
Meanwhile, make the mild abrasives stated to produce solid state reaction with ceramic material workpiece in process in grinding tool,
Realize that workpiece material is efficiently removed.This is because workpiece (ceramic material crystal) surface has planar defect, ceramic material crystal table
The atomic binding energy in face is in certain distribution.Therefore, although the hardness of abrasive material is less than ceramic material so that its ideal crystal is combined
Can be less than ceramic material, but ceramic material surfaces still some atom combination can be less than abrasive surface atom combination energy.
When abrasive particle is streaked in ceramic material surfaces, because of the atom phase counterdiffusion of effect mechanically and thermally, abrasive particle and ceramic material surfaces, have
A little abrasive material atoms clamp-on ceramic material top layer, more reduce the combination energy of ceramic material surfaces；When next abrasive particle streaks ceramics
During material surface, due to the reduction of ceramic material top layer atomic binding energy, material is removed easily.Therefore, by soft mill
The removal of material is realized in the chemical machinery effect produced between material and ceramic material, and its machining unit, thus can up to atom level
Obtain extremely low machined surface roughness.
Specific embodiment
Embodiment 1：
A kind of solubility set mild abrasives polishing film manufacture method, its structure is as shown in Figure 1.Mild abrasives layer 1 is adopted
Make with the following method：To make 100 grams of mild abrasives layers, abrasive material composition quality is weighed, it is as follows by mass percentage：Knot
It is that 50～60%, alditol quality is 1～5%, paraffin wax Emulsion quality that mixture (polyvinyl alcohol) quality is 10～25%, mild abrasives
It is 3～10% for 1～5%, Sal quality, abrasive material modifiers dispersants 0.5～1%, respectively constituting mass percent sum is
100%.It is silicon oxide that mild abrasives are selected, and grain size specification is respectively 300nm, 100nm, 40nm.Mass ratio is 5：2：3.
Making programme：First deionized water is put in reaction pot, polyvinyl alcohol is added under agitation, heated constant temperature to 85～
95 degrees Celsius, polyvinyl alcohol is set to be fully dissolved in water；10 grams of the hydrochloric acid of concentration 20～30% is added, is stirred 10～20 minutes；Again
Abrasive material, alditol that addition has been prepared, paraffin wax Emulsion, Sal are stirred 20～30 minutes；Add the first that concentration is 35～40%
Aldehyde liquid, stirs 20～30 minutes.It is required that the slurry after stirring goes out micro- pore foam, and keep certain mobility.
The slurry being stirred is poured in mould, die sleeve inwall is brushed with advance one layer of suds, one piece of thickness of liner on base plate
Spend the film-substrate 2 (such as non-woven fabrics, polyethylene material) for 0.1～1mm.Tiling slurry spreads out abrasive material on the surface of film-substrate 2
Thickness degree is 0.2～4mm.Material uniform mould in stand is put in constant temperature oven, steady temperature is 50～80 degrees Celsius, during insulation
Between 1～3 hour.It is dried, mould unloading.
The polishing film prepared using said method, polishes monocrystalline silicon piece, and load is 0.3MPa, grinding tool rotating speed 100r/
Min, polishing fluid adopts deionized water.Silicon chip surface roughness is finally reached below 10nm, unit interval workpiece material after polishing
Clearance reaches 11 microns.
Embodiment 2：
A kind of solubility set mild abrasives polishing film manufacture method, its structure is as shown in Figure 1.Mild abrasives layer 1 is adopted
With the following method：To make 100 grams of mild abrasives layers, abrasive material composition is weighed as follows by mass percentage：Bonding agent (alkyd
Resin) quality 12～20%, mild abrasives quality be 40～60%, alditol quality be 1～3%, paraffin wax Emulsion quality be 1～
5%th, Sal quality is 3～8%, abrasive material modifiers dispersants 0.5～1%.Abrasive material is cerium oxide, grain size specification be respectively 50 μm,
15μm、5μm.Mass ratio is 6：2：2.
Making programme：First deionized water is put in reaction pot, alkyd resin is added under agitation, heated constant temperature to 85～
95 degrees Celsius, alkyd resin is set to be fully dissolved in water；10 grams of the hydrochloric acid of concentration 20～30% is added, is stirred 10～15 minutes；Again
Abrasive material, alditol that addition has been prepared, paraffin wax Emulsion, Sal are stirred 10～20 minutes；Add the first that concentration is 35～40%
Aldehyde liquid, stirs 15～20 minutes.It is required that the slurry after stirring goes out micro- pore foam, and keep certain mobility.
The slurry being stirred is poured in mould, die sleeve inwall is brushed with advance one layer of suds, one piece of thickness of liner on base plate
Spend the film-substrate 2 (such as non-woven fabrics, polyethylene) for 0.1～1mm.Tiling slurry spreads out abrasive material thickness on the surface of film-substrate 2
Spend for 0.2～4mm.Material uniform mould in stand is put in constant temperature oven, steady temperature is 50～80 degrees Celsius, temperature retention time 1
～3 hours.It is dried, mould unloading.
The polishing film prepared using said method, polishes optical glass, and load is 0.4MPa, grinding tool rotating speed 100r/
Min, polishing fluid adopts deionized water.Optical lens surface roughness is finally reached below 10nm after polishing, and workpiece material is removed
Rate reaches 25 [mus.
Content described in this specification embodiment is only enumerating to the way of realization of inventive concept, the protection of the present invention
Scope is not construed as being only limitted to the concrete form that embodiment is stated, protection scope of the present invention also includes art technology
Personnel according to present inventive concept it is conceivable that equivalent technologies mean.
Claims (1)
1. a kind of solubility set mild abrasives polishing film manufacture method, it is characterised in that：Using a kind of soluble high-molecular
The soft fine abrasive that multilamellar particle diameter is distributed by a certain percentage is coated on elasticity by material as the bonding agent of soft fine abrasive
Film-substrate on, formed polishing film mild abrasives layer, the mild abrasives layer include following component, below press quality hundred
Divide than meter：Bonding agent 10～30%, mild abrasives 50～60%, paraffin wax Emulsion 1～5%, Sal 3～10%, modified point of abrasive material
Powder 1～5%, each composition mass percent sum is 100%；Make polishing film when, first by bonding agent stirring and dissolving in
In water, gluey aqueous solution is made；Add acid stirring 5～20 minutes；Soft fine abrasive, paraffin wax Emulsion, Sal are subsequently added into,
Stirring 5～30 minutes；Formalin is eventually adding, is stirred 5～30 minutes；It is required that the slurry after stirring goes out micro- pore foam, and protect
Hold certain mobility；The slurry being stirred is evenly laid out in film-substrate surface, in being placed in calorstat, steady temperature 50～
80 DEG C, temperature retention time 0.5～3 hour, drying and moulding；
The soluble high-molecular material as bonding agent is：Polyvinyl alcohol, poly(ethylene oxide), alkyd resin, Lauxite,
The salt of melamine resin, resol, polyacrylic acid or polymethylacrylic acid, one or more combination；
Described film-substrate is：Dacron cloth, flaxen fiber cloth, non-woven fabrics, paper and cloth constitute complex matrix, carbon fibre resin
Material, polyethylene, polypropylene, senior a- olefin polymers, coumarone-indene resin, EP rubbers, butene rubber, neoprene rubber
It is glue, butadiene-styrene rubber, SBS thermoplastic elastomer (TPE)s, SAN, ABS resin, polystyrene, polrvinyl chloride, poly-
Tetrachloroethylene, polyvinyl acetate, (methyl) acrylics；
The mild abrasives that the mild abrasives layer is used are：Cerium oxide, silicon oxide, ferrum oxide, magnesium oxide, chromium oxide, oxidation
One or more of aluminum, carborundum, the mixing particle diameter abrasive material prepared by a certain percentage；Described abrasive hardness is less than workpiece material
Hardness；Described abrasive material can occur solid state reaction with described workpiece material, realize that the nearly not damaged of material is efficiently removed；
The polishing fluid that the mild abrasives layer is used in process is that deionized water or pure water, alcohol solvent are constituted in proportion
's.
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| CN201410461448.3A CN104209879B (en) | 2014-09-11 | 2014-09-11 | Method for manufacturing soluble fixed soft abrasive-polishing film |
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| CN201410461448.3A CN104209879B (en) | 2014-09-11 | 2014-09-11 | Method for manufacturing soluble fixed soft abrasive-polishing film |
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| CN104209879B true CN104209879B (en) | 2017-04-12 |
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| CN107141673A (en) * | 2017-03-27 | 2017-09-08 | 湖北丽尔家日用品股份有限公司 | A kind of PVA polished silicon wafers and preparation method thereof |
| MX2020006850A (en) * | 2017-12-29 | 2020-08-24 | Saint Gobain Abrasives Inc | Abrasive buffing articles. |
| CN110052917A (en) * | 2019-04-27 | 2019-07-26 | 安徽工程大学 | A kind of sapphire polishing processing method based on concretion abrasive technology |
| CN110405543B (en) * | 2019-08-05 | 2020-08-04 | 衢州学院 | Ferrite substrate polishing method adopting acidic polishing solution and metal-based polishing disk |
| CN110405649B (en) * | 2019-08-05 | 2020-08-04 | 衢州学院 | Sol-gel polishing pellet added with soluble filler with water-resistant coating and preparation method thereof |
| CN112959233B (en) * | 2021-03-05 | 2022-08-16 | 南京航空航天大学 | Fixed abrasive polishing pad and deliquescent KDP crystal dry-type polishing method |
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| CN104209879A (en) | 2014-12-17 |
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