CN107141673A - A kind of PVA polished silicon wafers and preparation method thereof - Google Patents
A kind of PVA polished silicon wafers and preparation method thereof Download PDFInfo
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- CN107141673A CN107141673A CN201710188182.3A CN201710188182A CN107141673A CN 107141673 A CN107141673 A CN 107141673A CN 201710188182 A CN201710188182 A CN 201710188182A CN 107141673 A CN107141673 A CN 107141673A
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- pva
- silicon wafers
- polished silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
- C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/28—Condensation with aldehydes or ketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34922—Melamine; Derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/06—Vegetal fibres
- B32B2262/062—Cellulose fibres, e.g. cotton
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/554—Wear resistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/726—Permeability to liquids, absorption
- B32B2307/7265—Non-permeable
Abstract
The invention provides a kind of PVA polished silicon wafers, including flexible substrate and the PVA layers being arranged on flexible substrate, described PVA layers includes following component according to the mass fraction：10~70 parts of modified PVA；2~9 parts of fiber；It is ground 5~30 parts of sand；1~8 part of melamine；The modified PVA is that PVA powder is obtained with formaldehyde progress acetalation；Meanwhile, present invention also offers the preparation method of the PVA polished silicon wafers.PVA polished silicon wafers of the present invention not only have wearability, also there is certain toughness simultaneously, so as to realize PVA polished silicon wafers in 45~180 ° of scope bendings without being broken, and PVA polished silicon wafers can be cut into different shape size according to the actual requirements, it is convenient that accurate sanding and polishing is carried out to the tiny corner of small workpiece or workpiece by hand, expand the scope of application that PVA polishes product, quality of finish has been effectively ensured.
Description
Technical field
The invention belongs to polish production technical field, and in particular to a kind of PVA polished silicon wafers and preparation method thereof.
Background technology
PVA（Polyvinyl alcohol）A kind of widely used high molecular weight water soluble polymer, performance between plastics and rubber it
Between, product elasticity is good, crafters enrich, with wearability and it is specially treated have water resistance, therefore, PVA materials are now wide
It is general to be applied to grinding-polishing product.
However, because PVA toughness is poor, PVA polishings product currently used in the market typically has certain thickness,
And shape is fixed, such as PVA polishing wheels can only carry out sanding and polishing to workpiece by specific polishing machine, not be suitable for small workpiece
Sanding and polishing, this limit to a certain extent PVA polish product the scope of application；And produced because existing PVA is polished
Product have certain thickness, are difficult to carry out sanding and polishing to the tiny corner of workpiece, so as to influence the quality of finish of workpiece.
The content of the invention
It is an object of the invention to provide a kind of polishing effect is good, wear-resisting, stretch-proof flake structure PVA polished silicon wafers, expand
Big PVA polishes the scope of application of product.
The technical scheme is that there is provided a kind of PVA polished silicon wafers, including flexible substrate and it is arranged on flexible substrate
PVA layers, described PVA layers includes following component according to the mass fraction：10~70 parts of modified PVA；2~9 parts of fiber；Grinding
5~30 parts of sand；1~8 part of melamine；The modified PVA is that PVA powder is obtained with formaldehyde progress acetalation.
Further, described PVA layers also includes 1~5 part of buffing wax.
Further, the PVA powder and the mass ratio that formaldehyde acetalization is reacted are 4:3~5:1.
Further, the flexible substrate is cotton, paper cloth, plastic cloth, Ni Nongbu or non-woven fabrics.
Further, described PVA layers thickness is 1~10mm.
In addition, present invention also offers the preparation method of above-mentioned PVA polished silicon wafers, comprising the following steps：
1) it is PVA powder is soluble in water, stir, and high-temperature boiling material is carried out through 90~100 DEG C of steam.
2) to step 1) boil the formaldehyde of design flow, fiber, melamine, grinding sand and concentration 55% sequentially added in material
Sulfuric acid solution, be mixed evenly.
3) by step 2) obtained mixture is placed on forming panel, and one layer of flexible substrate is spread on the mixture, 60
2~3h is reacted under~90 DEG C of steam conditions.
4) reacted material is produced into PVA polished silicon wafers through cooling down, cleaning, dry, cut shaping.
Further, the step 1) in PVA powder and water mass ratio be 1:3~1:5.
The design principle of the present invention：Fiber uses chemical fibre or natural fiber, and fiber is used to increase PVA polishing flake products
Toughness；Grinding sand is used for doing the mineral matter or hard metal particle of grinding tool abrasive product for popularization, and its rigid structure causes PVA
Polishing flake products have grinding function；PVA powder carries out acetalation under catalyst sulfuric acid effect with formaldehyde and is modified
PVA, the modified PVA has certain adhesivity and wearability, and the stretch resistance energy for improving PVA polished silicon wafers is coordinated with fiber, so that
Guarantee to laminate the PVA polishing products of structure；Meanwhile, add a small amount of melamine, improve PVA polished silicon wafers intensity and
Water resistance；In addition, the design of flexible substrate further enhancing the tensile strength of PVA polished silicon wafers.
Compared with prior art, beneficial effects of the present invention：
(1) this PVA polished silicon wafers that the present invention is provided not only have wearability, while also having certain toughness, so as to realize
PVA polished silicon wafers are bent without being broken in 45~180 ° of scopes, and PVA polished silicon wafers can be cut into not similar shape according to the actual requirements
Shape size, expands the scope of application that PVA polishes product.
(2) this PVA polished silicon wafers that the present invention is provided are flake structure, are saved material, and convenient by hand to small workpiece
Or the tiny corner of workpiece carries out accurate sanding and polishing, and quality of finish has been effectively ensured.
(3) preparation method for this PVA polished silicon wafers that the present invention is provided is simple, and raw material is simple and easy to get, and production cost is low, tool
There is extensive market application foreground.
Embodiment
The technical scheme in the embodiment of the present invention is clearly and completely described below, it is clear that described embodiment
Only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, the common skill in this area
All other embodiment that art personnel are obtained under the premise of creative work is not made, belongs to the model that the present invention is protected
Enclose.
Embodiment 1：
Present embodiments provide a kind of PVA polished silicon wafers, including flexible substrate（Non-woven fabrics）With the PVA being arranged on flexible substrate
Layer, described PVA layers includes 10 parts of modified PVA；2 parts of fiber；It is ground 5 parts of sand；1 part of melamine；The modified PVA is
PVA powder carries out acetalation with formaldehyde and obtained.
The preparation method of the present embodiment PVA polished silicon wafers, comprises the following steps：
1) 8 parts of PVA powder are dissolved in 24 parts of water, stirred, and high-temperature boiling material 0.5h is carried out through 90~100 DEG C of steam.
2) to step 1) boil 6 parts of formaldehyde, 2 parts of fibers, 1 part of melamine, 5 parts of grinding sand and 6 parts sequentially added in material
The sulfuric acid solution of concentration 55%, is mixed evenly.
3) by step 2) obtained mixture is placed on forming panel, and one layer of paper cloth is spread on the mixture, 60~90
2h is reacted under DEG C steam condition, wherein, PVA polished silicon wafer thickness as needed can select the forming panel of different model.
4) reacted material is produced into PVA polished silicon wafers through cooling down, cleaning, dry, cut shaping.
Toughness detection experiment is carried out to PVA polished silicon wafers made from the present embodiment, after testing, PVA made from the present embodiment is thrown
The tensile strength of mating plate is 362MPa；And the PVA polished silicon wafers can be in 45~180 ° of scope bendings without being broken.
Experiment is polished using PVA polished silicon wafers made from the present embodiment, using metalwork as polishing object, through this implementation
After the PVA polished silicon wafers polishing of example, its finish is 0.020Ra.
Embodiment 2：
Present embodiments provide a kind of PVA polished silicon wafers, including flexible substrate (cotton) and the PVA layers that are arranged on flexible substrate,
Described PVA layers includes 35 parts of modified PVA；3 parts of fiber；It is ground 20 parts of sand；3 parts of melamine；1 part of buffing wax；The modification
PVA is that PVA powder is obtained with formaldehyde progress acetalation.
The preparation method of the present embodiment PVA polished silicon wafers, comprises the following steps：
1) 30 parts of PVA powder are dissolved in 120 parts of water, stirred, and high-temperature boiling material 1h is carried out through 90~100 DEG C of steam.
2) to step 1) boil sequentially added in material 10 parts of formaldehyde, 3 parts of fibers, 1 part of buffing wax, 3 parts of melamines, 20 parts
Sand and the sulfuric acid solution of 12 parts of concentration 55% are ground, is mixed evenly.
3) by step 2) obtained mixture is placed on forming panel, and one layer of cotton is spread on the mixture, 60~90
2.5h is reacted under DEG C steam condition, wherein, PVA polished silicon wafer thickness as needed can select the forming panel of different model.
4) reacted material is produced into PVA polished silicon wafers through cooling down, cleaning, dry, cut shaping.
Toughness detection experiment is carried out to PVA polished silicon wafers made from the present embodiment, after testing, PVA made from the present embodiment is thrown
The tensile strength of mating plate is 307MPa；And the PVA polished silicon wafers can be in 45~180 ° of scope bendings without being broken.
Experiment is polished using PVA polished silicon wafers made from the present embodiment, using metalwork as polishing object, through this implementation
After the PVA polished silicon wafers polishing of example, its finish is 0.023Ra.
Embodiment 3：
Present embodiments provide a kind of PVA polished silicon wafers, including flexible substrate（Plastic cloth）With the PVA being arranged on flexible substrate
Layer, described PVA layers includes 70 parts of modified PVA；9 parts of fiber；It is ground 30 parts of sand；8 parts of melamine；5 parts of buffing wax；It is described
Modified PVA is that PVA powder is obtained with formaldehyde progress acetalation.
The preparation method of the present embodiment PVA polished silicon wafers, comprises the following steps：
1) 60 parts of PVA powder are dissolved in 300 parts of water, stirred, and high-temperature boiling material 1.5h is carried out through 90~100 DEG C of steam.
2) to step 1) boil sequentially added in material 12 parts of formaldehyde, 9 parts of fibers, 5 parts of buffing waxs, 8 parts of melamines, 30 parts
Sand and the sulfuric acid solution of 20 parts of concentration 55% are ground, is mixed evenly.
3) by step 2) obtained mixture is placed on forming panel, and one layer of cotton is spread on the mixture, 60~90
3h is reacted under DEG C steam condition, wherein, PVA polished silicon wafer thickness as needed can select the forming panel of different model.
4) reacted material is produced into PVA polished silicon wafers through cooling down, cleaning, dry, cut shaping.
Toughness detection experiment is carried out to PVA polished silicon wafers made from the present embodiment, after testing, PVA made from the present embodiment is thrown
The tensile strength of mating plate is 284MPa；And the PVA polished silicon wafers can be in 45~180 ° of scope bendings without being broken.
Experiment is polished using PVA polished silicon wafers made from the present embodiment, using metalwork as polishing object, through this implementation
After the PVA polished silicon wafers polishing of example, its finish is 0.028Ra.
In summary, this PVA polished silicon wafers that the present invention is provided not only have wearability, while also having necessarily tough
Property, so that realize that PVA polished silicon wafers are bent without being broken in 45~180 ° of scopes, and PVA polished silicon wafers can be according to the actual requirements
Different shape size is cut into, it is convenient that accurate sanding and polishing is carried out to the tiny corner of small workpiece or workpiece by hand, expand PVA
The scope of application of product is polished, quality of finish has been effectively ensured.
It is exemplified as above be only to the present invention for example, do not constitute the limitation to protection scope of the present invention, it is all
It is to be belonged to the same or analogous design of the present invention within protection scope of the present invention.
Claims (7)
1. a kind of PVA polished silicon wafers, it is characterised in that：Including flexible substrate and the PVA layers being arranged on flexible substrate, the PVA
Layer includes following component according to the mass fraction：10~70 parts of modified PVA；2~9 parts of fiber；It is ground 5~30 parts of sand；Trimerization
1~8 part of cyanamide；The modified PVA is that PVA powder is obtained with formaldehyde progress acetalation.
2. PVA polished silicon wafers as claimed in claim 1, it is characterised in that：Described PVA layers also includes 1~5 part of buffing wax.
3. PVA polished silicon wafers as claimed in claim 1, it is characterised in that：The quality that the PVA powder reacts with formaldehyde acetalization
Than for 4:3~5:1.
4. PVA polished silicon wafers as claimed in claim 1, it is characterised in that：The flexible substrate is cotton, paper cloth, plastic cloth, Buddhist nun
Agriculture cloth or non-woven fabrics.
5. PVA polished silicon wafers as claimed in claim 1, it is characterised in that：Described PVA layers thickness is 1~10mm.
6. the preparation method of the PVA polished silicon wafers as described in any one of Claims 1 to 5, it is characterised in that：Comprise the following steps：
1) it is PVA powder is soluble in water, stir, and high-temperature boiling material is carried out through 90~100 DEG C of steam；
2) to step 1) boil the sulphur that the formaldehyde of design flow, fiber, melamine, grinding sand and concentration 55% are sequentially added in material
Acid solution, is mixed evenly；
3) by step 2) obtained mixture is placed on forming panel, and one layer of flexible substrate is spread on the mixture, 60~90
2~3h is reacted under DEG C steam condition；
4) reacted material is produced into PVA polished silicon wafers through cooling down, cleaning, dry, cut shaping.
7. the preparation method of PVA polished silicon wafers as claimed in claim 6, it is characterised in that：The step 1) in PVA powder and water
Mass ratio be 1:3~1:5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710188182.3A CN107141673A (en) | 2017-03-27 | 2017-03-27 | A kind of PVA polished silicon wafers and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710188182.3A CN107141673A (en) | 2017-03-27 | 2017-03-27 | A kind of PVA polished silicon wafers and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
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| CN107141673A true CN107141673A (en) | 2017-09-08 |
Family
ID=59783980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710188182.3A Pending CN107141673A (en) | 2017-03-27 | 2017-03-27 | A kind of PVA polished silicon wafers and preparation method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0757824B2 (en) * | 1990-11-29 | 1995-06-21 | 鐘紡株式会社 | Method for producing phenolic resin porous body |
| JP2005246584A (en) * | 2004-03-08 | 2005-09-15 | Shin Etsu Chem Co Ltd | Elastic grinding stone having uniform physical properties, and its manufacturing method |
| CN101445710A (en) * | 2008-12-30 | 2009-06-03 | 陈利佳 | Cross linking modified PVA environment-friendly watertight label adhesive and manufacture method thereof |
| CN102581780A (en) * | 2012-03-22 | 2012-07-18 | 厦门致力金刚石科技股份有限公司 | Flexible polishing sheet and production method thereof |
| CN103146104A (en) * | 2013-03-22 | 2013-06-12 | 黎尧文 | Production process for cleaning product |
| CN104209879A (en) * | 2014-09-11 | 2014-12-17 | 衢州学院 | Method for manufacturing soluble fixed soft abrasive-polishing film |
-
2017
- 2017-03-27 CN CN201710188182.3A patent/CN107141673A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0757824B2 (en) * | 1990-11-29 | 1995-06-21 | 鐘紡株式会社 | Method for producing phenolic resin porous body |
| JP2005246584A (en) * | 2004-03-08 | 2005-09-15 | Shin Etsu Chem Co Ltd | Elastic grinding stone having uniform physical properties, and its manufacturing method |
| CN101445710A (en) * | 2008-12-30 | 2009-06-03 | 陈利佳 | Cross linking modified PVA environment-friendly watertight label adhesive and manufacture method thereof |
| CN102581780A (en) * | 2012-03-22 | 2012-07-18 | 厦门致力金刚石科技股份有限公司 | Flexible polishing sheet and production method thereof |
| CN103146104A (en) * | 2013-03-22 | 2013-06-12 | 黎尧文 | Production process for cleaning product |
| CN104209879A (en) * | 2014-09-11 | 2014-12-17 | 衢州学院 | Method for manufacturing soluble fixed soft abrasive-polishing film |
Non-Patent Citations (1)
| Title |
|---|
| 李东光: "《实用化工产品配方与制备.7》", 30 June 2013, 北京：中国纺织出版社 * |
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Application publication date: 20170908 |