CN1088505A - Fixed abrasive polishing sheet - Google Patents
Fixed abrasive polishing sheet Download PDFInfo
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- CN1088505A CN1088505A CN 93111949 CN93111949A CN1088505A CN 1088505 A CN1088505 A CN 1088505A CN 93111949 CN93111949 CN 93111949 CN 93111949 A CN93111949 A CN 93111949A CN 1088505 A CN1088505 A CN 1088505A
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- wbn
- fixed abrasive
- silicon wafer
- cerium oxide
- polishing sheet
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Abstract
A kind of WBN (pricker zinc ore type boron nitride) fixed abrasive polishing sheet of glass being polished processing and preparation method thereof that is used for, polished silicon wafer be by 5-30%WBN micro mist, 50-85% cerium oxide, and 0-30 curing agent and 5-25% organic bond are formed.Method is for baking WBN micro mist → adding cerium oxide, curing agent mix → add organic adhesive → compression moulding → roasting curing earlier.This polished silicon wafer not only can be carried out efficient spherical polishing processing to glass, and can solve the problem of glass being carried out efficient plane polishing processing preferably.Compare with employing cerium oxide polished silicon wafer, cutting output can improve 2 times, and working ability can improve 10-20 times continuously, and first-time qualification rate can reach 90%, is a kind of novel polished silicon wafer.
Description
The present invention relates to instrument that glass is polished, more particularly, be a kind of glass is carried out efficient spherical polishing and glass is carried out the WBN(pricker zinc ore type boron nitride that the efficient plane polishing time is adopted, down with) fixed abrasive polishing sheet and preparation method thereof.
Traditional fixed abrasive material polished silicon wafer mainly is the cerium oxide polished silicon wafer.This cerium oxide polished silicon wafer is to be abrasive material with the cerium oxide; Adding other auxiliary material simultaneously, is that the bond compacting forms with resin.At present, this cerium oxide polished silicon wafer has obtained extensive use in glass being carried out efficient spherical polishing processing.There is following shortcoming man-hour but adopt this cerium oxide polished silicon wafer that glass is polished to add, the one, the cutting output of this polished silicon wafer is less, and operating efficiency is not high; The 2nd, this polished silicon wafer is difficult for keeping grinding tool face shape in polishing, has a strong impact on its continuous working ability, and the stock removal polishing product qualified rate is not high; The 3rd, this polished silicon wafer can only be carried out spherical polishing processing to glass, can not carry out plane polishing processing to glass, and application is narrower; The 4th, polish with this polished silicon wafer and to add man-hour, must finish grind and super grinding with the diamond precise abrasive plate earlier, to polish with this polished silicon wafer again, its operation is more numerous relatively.
The present invention's purpose, be glass to be polished the deficiency that exists in the processing at existing fixed abrasive material polished silicon wafer-cerium oxide polished silicon wafer, provide a kind of and can reach better polishing effect, can improve product qualified rate, can simplify the polishing manufacturing procedure of existing glass, not only can be used for glass is carried out efficient spherical polishing processing but also can carry out novel polishing sheet-WBN fixed abrasive polishing sheet of efficient plane polishing processing and preparation method thereof to glass.
Purpose of the present invention can realize like this:
A kind of WBN fixed abrasive polishing sheet, Main Ingredients and Appearance is (by a % weight), WBN micro mist 5-30, cerium oxide 50-85, curing agent 0-30, organic binder bond 5-25.
A kind of method of producing described WBN fixed abrasive polishing sheet comprises following processing step:
(1) baking WBN micro mist, 2 hours time, 100 ℃ of temperature;
(2) WBN micro mist, cerium oxide and the curing agent after will toasting evenly mixes;
(3) add organic binder bond;
(4) compression moulding, pressure 2.0-3.0MPa;
(5) roasting is solidified, and time 7-8 hour, 100 ℃-170 ℃ of temperature.
Key of the present invention is to have adopted with the synthetic WBN(pricker zinc ore type boron nitride of shock wave) micro mist is as the abrasive material of polished silicon wafer.This is a kind of ultra hard ceramic material polycrystalline micro mist with the synthetic WBN micro mist of shock wave, and its hardness is only second to diamond, but shock proof toughness is better than diamond, its distribution of particle sizes is in micron and sub-micrometer range, be multi-angular irregularly shaped, it is strong to have a grinding capacity, the characteristics that wearability is good; Its crystal grain is superfine in addition, be 20-30nm only, thereby self-sharpening is better.With the matrix of this pricker zinc ore type boron nitride micro mist as polished silicon wafer, only need the pressure of the granularity moulding of choose reasonable WBN micro mist, solidify the temperature of sintering, and the shape of polished silicon wafer, then can make and be applicable to the polished silicon wafer of different hardness glass being carried out efficient spherical polishing and plane polishing processing.
Organic binder bond among the present invention can be selected epoxy resin or phenolic resins, and curing agent can be selected gypsum or calcium carbonate.
Facts have proved, adopt WBN fixed abrasive polishing sheet of the present invention that glass is polished processing, compare with employing cerium oxide polished silicon wafer, cutting output can improve more than two times, working ability can improve 10-20 doubly continuously, and the stock removal polishing qualification rate reaches more than 90%, and finished product fineness can reach three grades.Not only can be used for glass is carried out efficient spherical polishing processing, and can replace classic method that glass is carried out efficient plane polishing processing, solve and glass is carried out efficient plane polished the difficult problem that this better solves as yet.Adopt the present invention that glass is polished and add man-hour, only need once to finish grind with the diamond precise abrasive plate, then can directly polish with the WBN polished silicon wafer, saved with the diamond precise abrasive plate and carried out this procedure of super grinding, improved the technical merit of existing glass polishing, be a kind of novel polishing sheet that can replace the cerium oxide polished silicon wafer and partly replace diamond super grinding sheet, reach the present invention's purpose.
The present invention will be described below in conjunction with example:
Example 1,
WBN fixed abrasive polishing sheet composition (by % weight): WBN micro mist 24, cerium oxide 57, gypsum 7, phenolic resins 12.
This routine preparation method: toast the WBN micro mist 2 hours under 100 ℃ of conditions (1); (2) WBN micro mist, cerium oxide and the gypsum after will toasting evenly mixes; (3) add phenolic resins; (4) need compression moulding by shape, briquetting pressure can be selected 2.5Mpa; (5) be that roasting curing promptly got finished product of the present invention in 7-8 hour under 115 ℃ of conditions in temperature.The granularity of WBN micro mist can be selected 2-3 μ m in this example.Polished silicon wafer can be used for the plane polishing processing to K class glass in this example.
Example 2,
WBN fixed abrasive polishing sheet composition (by % weight): WBN micro mist 16, cerium oxide 70, phenolic resins 14.
In the step of this routine preparation method: WBN micro mist and cerium oxide after (2) will toast evenly mix, and the roasting solidification temperature in (5) is outside 135 ℃, and all the other are all identical with example 1.The optional 0.6-1.0 μ of the granularity of WBN micro mist m in the example.Polished silicon wafer is suitable for BaK class glass is carried out spherical polishing processing in the example.
Example 3,
WBN fixed abrasive polishing sheet composition (by % weight): WBN micro mist 12, cerium oxide 77, epoxy resin 11.
In the step of this routine preparation method: the organic binder bond that adds in (3) is an epoxy resin, and briquetting pressure is 3.0Mpa in (4), and the roasting solidification temperature is 150 ℃ in (5), and all the other are all identical with example 2.The granularity of WBN may be selected to be 0.5-0.6 μ m in this example.This example is applicable to processes ZF class glass marble mirror polish.
Example 4:
WBN fixed abrasive polishing sheet composition (by % weight): WBN micro mist 11, cerium oxide 67, calcium carbonate 10, phenolic resins 12.
In the step of this routine preparation method, (2) are the WBN micro mist after will toasting, and cerium oxide and calcium carbonate evenly mix, and briquetting pressure is 2.0Mpa in (4), and the temperature that roasting is solidified in (5) is 120 ℃, and all the other are identical with example 1.WBN micro mist granularity is chosen as 0.5-0.6 μ m in the example.
This example is applicable to carries out spherical polishing processing to ZK class glass.
Claims (6)
1, a kind of WBN fixed abrasive polishing sheet, Main Ingredients and Appearance is (by a % weight), WBN micro mist 5-30, cerium oxide 50-85, curing agent 0-30, organic binder bond 5-25.
2, a kind of method of producing WBN fixed abrasive polishing sheet as claimed in claim 1 comprises following processing step:
(1) baking WBN micro mist, 2 hours time, 100 ℃ of temperature;
(2) WBN micro mist, cerium oxide and the curing agent after will toasting evenly mixes;
(3) add organic binder bond;
(4) compression moulding, pressure 2.0～3.0MPa;
(5) roasting is solidified, and time 7-8 hour, 100 ℃-170 ℃ of temperature.
3, by the described WBN fixed abrasive polishing sheet of claim 1, it is characterized in that described curing agent is a gypsum.
4, by the described WBN fixed abrasive polishing sheet of claim 1, it is characterized in that described curing agent is a calcium carbonate.
5, by the described fixed abrasive polishing sheet of claim 1, it is characterized in that described organic binder bond is a phenolic resins.
6, by the described fixed abrasive polishing sheet of claim 1, it is characterized in that described organic binder bond is an epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 93111949 CN1088505A (en) | 1993-08-23 | 1993-08-23 | Fixed abrasive polishing sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 93111949 CN1088505A (en) | 1993-08-23 | 1993-08-23 | Fixed abrasive polishing sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1088505A true CN1088505A (en) | 1994-06-29 |
Family
ID=4989698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 93111949 Pending CN1088505A (en) | 1993-08-23 | 1993-08-23 | Fixed abrasive polishing sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1088505A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104057403A (en) * | 2013-03-23 | 2014-09-24 | 厦门宇信金刚石工具有限公司 | Preparation method for epoxy resin binding agent diamond grinding tool with high polishing performance |
| CN104209879A (en) * | 2014-09-11 | 2014-12-17 | 衢州学院 | Method for manufacturing soluble fixed soft abrasive-polishing film |
| CN106363528A (en) * | 2016-08-30 | 2017-02-01 | 天通银厦新材料有限公司 | Fixed abrasive and grinding technique for sapphire |
-
1993
- 1993-08-23 CN CN 93111949 patent/CN1088505A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104057403A (en) * | 2013-03-23 | 2014-09-24 | 厦门宇信金刚石工具有限公司 | Preparation method for epoxy resin binding agent diamond grinding tool with high polishing performance |
| CN104057403B (en) * | 2013-03-23 | 2016-12-28 | 厦门宇信金刚石工具有限公司 | A kind of preparation method of the epoxy resin binder diamond grinding tool with high polishing performance |
| CN104209879A (en) * | 2014-09-11 | 2014-12-17 | 衢州学院 | Method for manufacturing soluble fixed soft abrasive-polishing film |
| CN104209879B (en) * | 2014-09-11 | 2017-04-12 | 衢州学院 | Method for manufacturing soluble fixed soft abrasive-polishing film |
| CN106363528A (en) * | 2016-08-30 | 2017-02-01 | 天通银厦新材料有限公司 | Fixed abrasive and grinding technique for sapphire |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |