CN104201160A - Enhanced boiling heat exchange structure with porous foam metal - Google Patents
Enhanced boiling heat exchange structure with porous foam metal Download PDFInfo
- Publication number
- CN104201160A CN104201160A CN201410452687.2A CN201410452687A CN104201160A CN 104201160 A CN104201160 A CN 104201160A CN 201410452687 A CN201410452687 A CN 201410452687A CN 104201160 A CN104201160 A CN 104201160A
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- China
- Prior art keywords
- foam metal
- heat
- conducting substrate
- porous foam
- enhanced boiling
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an enhanced boiling heat exchange structure with porous foam metal. The enhanced boiling heat exchange structure with porous foam metal comprises a heat-conducting substrate, and a porous foam metal layer closely bonded with one side of the heat-conducting substrate, and is characterized in that the porous foam pore equivalent diameter D of the porous foam metal layer is gradually increased from one side bonded with the heat-conducting substrate to the other side, the increasing rate ratio Dn/D(n-1) of the foam pore equivalent diameter Dn of the nth layer to the foam pore equivalent diameter D(n-1) of the (n-1)th layer is equal to 1.1 to 1.8, and n is a natural number. The foam metal with a non-uniform pore structure, disclosed by the invention effectively weakens a problem of a bubble flowing resistance in foam metal, increases a bubble escape speed, reinforces heat exchange, and saves metal consumables simultaneously; the heat-conducting substrate is combined together with one side of the foam metal by virtue of a welding technology, and the enhanced boiling heat exchange structure with the porous foam metal is simple and compact in structure, free from a contact thermal resistance, high in heat transfer efficiency, and capable of achieving a purpose of efficient heat exchange.
Description
Technical field
The present invention relates to a kind of heat transfer technology, what be specifically related to is a kind of enhanced boiling heat transfer structure of the through-hole foamed metal with non-homogeneous pore structure designing for high hot-fluid heat exchange property.
Background technology
Along with microelectric technique to miniaturization integrated and high-frequency high-speed future development, density of heat flow rate sharply increases, oneself becomes the bottleneck of restriction microelectronics industry development electronic radiation problem.The heat abstractor of optimal design electronic equipment, thus effectively reduce the temperature of key components, improve stability and the useful life of electronic equipment, become the problem in the urgent need to address in electronic equipment manufacturing field.
Utilize enhanced boiling heat transfer technology cool electronic chip to become the key technology in current electronic radiation field.Conventional structure has fin, micro-channel etc.Foam metal has the advantages such as high porosity, bigger serface, low-density, high thermal conductivity, high-fire resistance, is widely used in field of heat transfer.Utilize foam metal enhanced boiling heat transfer, can increase heat exchange area and bubble gasification core number, effectively improve exchange capability of heat.
But current foam metal pore structure is even, hole increases can reduce heat exchange area and thermal conductivity, and hole reduces can increase bubbly flow resistance.Utilize at present in the heat sink conception of foam metal, by changing the whole frame shape of foam metal and heat-conducting substrate laminating, address the above problem.But this kind of method is complex-shaped, make difficulty, be unfavorable for a large amount of Application and Development.
Summary of the invention
Technical problem to be solved by this invention is for above-mentioned the deficiencies in the prior art, and a kind of novel electronic chip enhanced boiling heat transfer structure is provided, and this heat exchange structure can improve the hot validity of pool boiling greatly, reaches the object of high efficient heat exchanging.
For solving the upper technical problem existing of electronic chip enhanced boiling heat transfer design, the technical solution used in the present invention is:
A kind of enhanced boiling heat transfer structure with porous foam metal, comprise heat-conducting substrate and the porous foam metal layer fitting tightly with described heat-conducting substrate one side, it is characterized in that: the porous foam hole equivalent diameter D of described porous foam metal layer is increased gradually by a side direction opposite side of fitting with heat-conducting substrate, n layer foam metal hole equivalent diameter D
nwith n-1 layer foam metal hole equivalent diameter D
n-1growth rate ratio be D
n/ D
n-1=1.1-1.8, n is natural number.
Described heat-conducting substrate length L is 5-30 mm, and width W is 5-30 mm, height H
1for 1-2mm; Described foam metal layer height H
2for 1-7mm, pore diameter D is 100 μ m-2mm.
Described foam metal is to make open-celled structure by copper or aluminium.
Described porous foam metal is made by hole agent pore-creating, vapour deposition or electrochemical deposition method.
Described foam metal and heat-conducting substrate utilize welding procedure to combine closely: during welding, heating heat-conducting substrate and foam metal are to the high temperature of 180-200 ℃, add metal scolding tin, welding heat-conducting substrate and foam metal, fit tightly foam metal and heat-conducting substrate.
The present invention adopts technique scheme, and compared with prior art tool has the following advantages:
1, the present invention is at a side welding porous foam metal layer of heat-conducting substrate, and porous foam metal layer is non-homogeneous pore structure, and pore-size is increased gradually by a side direction opposite side of fitting with heat-conducting substrate.Bottom adopts the foam metal of small-bore, increases heat exchange area and improves heat exchange coefficient; Top adopts wide-aperture foam metal, has weakened the bubbly flow resistance problem in foam metal, increases bubbles escape speed, strengthens exchange capability of heat, has reduced metal consumptive material simultaneously, has saved cost of manufacture.The equilibrium relation of considering heat exchange area and bubbles escape resistance, the growth rate ratio of n layer foam metal hole equivalent diameter Dn and n-1 layer foam metal hole equivalent diameter Dn-1 is Dn/ Dn-1=1.1-1.8.
2, the porous foam metal of non-homogeneous pore structure of the present invention, can make by methods such as hole agent pore-creating, vapour deposition, electrochemical depositions, and manufacture method is simple, is applicable to batch production.
3, the present invention adopts the method for foam metal and the equal high-temperature soldering of heat-conducting substrate, can make solder side more firm.Foam metal and heat-conducting substrate utilize welding procedure to combine closely, simple and compact for structure, do not have contact heat resistance, and heat transfer efficiency is high, reach the object of high efficient heat exchanging.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the front view of Fig. 1;
Fig. 3 is the end view of Fig. 2;
1. heat-conducting substrates in figure; 2. porous foam metal layer.
Embodiment
Below in conjunction with accompanying drawing, further describe in detail:
Fig. 1 has provided structural representation of the present invention, a kind of enhanced boiling heat transfer structure for high heat flux.Concrete structure comprises: the porous foam metal 2 of the heat-conducting substrate 1 on electronic chip surface, non-homogeneous pore structure.
Heat-conducting substrate 1 utilizes solder technology to combine with porous foam metal layer 2, simple and compact for structure, does not have contact heat resistance, and heat transfer efficiency is high.Heat-conducting substrate 1 structure length L is 5-30 mm, and width W is 5-30 mm, height H
1for 1-2mm.Foam metal layer 2 structure height H
2for 1-7mm, hole equivalent diameter D is 100 μ m-2mm.
Fig. 2, Fig. 3 have provided respectively front view and the end view of porous foam metal layer, and the pore-size of porous foam metal 2 is increased gradually by bottom to the top of heat-conducting substrate, n layer foam metal hole equivalent diameter D
nwith n-1 layer foam metal hole equivalent diameter D
n-1growth rate ratio be D
n/ D
n-1=1.1-1.8, n generally gets 1-5.
Foam metal 2 is to make open-celled structure by copper or aluminium, can make by methods such as hole agent pore-creating, vapour deposition, electrochemical depositions, and manufacture method is simple, is applicable to batch production.
Claims (5)
1. the enhanced boiling heat transfer structure with porous foam metal, comprise heat-conducting substrate and the porous foam metal layer fitting tightly with described heat-conducting substrate one side, it is characterized in that: the porous foam hole equivalent diameter D of described porous foam metal layer is increased gradually by a side direction opposite side of fitting with heat-conducting substrate, n layer foam metal hole equivalent diameter D
nwith n-1 layer foam metal hole equivalent diameter D
n-1growth rate ratio be D
n/ D
n-1=1.1-1.8, n is natural number.
2. enhanced boiling heat transfer structure according to claim 1, is characterized in that, described heat-conducting substrate length L is 5-30 mm, and width W is 5-30 mm, height H
1for 1-2mm; Described foam metal layer height H
2for 1-7mm, pore diameter D is 100 μ m-2mm.
3. enhanced boiling heat transfer structure according to claim 1, is characterized in that, described foam metal is to make open-celled structure by copper or aluminium.
4. enhanced boiling heat transfer structure according to claim 1, is characterized in that, described porous foam metal is made by hole agent pore-creating, vapour deposition or electrochemical deposition method.
5. enhanced boiling heat transfer structure according to claim 1, it is characterized in that, described foam metal and heat-conducting substrate utilize welding procedure to combine closely: during welding, heating heat-conducting substrate and foam metal are to the high temperature of 180-200 ℃, add metal scolding tin, welding heat-conducting substrate and foam metal, fit tightly foam metal and heat-conducting substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410452687.2A CN104201160A (en) | 2014-09-09 | 2014-09-09 | Enhanced boiling heat exchange structure with porous foam metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410452687.2A CN104201160A (en) | 2014-09-09 | 2014-09-09 | Enhanced boiling heat exchange structure with porous foam metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104201160A true CN104201160A (en) | 2014-12-10 |
Family
ID=52086432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410452687.2A Pending CN104201160A (en) | 2014-09-09 | 2014-09-09 | Enhanced boiling heat exchange structure with porous foam metal |
Country Status (1)
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104556279A (en) * | 2014-12-26 | 2015-04-29 | 巴布科克环境工程江苏有限公司 | Liquid distribution device for plate-type sea water desalination system |
| CN105845662A (en) * | 2015-01-29 | 2016-08-10 | 英飞凌科技股份有限公司 | Device including a metallization layer and method of manufacturing a device |
| CN106247302A (en) * | 2016-08-12 | 2016-12-21 | 东南大学 | A kind of dry saturated steam generating means of fractal structure |
| CN107195559A (en) * | 2017-04-27 | 2017-09-22 | 华中科技大学 | A kind of method for covering tin nano porous copper low-temperature bonding |
| CN107867020A (en) * | 2017-10-31 | 2018-04-03 | 东南大学 | A kind of enhanced boiling heat transfer structure with porous foam metal and preparation method thereof |
| CN108000977A (en) * | 2018-01-03 | 2018-05-08 | 梧州三和新材料科技有限公司 | A kind of Multi-layer graphite piece highly heat-conductive material with foam metal interlayer and preparation method thereof |
| CN108155162A (en) * | 2018-01-03 | 2018-06-12 | 梧州三和新材料科技有限公司 | A kind of three-dimensional high heat conduction highly exothermic of no glue laminating and preparation method thereof |
| CN108172554A (en) * | 2018-03-27 | 2018-06-15 | 梧州三和新材料科技有限公司 | A kind of high heat conduction and high-heating radiation piece and preparation method thereof |
| CN109764737A (en) * | 2018-12-27 | 2019-05-17 | 西安交通大学 | The composite structure surface of refrigerant closed cycle flash boiling spray cooling reinforcing heat exchange |
| CN109979899A (en) * | 2019-03-19 | 2019-07-05 | 武汉利之达科技股份有限公司 | A kind of composite heat sink and preparation method thereof containing foam metal layer |
| CN110108143A (en) * | 2019-04-12 | 2019-08-09 | 中国大唐集团新能源科学技术研究院有限公司 | A kind of phase change heat accumulator |
| CN112666207A (en) * | 2020-12-03 | 2021-04-16 | 航天特种材料及工艺技术研究所 | Method for testing thermal conductivity of porous high-thermal-conductivity material |
| WO2021145332A1 (en) * | 2020-01-15 | 2021-07-22 | 古河電気工業株式会社 | Heat transfer member and method for producing heat transfer member |
| CN113948241A (en) * | 2021-05-20 | 2022-01-18 | 万智豹 | High-power charging cable capable of conducting heat absorption and temperature control |
| CN114111428A (en) * | 2021-11-24 | 2022-03-01 | 华北电力大学 | Method for realizing time scale enhanced phase change boiling heat exchange through space architecture |
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| CN101220933A (en) * | 2008-01-31 | 2008-07-16 | 宁波安迪光电科技有限公司 | LED illumination device |
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| CN101533810A (en) * | 2009-04-20 | 2009-09-16 | 浙江大学 | Pulsating heat pipe radiator having foam |
| CN103060592A (en) * | 2013-01-11 | 2013-04-24 | 上海交通大学 | Through-hole metal foam with gradually varied morphologic characteristics, preparation method of through-hole metal foam, and heat exchange device |
| CN204067337U (en) * | 2014-09-09 | 2014-12-31 | 东南大学 | A kind of enhanced boiling heat transfer structure with porous foam metal |
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| TW425681B (en) * | 1998-11-04 | 2001-03-11 | Ind Tech Res Inst | Foaming metal heat sink |
| JP2004298962A (en) * | 2003-03-17 | 2004-10-28 | Mitsubishi Materials Corp | Solder joining material and power module substrate utilizing the same |
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| CN204067337U (en) * | 2014-09-09 | 2014-12-31 | 东南大学 | A kind of enhanced boiling heat transfer structure with porous foam metal |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104556279B (en) * | 2014-12-26 | 2018-07-17 | 巴布科克环境工程江苏有限公司 | A kind of board-like seawater desalination system liquid distributor |
| CN104556279A (en) * | 2014-12-26 | 2015-04-29 | 巴布科克环境工程江苏有限公司 | Liquid distribution device for plate-type sea water desalination system |
| CN105845662B (en) * | 2015-01-29 | 2020-01-07 | 英飞凌科技股份有限公司 | Device comprising a metallization layer and method of manufacturing a device |
| CN105845662A (en) * | 2015-01-29 | 2016-08-10 | 英飞凌科技股份有限公司 | Device including a metallization layer and method of manufacturing a device |
| CN106247302A (en) * | 2016-08-12 | 2016-12-21 | 东南大学 | A kind of dry saturated steam generating means of fractal structure |
| CN106247302B (en) * | 2016-08-12 | 2018-06-22 | 东南大学 | A kind of dry saturated steam generating means of fractal structure |
| CN107195559A (en) * | 2017-04-27 | 2017-09-22 | 华中科技大学 | A kind of method for covering tin nano porous copper low-temperature bonding |
| CN107867020A (en) * | 2017-10-31 | 2018-04-03 | 东南大学 | A kind of enhanced boiling heat transfer structure with porous foam metal and preparation method thereof |
| CN108000977A (en) * | 2018-01-03 | 2018-05-08 | 梧州三和新材料科技有限公司 | A kind of Multi-layer graphite piece highly heat-conductive material with foam metal interlayer and preparation method thereof |
| CN108155162A (en) * | 2018-01-03 | 2018-06-12 | 梧州三和新材料科技有限公司 | A kind of three-dimensional high heat conduction highly exothermic of no glue laminating and preparation method thereof |
| CN108172554A (en) * | 2018-03-27 | 2018-06-15 | 梧州三和新材料科技有限公司 | A kind of high heat conduction and high-heating radiation piece and preparation method thereof |
| CN108172554B (en) * | 2018-03-27 | 2024-02-06 | 梧州三和新材料科技有限公司 | High-heat-conductivity and high-heat-radiation sheet and preparation method thereof |
| CN109764737A (en) * | 2018-12-27 | 2019-05-17 | 西安交通大学 | The composite structure surface of refrigerant closed cycle flash boiling spray cooling reinforcing heat exchange |
| CN109979899A (en) * | 2019-03-19 | 2019-07-05 | 武汉利之达科技股份有限公司 | A kind of composite heat sink and preparation method thereof containing foam metal layer |
| CN110108143A (en) * | 2019-04-12 | 2019-08-09 | 中国大唐集团新能源科学技术研究院有限公司 | A kind of phase change heat accumulator |
| WO2021145332A1 (en) * | 2020-01-15 | 2021-07-22 | 古河電気工業株式会社 | Heat transfer member and method for producing heat transfer member |
| CN112666207A (en) * | 2020-12-03 | 2021-04-16 | 航天特种材料及工艺技术研究所 | Method for testing thermal conductivity of porous high-thermal-conductivity material |
| CN113948241A (en) * | 2021-05-20 | 2022-01-18 | 万智豹 | High-power charging cable capable of conducting heat absorption and temperature control |
| CN113948241B (en) * | 2021-05-20 | 2024-04-26 | 东莞市华劲技术有限公司 | High-power charging cable capable of absorbing heat and controlling temperature |
| CN114111428A (en) * | 2021-11-24 | 2022-03-01 | 华北电力大学 | Method for realizing time scale enhanced phase change boiling heat exchange through space architecture |
| CN114111428B (en) * | 2021-11-24 | 2023-01-20 | 华北电力大学 | Method for realizing time scale enhanced phase change boiling heat exchange through space architecture |
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Application publication date: 20141210 |
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