CN107979953A - Graded metal foam and fin combined radiator - Google Patents
Graded metal foam and fin combined radiator Download PDFInfo
- Publication number
- CN107979953A CN107979953A CN201711169574.1A CN201711169574A CN107979953A CN 107979953 A CN107979953 A CN 107979953A CN 201711169574 A CN201711169574 A CN 201711169574A CN 107979953 A CN107979953 A CN 107979953A
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- CN
- China
- Prior art keywords
- metal foam
- fin
- graded metal
- hole
- graded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Powder Metallurgy (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of graded metal foam and fin combined radiator, including：Exchange heat the double-deck graded metal foam of substrate, sintering in the fin and sintering for exchanging heat the different size on substrate on fin, wherein：The top section for being used to supplement the circulation for the liquid that evaporation needs in double-deck graded metal foam is the less homogeneous open-pore metal foam of hole, and the underclad portion for bubbles escape is the larger homogeneous open-pore metal foam of hole.The special construction of the present invention can greatly improve two-phase heat exchange efficiency, and the maximum boiling coefficient of heat transfer is 34 times of smooth copper coin, and boiling starting wall superheat degree is reduced to 2 3K, can be widely used in dissipation from electronic devices field.
Description
Technical field
The present invention relates to a kind of technology of circuit cooling field, is specifically a kind of graded metal foam and fin combination
Formula radiator.
Background technology
With the development of electronics industry, the heating power of electronic device is higher and higher, and the requirement to radiator is also increasingly
It is high.Gradient open-pore metal foam is a kind of high porosity (0.88-0.98), high-specific surface area (10000-13000m2/m3) it is more
Porous materials, flow-disturbing ability is very strong, can strengthen gas-liquid phase transition heat transfer effect significantly.Fin as a kind of excellent radiator structure,
Its advantage is to be easily worked, and cost price is low, and the coefficient of heat transfer is larger.Therefore, lead in electronic component cooling device according to gradient
Mesoporous metal foam and fin, which combine, carries out enhanced heat transfer, can significantly strengthen the heat-sinking capability of electronic device heat-exchanger rig.
The content of the invention
The present invention is ineffective and its advantages of solid-liquid heat exchange area is big for the boiling heat transfer of existing open-pore metal foam
The deficiency not being not fully exerted, proposes a kind of graded metal foam and fin combined radiator, can utilize Gao Kongmi
The advantage that metal foam heat exchange specific surface area is big, flow-disturbing ability is strong is spent, and the strong point of fin progress gas-liquid separation can be made full use of,
So as to reach the effect of enhancing boiling heat transfer ability.
The present invention is achieved by the following technical solutions：
The present invention includes：The fin and sintering of the different size of heat exchange substrate, sintering on heat exchange substrate are on fin
Double-deck graded metal foam, wherein：It is used for the upper strata for supplementing the circulation for the liquid that evaporation needs in double-deck graded metal foam
Part is the less homogeneous open-pore metal foam of hole, and the underclad portion for bubbles escape is the larger homogeneous through hole gold of hole
Belong to foam.
It is coupled between two layers of homogeneous open-pore metal foam up and down in the double-deck graded metal foam by method for brazing,
It is coupled between the heat exchange substrate and fin, between fin and graded metal foam by sintering process, so that further significantly
Reduce thermal contact resistance.
The agglomerated material is yellow gold piece.
The open-pore metal foam is prepared by investment casting.
The heat exchange substrate is preferably copper material, and thickness 1mm-2mm, is more preferably fine copper.
The hole density of the upper strata homogeneous open-pore metal foam is 60PPI~130PPI, and porosity is 0.8~0.9, thick
Spend for 2mm~3mm.
The hole density of the lower via hole metal foam is 5PPI~40PPI, and porosity is 0.92~0.98, and thickness is
3mm~6mm.
The fin shape is square, thickness 1mm-2mm, spacing 3mm-4mm, is highly 2mm~5mm.Technology
Effect
Compared with prior art, the less open-pore metal foam capillary force of upper strata hole of the present invention is larger, is steamed as supplement
The circulating pathway of the liquid needed is sent out, the larger open-pore metal foam of lower floor's hole is more advantageous to the escape of bubble, and bubble is from wing
Escape in cavity between piece, therefore, add to the escape paths separation of the inflow path and bubble of the liquid of evaporating area, significantly
The resistance run into during bubbles escape is reduced, so that boiling heat transfer coefficient increases.The special construction of the present invention can greatly improve
Boiling heat transfer efficiency, the maximum boiling coefficient of heat transfer are 3-4 times of smooth copper coin, and boiling starting wall superheat degree is reduced to 2-3K,
Dissipation from electronic devices field can be widely used in.
Brief description of the drawings
Fig. 1 is schematic diagram of the present invention；
In figure：Double-deck graded metal top layer of foam part 1, double-deck graded metal foam underclad portion 2, fin 3, heat exchange base
Plate 4.
Embodiment
As shown in Figure 1, the present embodiment includes：Heat exchange substrate 4, the fin 3 being sintered on heat exchange copper base 4, be sintered in wing
The double-deck graded metal foam 1,2 of on piece.
The top section 1 for the less structure of hole, the hole density is 60PPI~130PPI, described
Porosity is 0.8~0.9, and the depth of foam is 2mm~3mm.
The structure larger for hole of the homogeneous underclad portion 2, the hole density is 5PPI~40PPI, described
Porosity be 0.92~0.98, the depth of foam is 3mm~6mm.
The fin shape is square, its thickness is 1mm-2mm, spacing of fin 3mm-4mm, fin height 2mm
~5mm.
The top section 1 and underclad portion 2 is coupled by method for brazing, to reduce thermal contact resistance.
Above-mentioned open-pore metal foam is prepared by investment casting, and open-pore metal foam material is copper, nickel or aluminium.
The size of described heat exchange substrate 4 depending on the size of specific electronic device, top section 1, underclad portion 2,
Spacing, thickness and the height of fin 3 are depending on receiving heat exchange amount size.
Above-mentioned specific implementation can by those skilled in the art on the premise of without departing substantially from the principle of the invention and objective with difference
Mode carry out local directed complete set to it, protection scope of the present invention is subject to claims and not by above-mentioned specific implementation institute
Limit, each implementation in the range of it is by the constraint of the present invention.
Claims (6)
1. a kind of graded metal foam and fin combined radiator, it is characterised in that including：Heat exchange substrate, sintering are exchanging heat
Double-deck graded metal foam of the fin and sintering of different size on substrate on fin, wherein：Double-deck graded metal bubble
The top section for being used to supplement the circulation for the liquid that evaporation needs in foam is the less homogeneous open-pore metal foam of hole, for gas
The underclad portion of bubble escape is the larger homogeneous open-pore metal foam of hole；
It is coupled between two layers of homogeneous open-pore metal foam up and down in the double-deck graded metal foam by method for brazing, it is described
Heat exchange substrate and fin between, be coupled by sintering process between fin and graded metal foam.
2. graded metal foam according to claim 1 and fin combined radiator, it is characterized in that, the sintering material
Expect for yellow gold piece.
3. graded metal foam according to claim 1 and fin combined radiator, it is characterized in that, through hole gold
Belong to foam to be prepared by investment casting.
4. graded metal foam according to claim 1 and fin combined radiator, it is characterized in that, the heat exchange base
Plate is the fine copper that thickness is 1mm-2mm.
5. graded metal foam according to claim 1 and fin combined radiator, it is characterized in that, the upper strata is equal
The hole density of matter open-pore metal foam is 60PPI~130PPI, and porosity is 0.8~0.9, and thickness is 2mm~3mm；
The hole density of the lower via hole metal foam is 5PPI~40PPI, and porosity is 0.92~0.98, thickness 3mm
~6mm.
6. graded metal foam according to claim 1 and fin combined radiator, it is characterized in that, the fin shape
Shape is square, thickness 1mm-2mm, spacing 3mm-4mm, is highly 2mm~5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711169574.1A CN107979953A (en) | 2017-11-22 | 2017-11-22 | Graded metal foam and fin combined radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711169574.1A CN107979953A (en) | 2017-11-22 | 2017-11-22 | Graded metal foam and fin combined radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107979953A true CN107979953A (en) | 2018-05-01 |
Family
ID=62010705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711169574.1A Pending CN107979953A (en) | 2017-11-22 | 2017-11-22 | Graded metal foam and fin combined radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107979953A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600972A (en) * | 2018-12-14 | 2019-04-09 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of electronic equipment machine box structure of foam metal enhancing heat exchange |
| CN110010569A (en) * | 2019-05-06 | 2019-07-12 | 扬州大学 | A kind of gradient scale hole for heat dissipation of electronic chip is sintered the preparation method of core soaking sheet heat exchanger and its soaking sheet heat exchanger |
| WO2021145332A1 (en) * | 2020-01-15 | 2021-07-22 | 古河電気工業株式会社 | Heat transfer member and method for producing heat transfer member |
| CN113713721A (en) * | 2021-07-20 | 2021-11-30 | 西安交通大学 | Coupling sleeve hydrogen storage reactor of composite fin and metal foam |
| CN114226693A (en) * | 2021-12-23 | 2022-03-25 | 上海交通大学 | Preparation method of flexible gradient porous metal |
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| CN103157964A (en) * | 2011-12-13 | 2013-06-19 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacture method for aluminum-sintered temperature-equalizing board |
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2017
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Patent Citations (10)
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| CN102878844A (en) * | 2011-07-15 | 2013-01-16 | 奇鋐科技股份有限公司 | Temperature-uniformizing plate structure and manufacturing method for temperature-uniformizing plate |
| CN103157964A (en) * | 2011-12-13 | 2013-06-19 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacture method for aluminum-sintered temperature-equalizing board |
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| CN103060592A (en) * | 2013-01-11 | 2013-04-24 | 上海交通大学 | Through-hole metal foam with gradually varied morphologic characteristics, preparation method of through-hole metal foam, and heat exchange device |
| CN103322541A (en) * | 2013-06-28 | 2013-09-25 | 华南理工大学 | Integrated radiator based on foamy copper and micro-channel, and manufacturing method thereof |
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| CN203758330U (en) * | 2014-01-08 | 2014-08-06 | 南京航空航天大学 | Channel temperature-uniformizing plate |
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| CN104729338A (en) * | 2015-03-16 | 2015-06-24 | 上海交通大学 | Gradient metal foam heat dissipation device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600972A (en) * | 2018-12-14 | 2019-04-09 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of electronic equipment machine box structure of foam metal enhancing heat exchange |
| CN110010569A (en) * | 2019-05-06 | 2019-07-12 | 扬州大学 | A kind of gradient scale hole for heat dissipation of electronic chip is sintered the preparation method of core soaking sheet heat exchanger and its soaking sheet heat exchanger |
| CN110010569B (en) * | 2019-05-06 | 2023-11-21 | 扬州大学 | Gradient-scale pore sintering core soaking plate heat exchanger and preparation method thereof |
| WO2021145332A1 (en) * | 2020-01-15 | 2021-07-22 | 古河電気工業株式会社 | Heat transfer member and method for producing heat transfer member |
| CN113713721A (en) * | 2021-07-20 | 2021-11-30 | 西安交通大学 | Coupling sleeve hydrogen storage reactor of composite fin and metal foam |
| CN114226693A (en) * | 2021-12-23 | 2022-03-25 | 上海交通大学 | Preparation method of flexible gradient porous metal |
| CN114226693B (en) * | 2021-12-23 | 2022-11-01 | 上海交通大学 | Preparation method of flexible gradient porous metal |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180501 |
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| RJ01 | Rejection of invention patent application after publication |