CN104729338A - Gradient metal foam heat dissipation device - Google Patents
Gradient metal foam heat dissipation device Download PDFInfo
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- CN104729338A CN104729338A CN201510114972.8A CN201510114972A CN104729338A CN 104729338 A CN104729338 A CN 104729338A CN 201510114972 A CN201510114972 A CN 201510114972A CN 104729338 A CN104729338 A CN 104729338A
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Abstract
A gradient metal foam heat dissipation device comprises a cooling liquid circulation channel and a closed evaporation cavity. One side of the cooling liquid circulation channel and the inner wall of the closed evaporation cavity are both provided with gradient metal foam. The change range of the hole density of the gradient metal foam is from 3 PPI to 130 PPI, the change range of the porosity is from 0.5 to 0.98, and materials are red copper, stainless steel, aluminum and nickel. By the adoption of the gradient metal foam heat dissipation device, the structural features of the gradient metal foam are ingeniously used, heat of the wall of the bottom is dissipated in the mode that the evaporation cavity is additionally provided with the square channel, the heat exchange coefficient is greatly increased, the wall temperature of an electronic device can be effectively reduced, the operation performance of the electronic device is improved, and the service life of the electronic device is prolonged.
Description
Technical field
The present invention relates to a kind of technology of heat abstractor field, the graded metal loose foam thermal that specifically a kind of heat exchange efficiency is high.
Background technology
Eighties of last century eighties, the heat flow density of integrated circuit is about 10Wcm
?2, to the nineties then increase to 20 ?30Wcm
?2, within 2008, increase to 100Wcm
?2, future reaches as high as 1000Wcm
?2.The height of heat abstractor heat exchange efficiency directly has influence on runnability and the service life of electronic equipment.Therefore, developing efficient electronic device heat transmission equipment is a task urgently to be resolved hurrily.Current, the radiator of most electronic device is the aluminium fin of casting, although this radiator is easily processed, the coefficient of heat transfer is low, and radiating rate is slow, can not meet the requirement of current electron trade to heat radiation.And graded metal foam heat exchange specific area is large, there is the passage wriggled of dense metallic framework and gradual change inside, and quality is light, has very bright application prospect in phase-change heat-exchange field.
Through finding the retrieval of prior art, open (bulletin) the day 2006.12.13 of Chinese patent literature CN 1878451A, disclose a kind of heat abstractor, the multiple fin comprising pedestal and extend from base-plates surface, this base interior has an evaporation cavity, be filled with working fluid in chamber, wherein, in this working fluid, be added with nano particle.But in evaporation process, the nano particle in the evaporation cavity in this technology in working fluid easily deposits, and causes the reduction of effective thermal conductivity, reduce the overall heat exchange efficiency of this heat abstractor, be unfavorable for Long-Time Service.
Chinese patent literature CN104266519A, open (bulletin) day 2015.01.07, disclose a kind of open-pore metal foam heat pipe with hole density gradual change utilizing rigidity thermal conductor technical field, comprise: heat pipe and foam are sintered in the open-pore metal foam of heat pipe inner wall, wherein: the middle part skin of heat pipe is provided with adiabatic section, two ends are placed in cold junction and the hot junction of heat exchange environment respectively; The structure of open-pore metal foam is: interior bone is the structure of dense degree gradual change, and namely porosity is identical, and hole density increases gradually along heat pipe wall vertical direction or reduces; Or hole density is identical, porosity increases gradually along heat pipe wall vertical direction or reduces; Or hole density and porosity are all identical, the material of use presses layer change.This technology increases heat exchange specific area, being conducive to the flow and heat transfer of the fluid expanded gradually because being heated, enhancing capillary force, makes this heat pipe heat exchange efficiency when heat transfer effect is identical higher, and metal consumptive material is less, volume is less.But this technology prepares the complex process of the foam-filled heat pipe of graded metal, and cost is higher, and heat pipe easily damages, be unfavorable for reusing.
Chinese patent literature CN103528410A, open (bulletin) day 2014.01.22, discloses a kind of gravity heat pipe type metal foam flat plate heat exchanger, relates to a kind of flat plate heat exchanger.This technology is large in order to solve existing heat exchanger dividing plate both sides fluid temperature difference, the problem of heat exchanger effectiveness difference.The top board of this technology, base plate and two side plates enclose formation rectangular frame structure, dividing plate is arranged between top board and base plate, dividing plate, top board and base plate are all horizontally disposed with, the front and back sides of dividing plate is connected on two side plates, cry-fluid passage is formed between dividing plate and top board, high temperature fluid passage is formed between dividing plate and base plate, in cry-fluid passage and high temperature fluid passage, all sintering has metal foam, dividing plate offers multiple installing hole, gravity assisted heat pipe is arranged perpendicular to dividing plate, the stage casing of gravity assisted heat pipe is welded on installing hole, the condensation end of gravity assisted heat pipe is positioned at cry-fluid passage, the evaporation ends of gravity assisted heat pipe is positioned at high temperature fluid passage.This technology dividing plate both sides fluid temperature difference is little, and heat exchanger effectiveness is good.But this technology uses common homogeneous metal foam, can not meet the trend that heated liquid expands, thus heat exchange property is lower.
Summary of the invention
The present invention is directed to prior art above shortcomings, propose a kind of graded metal loose foam thermal.
The present invention is achieved by the following technical solutions:
The present invention relates to a kind of graded metal loose foam thermal, comprising: cooling fluid circulation passage and airtight evaporation cavity, wherein: the side of cooling fluid circulation passage and the inwall of airtight evaporation cavity are equipped with graded metal foam.
Described airtight evaporation cavity injects liquid by liquid injection channel, and this liquid is FC ?72 or deionized water.
Described liquid injection channel is provided with safety-valve, in case hypertonia in evaporation cavity, avoids evaporation cavity to explode.
The excursion of the hole density of described graded metal foam is 3PPI ~ 130PPI, porosity change scope 0.5 ~ 0.98, and material is red copper, stainless steel, aluminium, nickel.
The present invention relates to the preparation method of above-mentioned graded metal loose foam thermal, by realizing in the Muffle furnace under argon shield environment, its concrete steps comprise:
The first step, place between graded metal foam and copper plate a yellow gold sheet and clamping after sintering, make the first half of evaporation cavity; Repeat separately this operation in addition and obtain the latter half of evaporation cavity.
Second step, is positioned over the upper and lower two-part side of evaporation cavity some pieces of copper plates, arranges corresponding yellow gold sheet and clamps rear sintering, make closed evaporating chamber between copper plate with graded metal foam.
3rd step, setting gradually yellow gold sheet and graded metal foam in the upper body outside wall surface in closed evaporating chamber and sinters after stepping up, making the square duct for cooling.
4th step, arranging one for injecting the pipeline of the band valve of liquid, making heat abstractor in the side in closed evaporating chamber.
Described sintering refers to: be warming up to 950 DEG C by Muffle furnace and naturally cool to room temperature after keeping 30 minutes, graded metal foam and copper plate being sintered together.
Described Muffle furnace is preferably built-in argon shield.
Technique effect
Compared with prior art, the present invention utilizes the geometry feature of the interconnected pore gradual change of graded metal foam, is more conducive to the evaporation of liquid, and compared with traditional evaporation cavity, the coefficient of heat transfer of evaporation cavity of the present invention can improve an order of magnitude.The present invention, by means of the heat exchange property of graded metal foam excellence, can require according to the area of dissipation of electronic device the evaporation cavity making corresponding size, be suitable for large-scale application.
Accompanying drawing explanation
Fig. 1 is sectional view of the present invention;
In figure: heating surface copper base 1, graded metal foam 2, red copper wall 3, airtight evaporation cavity 4, graded metal foam 5, red copper wall 6, graded metal foam 7, cooling fluid circulation passage 8, red copper wall 9, liquid injection channel 10, safety-valve 11.
Fig. 2 is preparation process schematic diagram of the present invention;
In figure: a, b, c, d are followed successively by four steps.
Detailed description of the invention
Be described in detail to preferred embodiment of the present invention below in conjunction with accompanying drawing, to make advantage of the present invention more easily be readily appreciated by one skilled in the art, but protection scope of the present invention is not limited to this embodiment.
Embodiment 1
As shown in Figure 1, the present embodiment graded metal loose foam thermal, comprise: the cooling fluid circulation passage 10 be split to form by metallic plate and airtight evaporation cavity 4, wherein: the side of cooling fluid circulation passage 10 and the inwall of airtight evaporation cavity 4 are equipped with graded metal foam 2,5,7.
Described airtight evaporation cavity 4 injects liquid by liquid injection channel, and this liquid is FC ?72 or deionized water.
Described liquid injection channel 10 is provided with safety-valve 11, in case hypertonia in evaporation cavity, avoids evaporation cavity to explode.
The hole variable density scope of described graded metal foam 2,5,7 is consistent, is 3PPI ~ 130PPI; Porosity change scope 0.5 ~ 0.98; Material is red copper, stainless steel, aluminium, nickel.
The present embodiment realizes preparation by following steps:
The first step, between graded metal foam and copper plate, place a slice yellow gold sheet, with stainless steel flexible jig, they are clamped, then they are positioned in the Muffle furnace of argon shield environment.
Second step, opening power, rise to 950 DEG C by Muffle furnace in-furnace temperature, keeps 30 minutes.
3rd step, powered-down, naturally cool, in-furnace temperature is reduced to room temperature gradually.So just graded metal foam and copper plate are sintered together, make the latter half of evaporation cavity, as shown in Figure 2 a.
4th step, repeat above-mentioned first, second and third step, prepare the first half of evaporation cavity.
5th step, is placed on yellow gold sheet between the upper and lower two-part side of evaporation cavity and four pieces of copper plates, they is clamped with stainless steel flexible jig, then they are positioned in the Muffle furnace of argon shield environment, repeats second step and the 3rd step.Be prepared into closed evaporation cavity, as shown in Figure 2 b.
6th step, repeats first, second and third step, graded metal foam and evaporation cavity upper body outside wall surface is sintered together, be prepared into the square duct of cooling, as shown in Figure 2 c.
7th step, punches in the side of evaporation cavity, the pipeline of soldering one band valve, is convenient to inject liquid in evaporation cavity, as shown in Figure 2 d.
The present embodiment, by the latter half sintering graded metal foam 2 at evaporation cavity, is convenient to the evaporation of liquid.There is graded metal foam 5 at the first half sintering of evaporation cavity, be convenient to the whereabouts of the liquid that steam-condensation is formed.There is graded metal foam 7 at the bottom frit of square duct, be convenient to cooling liquid and the heat of evaporation cavity is taken away.The design feature of the graded metal foam that the present invention utilizes cleverly, with the form of evaporation cavity additional square duct, bottom wall heat is discharged, greatly improve the coefficient of heat transfer, the wall surface temperature of electronic device can be effectively reduced, improve the runnability of electronic device, extend the service life of electronic device.
The overall coefficient of heat transfer of graded metal loose foam hot charging of the present invention is compared with high 4 ~ 10 times without the evaporation cavity of filling metal foam, and the foam-filled evaporation cavity of more common homogeneous metal is high 2 ~ 5 times.
Claims (6)
1. a graded metal loose foam thermal, is characterized in that, comprising: cooling fluid circulation passage and airtight evaporation cavity, wherein: the side of cooling fluid circulation passage and the inwall of airtight evaporation cavity are equipped with graded metal foam;
The excursion of the hole density of described graded metal foam is 3PPI ~ 130PPI, porosity change scope 0.5 ~ 0.98, and material is red copper, stainless steel, aluminium, nickel.
2. graded metal loose foam thermal according to claim 1, is characterized in that, described airtight evaporation cavity injects liquid by liquid injection channel, and this liquid is FC ?72 or deionized water.
3. graded metal loose foam thermal according to claim 1, is characterized in that, described liquid injection channel is provided with safety-valve.
4. the preparation method of graded metal loose foam thermal according to above-mentioned arbitrary claim, it is characterized in that, concrete steps comprise:
The first step, place between graded metal foam and copper plate a yellow gold sheet and clamping after sintering, make the first half of evaporation cavity; Repeat separately this operation in addition and obtain the latter half of evaporation cavity;
Second step, is positioned over the upper and lower two-part side of evaporation cavity some pieces of copper plates, arranges corresponding yellow gold sheet and clamps rear sintering, make closed evaporating chamber between copper plate with graded metal foam;
3rd step, setting gradually yellow gold sheet and graded metal foam in the upper body outside wall surface in closed evaporating chamber and sinters after stepping up, making the square duct for cooling;
4th step, arranging one for injecting the pipeline of the band valve of liquid, making heat abstractor in the side in closed evaporating chamber.
5. method according to claim 4, is characterized in that, described sintering refers to: be warming up to 950 DEG C by Muffle furnace and naturally cool to room temperature after keeping 30 minutes, graded metal foam and copper plate being sintered together.
6. method according to claim 4, is characterized in that, the built-in argon shield of described Muffle furnace.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510114972.8A CN104729338B (en) | 2015-03-16 | 2015-03-16 | Graded metal loose foam thermal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510114972.8A CN104729338B (en) | 2015-03-16 | 2015-03-16 | Graded metal loose foam thermal |
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| CN104729338A true CN104729338A (en) | 2015-06-24 |
| CN104729338B CN104729338B (en) | 2016-11-16 |
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| CN201510114972.8A Active CN104729338B (en) | 2015-03-16 | 2015-03-16 | Graded metal loose foam thermal |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105716461A (en) * | 2016-02-05 | 2016-06-29 | 江苏科技大学 | Temperature equalizing plate with gradient porous capillary cores in plane direction and manufacturing method for temperature equalizing plate |
| CN107979953A (en) * | 2017-11-22 | 2018-05-01 | 上海交通大学 | Graded metal foam and fin combined radiator |
| CN114688889A (en) * | 2022-03-22 | 2022-07-01 | 东南大学 | Space lattice type foam metal-based intensified condensing device of aerospace thermal control system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201226636Y (en) * | 2008-07-04 | 2009-04-22 | 北京奇宏科技研发中心有限公司 | Liquid cooling radiating device with evaporation cavity |
| US20110284189A1 (en) * | 2010-05-24 | 2011-11-24 | Sumontro Sinha | Reusable high temperature thermal protection system |
| CN103134365A (en) * | 2013-02-17 | 2013-06-05 | 上海交通大学 | Through hole metal foam heat pipe heat exchange device with gradient topographic characteristics |
| CN103528410A (en) * | 2013-10-31 | 2014-01-22 | 中国石油大学(华东) | Gravity heat pipe type metal foam flat plate heat exchanger |
| CN103528406A (en) * | 2013-10-31 | 2014-01-22 | 中国石油大学(华东) | Flat-plate heat exchanger filled with metal foam at partial portion |
| CN104236359A (en) * | 2014-10-09 | 2014-12-24 | 中国石油大学 | Step phase change heat storage and heat release integrated device with metal foam |
-
2015
- 2015-03-16 CN CN201510114972.8A patent/CN104729338B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201226636Y (en) * | 2008-07-04 | 2009-04-22 | 北京奇宏科技研发中心有限公司 | Liquid cooling radiating device with evaporation cavity |
| US20110284189A1 (en) * | 2010-05-24 | 2011-11-24 | Sumontro Sinha | Reusable high temperature thermal protection system |
| CN103134365A (en) * | 2013-02-17 | 2013-06-05 | 上海交通大学 | Through hole metal foam heat pipe heat exchange device with gradient topographic characteristics |
| CN103528410A (en) * | 2013-10-31 | 2014-01-22 | 中国石油大学(华东) | Gravity heat pipe type metal foam flat plate heat exchanger |
| CN103528406A (en) * | 2013-10-31 | 2014-01-22 | 中国石油大学(华东) | Flat-plate heat exchanger filled with metal foam at partial portion |
| CN104236359A (en) * | 2014-10-09 | 2014-12-24 | 中国石油大学 | Step phase change heat storage and heat release integrated device with metal foam |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105716461A (en) * | 2016-02-05 | 2016-06-29 | 江苏科技大学 | Temperature equalizing plate with gradient porous capillary cores in plane direction and manufacturing method for temperature equalizing plate |
| CN107979953A (en) * | 2017-11-22 | 2018-05-01 | 上海交通大学 | Graded metal foam and fin combined radiator |
| CN114688889A (en) * | 2022-03-22 | 2022-07-01 | 东南大学 | Space lattice type foam metal-based intensified condensing device of aerospace thermal control system |
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| Publication number | Publication date |
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| CN104729338B (en) | 2016-11-16 |
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