CN100370605C - Heat sink for heat pipe - Google Patents
Heat sink for heat pipe Download PDFInfo
- Publication number
- CN100370605C CN100370605C CNB200410091897XA CN200410091897A CN100370605C CN 100370605 C CN100370605 C CN 100370605C CN B200410091897X A CNB200410091897X A CN B200410091897XA CN 200410091897 A CN200410091897 A CN 200410091897A CN 100370605 C CN100370605 C CN 100370605C
- Authority
- CN
- China
- Prior art keywords
- heat
- pipe
- foaming metal
- heat pipe
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The present invention discloses a heat-pipe heat dissipating device which comprises at least one heat pipe and foaming metal combined on the heat pipe, wherein the foaming metal is directly compounded on the heat pipe. The heat pipe is adopted by the heat-pipe heat dissipating device of the present invention to be combined on the foaming metal having a compact structure and oversize surface volume ratios, larger heat dissipating area can be obtained, and simultaneously structure is compact. The foaming metal is directly compounded on the heat pipe, larger interface resistance can be prevented from forming on the combination surface of the foaming metal and the heat pipe, and thus, heat dissipating efficiency is lifted.
Description
[technical field]
The invention relates to a kind of heat abstractor, particularly about a kind of heat-pipe radiating apparatus in order to electronic element radiating.
[background technology]
Along with the develop rapidly of electronics and information industry, the speed of updates such as various electronic product such as computer is obviously accelerated, function also from strength to strength, but simultaneously the heat that produces such as electronic component in it such as central processing unit is also more and more.For guaranteeing the normal operation of electronic product, industry is usually by installing heat abstractor with cooling that it is dispelled the heat.
In existing heat radiation field, heat pipe is owing to have and conduct heat fast characteristics and extensively used, and it is to utilize hydraulic fluid in the shell to absorb when gas, liquid two phase inversion or the principle of emitting big calorimetric is carried out work.Usually in use, an end of heat pipe is combined on the heat conducting base, and the other end is in conjunction with some radiating fins, distributes after heat-generating electronic elements absorbs heat and is passed to radiating fin by heat pipe by heat conducting base.Usually, for reaching bigger area of dissipation, usually the radiating fin quantity that is adopted is more, but for the electronic product that is developing at present towards miniaturization, microminiaturized direction, there has not been more space to hold the too much radiating fin of quantity, therefore, the heat abstractor of compact conformation has become inevitable development trend; In addition, these radiating fins heating tube that is stacked one by one again after manufacturing is finished usually wears, be to pass through welding sequence between heat pipe and the radiating fin, or adopt other existing combination to carry out combination, thereby on both faying faces, form bigger interface resistance inevitably, to the bigger influence of radiating effect generation of entire heat dissipation device.
[summary of the invention]
Technical problem underlying to be solved by this invention is to provide a kind of heat-pipe radiating apparatus with big area of dissipation and compact conformation.
Another technical problem to be solved by this invention is to provide a kind of heat-pipe radiating apparatus that has than low thermal resistance.
For solving above-mentioned technical problem underlying, heat-pipe radiating apparatus of the present invention comprises at least one heat pipe and is bonded to foaming metal on this heat pipe, is formed with the fluting that air feed stream passes through between this foaming metal.
As further improving of the present invention, above-mentioned foaming metal is directly to be compounded on this heat pipe by modes such as electrocasting, casting, foaming or THROUGH METHOD.
Compared with prior art, heat-pipe radiating apparatus of the present invention adopts heat pipe to be bonded to compact conformation and to have the foaming metal of the surface volume of super large than (being surface to volume ratio), can obtain big area of dissipation and while compact conformation; In addition, foaming metal directly is compounded on the heat pipe, can avoid forming bigger interface resistance on both faying faces, reduces the influence to radiating efficiency.
[description of drawings]
Below with reference to accompanying drawing, in conjunction with the embodiments the present invention is further described.
Fig. 1 is the lateral plan of heat-pipe radiating apparatus of the present invention.
Fig. 2 to Fig. 6 is the lateral plan of a plurality of embodiment of heat-pipe radiating apparatus of the present invention.
Fig. 7 is the schematic cross-section of the another embodiment of heat-pipe radiating apparatus of the present invention.
Fig. 8 is the schematic cross-section of another embodiment of heat-pipe radiating apparatus of the present invention.
[embodiment]
Fig. 1 is the lateral plan of first embodiment of heat-pipe radiating apparatus of the present invention, it comprises heat pipe 10 and is bonded to the wherein foaming metal 20 (can be described as foam metal again) on the end of this heat pipe 10, this foaming metal 20 is around the whole periphery that is formed on heat pipe 10 1 ends, foaming metal 20 mainly is with stainless steel, copper alloy, aluminium alloys etc. are object, it is higher to form porosity at material internal, the aperture is than the porous metals that are interconnected between big and hole, it has compact conformation and the super large surface volume characteristics than (can reach 10000 metre squared per cubic), thereby make the entire heat dissipation device when obtaining big area of dissipation and the physical dimension compactness can satisfy the radiating requirements with small space electronic product.
Utilize the processing procedure characteristics of above-mentioned foaming metal, the heat pipe 10 and the locus of foaming metal 20 also can arbitrarily be made up, as shown in Figure 2, this foaming metal 20 only is formed on the part of heat pipe 10 1 ends and places outward; As shown in Figure 3, this foaming metal 20 is around the whole periphery that is formed on heat pipe 10 1 ends, but is formed with fluting 30 between the foaming metal 20, so that air communication is crossed and reduced gas-flow resistance; As shown in Figure 4, this foaming metal 20 part of only being formed on heat pipe 10 1 ends place outward and foaming metal 20 between be formed with fluting 30; As Fig. 5 and shown in Figure 6, adopt many heat pipes 10 to be combined on the foaming metal 20, on the part of this foaming metal 20 around whole periphery that is formed on heat pipe 10 1 ends or periphery, and can be formed with fluting 30 between the foaming metal 20; As shown in Figure 7, being combined in many heat pipes 10 on the foaming metal 20 spatially can be definite shape and arrange, promptly be arranged into triangle as the circular heat pipe 10 among the figure, in addition, the cross section of the heat pipe 10 of institute's combination can also be template on the foaming metal 20, as shown in Figure 8 promptly in conjunction with plate shaped heat pipe 10a.
Among the present invention, adopt heat pipe 10 to be combined in compact conformation and have on the foaming metal 20 of surface volume ratio of super large, can obtain big area of dissipation and compact conformation simultaneously; In addition, because foaming metal 20 directly is compounded on the heat pipe 10, reducing radiating fin in the prior art makes separately and piles up one by one and then it is bonded to operation on the heat pipe, simultaneously, can avoid on the faying face of heat pipe and radiating fin, forming bigger interface resistance in conjunction with operation, thereby promote the radiating efficiency of heat-pipe radiating apparatus of the present invention owing to existing.
Claims (9)
1. heat-pipe radiating apparatus, it comprises at least one heat pipe, it is characterized in that: be combined with foaming metal on this heat pipe, be formed with the fluting that air feed stream passes through between this foaming metal.
2. heat-pipe radiating apparatus as claimed in claim 1 is characterized in that: described foaming metal directly is compounded on this heat pipe.
3. heat-pipe radiating apparatus as claimed in claim 1 or 2 is characterized in that: described foaming metal is made by the mode of electroforming.
4. heat-pipe radiating apparatus as claimed in claim 1 or 2 is characterized in that: described foaming metal is made by the mode of casting.
5. heat-pipe radiating apparatus as claimed in claim 1 or 2 is characterized in that: described foaming metal is made by the mode of foaming.
6. heat-pipe radiating apparatus as claimed in claim 1 or 2 is characterized in that: described foaming metal is made by the mode of seepage flow.
7. heat-pipe radiating apparatus as claimed in claim 1 or 2 is characterized in that: described heat pipe is a template.
8. heat-pipe radiating apparatus as claimed in claim 1 or 2 is characterized in that: described foaming metal is combined in an end of heat pipe.
9. heat-pipe radiating apparatus as claimed in claim 8 is characterized in that: foaming metal is combined in the whole periphery of this heat pipe one end or partly outer placing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200410091897XA CN100370605C (en) | 2004-12-25 | 2004-12-25 | Heat sink for heat pipe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200410091897XA CN100370605C (en) | 2004-12-25 | 2004-12-25 | Heat sink for heat pipe |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1797753A CN1797753A (en) | 2006-07-05 |
CN100370605C true CN100370605C (en) | 2008-02-20 |
Family
ID=36818665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200410091897XA Expired - Fee Related CN100370605C (en) | 2004-12-25 | 2004-12-25 | Heat sink for heat pipe |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100370605C (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101282629B (en) | 2007-04-06 | 2010-05-26 | 富准精密工业(深圳)有限公司 | Cooling device |
CN104348291A (en) * | 2013-07-26 | 2015-02-11 | 上海众汇泡沫铝材有限公司 | Foam aluminum heat radiator for motor |
CN104955311A (en) * | 2014-03-27 | 2015-09-30 | 玉晶光电股份有限公司 | Cooling device and manufacturing method thereof |
TWI573976B (en) * | 2014-03-27 | 2017-03-11 | 玉晶光電股份有限公司 | Cooling device and the manufacturing method thereof |
CN104201160A (en) * | 2014-09-09 | 2014-12-10 | 东南大学 | Enhanced boiling heat exchange structure with porous foam metal |
CN107202509A (en) * | 2017-06-08 | 2017-09-26 | 无锡来德电子有限公司 | A kind of temperature-uniforming plate composite foam metal radiator |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06221750A (en) * | 1993-01-21 | 1994-08-12 | Showa Alum Corp | Heat insulating panel |
US6411508B1 (en) * | 2000-01-29 | 2002-06-25 | Korea Institute Of Science And Technology | Foam metal heat sink |
CN1093251C (en) * | 1993-12-27 | 2002-10-23 | 日立化成工业株式会社 | Heat transfer member and manufacturing method |
-
2004
- 2004-12-25 CN CNB200410091897XA patent/CN100370605C/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06221750A (en) * | 1993-01-21 | 1994-08-12 | Showa Alum Corp | Heat insulating panel |
CN1093251C (en) * | 1993-12-27 | 2002-10-23 | 日立化成工业株式会社 | Heat transfer member and manufacturing method |
US6411508B1 (en) * | 2000-01-29 | 2002-06-25 | Korea Institute Of Science And Technology | Foam metal heat sink |
Also Published As
Publication number | Publication date |
---|---|
CN1797753A (en) | 2006-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6966585B2 (en) | Microreactor system and microreactor method | |
CN104764350B (en) | Method for manufacturing uniform-heating plate with foam copper as liquid absorption core | |
TWI275770B (en) | Heat dissipation device with heat pipes | |
US20130168071A1 (en) | 3d porous material comprising machined side | |
CN103900412B (en) | There is the open-pore metal foam heat pipe of gradual change shape characteristic | |
CN105352352A (en) | Ultra-thin even-temperature plate device and manufacturing method thereof | |
CN1836146A (en) | Heat transfer device and method of making same | |
TW201231903A (en) | Thin heat pipe structure and method of manufacturing the same | |
CN110542337A (en) | 3D printing porous capillary core ultrathin flat heat pipe and printing method | |
CN104201160A (en) | Enhanced boiling heat exchange structure with porous foam metal | |
US20120210581A1 (en) | Manufacturing heat exchanger from porous medium and conduits | |
CN100370605C (en) | Heat sink for heat pipe | |
JP2018527546A (en) | Integrated multi-chamber heat exchanger | |
CN110530184A (en) | The temperature-uniforming plate and its manufacturing method that aluminum bronze combines | |
CN109411431A (en) | A kind of heat exchange structure and preparation method thereof | |
KR20080032324A (en) | Heat sink and fabricating method the same using metal foam | |
CN108120333A (en) | A kind of flat-plate heat pipe microchannel composite heating radiator and its manufacturing method | |
KR101329886B1 (en) | Evaporator for phase change heat transfer system | |
CN215832540U (en) | Ultra-light high-performance copper-aluminum composite soaking plate | |
JP2002318085A (en) | Heat pipe and its manufacturing method | |
CN113758325A (en) | VC radiator with built-in copper/diamond sintered wick and preparation method thereof | |
JP2017143094A (en) | Heat sink, thermoelectric conversion module, method of manufacturing heat sink | |
EP0930480A3 (en) | Heat exchanger | |
CN116060717A (en) | High-precision coating method for diamond metal composite material surface | |
CN115443048A (en) | Loop heat pipe structure and electronic product |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080220 Termination date: 20100125 |