CN101220933A - LED illumination device - Google Patents

LED illumination device Download PDF

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Publication number
CN101220933A
CN101220933A CNA2008100333269A CN200810033326A CN101220933A CN 101220933 A CN101220933 A CN 101220933A CN A2008100333269 A CNA2008100333269 A CN A2008100333269A CN 200810033326 A CN200810033326 A CN 200810033326A CN 101220933 A CN101220933 A CN 101220933A
Authority
CN
China
Prior art keywords
led
foam
foam metal
lighting device
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008100333269A
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Chinese (zh)
Inventor
刘学勇
楼洪献
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Andy Optoelectronic Co Ltd
Original Assignee
Ningbo Andy Optoelectronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Andy Optoelectronic Co Ltd filed Critical Ningbo Andy Optoelectronic Co Ltd
Priority to CNA2008100333269A priority Critical patent/CN101220933A/en
Publication of CN101220933A publication Critical patent/CN101220933A/en
Pending legal-status Critical Current

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Abstract

The invention relates to an LED lighting device which includes a shell body and an LED light source module, wherein, the LED light source module includes a plurality of LEDs and LED supporters. The LED is arranged on the LED supporter which includes a foam metal layer which is formed by a foam metal with a through hole structure and a cooling device which is arranged on the surface of the foam metal layer or in a containing space that is formed in the foam metal layer.

Description

The LED lighting device
[technical field]
The present invention relates to the LED lighting technical field, or rather, relate to a kind of LED lighting device.
[background technology]
Development and maturation along with the LED technology, the performance indications of LED increase substantially day by day, the light efficiency of white light LEDs has has met or exceeded the light efficiency level of ordinary incandescent lamp at present, and luminous flux is also increasing considerably, and makes LED obtain using widely at lighting field.LED compare with the energy-saving lighting lamp of general photo-voltaic power supply adapted have the life-span long, heating is low, not fragile, power consumption is little and more energy-conservation outstanding advantage, people it be described as 21 century replace fluorescent lamps and incandescent lamp the 4th generation lighting source.
Present LED lighting device normally is installed in many light emitting diodes mode in accordance with regulations and forms the lumination of light emitting diode module on the aluminium base, dispels the heat by aluminium base.In order to reach the heat radiation requirement, often need to increase the thickness of aluminium base, increased the weight of whole lighting so on the one hand, be inconvenient to use, the opposing party also certainly will increase manufacturing cost, and for high power LED lighting lamp, it is especially obvious that this defective seems.Such as, high power LED road lamp of about 120 watts by the aluminium base heat radiation, its weight is probably about 9 kilograms, wherein most increases the thickness of aluminium base for the needs that reach heat radiation and the height of fin produces, this has increased the weight of whole street lamp on the one hand greatly, make installing/dismounting all inconvenient, and increased material cost; On the other hand for too high fin, under the especially integrated situation, also than higher, and the yield rate of product can decrease to the requirement of mould, and this has also increased manufacturing cost to a certain extent; And even so, it also is difficult to arrive desirable radiating effect on the whole.
[summary of the invention]
The technical problem that the present invention solves is to overcome the defective that prior art exists, provide a kind of in light weight, cost is low and the good LED lighting device of radiating effect.
The present invention is achieved by the following technical solutions: a kind of LED lighting device, comprise housing and led light source module, wherein said led light source module comprises some LED and LED supporter, described LED is installed on the described LED supporter, described LED supporter comprises a foam metal layer and a cooling fan that is formed by the foam metal with through-hole structure, and described cooling fan is configured in the foam metal laminar surface or is configured in the receiving space that forms in the foam metal layer.
Described foam metal is a kind of in foam iron, foam copper, foamed aluminium, foam iron alloy, foam copper alloy, the foam aluminium alloy.
Hole count is 10~50 on the described foam metal per inch.
Described LED is fixed on the circuit board of being made by Heat Conduction Material, and described LED is fixed on the described LED supporter by circuit board.
Be provided with heat-conducting glue between described circuit board and the LED supporter.
Described LED supporter also comprises part surface that is formed at foam metal layer and the metal supporting layer that is used to support described LED to small part.
Described metal supporting layer is one with foam metal by electroplating to engage.
Described cooling fan is configured in the part except that being formed with the metallic support layer region in the described foam metal laminar surface.
Except that the part that is formed with metal supporting layer, there is part to be closed in the remaining surface in the described foam metal laminar surface.
The described metal supporting layer solid metal layer that the material identical with foam metal made of serving as reasons.
Compared with prior art, LED lighting device of the present invention is by improving the LED supporter, dispose cooling fan at the foam metal laminar surface or in the receiving space that foam metal layer forms when on supporter, forming foam metal layer, make heat that LED produces when passing to foam metal layer rapidly, flowing velocity by air in the 3 D stereo network structure of cooling fan acceleration foam metal inside, when guaranteeing that the long-pending first mate of heat source-contacting surface increases, take away by the heat that quickly LED that carries on the LED supporter is produced that flows of hot gas fast, played extraordinary radiating effect.In addition, adopt foam metal can also save a large amount of metal materials, also reduced the weight of whole LED lighting device simultaneously significantly, not only economy but also easy to use.
[description of drawings]
Fig. 1 is the schematic perspective view of led light source module embodiment one in the LED lighting device of the present invention.
Fig. 2 is the schematic perspective view of another angle of Fig. 1.
Fig. 3 is the schematic perspective view of led light source module embodiment two in the LED lighting device of the present invention.
Fig. 4 is the schematic perspective view of led light source module embodiment three in the LED lighting device of the present invention.
Fig. 5 is the schematic perspective view of led light source module embodiment four in the LED lighting device of the present invention.
Fig. 6 is the schematic diagram of LED lighting device of the present invention.
[specific embodiment]
Embodiment one
See also Fig. 1, Fig. 2 and shown in Figure 6, LED lighting device 9 of the present invention, comprise housing 7 and led light source module 8, led light source module 8 comprises led light source part 1 and LED supporter 2, wherein said led light source part 1 comprises some LED (not shown) and carries the circuit board of being made by the good Heat Conduction Material of heat conductivility (as aluminium) 10 of described LED, described LED is configured in and forms some LED light-emitting sections (not label) on the circuit board 10, certainly better going out light effect in order to obtain, also can be every LEDs configuration lens devices 11 according to actual needs; Described LED supporter 2 comprises foam metal layer 21 and is used to support the metal supporting layer 20 of described LED to small part, described foam metal layer 21 by foam metal with through-hole structure (as foam iron, foam copper, foamed aluminium, foam iron alloy, the foam copper alloy, foam aluminium alloy) forms, hole count is 10~50 on this foam metal per inch, adopt foam copper in the present embodiment, described metal supporting layer 20 is formed at the part surface of foam metal layer 21, the solid metal layer that this metal supporting layer 20 is made by the metal material identical with foam metal, such as adopting foam copper in the present embodiment, 20 of metal supporting layer are solid metal copper layer, described metal supporting layer 20 engages with foam metal layer 21 and is one, and preferred mode is one for by plating metal supporting layer 20 is engaged with foam metal layer 21.Described LED supporter 2 also disposes a cooling fan 23, this cooling fan 23 is configured in foam metal layer 21 surfaces part except that being formed with metal supporting layer 20 zones, in Fig. 1 and Fig. 2 cooling fan 23 has been shown and has been arranged on foam metal layer and the metal supporting layer 20 relative one sides of setting up.Described LED is fixed on the described LED supporter 2 by circuit board 10, in the present embodiment, described LED is fixed on the metal supporting layer 20 by circuit board 10, circuit board 10 is close to metal supporting layer 20 and is contacted as far as possible in large area with it, be close between the metal supporting layer 20 at circuit board 10 and also Heat Conduction Material can be set, such as heat-conducting glue etc.When the led light source module is worked like this, the heat that LED produces passes to metal supporting layer 20 by heat conduction circuit board 10, by metal supporting layer 20 heat is passed to foam metal layer 21 rapidly, 3 D stereo network structure by foam metal 21 inside, the long-pending first mate of air and heat source-contacting surface is increased, 3 D stereo network structure and through hole that cooling fan 23 rotates by foam metal 21 inside, the flowing velocity of foam metal layer 21 inner airs will be accelerated, the heat that LED is produced is taken away fast, plays better radiating effect.In addition, adopt foam metal can also save a large amount of metal materials, also reduced the weight of whole LED lighting device 9 simultaneously significantly, not only economy but also easy to use.
Embodiment two
See also shown in Figure 3ly, LED lighting device that this embodiment disclosed and the difference of embodiment one are led light source module 8 ', and in the present embodiment, the cooling fan 23 of described led light source module 8 ' is configured in the side of foam metal layer 21.Its operation principle is identical with embodiment two, is not giving unnecessary details at this.
Embodiment three
See also shown in Figure 4ly, LED lighting device that this embodiment disclosed and the difference of embodiment one are led light source module 8 ", in the present embodiment, a side is arranged in the side of foam metal layer 21 by a heat-insulating shield 25 sealings.The side that this embodiment can be closed at the particular location setting of thermal source and the position of cooling fan 23 to reach better radiating effect, effectively solve local heat source's concentration problem.The part that is closed is specifically determined according to the position of thermal source, such as other sides in can closed side, the side that only stays the thermal source position keeps open, when cooling fan 23 work, air only flows through from the side of thermal source position, will effectively solve local heat source's concentration problem.
Embodiment four
See also shown in Figure 5ly, LED lighting device that this embodiment disclosed and the difference of embodiment two are led light source module 8 , and in the present embodiment, cooling fan 23 is configured in the receiving space that foam metal layer forms.Its operation principle is identical with embodiment two, is not giving unnecessary details at this.
More than describing is embodiments of the invention only, forgives and can understand, and under the prerequisite that does not depart from the present invention's design, all should be included within the technical conceive of the present invention simple modification of the present invention and replacement.

Claims (10)

1. LED lighting device, comprise housing and led light source module, wherein said led light source module comprises some LED and LED supporter, described LED is installed on the described LED supporter, it is characterized in that: described LED supporter comprises a foam metal layer and a cooling fan that is formed by the foam metal with through-hole structure, and described cooling fan is configured in the foam metal laminar surface or is configured in the receiving space that forms in the foam metal layer.
2. LED lighting device as claimed in claim 1 is characterized in that: described foam metal is a kind of in foam iron, foam copper, foamed aluminium, foam iron alloy, foam copper alloy, the foam aluminium alloy.
3. LED lighting device as claimed in claim 1 or 2 is characterized in that: hole count is 10~50 on the described foam metal per inch.
4. LED lighting device as claimed in claim 1 is characterized in that: described LED is fixed on the circuit board of being made by Heat Conduction Material, and described LED is fixed on the described LED supporter by circuit board.
5. LED lighting device as claimed in claim 4 is characterized in that being provided with heat-conducting glue between described circuit board and the LED supporter.
6. LED lighting device as claimed in claim 1 is characterized in that: described LED supporter also comprises part surface that is formed at foam metal layer and the metal supporting layer that is used to support described LED to small part.
7. LED lighting device as claimed in claim 6 is characterized in that: described metal supporting layer is one with foam metal by electroplating to engage.
8. as claim 6 or 7 described LED lighting devices, it is characterized in that: described cooling fan is configured in the part except that being formed with the metallic support layer region in the described foam metal laminar surface.
9. LED lighting device as claimed in claim 8 is characterized in that: except that the part that is formed with metal supporting layer, have part to be closed in the remaining surface in the described foam metal laminar surface.
10. as claim 1,2 or 7 described LED lighting devices, it is characterized in that: the described metal supporting layer solid metal layer that the material identical with foam metal made of serving as reasons.
CNA2008100333269A 2008-01-31 2008-01-31 LED illumination device Pending CN101220933A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2008100333269A CN101220933A (en) 2008-01-31 2008-01-31 LED illumination device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2008100333269A CN101220933A (en) 2008-01-31 2008-01-31 LED illumination device

Publications (1)

Publication Number Publication Date
CN101220933A true CN101220933A (en) 2008-07-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008100333269A Pending CN101220933A (en) 2008-01-31 2008-01-31 LED illumination device

Country Status (1)

Country Link
CN (1) CN101220933A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104201160A (en) * 2014-09-09 2014-12-10 东南大学 Enhanced boiling heat exchange structure with porous foam metal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104201160A (en) * 2014-09-09 2014-12-10 东南大学 Enhanced boiling heat exchange structure with porous foam metal

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Open date: 20080716