CN101220934A - LED illumination device - Google Patents

LED illumination device Download PDF

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Publication number
CN101220934A
CN101220934A CN 200810033327 CN200810033327A CN101220934A CN 101220934 A CN101220934 A CN 101220934A CN 200810033327 CN200810033327 CN 200810033327 CN 200810033327 A CN200810033327 A CN 200810033327A CN 101220934 A CN101220934 A CN 101220934A
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CN
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Prior art keywords
led
metal
layer
foam
supporting
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CN 200810033327
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Chinese (zh)
Inventor
刘学勇
楼洪献
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宁波安迪光电科技有限公司
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/002Cooling arrangements
    • F21V29/004Natural cooling, i.e. by natural convection, conduction or radiation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The invention relate to an LED lighting device which includes a shell body and an LED light source module, wherein, the LED light source module includes a plurality of LEDs and LED supporters. The LED is arranged on the LED supporter which includes a foam metal layer and a metal supporting layer, at least part of which is used for supporting the LED. The foam metal layer is formed by a foam metal which is provided with a through hole structure and the metal supporting layer is formed on part of the surface of the foam metal layer. The metal supporting layer and the foam metal layer are jointed into a whole.

Description

【技术领域】本发明涉及LED照明技术领域,更确切地说,涉及一种LED照明装置。 [Technical Field] The present invention is an LED lighting device relates to the field of LED lighting technology, and more particularly, relates. 【背景技术】随着LED技术的发展与成熟,LED的性能指标日益大幅度提高,目前白光LED的光效已经达到甚至超过普通白炽灯的光效水平,光通量也在大幅度增加,使LED在照明领域得到了广泛的应用。 BACKGROUND With the development of LED technology and mature, LED performance indicators increasingly greatly improved, the current white LED light efficiency has been achieved and even exceeded the level of an ordinary incandescent light efficiency, luminous flux is also a substantial increase in the LED lighting has been widely used. LED与一般光伏电源配用的节能照明灯具相比具有寿命长、发热低、不易损坏、功耗小及更加节能的突出优点,人们把它誉为21世纪替代荧光灯和白炽灯的第四代照明光源。 Energy-saving lighting LED equipped with general photovoltaic power compared to having long life, low heat generation, not easily damaged, and highlight the advantages of low power consumption more energy efficient, it hailed as the 21st century people replace incandescent and fluorescent lighting fourth generation light source. 目前的LED照明装置,通常是把多颗发光二极管按规定的方式安装在铝基板上形成发光二极管发光模组,通过铝基板散热。 Current LED lighting device, usually the predetermined multi-segment LED mounted on the aluminum substrate formed light emitting diode module, the heat dissipation through the aluminum plate. 为了达到散热要求,往往需要增加铝基板的厚度,这样一方面增加了整个照明灯具的重量,不方便使用,另一方也势必增加了制造成本,对于大功率发光二极管照明装置来说, 这种缺陷显得尤其明显。 To achieve the cooling requirements are often necessary to increase the thickness of the aluminum substrate, so that on the one hand increases the weight of the whole lighting, difficult to use, but also the other is bound to increase the manufacturing cost, for high-power LED illumination apparatus, this defect It is particularly evident. 比如, 一个通过铝基板散热的120瓦左右的大功率发光二极管路灯,其重量大概在9公斤左右,其中一大部分是为了达到散热的需要而增加铝基板的厚度以及散热片的高度而产生的,这一方面大大的增加了整个路灯的重量,使得安装拆卸均不方便,而且增加了材料成本;另一方面对于过高的散热片,尤其是一体成型的情况下,对模具的要求也比较高, 而且产品的成品率会有所降低,这也在一定程度上增加了制造成本;而且即使如此,其整体上也很难到达理想的散热效果。 For example, by generating a power LED street lamp of approximately 120 watts of cooling aluminum plate, which is probably about 9 kg weight, most of which is to achieve a heat needed to increase the height of the fin and the thickness of the aluminum plate this aspect greatly increases the weight of the lights, so that it is not convenient installation and removal, but also increases the cost of materials; hand for excessive heat sink, especially in the case of integrally molded, the mold requirements are relatively high, and the product yield will be reduced, increasing manufacturing costs which to some extent; but even so, on the whole it is difficult to reach the desired cooling effect. 【发明内容】本发明解决的技术问题是克服现有技术存在的缺陷,提供一种重量轻、 成本低且散热效果很好的LED照明装置。 SUMMARY OF THE INVENTION technical problem solved by the present invention is to overcome the drawbacks of the prior art, to provide a light weight, low cost and good heat dissipation effect of the LED lighting device. 本发明是通过以下技术方案实现的: 一种LED照明装置,包括壳体和LED光源模组,其中,所述LED光源模组包括若干LED及LED支撑体,所述LED安装于所述LED支撑体上,所述LED支撑体包括泡沫金属层和至少部分用于支撑所述LED的金属支撑层,所述泡沫金属层由具有通孔结构的泡沫金属形成,所述金属支撑层形成于泡沫金属层的部分表面,所述金属支撑层与泡沫金属层接合为一体。 The present invention is achieved by the following technical solutions: An LED lighting device comprising a housing and a LED light source module, wherein the LED module comprises a plurality of LED light source and a LED support member, the LED mounted on the LED support the body, the LED support member includes a foam metal layer and a metal layer at least partially a support for supporting said LED, said metal foam layer is formed of a foam metal having a through-hole structure, the metal supporting layer is formed in the metal foam portion of the surface layer, the metallic support layer and the metal foam layer is bonded integrally. 所述泡沫金属可以是泡沫铁、泡沫铜、泡沫铝、泡沫铁合金、泡沫铜合金、泡沫铝合金中的一种。 The metal foam may be a foam iron, foam copper, foam aluminum, foam iron alloy, foam copper alloy, an aluminum alloy foam. 所述泡沫金属每英寸上孔数为10 ~ 50个。 The metal foam on the number of pores per inch is 10 to 50. 所述LED固定在由导热材料制作的电^各板上,所述LED通过电路板固定在所述LED支撑体上。 The LED is electrically secured to a thermally conductive material made of ^ each plate, the LED through the circuit board fixed to the LED support member. 所述电路板与LED支撑体之间设置有导热胶。 There is provided a thermally conductive adhesive between the circuit board and the LED support member. 所述制作电路板的导热材料是铝。 The circuit board made of thermally conductive material is aluminum. 所述金属支撑层为由与泡沫金属相同的材质制成的实心金属层。 The metal support layer is a metallic foam with a solid metal layer made of the same material. 所述LED照明装置还包括一冷却扇,所述冷却扇配置在泡沫金属层表面中除形成有金属支撑层区域以外的部分或者配置在泡沫金属层内形成的收容空间内。 The LED illumination device further comprises a cooling fan, a cooling fan disposed on the other surface of the foam metal layer is formed with a portion other than the inner region of the metal support layer is formed or disposed within the foam metal layer receiving space. 所述泡沫金属层表面中除形成有金属支撑层的部分外,其余表面中有部分被封闭所述金属支撑层与泡沫金属层通过电镀接合为一体。 Portion of the metal support layer surface of the foam metal layer is formed in addition, the other engaging surface electroplating enclosed as an integral part of the metallic support layer and the metal foam layer. 与现有技术相比,本发明通过对LED照明装置的LED支撑体进行改进, 使得该支撑体在泡沫金属的表面形成金属支撑层,再将LED光源通过电路板固定在所述金属支撑层上,使得LED产生的热量迅速通过金属支撑层传递给泡沫金属层,借助泡沫金属内部的三维立体网状结构,使空气与热源接触面积大副增大,从而可以起到迅速良好的散热作用。 Compared with the prior art, the present invention through the support of the LED of the LED lighting device is improved, such that the support member is formed on the surface of the metal supporting layer of metal foam, then the LED light source is fixed through the circuit board on the metallic support layer the heat generated by the LED is transmitted to the foam metal layer is a metal support layer by means of three-dimensional network structure inside the metal foam, the heat source in contact with air increases the area of ​​the mate, which can play a good role quickly by rapid cooling. 另外,采用泡沫金属还可以节省大量的金属材料,同时也大幅度降低了整个LED照明装置的重量,既经济又使用方便。 Further, the use of metal foam also can save a lot of metal material, but also significantly reduce the weight of the LED lighting device, economical and easy to use. 【附图说明】图1为本发明LED照明装置中LED光源模组实施例一的立体示意图。 BRIEF DESCRIPTION OF DRAWINGS FIG 1 LED lighting device LED light module schematic diagram of a perspective view of the embodiment of the present invention. 图2为本发明LED照明装置中LED光源模组实施例二立体示意图。 FIG 2 LED lighting device LED light module perspective schematic view of two embodiments of the present invention. 图3为图2另一个角度的立体示意图。 3 is a perspective schematic view of another angle 2 in FIG. 图4为本发明LED照明装置中LED光源模组实施例三的立体示意图。 LED illumination apparatus of FIG. 4 in a perspective schematic view of LED light module according to a third embodiment of the present invention. 图5为本发明LED照明装置中LED光源模组实施例四的立体示意图。 LED illumination apparatus of FIG. 5 in a perspective schematic view of LED light module according to a fourth embodiment of the present invention. 图6为本发明LED照明装置中LED光源模组实施例五的立体示意图。 LED illumination apparatus of FIG. 6 in a perspective schematic view of LED light module according to a fifth embodiment of the present invention. 图7为本发明LED照明装置的示意图。 A schematic view of the LED lighting device of the present invention FIG. 【具体实施方式】 实施例一请一并参阅图1和图7所示,本发明LED照明装置9,包括壳体7和LED光源模组8, LED光源模组8包括LED光源部分1及LED支撑体2, 其中所述LED光源部分1包括若干LED (未示出)及承载所述LED的由导热性能良好的导热材料(如铝)制成的电路板10,所述LED配置在电路板IO上形成若干LED发光条(未标号),当然为了取得更好的出光效果,也可以根据实际需要为每颗LED配置透镜装置11;所述LED支撑体2包括泡沫金属层21和至少部分用于支撑所述LED的金属支撑层20,所述泡沫金属层21由具有通孔结构的泡沫金属(如泡沫铁、泡沫铜、泡沫铝、泡沫铁合金、 泡沫铜合金、泡沫铝合金)形成,该泡沫金属每英寸上孔数为10~50个,在本实施例中采用泡沫铜,所述金属支撑层20形成于泡沫金属层21的部分表面,该金属支撑层20由与泡沫金属相同的金属材质制成的 DETAILED DESCRIPTION Embodiment Example] Referring to FIG 1 a and FIG. 7, LED illuminating device 9 according to the present invention, comprises a housing 7 and a LED light source module 8, 8 LED light module comprises an LED light source section 1 and the LED the support body 2, wherein said LED light source section 1 comprises a plurality of LED (not shown) and carried by said LED good thermal conductivity of a thermally conductive material (e.g. aluminum) of the circuit board 10 made of, said LED circuit board arranged forming a plurality of LED light bar (not numbered), of course, in order to achieve better performance on the IO light, may be based on actual needs of each LED 11 arranged lenses; a LED support member 2 comprises at least a portion of the foam 21 and the metal layer supporting the LED on the metallic support layer 20, the foam metal layer 21 is formed of a metal foam (e.g., foam iron, foam copper, foam aluminum, foam iron alloy, foam copper alloy, foam aluminum alloy) having a through-hole structure, the metal foam on the number of pores per inch is 10 to 50, a copper foam employed in the present embodiment, the metallic support layer 20 is formed on the portion of the surface of the foam metal layer 21, 20 and the metal foam of the same metal as the metallic support layer material made 心金属层,比如在本实施例中采用泡沫铜,金属支撑层20则为实心金属铜层,所述金属支撑层20与泡沫金属层21接合为一体,优选的方式为通过电镀使金属支撑层20 与泡沫金属层21接合为一体。 Core metal layer, such as employed in the present embodiment, a copper foam, a metal supporting layer 20, compared with a solid metal layer of copper, the metal supporting layer 20 and the foam metal layer 21 bonded integrally, preferred is the metal support layer by plating 20 and the foam metal layer 21 bonded integrally. 所述LED通过电路板10固定在所述LED支撑体2上,在本实施例中,所述LED通过电路板10固定在金属支撑层20 上,电路板10紧贴金属支撑层20与其尽可能大面积地接触,在电路板10 紧贴金属支撑层20之间也可以设置导热材料,比如导热胶等。 The LED 10 is fixed through the circuit board in the LED support body 2, in the present embodiment, the LED is fixed to the metallic support layer 20, circuit board 10 against the metal support layer 10 through the circuit board 20 and its possible embodiments a large area of ​​contact, the circuit board 10 against the metal support layer may be provided between the thermally conductive material 20, such as a thermally conductive glue. 这样LED光源模组8工作时,LED产生的热量通过导热电路板IO传递给金属支撑层20, 通过金属支撑层20将热量迅速传递给泡沫金属层21,借助泡沫金属21内部的三维立体网状结构,使空气与热源接触面积大副增大,从而可以达到良好的散热效果。 In this way the LED light source module 8 work, the heat generated by the LED is transmitted to the IO circuit board by a thermally conductive metallic support layer 20, 20 will rapidly transfer heat through the metal supporting layer to the foam metal layer 21, by means of an internal three-dimensional reticulated foamed metal 21 structure, the area of ​​contact with the heat source air increases mate, so as to achieve good cooling effect. 另外,采用泡沫金属还可以节省大量的金属材料,同时也大幅度降低了整个LED照明装置9的重量,既经济又使用方便。 Further, the use of metal foam also can save a lot of metal material, but also significantly reduce the weight of the entire LED illuminating device 9, economical and easy to use. 实施例二请一并参阅图2和图3所示,该实施例所揭示的LED照明装置与实施例一的不同之处在于LED光源;漠组8,。 Second Embodiment Referring to FIGS. 2 and 3, LED lighting device disclosed in this embodiment and the embodiment except that a LED light source embodiment; desert group 8 ,. 在本实施例中,所述LED光源模组8,的LED支撑体2还配置有一冷却扇23,该冷却扇23配置在泡沫金属层21 表面中除形成有金属支撑层20区域以外的部分,在图2和图3中示出了冷却扇23设置在泡沫金属层与金属支撑层? In the present embodiment, the LED light source module 8, the LED support member 2 is also provided with a cooling fan 23, the cooling fan 23 is disposed on the surface of the foam metal layer 21 is formed in addition to the metal supporting layer portion other than the region 20, in FIG 2 and FIG 3 shows a cooling fan 23 disposed on the foam metal layer and the metal supporting layer? 0相对设立的一面。 0 opposite side of the establishment. 在使用时,由于泡沫金属层21由具有通孔结构的泡沫金属形成,冷却扇23转动借助借助泡沫金属21内部的三维立体网状结构和通孔,将加快泡沫金属层21内部空气的流动速度,快速将LED产生的热量带走,起到更好的散热效果。 In use, since the foam metal layer 21 formed of a foam metal having a through-hole structure, the cooling fan 23 is rotated by means of three-dimensional network structure and the through hole 21 inside the metal foam, will accelerate the speed of the flow 21 of air inside the foam metal layer , quickly take away the heat generated by the LED, play a better cooling effect. 实施例三请参阅图4所示,该实施例所揭示的LED照明装置与实施例二的不同之处在于LED光源模组8"。在本实施例中,所述LED光源模组8"的冷却扇23配置在泡沫金属层21的側面。 Third Embodiment Referring to FIG. 4, the embodiment of the LED lighting device disclosed embodiment is different from the second embodiment of the LED light source module 8. "In the present embodiment, the LED light source module 8" the cooling fan 23 is disposed on the side surface of the foam metal layer 21. 其工作原理与实施例二相同,在此不在赘述。 It works the same as the second embodiment, not further described herein. 实施例四请参阅图5所示,该实施例所揭示的LED照明装置与实施例一的不同之处在于LED光源模组8",。在本实施例中,所述LED光源模组8,"中泡沫金属层21的側面中有一个侧面被一绝热板25封闭。 Fourth Embodiment Referring to FIG. 5, the LED lighting device according to the embodiment of the disclosed embodiment is different from the embodiment in that a LED light source module 8 ",. In the present embodiment, the LED light source module 8, "sides of the foam metal layer 21 has a side face 25 is closed by a heat insulating plate. 这种实施方式可以针对热源的具体位置设置被封闭的侧面和冷却扇23的位置,以达到更好的散热效果,有效解决局部热源集中问题。 This embodiment can be provided for a specific location of the heat source side and a closed position of the cooling fan 23 to achieve better heat dissipation, effectively solving the problem of local heat concentration. 被封闭的部分具体根据热源的位置进行确定,比如可以封闭侧面中其他侧面,只留下热源所在位置的側面保持开放, 当冷却扇23工作时,空气只从热源所在位置的侧面流过,将有效解决局部热源集中问题。 DETAILED portion is closed for determining the position of the heat source, such as the other side surface sides can be closed, leaving only the location of the heat source side is kept open, when the cooling fan 23 is operating, air flows only through the heat source side from the position where the effective solution to a local problem concentrated heat source. 实施例五请参阅图6所示,该实施例所揭示的LED照明装置与实施例一的不同之处在于LED光源模组8""。 See fifth embodiment shown in FIG. 6, LED lighting device according to the embodiment of the disclosed embodiment is different from the embodiment in that a LED light source module 8 "." 在本实施例中,所述LED光源模组8""的冷却扇23配置在泡沫金属层形成的收容空间内。 Embodiment, the LED light source module 8 "" The cooling fan 23 is disposed in the housing space formed in the metal foam layer in the present embodiment. 其工作原理与实施例二相同,在此不在赘述。 It works the same as the second embodiment, not further described herein. 以上描述仅为本发明的实施例,谅能理解,在不偏离本发明构思的前提下,对本发明的简单修改和替换皆应包含在本发明的技术构思之内。 The foregoing description is only the embodiments of the present invention, understanding can be understood that without departing from the inventive concept, simple modifications and alterations to the present invention are to be included in the technical concept of the present invention.

Claims (10)

  1. 1.一种LED照明装置,包括壳体和LED光源模组,其中,所述LED光源模组包括若干LED及LED支撑体,所述LED安装于所述LED支撑体上,其特征在于:所述LED支撑体包括泡沫金属层和至少部分用于支撑所述LED的金属支撑层,所述泡沫金属层由具有通孔结构的泡沫金属形成,所述金属支撑层形成于泡沫金属层的部分表面,所述金属支撑层与泡沫金属层接合为一体。 1. An LED lighting device comprising a housing and a LED light source module, wherein the LED module comprises a plurality of LED light source and a LED support member, the LED mounted on the LED support member, characterized in that: the said LED support member includes a foam metal layer and a metal layer at least partially a support for supporting said LED, said metal foam layer is formed of a foam metal having a through-hole structure, the metal supporting layer is formed on the surface of the foam metal layer portion the metallic support layer and the metal foam layer is bonded integrally.
  2. 2. 如权利要求1所述的LED照明装置,其特征在于:所述泡沫金属可以是泡沫铁、泡沫铜、泡沫铝、泡沫铁合金、泡沫铜合金、泡沫铝合金中的一种。 2. The LED lighting device according to claim 1, wherein: said metal foam can be a foam iron, foam copper, foam aluminum, foam iron alloy, foam copper alloy, foam aluminum alloy.
  3. 3. 如权利要求1或2所述的LED照明装置,其特征在于:所述泡沫金属每英寸上孔数为10~50个。 The LED lighting device according to claim 12, wherein: said metal foam on the number of pores per inch is 10 to 50.
  4. 4. 如权利要求1所述的LED照明装置,其特征在于:所述LED固定在由导热材料制作的电路板上,所述LED通过电路板固定在所述LED支撑体上。 4. The LED lighting device according to claim 1, wherein: the LED is fixed on a circuit board made of a thermally conductive material, through the LED circuit board fixed to the LED support member.
  5. 5. 如权利要求4所述的LED照明装置,其特征在t所述电路板与LED 支撑体之间设置有导热胶。 The LED lighting device according to claim 4, characterized in t between the circuit board and the LED support member is provided with a thermally conductive adhesive.
  6. 6. 如权利要求4或5所述的LED照明装置,其特征在于:所述制作电路板的导热材料是铝。 4 or 5, the LED lighting device according to claim 6, characterized in that: the thermally conductive material is a circuit board made of aluminum.
  7. 7. 如权利要求1所述的LED照明装置,其特征在于:所述金属支撑层为由与泡沫金属相同的材质制成的实心金属层。 7. The LED lighting device according to claim 1, wherein: the metal supporting layer is a solid metal layer of the same material made of metal foam.
  8. 8. 如权利要求1所述的LED照明装置,其特征在于:所述LED照明装置还包括一冷却扇,所述冷却扇配置在泡沫金属层表面中除形成有金属支撑层区域以外的部分或者配置在泡沫金属层内形成的收容空间内。 8. The LED lighting device according to claim 1, wherein: the LED lighting device further comprises a cooling fan, a cooling fan disposed on the surface of the foam metal layer portion other than the region formed with a metallic support layer in addition to or disposed within the housing space formed in the metal foam layer.
  9. 9. 如权利要求8所述的LED照明装置,其特征在于:所述泡沫金属层表面中除形成有金属支撑层的部分外,其余表面中有部分被封闭。 9. The LED lighting device according to claim 8, wherein: the metal portion of the support surface of the foam layer in addition the metal layer is formed, the remaining surface part is closed.
  10. 10. 如权利要求I、 2、 4、 5、 7、 8或9所述的LED照明装置,其特征在于:所述金属支撑层与泡沫金属层通过电镀接合为一体。 I as claimed in claim 10, 2, 4, 5, LED lighting means 7, 8 or 9, wherein: said metallic support layer and the foam metal layer by plating integrally joined.
CN 200810033327 2008-01-31 2008-01-31 LED illumination device CN101220934A (en)

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CN 200810033327 CN101220934A (en) 2008-01-31 2008-01-31 LED illumination device
KR20090005409A KR20090084689A (en) 2008-01-31 2009-01-22 Led illuminating device, led light source module, and led support member
JP2009012664A JP2009182327A (en) 2008-01-31 2009-01-23 Led illuminating device, led light source module, and led support member
EP20090151178 EP2085681A2 (en) 2008-01-31 2009-01-23 LED illuminating device, LED light source module, and LED support member

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CN102661504A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power light-emitting diode (LED) down lamp provided with metal radiating device
CN102661505A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power LED (light-emitting diode) flat plate lamp provided with metal heat abstractor

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JP5574671B2 (en) * 2009-11-05 2014-08-20 キヤノン株式会社 Usb host device, control method, and program
FR2961894B1 (en) * 2010-06-24 2013-09-13 Valeo Vision Heat exchange device, particularly for motor vehicle
FR2965042B1 (en) * 2010-09-22 2014-11-21 Valeo Vision Heat exchange device, particularly for motor vehicle
CN104315486A (en) * 2013-04-20 2015-01-28 大连三维传热技术有限公司 Foam metal wick hot plate heat radiator of SiO2 nano working fluid
CN103727506A (en) * 2013-12-13 2014-04-16 青岛威力电子科技有限公司 Efficient heat-dissipation method of LED light source carrier
CN105177339B (en) * 2015-10-26 2016-12-07 三峡大学 A three-dimensional spatial structure and preparation method aluminum foam ordered pore

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GB2404009B (en) * 2003-07-17 2005-06-15 Enfis Ltd Cooling method and apparatus
US9412926B2 (en) * 2005-06-10 2016-08-09 Cree, Inc. High power solid-state lamp

Cited By (2)

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Publication number Priority date Publication date Assignee Title
CN102661504A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power light-emitting diode (LED) down lamp provided with metal radiating device
CN102661505A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power LED (light-emitting diode) flat plate lamp provided with metal heat abstractor

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