CN104170533B - 在将要印刷的衬底上以流体形式转移导电材料的方法和结构 - Google Patents

在将要印刷的衬底上以流体形式转移导电材料的方法和结构 Download PDF

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Publication number
CN104170533B
CN104170533B CN201380007268.1A CN201380007268A CN104170533B CN 104170533 B CN104170533 B CN 104170533B CN 201380007268 A CN201380007268 A CN 201380007268A CN 104170533 B CN104170533 B CN 104170533B
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China
Prior art keywords
substrate
conductive material
fluid
temperature
fluid conductive
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CN201380007268.1A
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English (en)
Chinese (zh)
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CN104170533A (zh
Inventor
尤哈·麦加拉
派翠·瑟维奥
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Finnish Digital Label Co
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Stora Enso Oyj
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/18—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area using fluids, e.g. gas streams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/16—Arrangements for supplying liquids or other fluent material
    • B05B5/1608—Arrangements for supplying liquids or other fluent material the liquid or other fluent material being electrically conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0386—Paper sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0615—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced at the free surface of the liquid or other fluent material in a container and subjected to the vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • B05B5/14—Plant for applying liquids or other fluent materials to objects specially adapted for coating continuously moving elongated bodies, e.g. wires, strips, pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Textile Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Nozzles (AREA)
CN201380007268.1A 2012-01-30 2013-01-30 在将要印刷的衬底上以流体形式转移导电材料的方法和结构 Active CN104170533B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20125088A FI125906B (en) 2012-01-30 2012-01-30 A method and arrangement for transferring electrically conductive material in fluid form onto a printable substrate
FI20125088 2012-01-30
PCT/FI2013/050098 WO2013113994A1 (en) 2012-01-30 2013-01-30 Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed

Publications (2)

Publication Number Publication Date
CN104170533A CN104170533A (zh) 2014-11-26
CN104170533B true CN104170533B (zh) 2017-04-05

Family

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Family Applications (1)

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CN201380007268.1A Active CN104170533B (zh) 2012-01-30 2013-01-30 在将要印刷的衬底上以流体形式转移导电材料的方法和结构

Country Status (18)

Country Link
US (1) US10085350B2 (enExample)
EP (1) EP2810541B1 (enExample)
JP (1) JP6262151B2 (enExample)
KR (1) KR102023585B1 (enExample)
CN (1) CN104170533B (enExample)
AU (1) AU2013214093B2 (enExample)
BR (1) BR112014018777B1 (enExample)
CA (1) CA2862587C (enExample)
DK (1) DK2810541T3 (enExample)
ES (1) ES2688706T3 (enExample)
FI (1) FI125906B (enExample)
IN (1) IN2014DN06613A (enExample)
MX (1) MX2014009162A (enExample)
MY (1) MY176775A (enExample)
PL (1) PL2810541T3 (enExample)
PT (1) PT2810541T (enExample)
RU (1) RU2617703C2 (enExample)
WO (1) WO2013113994A1 (enExample)

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CN106658984A (zh) * 2016-10-27 2017-05-10 江门崇达电路技术有限公司 解决喷锡板水洗后出现水印的工艺及设备
CN108970896B (zh) * 2018-06-20 2019-12-24 荆门市格林美新材料有限公司 一种正极材料极片刮涂装置
CN110142175B (zh) * 2019-05-22 2021-05-25 昆山东申塑料科技有限公司 自动化喷涂产线
US12227902B2 (en) * 2020-04-15 2025-02-18 Kohpa Gmbh Electrically conductive paper
CN116095978A (zh) * 2023-02-15 2023-05-09 北京梦之墨科技有限公司 一种平整度改善的导电结构及其制作方法
CN116031010B (zh) * 2023-02-17 2025-05-27 北京梦之墨科技有限公司 导电结构、低温导电浆料的印刷平整化方法及设备

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US2414923A (en) * 1943-07-30 1947-01-28 Batcheller Clements Metal cladding by spraying
US20010032387A1 (en) * 2000-03-24 2001-10-25 Olympus Optical Co., Ltd. Electric wiring forming system
JP2009212249A (ja) * 2008-03-03 2009-09-17 Digital Powder Systems Inc 配線パターン形成装置及び形成方法
CN101668876A (zh) * 2007-04-26 2010-03-10 气体产品与化学公司 热表面处理工艺中低温冷却的设备及方法

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US2414923A (en) * 1943-07-30 1947-01-28 Batcheller Clements Metal cladding by spraying
US20010032387A1 (en) * 2000-03-24 2001-10-25 Olympus Optical Co., Ltd. Electric wiring forming system
CN101668876A (zh) * 2007-04-26 2010-03-10 气体产品与化学公司 热表面处理工艺中低温冷却的设备及方法
JP2009212249A (ja) * 2008-03-03 2009-09-17 Digital Powder Systems Inc 配線パターン形成装置及び形成方法

Also Published As

Publication number Publication date
FI20125088L (fi) 2013-07-31
US10085350B2 (en) 2018-09-25
DK2810541T3 (en) 2018-10-08
JP2015508704A (ja) 2015-03-23
RU2617703C2 (ru) 2017-04-26
EP2810541A4 (en) 2016-01-06
KR102023585B1 (ko) 2019-09-23
KR20140129078A (ko) 2014-11-06
RU2014133100A (ru) 2016-03-27
MX2014009162A (es) 2014-08-27
MY176775A (en) 2020-08-21
AU2013214093B2 (en) 2017-02-23
BR112014018777A8 (pt) 2017-07-11
FI125906B (en) 2016-03-31
BR112014018777B1 (pt) 2022-05-17
JP6262151B2 (ja) 2018-01-17
PL2810541T3 (pl) 2018-12-31
CN104170533A (zh) 2014-11-26
CA2862587C (en) 2020-04-07
PT2810541T (pt) 2018-10-26
BR112014018777A2 (enExample) 2017-06-20
WO2013113994A1 (en) 2013-08-08
EP2810541B1 (en) 2018-07-25
EP2810541A1 (en) 2014-12-10
CA2862587A1 (en) 2013-08-08
US20150024119A1 (en) 2015-01-22
ES2688706T3 (es) 2018-11-06
IN2014DN06613A (enExample) 2015-05-22
AU2013214093A1 (en) 2014-08-21

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