CN104169657B - 排气阵列及制造方法 - Google Patents

排气阵列及制造方法 Download PDF

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CN104169657B
CN104169657B CN201380013497.4A CN201380013497A CN104169657B CN 104169657 B CN104169657 B CN 104169657B CN 201380013497 A CN201380013497 A CN 201380013497A CN 104169657 B CN104169657 B CN 104169657B
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A·J·霍利达
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WL Gore and Associates Inc
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    • B81—MICROSTRUCTURAL TECHNOLOGY
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    • B81B7/0032—Packages or encapsulation
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
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    • B01D53/22—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by diffusion
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Abstract

本发明涉及包括多个排气区域的排气阵列，排气区域包括多孔PTFE基底材料和包括具有多个穿孔的基质材料的无孔材料，其中，基质材料填充多孔PTFE基底的孔，以形成无孔区域，该无孔区域使多个排气区域互连。

Description

排气阵列及制造方法
相关申请
本申请要求对2012年3月13日提交的、题为“VENTING ARRAY AND MANUFACTURINGMETHOED(排气阵列及制造方法)”的美国临时专利申请第61/610,254号的优先权，本文以参见方式引入该申请的全部内容。
背景技术
通过微制造技术将机械元件、传感器、致动器等和电子器件集成在共同的硅基片上被公知为MEMS。微-电子-机械系统传感器可被用于麦克风、用户压力传感器应用、轮胎压力监控系统、气体流量传感器、加速度计和陀螺仪。
美国专利第7,434,305号描述了硅电容式麦克风MEMS封装，其包括声换能器和声端口。声端口还包括诸如PTFE或烧结的金属那样的环境屏蔽件，以保护换能器免受诸如太阳光、潮气、油、脏物和/或灰尘之类环境元素的影响。
该屏蔽件通常使用粘结剂层密封在导电或非导电材料层之间。所披露的电容式麦克风可使用回流焊接技术附连到电路板上。回流焊接技术在相当高的温度下进行。因此，这种粘结剂层的耐热性是关键的。回流焊接条件下经历的高温又结合屏蔽件本身低的机械强度使得以此种方式将环境屏蔽件纳入到MEMS封装内相当困难。
如MEMS封装所要求的，在薄形式的因素中，仍然存在着对环境屏蔽件和压力平衡能力的需要。此外，需要以有效的方式制造小的排气装置。这里所披露的排气阵列实现了如此的需要。
附图的简要说明
图1示出本发明的一个实施例，其是附连到MEMS封装的排气装置。
图2是排气阵列的图示。
图3示出排气装置。
图4示出排气阵列的剖视图。
图5是描述排气的MEMS封装的另一方面。
图6示出排气阵列的剖面的SEM图像。
具体实施方式
在一个实施例中，本发明涉及制造用于容器的排气装置的方法。尤其是，适用于MEMS封装的排气装置可由本发明的工艺过程制造。图1示出如此的容器18，其具有内部空间20和使内部空间与环境空间24分开的孔22。容器的实例可包括但不限于：压力传感器、电子封壳、气体传感器、麦克风和助听装置。
图2示出排气阵列。该阵列包括以单个工艺过程制造的多个排气口。排气口可在安装之前通过切割或切块而分离开，或可在分离之前安装在MEMS封装的阵列上。
诸如图3中所示的排气装置26可放置在容器内的孔22上方。排气装置用来保护容器内部空间免遭外部环境空间中的包括灰尘、潮气和其他液体的污染物侵袭，同时允许用于压力平衡或潮气传送的气流。装置26可以排气阵列28的形式提供，其包括如图2所示的若干个排气装置。排气阵列可通过将多孔聚合物基底材料30和具有多个穿孔34的基质材料32组合来构造。
多孔聚合物基底材料是不透液体但透气体的材料。多孔的聚合物基底材料可以是像PTFE、PVDF、PFA、FEP之类的含氟聚合物以及它们的共聚物。这些多孔聚合物基底材料可以单层或多层结构提供，多层结构包括空隙率变化的和/或聚合物材料变化的多层。各层可以是对称的或非对称的层。根据授予Gore的美国专利第3,953,566号的教导而制造的膨胀型PTFE隔膜特别用作为多孔材料。这些PTFE隔膜可以是单轴向或双轴向膨胀的。通过使用行内众所周知的涂层和方法来涂覆聚合物涂层，可使多孔材料变为疏油性的。
PTFE的共聚物也可以是有用的。如这里所使用的，PTFE包括为本技术领域内技术人员理解的PTFE的共聚物和膨胀型PTFE共聚物。
基质材料可以是任何聚合物材料，该种材料在热量和/或压力作用下，一旦组合了两组材料，就可流入和填充到多孔聚合物基底的各孔中。例如，基质可以是热塑性的。基质材料可以是由高温有机绝缘基质材料制成的任何绝缘材料，这样的材料诸如但不限于聚酰亚胺、环氧树脂，至少部分地由PTFE组成，具有或者不具有填料。
材料是特别有用的基质。C半固化材料是用热固性树脂浸渍过的膨胀型PTFE片。膨胀型PTFE内的空气空间用树脂取代，膨胀型PTFE隔膜变成树脂的载体或递送系统。在层叠过程中，树脂以与传统基于玻璃的半固化材料相同的方式流动、填充和粘结。
基质材料还可包括部分固化的和完全固化的材料。基质材料可包括阶段BFR4/BT以及Tacpreg-Taconic。基质的厚度范围可以是从15微米至200微米。较佳地，基质厚度是在30微米和80微米之间。
借助于诸如激光钻孔、冲模或机械钻孔等方法，使穿孔形成在基质材料片上。穿孔的大小、形状和位置可根据排气装置的孔22的大小和形状来定。一般地，穿孔的尺寸范围可以是从0.3mm至1.5mm。穿孔形状不是关键的，可选用诸如圆形、椭圆形、正方形、矩形等的任何形状。
如图4中所示，通过层叠或砑光技术将多孔聚合物材料基底42和穿孔的基质44组合在一起而形成排气阵列40。如此技术可涉及热量或压力或两者。穿孔38生成用于气体压力的排气口并允许声音传输。基质和基底材料组合而形成复合材料。基质材料在某些区域内流入和填充多孔聚合物材料的空隙。生成的复合物由此包括多孔聚合物材料43的区域和非多孔的区域46，其中，多孔聚合物材料基本上用基质材料填充。
如图2所示，排气阵列28可包括多个排气装置26，每个装置包括至少一个聚合物材料的多孔区域。每个阵列的排气装置数量取决于排气组件的尺寸。排气装置可通过切块或切割与阵列分离，并使用诸如粘结剂、热焊接那样公知的方法或通过将基质流动和固化到容器而附连到容器。
在一个方面，诸如金属盖或热塑性片或树脂片的附连特征可提供给排气阵列，以便于将排气装置附连到封装上。在另一方面，带有附连特征的各个排气装置可用已知方法从排气阵列中切出，并且该装置然后用来覆盖容器的孔。
本发明的另一方面涉及制造排气的MEMS封装的方法。图5示出示范的MEMS电容式麦克风封装50，其包括换能器单元52和放大器54。该封装具有声端口或孔56，以允许声波到达换能器。本发明的制造方法类似地构造和构思了用于其它应用的其他的MEMS封装，诸如MEMS扬声器。孔被排气装置26覆盖，以允许声波或气体通过但阻止液体污染物、灰尘和潮气进入该封装，由此保护封装内部的内容物。
实例：制造排气阵列的方法
半固化材料(GORETM C)被用作为基质。使用CO2激光器在基质(尺寸为12.7cm乘15.2cm)内钻出直径0.8mm的圆形穿孔。基质具有总数为1755个如此的钻孔，它们彼此间距开3.25mm。膨胀型PTFE隔膜用作为多孔聚合物基底材料，隔膜的特性如下：厚度大约为35微米，平均孔尺寸为0.5微米，格里值(Gurley)为约10秒。通过用溶剂系统中的氟化丙烯酸酯聚合物的溶液进行涂覆，其后通过干燥来除去溶剂，可使得膨胀型PTFE隔膜为疏油性。
使用手动的Carver压机，在200°F的温度、1600磅/平方英寸的压力之下将穿孔的基质压到该层疏油性的膨胀型PTFE隔膜上持续大约4分45秒，由此形成复合物。基质材料32贯穿疏油性隔膜30的全部厚度，如在图6中所示的复合物的横截面SEM图像中所观察到那样。因此，所得的复合物具有：(a)无孔区域60，那里，基质材料穿过隔膜，(b)对应于基质材料中的穿孔的刚好疏油性隔膜的透气的多孔区域62。

Claims (10)

1.一种排气阵列，所述排气阵列包括：
a.包括多孔PTFE基底的多个排气区域，以及
b.包括具有多个穿孔的基质材料的无孔基底材料，其中，基底材料填充多孔PTFE基底的孔，以形成无孔区域，所述无孔区域与多个排气区域互连。
2.如权利要求1所述的排气阵列，其特征在于，多孔PTFE基底是疏油性的。
3.如权利要求1所述的排气阵列，其特征在于，所述基质材料是绝缘材料。
4.如权利要求1所述的排气阵列，其特征在于，所述基质材料是环氧树脂。
5.如权利要求1所述的排气阵列，其特征在于，所述基质材料是聚酰亚胺。
6.如权利要求1所述的排气阵列，其特征在于，所述排气阵列的厚度小于200微米。
7.如权利要求1所述的排气阵列，其特征在于，还包括附连层。
8.一种制造用于容器的排气装置的方法，所述容器形成内部空间和环境空间，并具有介于所述内部空间和所述环境空间之间的孔，所述排气装置适于放置在所述孔上，所述方法包括：
a.提供多孔PTFE基底，
b.提供具有多个穿孔的基质材料，
c.将所述多孔PTFE基底和所述基质材料组合，以使所述基质材料填充邻近的多孔PTFE基底，从而形成具有多孔PTFE基底的区域和填充的PTFE基底的区域的复合物，以及
d.将所述复合物分为多个排气装置，每个排气装置包括多孔PTFE基底的至少一个区域。
9.一种制造排气的MEMS封装的方法，所述方法包括：
a.提供具有容器的MEMS封装，所述容器形成内部空间和环境空间，并具有介于内部空间和所述环境空间之间的孔，
b.提供多孔PTFE基底，
c.提供具有多个穿孔的基质材料，
d.将所述多孔PTFE基底和所述基质材料组合，以使所述基质材料填充邻近的多孔PTFE基底，由此，形成具有多孔PTFE基底的区域和填充的PTFE基底的区域的复合物，
e.将所述复合物分为多个排气装置，每个排气装置包括多孔PTFE基底的至少一个区域，以及
f.将所述排气装置附连在MEMS封装的孔上。
10.一种制造排气阵列的方法，所述方法包括：
a.提供多孔PTFE基底，
b.提供具有多个穿孔的基质材料，以及
c.将所述多孔PTFE基底和所述基质材料组合，以使所述基质材料填充邻近的多孔PTFE基底，由此，形成具有多孔PTFE基底的区域和填充的PTFE基底的区域的复合物。
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