CN104142416B - 用于电流测量的设备 - Google Patents

用于电流测量的设备 Download PDF

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Publication number
CN104142416B
CN104142416B CN201410133683.8A CN201410133683A CN104142416B CN 104142416 B CN104142416 B CN 104142416B CN 201410133683 A CN201410133683 A CN 201410133683A CN 104142416 B CN104142416 B CN 104142416B
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CN
China
Prior art keywords
current
magnetic field
current conductor
conductor
sensor
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Active
Application number
CN201410133683.8A
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English (en)
Chinese (zh)
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CN104142416A (zh
Inventor
罗伯特·拉兹
M·阿克曼
陈健
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Melexis Technologies SA
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Melexis Technologies SA
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Publication of CN104142416A publication Critical patent/CN104142416A/zh
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0092—Measuring current only
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/207—Constructional details independent of the type of device used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
CN201410133683.8A 2013-05-07 2014-04-04 用于电流测量的设备 Active CN104142416B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CHCH924/13 2013-05-07
CH924/13 2013-05-07
CH9242013 2013-05-07
CHCH1130/13 2013-06-17
CH01130/13A CH708052B1 (de) 2013-05-07 2013-06-17 Vorrichtung zur Strommessung.
CH1130/13 2013-06-17

Publications (2)

Publication Number Publication Date
CN104142416A CN104142416A (zh) 2014-11-12
CN104142416B true CN104142416B (zh) 2017-10-27

Family

ID=50190174

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410133683.8A Active CN104142416B (zh) 2013-05-07 2014-04-04 用于电流测量的设备

Country Status (5)

Country Link
US (1) US9547024B2 (https=)
EP (1) EP2801832B1 (https=)
JP (1) JP6467696B2 (https=)
CN (1) CN104142416B (https=)
CH (1) CH708052B1 (https=)

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CH707687B1 (de) * 2013-03-08 2016-09-15 Melexis Technologies Nv Stromsensor.
US9823329B2 (en) * 2014-10-15 2017-11-21 Honeywell International Inc. Magnetic current sensor calibration system
US9860987B2 (en) * 2015-02-13 2018-01-02 Deere & Company Electronic assembly with one or more heat sinks
US9810721B2 (en) * 2015-12-23 2017-11-07 Melexis Technologies Sa Method of making a current sensor and current sensor
US10283699B2 (en) * 2016-01-29 2019-05-07 Avago Technologies International Sales Pte. Limited Hall-effect sensor isolator
US10165670B2 (en) * 2016-04-29 2018-12-25 Deere & Company Electrical connector assembly
EP3306325B1 (en) * 2016-10-05 2021-07-21 Fico Triad, S.A. A current measuring device
EP3367067B1 (en) * 2017-02-28 2019-07-03 Melexis Technologies SA Position sensor and method of position sensing
EP3611519B1 (en) * 2017-04-11 2021-10-06 Alps Alpine Co., Ltd. Electric current sensor
JP7082622B2 (ja) * 2017-07-24 2022-06-08 株式会社村田製作所 アクチュエータ、およびアクチュエータの製造方法
CN107942251B (zh) 2017-10-23 2020-10-16 宁德时代新能源科技股份有限公司 电流检测系统、方法和电流检测装置
US11982693B2 (en) * 2018-10-11 2024-05-14 The University Of North Carolina At Charlotte Systems and methods to detect and measure the current mismatch among parallel semiconductor devices
WO2021070833A1 (ja) * 2019-10-08 2021-04-15 アルプスアルパイン株式会社 磁気センサ及びこれを備えた電流検出装置
EP3992653B1 (en) * 2020-10-31 2024-10-02 Melexis Technologies SA Current sensing system
DE102020214311A1 (de) * 2020-11-13 2022-05-19 Zf Friedrichshafen Ag Leiterplattenanordnung, Inverter sowie Kraftfahrzeug
DE102021125397A1 (de) * 2021-09-30 2023-03-30 Infineon Technologies Ag Chipgehäuse mit kontaktklammer

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US5075759A (en) * 1989-07-21 1991-12-24 Motorola, Inc. Surface mounting semiconductor device and method
US5942895A (en) * 1995-10-30 1999-08-24 Sentron Ag Magnetic field sensor and current and/or energy sensor
CN102016606A (zh) * 2008-06-02 2011-04-13 阿莱戈微系统公司 用于电流检测电路和集成电流传感器的装置
CN102257394A (zh) * 2008-10-21 2011-11-23 霍尼韦尔国际公司 具有包括夹在电导体中间的磁导率层的场屏蔽布置的电流传感器
CN102969446A (zh) * 2011-08-30 2013-03-13 英飞凌科技股份有限公司 半导体芯片封装和方法

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DE3854457T2 (de) * 1987-07-07 1996-02-29 Nippon Denso Co Stromdetektoranordnung mit ferromagnetischem Magnetwiderstandselement.
GB9500974D0 (en) * 1995-01-18 1995-03-08 Horstmann Timers & Controls Electricity measurement apparatus
EP0772046B1 (de) 1995-10-30 2002-04-17 Sentron Ag Magnetfeldsensor und Strom- oder Energiesensor
JP2002202327A (ja) * 2000-10-23 2002-07-19 Sanken Electric Co Ltd ホール素子を備えた電流検出装置
CN1295514C (zh) * 2001-11-01 2007-01-17 旭化成电子材料元件株式会社 电流传感器与电流传感器的制造方法
JP2003302428A (ja) 2002-04-09 2003-10-24 Asahi Kasei Corp 基板実装型電流センサ及び電流測定方法
JP2003329749A (ja) * 2002-05-13 2003-11-19 Asahi Kasei Corp 磁気センサ及び電流センサ
US7259545B2 (en) * 2003-02-11 2007-08-21 Allegro Microsystems, Inc. Integrated sensor
US7166807B2 (en) * 2003-08-26 2007-01-23 Allegro Microsystems, Inc. Current sensor
US20060219436A1 (en) * 2003-08-26 2006-10-05 Taylor William P Current sensor
US7709754B2 (en) 2003-08-26 2010-05-04 Allegro Microsystems, Inc. Current sensor
US6940266B2 (en) * 2003-12-17 2005-09-06 Bae Systems Controls, Inc. Enhanced cost effective method for high current measurements
JP5166736B2 (ja) * 2003-12-23 2013-03-21 エリポスキ リモート リミテッド エルエルシー 高感度磁気内蔵電流センサ
DE102005047413B8 (de) * 2005-02-23 2012-05-10 Infineon Technologies Ag Magnetfeldsensorelement und Verfahren zum Durchführen eines On-Wafer-Funktionstests, sowie Verfahren zur Herstellung von Magnetfeldsensorelementen und Verfahren zur Herstellung von Magnetfeldsensorelementen mit On-Wafer-Funktionstest
EP1772737A3 (de) * 2005-10-08 2008-02-20 Melexis Technologies SA Baugruppe zur Strommessung
JP4612554B2 (ja) * 2006-02-16 2011-01-12 株式会社東海理化電機製作所 電流センサ
DE102006062750B4 (de) * 2006-09-15 2010-07-08 Infineon Technologies Ag Vorrichtung zum Erfassen einer Änderung einer physikalischen Grösse mittels einer Stromleiterstruktur
JP4893506B2 (ja) * 2007-06-04 2012-03-07 甲神電機株式会社 電流センサ
US7612553B2 (en) * 2007-07-26 2009-11-03 Honeywell International Inc. Current sensor having sandwiched magnetic permeability layer
US9222992B2 (en) 2008-12-18 2015-12-29 Infineon Technologies Ag Magnetic field current sensors
WO2010096367A1 (en) * 2009-02-17 2010-08-26 Allegro Microsystems, Inc. Circuits and methods for generating a self-test of a magnetic field sensor
CH703903B1 (de) * 2010-10-01 2014-04-30 Melexis Tessenderlo Nv Stromsensor.
US8878531B2 (en) * 2010-11-18 2014-11-04 Infineon Technologies Ag Current sensor
US9389247B2 (en) * 2011-11-04 2016-07-12 Infineon Technologies Ag Current sensors

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5075759A (en) * 1989-07-21 1991-12-24 Motorola, Inc. Surface mounting semiconductor device and method
US5942895A (en) * 1995-10-30 1999-08-24 Sentron Ag Magnetic field sensor and current and/or energy sensor
CN102016606A (zh) * 2008-06-02 2011-04-13 阿莱戈微系统公司 用于电流检测电路和集成电流传感器的装置
CN102257394A (zh) * 2008-10-21 2011-11-23 霍尼韦尔国际公司 具有包括夹在电导体中间的磁导率层的场屏蔽布置的电流传感器
CN102969446A (zh) * 2011-08-30 2013-03-13 英飞凌科技股份有限公司 半导体芯片封装和方法

Also Published As

Publication number Publication date
CH708052A1 (de) 2014-11-14
EP2801832A2 (de) 2014-11-12
CN104142416A (zh) 2014-11-12
EP2801832A3 (de) 2018-01-17
CH708052B1 (de) 2016-09-15
US20140333301A1 (en) 2014-11-13
JP2014219386A (ja) 2014-11-20
EP2801832B1 (de) 2024-03-27
US9547024B2 (en) 2017-01-17
JP6467696B2 (ja) 2019-02-13

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