CN104136325B - 异常接触检测方法、电子元器件保持装置以及电子元器件搬运装置 - Google Patents
异常接触检测方法、电子元器件保持装置以及电子元器件搬运装置 Download PDFInfo
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- CN104136325B CN104136325B CN201280070781.0A CN201280070781A CN104136325B CN 104136325 B CN104136325 B CN 104136325B CN 201280070781 A CN201280070781 A CN 201280070781A CN 104136325 B CN104136325 B CN 104136325B
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- China
- Prior art keywords
- electronic devices
- components
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- rising
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 79
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- 230000008485 antagonism Effects 0.000 claims abstract description 22
- 230000004044 response Effects 0.000 claims abstract description 17
- 238000012360 testing method Methods 0.000 claims description 40
- 230000007423 decrease Effects 0.000 claims description 39
- 238000001514 detection method Methods 0.000 claims description 22
- 230000007246 mechanism Effects 0.000 claims description 16
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Sorting Of Articles (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/054874 WO2013128560A1 (ja) | 2012-02-28 | 2012-02-28 | 異常接触検出方法、電子部品保持装置、及び電子部品搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104136325A CN104136325A (zh) | 2014-11-05 |
CN104136325B true CN104136325B (zh) | 2015-09-30 |
Family
ID=49081814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280070781.0A Expired - Fee Related CN104136325B (zh) | 2012-02-28 | 2012-02-28 | 异常接触检测方法、电子元器件保持装置以及电子元器件搬运装置 |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP5300111B1 (ja) |
KR (1) | KR101520677B1 (ja) |
CN (1) | CN104136325B (ja) |
HK (1) | HK1202101A1 (ja) |
MY (1) | MY167646A (ja) |
SG (1) | SG11201404990XA (ja) |
TW (1) | TWI583272B (ja) |
WO (1) | WO2013128560A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6533112B2 (ja) * | 2015-07-21 | 2019-06-19 | 株式会社Fuji | 回路形成方法 |
JP6164624B1 (ja) * | 2016-10-18 | 2017-07-19 | 上野精機株式会社 | 電子部品移動装置及び電子部品搬送装置 |
JP7188735B2 (ja) * | 2018-08-01 | 2022-12-13 | Thk株式会社 | アクチュエータ |
TWI778647B (zh) * | 2021-06-01 | 2022-09-21 | 天正國際精密機械股份有限公司 | 改良式電子元件植入裝置及植入方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1241958A (zh) * | 1996-12-25 | 2000-01-19 | 松下电器产业株式会社 | 元件吸持头、元件装配装置及元件吸持方法 |
JP2000264305A (ja) * | 1999-03-15 | 2000-09-26 | Shin Etsu Polymer Co Ltd | キャリアテープの検査方法 |
JP2005096789A (ja) * | 2003-09-24 | 2005-04-14 | Ricoh Co Ltd | キャリアテープ及びその製造方法、並びにそのキャリアテープを用いた電子部品の実装方法及び外観検査方法 |
JP2007145365A (ja) * | 2005-11-28 | 2007-06-14 | Ueno Seiki Kk | テーピング装置及びその制御方法 |
JP4202102B2 (ja) * | 2002-12-03 | 2008-12-24 | 上野精機株式会社 | 半導体装置のテーピング装置 |
JP4462705B2 (ja) * | 2000-03-30 | 2010-05-12 | 三井金属鉱業株式会社 | 電子部品実装用フィルムキャリアテープの最終不良マーキング装置 |
JP2010129718A (ja) * | 2008-11-27 | 2010-06-10 | Juki Corp | 部品実装装置 |
JP2010131680A (ja) * | 2008-12-02 | 2010-06-17 | Ueno Seiki Kk | 保持手段駆動装置 |
CN101873792A (zh) * | 2009-04-23 | 2010-10-27 | 东京威尔斯股份有限公司 | 工件插入机构以及工件插入方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004328846A (ja) * | 2003-04-22 | 2004-11-18 | Olympus Corp | 荷重制御装置、荷重制御式アクチュエータ及び荷重制御方法 |
JP2005142313A (ja) * | 2003-11-06 | 2005-06-02 | Tdk Corp | 実装処理装置用接触開始検出装置及び該装置を備えた実装処理装置 |
CN103229610B (zh) * | 2010-11-30 | 2016-01-20 | 上野精机株式会社 | 电子零件的保持装置、检查装置以及分类装置 |
-
2012
- 2012-02-28 MY MYPI2014702298A patent/MY167646A/en unknown
- 2012-02-28 JP JP2013510154A patent/JP5300111B1/ja active Active
- 2012-02-28 CN CN201280070781.0A patent/CN104136325B/zh not_active Expired - Fee Related
- 2012-02-28 KR KR1020147020799A patent/KR101520677B1/ko active IP Right Grant
- 2012-02-28 WO PCT/JP2012/054874 patent/WO2013128560A1/ja active Application Filing
- 2012-02-28 SG SG11201404990XA patent/SG11201404990XA/en unknown
-
2013
- 2013-02-22 TW TW102106299A patent/TWI583272B/zh active
-
2015
- 2015-03-10 HK HK15102467.3A patent/HK1202101A1/zh not_active IP Right Cessation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1241958A (zh) * | 1996-12-25 | 2000-01-19 | 松下电器产业株式会社 | 元件吸持头、元件装配装置及元件吸持方法 |
JP2000264305A (ja) * | 1999-03-15 | 2000-09-26 | Shin Etsu Polymer Co Ltd | キャリアテープの検査方法 |
JP4462705B2 (ja) * | 2000-03-30 | 2010-05-12 | 三井金属鉱業株式会社 | 電子部品実装用フィルムキャリアテープの最終不良マーキング装置 |
JP4202102B2 (ja) * | 2002-12-03 | 2008-12-24 | 上野精機株式会社 | 半導体装置のテーピング装置 |
JP2005096789A (ja) * | 2003-09-24 | 2005-04-14 | Ricoh Co Ltd | キャリアテープ及びその製造方法、並びにそのキャリアテープを用いた電子部品の実装方法及び外観検査方法 |
JP2007145365A (ja) * | 2005-11-28 | 2007-06-14 | Ueno Seiki Kk | テーピング装置及びその制御方法 |
JP2010129718A (ja) * | 2008-11-27 | 2010-06-10 | Juki Corp | 部品実装装置 |
JP2010131680A (ja) * | 2008-12-02 | 2010-06-17 | Ueno Seiki Kk | 保持手段駆動装置 |
CN101873792A (zh) * | 2009-04-23 | 2010-10-27 | 东京威尔斯股份有限公司 | 工件插入机构以及工件插入方法 |
Also Published As
Publication number | Publication date |
---|---|
SG11201404990XA (en) | 2014-11-27 |
KR20140103185A (ko) | 2014-08-25 |
CN104136325A (zh) | 2014-11-05 |
JPWO2013128560A1 (ja) | 2015-07-30 |
HK1202101A1 (zh) | 2015-09-18 |
WO2013128560A1 (ja) | 2013-09-06 |
MY167646A (en) | 2018-09-21 |
KR101520677B1 (ko) | 2015-05-15 |
TW201343022A (zh) | 2013-10-16 |
TWI583272B (zh) | 2017-05-11 |
JP5300111B1 (ja) | 2013-09-25 |
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