CN104134646A - 具有支撑构件的引线框架条 - Google Patents

具有支撑构件的引线框架条 Download PDF

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CN104134646A
CN104134646A CN201410180437.8A CN201410180437A CN104134646A CN 104134646 A CN104134646 A CN 104134646A CN 201410180437 A CN201410180437 A CN 201410180437A CN 104134646 A CN104134646 A CN 104134646A
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supporting member
lead frame
pipe core
welding disc
core welding
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CN104134646B (zh
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C.马尔贝拉
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Infineon Technologies AG
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Infineon Technologies AG
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Abstract

一种具有支撑构件的引线框架条。引线框架条包括多个连接的单元引线框架。每个单元引线框架具有用于附着于半导体管芯的管芯焊盘、将管芯焊盘连接到单元引线框架的外围的系杆以及从该外围朝着管芯焊盘突出的多个引线。引线框架条还包括支撑构件，其在近端处被图案化到每个单元引线框架的外围中或被连接到该外围，并弯曲到与引线不同的平面中，使得每个支撑构件的远端被设置在引线上面或下面并朝着管芯焊盘突出。能够将支撑构件的远端锚定在密封被附着于管芯焊盘的电子部件的模塑料中，以在单元引线框架分离之前的引线框架条测试期间维持结构完整性。

Description

具有支撑构件的引线框架条
技术领域
本申请涉及引线框架条，并且更具体地用于在引线框架条测试期间维持结构完整性的支撑构件。
背景技术
引线框架形成IC封装的底座或骨架，在到完成的封装的组装期间向半导体管芯提供机械支撑。引线框架通常包括用于附着半导体管芯的管芯焊盘（die paddle）和提供用于到管芯的外部电连接的装置的引线。能够由导线、例如通过导线结合或胶带自动接合来将管芯连接到引线。引线框架通常由扁平金属片构造而成，例如通过冲压或蚀刻。金属片通常被暴露于去除未被光致抗蚀剂覆盖的区域的化学蚀刻剂。在蚀刻过程之后，将被蚀刻框架单体化（分离）成引线框架条。每个引线框架条包括多个单元引线框架，每个具有上面描述的管芯焊盘和引线构造。
通常在单元引线框架从引线框架条的分离（例如通过打孔(punch)）之后测试在引线框架条的组装过程完成之后附着于芯片焊盘的半导体管芯。替换地，单元引线框架在管芯测试期间通过系杆而保持机械连接到引线框架。这一般地称为引线框架条测试。单元引线框架与引线框架条的分离在电测试之后发生。管芯焊盘在测试期间通过系杆保持电连接到引线框架条。这对于其中管芯焊盘服务于电连接功能的应用而言是有问题的，例如在DSO（双重小轮廓）封装中，其中暴露的管芯焊盘提供到被附着于管芯焊盘的半导体管芯的背面的电连接。
在这种情况下，系杆将管芯焊盘电短路至引线框架条和被附着于相同的引线框架条的其它管芯焊盘，使电测试过程复杂化。
发明内容
根据本文所描述的实施例，提供了包括多个连接的单元引线框架的引线框架条。每个单元引线框架具有用于附着于半导体管芯的管芯焊盘、将管芯焊盘连接到单元引线框架的外围的系杆、以及从该外围朝着管芯焊盘突出的多个引线。引线框架条还包括在近端处被图案化到每个单元引线框架的外围中或被连接到该外围的支撑构件。支撑构件弯曲到与引线不同的平面中，使得每个支撑构件的远端被设置在引线上面或下面并朝着管芯焊盘突出。能够将支撑构件的远端锚定在密封被附着于管芯焊盘的电子部件的模塑料（mold compound）中。支撑构件在系杆被从管芯焊盘拆卸之后维持引线框架条的结构完整性，以使得能够在单元引线框架从引线框架条的分离之前发生可靠引线框架条测试。
根据测试被附着于引线框架条的电子部件的方法的实施例，该方法包括：
将半导体管芯附着于管芯焊盘中的每个；
使支撑构件弯曲到与引线不同的平面中，使得每个支撑构件的远端被设置在引线上面或下面并朝着管芯焊盘突出；
用模塑料来密封单元引线框架，使得每个支撑构件的远端被锚定在模塑料中，并且系杆的一部分保持不被模塑料覆盖；
在模塑料外面将系杆从管芯焊盘拆卸，使得支撑构件将单元引线框架固定就位，并且半导体管芯与引线框架条电隔离；
在将系杆从管芯焊盘拆卸之后测试半导体管芯；以及
在测试半导体管芯之后将单元引线框架分离。
根据包括引线框架条和支撑构件的半导体条组件的实施例，该组件还包括被附着于管芯焊盘中的每个的半导体管芯以及模塑料，其至少部分地密封单元引线框架，使得每个支撑构件的远端被锚定在模塑料中，并且系杆的一部分保持不被模塑料覆盖。在模塑料外面将系杆从单元引线框架的外围拆卸，使得支撑构件将单元引线框架固定就位，并且半导体管芯例如在条测试期间与引线框架条电隔离。
本领域的技术人员在阅读以下详细描述时并在浏览附图时将认识到附加特征和优点。
附图说明
图中的部件不一定按比例，而是将重点放在说明本发明的原理上。此外，在图中，相似的参考数字指示对应的部分。在所述附图中：
图1图示出根据实施例的具有支撑构件的引线框架条的自上而下的平面图；
图2图示出根据另一实施例的具有支撑构件的引线框架条的自上而下的平面图；
图3图示出在支撑构件的弯曲期间的具有支撑构件的引线框架条的透视截面图；
图4图示出根据实施例的包括具有多个单元引线框架和支撑构件的引线框架条以及被附着于单元引线框架的管芯焊盘的密封半导体管芯的半导体条组件的透视截面图；
图5图示出将系杆从管芯焊盘拆卸之后的图4的半导体条组件的透视截面图；
图6图示出根据另一实施例的包括具有多个单元引线框架和支撑构件的引线框架条以及被附着于单元引线框架的管芯焊盘的密封半导体管芯的半导体条组件的透视截面图；
图7图示出将系杆从管芯焊盘拆卸之后的图6的半导体条组件的透视截面图；以及
图8图示出测试被附着于具有支撑构件的引线框架条的单元引线框架的电子部件的方法的实施例的流程图。
具体实施方式
本文所描述的实施例提供了包括多个连接的单元引线框架的引线框架条。每个单元引线框架被设计成容纳半导体管芯。稍后在管芯附着之后将单元引线框架从引线框架条分离成单独的单元，并且稍后进行引线框架条测试。引线框架条还包括在近端处被图案化到每个单元引线框架的外围中或被连接到该外围的支撑构件。支撑构件弯曲到与引线不同的平面中，使得每个支撑构件的远端被设置在引线上面或下面并朝着管芯焊盘突出。能够将支撑构件的远端锚定在密封被附着于单元引线框架的管芯焊盘的电子部件的模塑料中，使得在引线框架条测试期间（在单元引线框架的分离之前）维持引线框架条的结构完整性。
图1图示出根据实施例的引线框架条100的一部分的自上而下的平面图。引线框架条100包括多个连接的单元引线框架102，在图1中示出了其中的两个。每个单元引线框架102具有用于附着于半导体管芯的管芯焊盘104、将管芯焊盘104连接到单元引线框架102的外围108的系杆106以及从该外围108朝着管芯焊盘104突出的多个引线110。
引线框架条100还包括在近端111处被图案化到每个单元引线框架102的外围108中或被连接到该外围的支撑构件112。支撑构件112可以包括与引线框架条100相同或不同的材料。例如，支撑构件112可以具有与系杆106、管芯焊盘104、以及引线110相同的CTE（热膨胀系数）和材料饰面（material finish），由于材料同性而提供类似的热循环应力特性和/或界面和粘附特性。
支撑构件112还可以与管芯焊盘104和引线110间隔开。例如，能够将支撑构件112空间地设置在与系杆108、引线110和/或管芯焊盘104不同的平面上。用此类配置，支撑构件112并不争夺与系杆106、引线110和管芯焊盘104相同的平面空间，允许管芯焊盘104和引线110的尺寸最大化。并且，用此类配置，支撑构件112并不争夺围绕管芯焊盘104的外围的邻近的引线框架金属。支撑构件112能够位于更远离管芯焊盘104，在那里存在更多可用金属，使得更宽支撑构件112的设计能够为引线框架条100提供更强机械支撑并避免对围绕管芯焊盘外围的引线框架材料的争夺。支撑构件112能够被涂敷电绝缘体或者保持不被涂敷。
在一个实施例中，引线框架条100例如通过冲压或蚀刻由扁平金属片构造。例如，能够使金属片暴露于去除未被光致抗蚀剂覆盖的区域的化学蚀刻剂。能够执行其它处理，例如诸如激光蚀刻以使金属片图案化。在图案化过程之后，将图案化框架单体化（分离）成引线框架条100。在图1中示出了一个此类引线框架条100。能够将支撑构件112图案化到金属片中作为图案化过程的一部分，并且因此将支撑构件112形成为引线框架条100的单一连续部分。替换地，能够在图案化过程之后例如通过胶合、焊接等将支撑构件112连接到每个单元引线框架102的外围。在每种情况下，根据图1中所示的实施例，单元引线框架102每个具有在外围108的相对侧被图案化到单元引线框架102的外围108中或连接到该外围108的一对支撑构件112。此外，根据图1中所示的实施例，被图案化到每个单元引线框架102的外围108中或被连接到该外围108的该对支撑构件112参考在图1中标记为‘CL’的中心线相互偏移。替换地，被图案化到每个单元引线框架102的外围108中或被连接到该外围108的该对支撑构件112能够对于每个单元引线框架102而被相互对准，或者能够为引线框架条100提供对准和未对准支撑构件配置的某个组合。
图2图示出根据另一实施例的引线框架条200的一部分的自上而下的平面图。图2中所示的引线框架条200类似于图1中所示的那个。然而，被图案化到每个单元引线框架102的外围108中或被连接到该外围108的该对支撑构件112在与对应管芯焊盘104平行的第一方向上弯曲，并且然后在垂直于第一方向且朝向对应管芯焊盘104的第二方向上弯曲。
图3图示出使支撑构件112弯曲到与引线110和系杆106不同的平面中之后的引线框架条100/200的截面图。引线110在图3中的视图之外。由图3中所示的曲线箭头来指示支撑构件的弯曲过程。能够使支撑构件112从单元引线框架外围108向上并朝着管芯焊盘104弯曲，如图3中所示。替换地，能够使支撑构件112从单元引线框架外围108向下并朝着管芯焊盘104弯曲。一般地，每个支撑构件112的远端113被设置在引线110和系杆106上面或下面并朝着管芯焊盘104突出。支撑构件112的近端111保持连接到对应的单元引线框架102的外围108。能够在半导体管芯到管芯焊盘104的附着之前或之后使支撑构件112弯曲到与引线110不同的平面中并朝向管芯焊盘104。在图1和2中，由参考数字112'来指示支撑构件的弯曲前位置，并且由参考数字112来指示弯曲后位置。
图4图示出将半导体管芯302附着于引线框架条100/200的管芯焊盘104且单元引线框架102至少部分地被诸如环氧树脂之类的模塑料304密封之后的半导体条组件300的截面图。根据本实施例，引线框架条100/200具有到管芯焊盘104的向下的延伸306，使得管芯焊盘104被定位在引线110下面。根据本实施例，支撑构件112在密封之前从引线框架条100/200向上且朝着管芯焊盘104弯曲，使得每个支撑构件112的远端113被锚定在管芯焊盘104上面的模塑料304中。能够如图4中所示使支撑构件112的远端113向下朝着管芯焊盘104弯曲，以更好地将支撑构件112的远端113锚定在模塑料304中。
面对管芯焊盘104的半导体管芯302的底侧在由模塑料304进行的密封之前被附着于管芯焊盘104。在垂直电流器件的情况下，管芯302的底侧具有端子或焊盘，并且电流在顶侧与底侧之间的器件中垂直地流动。根据本实施例，管芯302的底侧被诸如焊料之类的导电材料308附着于对应的管芯焊盘104。管芯焊盘104的底侧能够保持暴露以形成用于对应半导体管芯302的测试和正常操作的接触焊盘，即在管芯302的底侧提供到端子的外部电连接。在其中在管芯302的顶侧进行所有电器件连接的横向电流器件的情况下，能够使用诸如胶或环氧树脂之类的电绝缘材料308将管芯302的底侧胶合或别的方式附着到管芯焊盘104。能够由导线310、例如通过导线结合或胶带自动结合来将半导体管芯302的顶侧的端子或焊盘连接到对应的引线110。
在密封过程之后，将每个支撑构件112的远端113锚定在密封对应半导体管芯302的模塑料304中。此类配置在后续引线框架条测试期间（在单元引线框架102的分离之前）维持引线框架条100/200的结构完整性，如接下来参考图5所描述的。
图5示出了在模塑料304外面切断或切割将管芯焊盘104固定到单元引线框架102的外围108的系杆106之后的图4的半导体条组件300的截面图。在图5中由有角度的短划线来表示系杆切断/切割过程。在将系杆106从单元引线框架102的外围108拆卸之后，半导体管芯302与引线框架条100/200电隔离。支撑构件112在管芯302的后续测试期间（在单元引线框架102的分离之前）将单元引线框架102固定就位。
图6图示出将半导体管芯302附着于引线框架条100/200的管芯焊盘104且单元引线框架102至少部分地被诸如环氧树脂之类的模塑料304密封之后的半导体条组件400的另一实施例的截面图。图6中所示的半导体条组件400类似于图4中所示的那个，然而，支撑构件112在密封之前从引线框架条100/200向下而不是向上弯曲且朝向管芯焊盘104。根据本实施例，每个支撑构件112的远端113在密封过程之后被锚定于在管芯焊盘104下面的模塑料304中。能够如图6中所示地使支撑构件112的远端113朝着管芯焊盘104向上弯曲以更好地将支撑构件112的远端104锚定在模塑料304中。类似于图4中所示的那个，图6中所示的配置在后续引线框架条测试期间（在单元引线框架102的分离之前）维持引线框架条100/200的结构完整性，如接下来参考图7所描述的。
图7示出了在模塑料304外面切断或切割将管芯焊盘104固定到单元引线框架102的外围108的系杆106之后的图6的半导体条组件的截面图。在图7中由有角度的短划线来表示系杆切断/切割过程。根据本实施例，在支撑构件112上面切断/切割系杆106。半导体管芯302在将系杆106从单元引线框架102的外围108拆卸之后与引线框架条100/200电隔离，并且支撑构件112在管芯302的后续测试期间（在单元引线框架102的分离之前）将单元引线框架102固定就位，如本文中先前所描述的。
图8图示出如本文中先前所描述的测试被附着于包括多个连接的单元引线框架和支撑构件的引线框架条的电子部件的方法的实施例。该方法包括将半导体管芯附着于单元引线框架的管芯焊盘（方框500）和将管芯的顶侧与单元引线框架的对应引线之间的电连接导线结合（方框510）。在管芯附着和/或结合过程之前或之后使支撑构件弯曲到与引线不同的平面中，使得每个支撑构件的远端被设置在引线的上面或下面并朝着管芯焊盘突出（方框520）。可选地，能够在引线框架供应商处执行引线框架支撑构件弯曲或制造/准备，接下来是管芯组装过程（步骤500和510）。在每种情况下，用模塑料将单元引线框架密封，使得每个支撑构件的远端被锚定在模塑料中，并且系杆的一部分保持不被模塑料覆盖（方框530）。在模塑料外面将系杆从管芯焊盘拆卸，使得支撑构件将单元引线框架固定就位，并使半导体管芯与引线框架条电隔离（方框540）。在将系杆从管芯焊盘拆卸之后测试半导体管芯（方框550）。在测试半导体管芯之后将单元引线框架从引线框架条分离（方框560）。该方法能够可选地包括在用模塑料来密封单元引线框架之前用电绝缘体涂敷支撑构件。能够通过对引线框架条进行冲压或蚀刻或者通过将支撑构件附着于引线框架条（例如通过如本文中先前所描述的焊接或胶合）来形成支撑构件。
诸如“下”、“下面”、“较低”、“之上”、“上”等空间相对术语被用于容易描述以解释一个元件相对于第二元件的定位。除与图中所描绘的那些不同的取向之外，这些术语意图涵盖器件的不同取向。此外，还使用诸如“第一”、“第二”等的术语来描述各种元件、区域、部分等，并且也不意图是限制性的。遍及描述，相似的术语指的是相似的元件。
如本文所使用的，术语“具有”、“包含”、“包括”、“含有”等是开放性术语，其指示声称的元件或特征的存在，但是不排除附加元件或特征。冠词“一”、“一个”和“该”意图包括复数以及单数，除非上下文另外明确地指出。
鉴于以上变化和应用的范围，应理解的是本发明不受前述描述的限制，也不受附图的限制。事实上，本发明仅仅由以下权利要求及其法律等价物来限制。

Claims (20)

1.一种测试被附着于引线框架条的电子部件的方法，该引线框架条包括多个连接的单元引线框架，每个单元引线框架具有管芯焊盘、将管芯焊盘连接到单元引线框架的外围的系杆、从外围朝着管芯焊盘突出的多个引线、以及在近端处被图案化到外围中或连接到外围的支撑构件，该方法包括：
将半导体管芯附着于管芯焊盘中的每个；
使支撑构件弯曲到与引线不同的平面中，使得每个支撑构件的远端被设置在引线上面或下面并朝着管芯焊盘突出；
用模塑料来密封单元引线框架，使得每个支撑构件的远端被锚定在模塑料中，并且系杆的一部分保持不被模塑料覆盖；
在模塑料外面将系杆从管芯焊盘拆卸，使得支撑构件将单元引线框架固定就位，并且半导体管芯与引线框架条电隔离；
在将系杆从管芯焊盘拆卸之后测试半导体管芯；以及
在测试半导体管芯之后将单元引线框架分离。
2.权利要求1的方法，包括使在引线上面的支撑构件和支撑构件的远端朝着管芯焊盘向下弯曲。
3.权利要求1的方法，包括使在引线下面的支撑构件和支撑构件的远端朝着管芯焊盘向上弯曲。
4.权利要求1的方法，其中，所述支撑构件包括与引线框架条相同的材料。
5.权利要求1的方法，其中，所述支撑构件被形成为引线框架条的单一连续部分。
6.权利要求1的方法，还包括在用模塑料来密封单元引线框架之前用电绝缘体涂敷支撑构件。
7.权利要求1的方法，其中，所述支撑构件在被弯曲到与引线不同的平面中之后与管芯焊盘和引线间隔开。
8.权利要求1的方法，还包括通过对引线框架条进行冲压或蚀刻来形成支撑构件。
9.一种半导体条组件，包括：
包括多个连接的单元引线框架的引线框架条，每个单元引线框架具有管芯焊盘、用于将管芯焊盘连接到单元引线框架的外围的系杆、和从外围朝着管芯焊盘突出的多个引线；
支撑构件，其在近端处被图案化到每个单元引线框架的外围中或被连接到该外围，并被弯曲到与引线不同的平面中，使得每个支撑构件的远端被设置在引线上面或下面并朝着管芯焊盘突出；
半导体管芯，其被附着于管芯焊盘中的每个；
至少部分地密封单元引线框架的模塑料，使得每个支撑构件的远端被锚定在模塑料中，并且系杆的一部分保持不被模塑料覆盖，以及
其中，在模塑料外面将系杆从单元引线框架的外围拆卸，使得支撑构件将单元引线框架固定就位，并且半导体管芯与引线框架条电隔离。
10.权利要求9的半导体条组件，其中，所述支撑构件在引线上面弯曲，并且支撑构件的远端朝着管芯焊盘向下弯曲。
11.权利要求9的半导体条组件，其中，所述支撑构件在引线下面弯曲，并且支撑构件的远端朝着管芯焊盘向上弯曲。
12.权利要求9的半导体条组件，其中，所述支撑构件包括与引线框架条相同的材料。
13.权利要求9的半导体条组件，其中，所述支撑构件被形成为引线框架条的单一连续部分。
14.权利要求9的半导体条组件，其中，所述支撑构件被涂敷电绝缘体。
15.权利要求9的半导体条组件，其中，所述支撑构件与管芯焊盘和引线间隔开。
16.权利要求9的半导体条组件，其中，每个单元引线框架包括在单元引线框架的外围的相对侧被图案化到该外围中或被连接到该外围的一对支撑构件。
17.权利要求16的半导体条组件，其中，被图案化到每个单元引线框架的外围中或被连接到该外围的该对支撑构件相互偏移。
18.一种引线框架条，包括：
多个连接的单元引线框架，每个单元引线框架具有用于附着到半导体管芯的管芯焊盘、将管芯焊盘连接到单元引线框架的外围的系杆、以及从外围朝着管芯焊盘突出的多个引线；以及
支撑构件，其在近端处被图案化到每个单元引线框架的外围中或被连接到该外围，并弯曲到与引线不同的平面中，使得每个支撑构件的远端被设置在引线上面或下面并朝着管芯焊盘突出。
19.权利要求18的引线框架条，其中，每个单元引线框架包括在单元引线框架的外围的相对侧被图案化到该外围中或被连接到该外围的一对支撑构件。
20.权利要求19的引线框架条，其中，被图案化到每个单元引线框架的外围中或被连接到该外围的该对支撑构件相互偏移。
CN201410180437.8A 2013-05-03 2014-04-30 具有支撑构件的引线框架条 Expired - Fee Related CN104134646B (zh)

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CN106158810B (zh) * 2015-04-03 2020-04-10 恩智浦美国有限公司 用于ic封装的具有偏转的连接杆的引线框架
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