CN104134632A - Power tube shell and manufacturing method thereof - Google Patents
Power tube shell and manufacturing method thereof Download PDFInfo
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- CN104134632A CN104134632A CN201410378148.9A CN201410378148A CN104134632A CN 104134632 A CN104134632 A CN 104134632A CN 201410378148 A CN201410378148 A CN 201410378148A CN 104134632 A CN104134632 A CN 104134632A
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Abstract
The invention provides a power tube shell and a manufacturing method of the power tube shell. The power tube shell comprises a flange (P1), metal leads (P2 and P3) and a ceramic framework, wherein the ceramic framework is formed by metalizing and then welding a first ceramic block (P4), a second ceramic block (P5), a third ceramic block (P6) and a fourth ceramic block (P7) end to end. The ceramic framework is manufactured through an HTCC technology based on aluminum oxide materials. The ceramic framework and the metal flange are welded to form a core chamber of a power tube, and the core chamber is used for containing an active chip and an inner matched circuit. By the adoption of the power tube shell and the manufacturing method of the power tube shell, the utilization rate of the ceramic materials can be improved, the process difficulty of ceramic sintering is reduced, the rate of finished products is improved, and the purposes of lowering the production cost, saving energy and reducing emission are achieved on the whole.
Description
Technical field
The present invention relates to solid state microwave high power device technical field, relate in particular to a kind of power tube shell and manufacture method thereof.
Background technology
LDMOS power tube is as the key components of base station, very wide in communications field application prospect, as CDMA, W-CDMA, TETRA, digital terrestrial television, microwave-navigation system etc.Every profession and trade is the more powerful base station functions of realization and signal area coverage, sends the needs of HDTV (High-Definition Television) signal, raising imaging definition etc., particularly strong to the demand of high power LD MOS power tube more than dissipation power 200W and shell thereof.
High power LD MOS power tube shell, plays mechanical support and Environmental Role to device, has the function of electric interconnection and heat dissipation channel simultaneously.
Fig. 1 is power tube shell mechanism schematic diagram of the prior art, and as shown in Figure 1, LDMOS power tube shell mechanism of the prior art is made up of metal heat sink P1, ceramic frame P4 and metal lead wire P2 and P3.
Fig. 2 is ceramic frame structural representation in prior art, and as shown in Figure 2, ceramic frame adopts high temperature co-firing multi-layer ceramics (HTCC) technology based on alumina material to make.Ceramic frame and metal heat sink consist of the core chamber of power tube welding, for accommodating source chip and interior match circuit.
Wherein, the manufacture craft of ceramic frame is alumina high temperature common burning porcelain (being called for short HTCC) technique.For more powerful LDMOS power tube shell, mean the ceramic frame of the larger physical size of use.Owing to burning till under the heating and cooling process curve of aluminium oxide ceramics frame more than maximum temperature 1600 degree, the larger sintering process difficulty of ceramic frame size is larger, more easily causes the defects such as distortion, warpage and dimension overproof.On the other hand, aluminium oxide ceramics frame, at green formative stage, adopts process for stamping that center material is removed conventionally, and the ceramic frame that size is larger needs the material of removal also more.
Summary of the invention
In view of this, in order to overcome deficiency of the prior art, the present invention, by adopting the ceramic frame structure of separate assembling, is broken the whole up into parts in the manufacturing process of ceramic member, improves the utilance of green raw material, production efficiency and the rate of finished products of raising ceramic frame part.
The invention provides a kind of power tube shell, it comprises: flange (P1); Metal lead wire (P2, P3); Ceramic frame, is formed by head and the tail welding after the first ceramic block (P4), the second ceramic block (P5), the 3rd ceramic block (P6), the 4th ceramic block (P7) metallization.
Further, this first ceramic block (P4) is identical with the 3rd ceramic block (P6) size, and this second ceramic block (P5) is identical with the 4th ceramic block (P7) size.
Further, the end plane metal of this first ceramic block (P4) and the 3rd ceramic block (P6), two end faces in this second ceramic block (P5) and the 4th ceramic block (P7) side metallize respectively, and metallized this endface position and metallized this side correspondence position pass through metal solder.
Further, two end faces of this second ceramic block (P5) and the 4th ceramic block (P7) side metallize respectively, in the correspondence position metallization of this first ceramic block (P4) and the 3rd ceramic block (P6) side, and metallized this endface position and metallized this side correspondence position pass through metal solder.
The present invention also provides a kind of manufacture method of power tube shell, and it comprises following processing step:
(1) provide flange (P1), metal lead wire (P2, P3);
(2) to this flange (P1), this metal lead wire (P2, P3) clean, stand-by after annealing and Nickel Plating Treatment;
(3) make the first ceramic block (P4), the second ceramic block (P5), the 3rd ceramic block (P6), the 4th ceramic block (P7) according to high temperature co-firing multi-layer ceramics technique, and to its metallization;
(4) first to fourth ceramic block to above-mentioned steps (3) (P4, P5, P6, P7) carries out after nickel plating stand-by;
(5) by this flange after treatment above-mentioned steps (2) (P1) and this metal lead wire (P2, P3) and above-mentioned steps (4) first to fourth ceramic block (P4 after treatment, P5, P6, P7) be power tube shell semi-finished product by scolder soldering;
(6) above-mentioned steps (5) being processed to these power tube shell semi-finished product that obtain makes and becomes power tube shell through nickel-gold electroplating order.
Further, this first ceramic block (P4) is identical with the 3rd ceramic block (P6) size, and this second ceramic block (P5) is identical with the 4th ceramic block (P7) size.
Further, this first ceramic block (P4) in described processing step (3) and the end plane metal of the 3rd ceramic block (P6), two end faces in this second ceramic block (P5) and the 4th ceramic block (P7) side metallize respectively, in described processing step (5), metallized this endface position and metallized this side correspondence position are passed through to metal solder.
Further, in described processing step (3), this first ceramic block (P4) and the 3rd ceramic block (P6) are of a size of: 6.00mm × 1.00mm × 0.51mm, this second ceramic block (P5) and the 4th ceramic block (P7) are of a size of 19.81mm × 1.65mm × 0.51mm.
Further, in this processing step (3), two end faces of this second ceramic block (P5) and the 4th ceramic block (P7) side metallize respectively, in the correspondence position metallization of this first ceramic block (P4) and the 3rd ceramic block (P6) side, and in processing step (5), metallized this endface position and metallized this side correspondence position pass through metal solder.
Further, in described processing step (5), the first ceramic block (P4) and the 3rd ceramic block (P6) are of a size of: 9.40mm × 1.00mm × 0.51mm, this second ceramic block (P5) and the 4th ceramic block (P7) are of a size of 17.71mm × 1.65mm × 0.51mm.
Compared with prior art, the invention has the advantages that:
By overall ceramic frame being decomposed into four independently ceramic side walls, on the one hand, can reduce the sintering difficulty of porcelain piece, thereby increase substantially the rate of finished products of porcelain piece; On the other hand, adopt independently after side wall, in the HTCC green stage without the excess stock of removing ceramic frame center, can be by the utilance of intensive typesetting raising raw material.In a word, adopt the technology of the present invention, can improve the production efficiency of LDMOS shell and significantly reduce production costs.
Brief description of the drawings
Fig. 1 is power tube shell mechanism schematic diagram of the prior art;
Fig. 2 is ceramic frame structural representation in prior art;
Fig. 3 is the power tube shell that adopts separate assembling pottery sidewall structure;
Fig. 4 is separate assembling pottery sidewall structure schematic diagram in the embodiment of the present invention 1;
Fig. 5 is separate assembling pottery sidewall structure schematic diagram in the embodiment of the present invention 2.
Embodiment
Below technical solution of the present invention is elaborated, but protection scope of the present invention is not limited to described embodiment.
Fig. 3 is the power tube shell that adopts separate assembling pottery sidewall structure.As shown in Figure 3, power tube shell comprises: flange (P1); Metal lead wire (P2, P3); Ceramic frame, is formed by head and the tail welding after the first ceramic block (P4), the second ceramic block (P5), the 3rd ceramic block (P6), the 4th ceramic block (P7) metallization.Wherein, ceramic frame adopts high temperature co-firing multi-layer ceramics (HTCC) technology based on alumina material to make.Ceramic frame and metal flange consist of the core chamber of power tube welding, for accommodating source chip and interior match circuit.
The present invention is preferably a kind of LDMOS power tube shell, and independently ceramic side wall part original position is alternative by four for its ceramic frame, in soldering operation, four sidewall weldings is integrated, and makes it possess the function that former ceramic frame is identical.
Adopt the advantage of power tube shell of the present invention to be, first,, by overall ceramic frame being decomposed into four independently side walls, adopt independently after side wall, without the excess stock of removing ceramic frame center, can improve by intensive typesetting the utilance of raw material in the HTCC green stage.Secondly, ceramic side wall is compared ceramic frame, and simple shape and physical size are less, and sintering process difficulty is little, and rate of finished products is high; Three, comparing ceramic frame, there is not hollow parts in ceramic side wall compact shape, and the area of porcelain piece sintering circuit load bearing board can more be made full use of, thereby makes the production capacity of ceramic part of LDMOS power tube shell higher.Therefore, adopt the technology of the present invention, can improve the production efficiency of LDMOS shell and significantly reduce production costs.
The present invention also provides the manufacture method of power tube shell, and it comprises following processing step:
(1) prepare metal parts, comprise P1 flange, P2 lead-in wire and P3 lead-in wire;
(2) stand-by after cleaning, annealing and the Nickel Plating Treatment of above-mentioned steps (1) metal parts being carried out;
(3) make aluminium oxide ceramics piece P4, P5, P6 and P7 according to high temperature co-firing multi-layer ceramics (being called for short HTCC) technique, and make metallization at respective regions by product design requirement.
(4) carry out after nickel plating stand-by to the aluminium oxide ceramics piece of above-mentioned steps (3);
(5) by the ceramic part of above-mentioned steps (2) metal parts and above-mentioned steps (4) according to Figure of abstract structural representation, be LDMOS power tube shell semi-finished product by using AgCu28 braze 810 DEG C~830 DEG C solderings;
(6) the nickel-gold electroplating order of above-mentioned steps (5) gained LDMOS power tube shell semi-finished product process is made and become LDMOS power tube shell finished product, after test and screening, can be used for encapsulating silicon LDMOS power tube.
The power tube shell of employing separate assembling sidewall structure provided by the invention, wherein, the material of flange P1 is tungsten copper or copper molybdenum copper; The material of metal lead wire P2 and P3 is for can cut down 4J29 or iron-nickel alloy 4J42; With the material of ceramic side wall be HTCC aluminium oxide ceramics.In the manufacture method of power tube shell provided by the invention, using silver-copper brazing alloy to adopt soldering processes, is power tube shell semi-finished product by above-mentioned part soldering.
Embodiment 1
The manufacture method of power tube shell provided by the invention, it comprises following processing step:
(1) prepare metal parts, comprise P1 flange, be of a size of 34.04mm × 9.78mm × 1.00mm, material is tungsten copper WCu15; P2 lead-in wire and P3 lead-in wire, be of a size of 12.7mm × 5mm × 0.10mm, and material is iron-nickel alloy 4J42;
(2) stand-by after cleaning, annealing and the Nickel Plating Treatment of above-mentioned steps (1) metal parts being carried out;
(3) Fig. 4 is separate assembling pottery sidewall structure schematic diagram in the embodiment of the present invention 1, as shown in Figure 4, make aluminium oxide ceramics piece P4, P5, P6 and P7 according to high temperature co-firing multi-layer ceramics (being called for short HTCC) technique, P4 and P6 are of a size of: 6.00mm × 1.00mm × 0.51mm, P5 and P7 are of a size of 19.81mm × 1.65mm × 0.51mm, and by the end plane metal of this P4 and this P6, two end faces in this P5 and this P7 side metallize respectively, and metallized this endface position and metallized this side correspondence position are passed through to metal solder.
(4) carry out after nickel plating stand-by to the aluminium oxide ceramics piece of above-mentioned steps (3);
(5) by the ceramic part of above-mentioned steps (2) metal parts and above-mentioned steps (4) according to Figure of abstract structural representation, be LDMOS power tube shell semi-finished product by using AgCu28 braze 810 DEG C~830 DEG C solderings;
(6) the nickel-gold electroplating order of above-mentioned steps (5) gained LDMOS power tube shell semi-finished product process is made and become LDMOS power tube shell finished product, after test and screening, can be used for encapsulating LDMOS power tube.
Embodiment 2
Manufacture method and the embodiment 1 of the power tube shell that the embodiment of the present invention 2 provides are roughly the same, its difference is only: in processing step (3), as shown in Figure 5, P4 and P6 are of a size of: 9.40mm × 1.00mm × 0.51mm, P5 and P7 are of a size of 17.71mm × 1.65mm × 0.51mm.Two end faces at P5 and P7 are made metallization, make metallization at the correspondence position of P4 and P6 side, are the ceramic frame structure of LDMOS power tube shell at processing step (5) by P4, P5, P6 and P7 soldering.
By changing the size of metal parts and ceramic part of above-mentioned two embodiment, can make the inner cavity size of LDMOS power tube shell change, can be used for encapsulating the LDMOS power tube chip of different dissipation powers.
As mentioned above, although represented and explained the present invention with reference to specific preferred embodiment, it shall not be construed as the restriction to the present invention self.Not departing under the spirit and scope of the present invention prerequisite of claims definition, can make in the form and details various variations to it.
Claims (10)
1. a power tube shell, it comprises:
Flange (P1);
Metal lead wire (P2, P3);
Ceramic frame, by the first ceramic block (P4), the second ceramic block (P5), the 3rd ceramic block (P6),
After the 4th ceramic block (P7) metallization, head and the tail welding forms.
2. power tube shell as claimed in claim 1, it is characterized in that: this first ceramic block (P4) is identical with the 3rd ceramic block (P6) size, this second ceramic block (P5) is identical with the 4th ceramic block (P7) size.
3. power tube shell as claimed in claim 1 or 2, it is characterized in that: the end plane metal of this first ceramic block (P4) and the 3rd ceramic block (P6), two end faces in this second ceramic block (P5) and the 4th ceramic block (P7) side metallize respectively, and metallized this endface position and metallized this side correspondence position pass through metal solder.
4. power tube shell as claimed in claim 1 or 2, it is characterized in that: two end faces of this second ceramic block (P5) and the 4th ceramic block (P7) side metallize respectively, in the correspondence position metallization of this first ceramic block (P4) and the 3rd ceramic block (P6) side, and metallized this endface position and metallized this side correspondence position pass through metal solder.
5. a manufacture method for power tube shell, it comprises following processing step:
(1) provide flange (P1), metal lead wire (P2, P3);
(2) to this flange (P1), this metal lead wire (P2, P3) clean, stand-by after annealing and Nickel Plating Treatment;
(3) make the first ceramic block (P4), the second ceramic block (P5), the 3rd ceramic block (P6), the 4th ceramic block (P7) according to high temperature co-firing multi-layer ceramics technique, and to its metallization;
(4) first to fourth ceramic block to above-mentioned steps (3) (P4, P5, P6, P7) carries out after nickel plating stand-by;
(5) by this flange after treatment above-mentioned steps (2) (P1) and this metal lead wire (P2, P3) and above-mentioned steps (4) first to fourth ceramic block (P4 after treatment, P5, P6, P7) be power tube shell semi-finished product by scolder soldering;
(6) above-mentioned steps (5) being processed to these power tube shell semi-finished product that obtain makes and becomes power tube shell through nickel-gold electroplating order.
6. the manufacture method of power tube shell as claimed in claim 5, it is characterized in that: this first ceramic block (P4) is identical with the 3rd ceramic block (P6) size, this second ceramic block (P5) is identical with the 4th ceramic block (P7) size.
7. the manufacture method of the power tube shell as described in claim 5 or 6, it is characterized in that: this first ceramic block (P4) in described processing step (3) and the end plane metal of the 3rd ceramic block (P6), two end faces in this second ceramic block (P5) and the 4th ceramic block (P7) side metallize respectively, in described processing step (5), metallized this endface position and metallized this side correspondence position are passed through to metal solder.
8. the manufacture method of the power tube shell as described in claim 5 or 6, it is characterized in that: in described processing step (3), this first ceramic block (P4) and the 3rd ceramic block (P6) are of a size of: 6.00mm × 1.00mm × 0.51mm, this second ceramic block (P5) and the 4th ceramic block (P7) are of a size of 19.81mm × 1.65mm × 0.51mm.
9. the manufacture method of the power tube shell as described in claim 5 or 6, it is characterized in that: in this processing step (3), two end faces of this second ceramic block (P5) and the 4th ceramic block (P7) side metallize respectively, in the correspondence position metallization of this first ceramic block (P4) and the 3rd ceramic block (P6) side, and in processing step (5), metallized this endface position and metallized this side correspondence position pass through metal solder.
10. the manufacture method of the power tube shell as described in claim 5 or 6, it is characterized in that: in described processing step (5), the first ceramic block (P4) and the 3rd ceramic block (P6) are of a size of: 9.40mm × 1.00mm × 0.51mm, this second ceramic block (P5) and the 4th ceramic block (P7) are of a size of 17.71mm × 1.65mm × 0.51mm.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109742055A (en) * | 2018-11-22 | 2019-05-10 | 中国电子科技集团公司第五十五研究所 | The power device shell transition rings and its assembly method of control deformation and solder |
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US6365961B1 (en) * | 1997-02-27 | 2002-04-02 | Kyocera Corporation | High-frequency input/output feedthrough and package for housing high-frequency semiconductor element using same |
CN102254875A (en) * | 2011-07-11 | 2011-11-23 | 中国电子科技集团公司第五十五研究所 | Ceramic package and manufacturing method thereof |
CN103441077A (en) * | 2013-07-15 | 2013-12-11 | 中国电子科技集团公司第五十五研究所 | Method for manufacturing shell of microwave high-power pipe |
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2014
- 2014-08-01 CN CN201410378148.9A patent/CN104134632A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US6365961B1 (en) * | 1997-02-27 | 2002-04-02 | Kyocera Corporation | High-frequency input/output feedthrough and package for housing high-frequency semiconductor element using same |
CN102254875A (en) * | 2011-07-11 | 2011-11-23 | 中国电子科技集团公司第五十五研究所 | Ceramic package and manufacturing method thereof |
CN103441077A (en) * | 2013-07-15 | 2013-12-11 | 中国电子科技集团公司第五十五研究所 | Method for manufacturing shell of microwave high-power pipe |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109742055A (en) * | 2018-11-22 | 2019-05-10 | 中国电子科技集团公司第五十五研究所 | The power device shell transition rings and its assembly method of control deformation and solder |
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Application publication date: 20141105 |