CN104130714A - 一种含有磨料的适用于金属的混合抛光液及其制备方法 - Google Patents
一种含有磨料的适用于金属的混合抛光液及其制备方法 Download PDFInfo
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- CN104130714A CN104130714A CN201410308710.0A CN201410308710A CN104130714A CN 104130714 A CN104130714 A CN 104130714A CN 201410308710 A CN201410308710 A CN 201410308710A CN 104130714 A CN104130714 A CN 104130714A
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- polishing solution
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- 238000005498 polishing Methods 0.000 title claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 14
- 239000002184 metal Substances 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title claims description 7
- 150000002739 metals Chemical class 0.000 title abstract description 4
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000003082 abrasive agent Substances 0.000 claims abstract description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 9
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910000420 cerium oxide Inorganic materials 0.000 claims abstract description 8
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims abstract description 8
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000008367 deionised water Substances 0.000 claims abstract description 7
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 7
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 7
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 claims abstract description 7
- FFEARJCKVFRZRR-BYPYZUCNSA-N L-methionine Chemical compound CSCC[C@H](N)C(O)=O FFEARJCKVFRZRR-BYPYZUCNSA-N 0.000 claims abstract description 4
- 229960000583 acetic acid Drugs 0.000 claims abstract description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 4
- 239000012362 glacial acetic acid Substances 0.000 claims abstract description 4
- 229930182817 methionine Natural products 0.000 claims abstract description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 4
- 239000004323 potassium nitrate Substances 0.000 claims abstract description 4
- 235000010333 potassium nitrate Nutrition 0.000 claims abstract description 4
- 229960004025 sodium salicylate Drugs 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims description 12
- 229920002785 Croscarmellose sodium Polymers 0.000 claims description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 claims description 6
- 229960001681 croscarmellose sodium Drugs 0.000 claims description 6
- 235000010947 crosslinked sodium carboxy methyl cellulose Nutrition 0.000 claims description 6
- 239000003995 emulsifying agent Substances 0.000 claims description 6
- 239000012467 final product Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 235000019353 potassium silicate Nutrition 0.000 claims description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- ABBQHOQBGMUPJH-UHFFFAOYSA-M Sodium salicylate Chemical compound [Na+].OC1=CC=CC=C1C([O-])=O ABBQHOQBGMUPJH-UHFFFAOYSA-M 0.000 abstract description 2
- 229910000831 Steel Inorganic materials 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 239000010959 steel Substances 0.000 abstract description 2
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- 239000012530 fluid Substances 0.000 description 3
- 238000006263 metalation reaction Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 241000533950 Leucojum Species 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000009533 lab test Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229960001866 silicon dioxide Drugs 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
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Priority Applications (1)
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CN201410308710.0A CN104130714B (zh) | 2014-07-01 | 2014-07-01 | 一种含有磨料的适用于金属的混合抛光液及其制备方法 |
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CN201410308710.0A CN104130714B (zh) | 2014-07-01 | 2014-07-01 | 一种含有磨料的适用于金属的混合抛光液及其制备方法 |
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CN104130714A true CN104130714A (zh) | 2014-11-05 |
CN104130714B CN104130714B (zh) | 2015-10-28 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105385412A (zh) * | 2015-10-16 | 2016-03-09 | 珠海东锦石英科技有限公司 | 研磨液、研磨液制备工艺及研磨液的使用添加方法 |
CN106318220A (zh) * | 2016-08-18 | 2017-01-11 | 江苏锦阳不锈钢制品有限公司 | 一种不锈钢表面加工用抛光液 |
CN106318222A (zh) * | 2016-08-18 | 2017-01-11 | 江苏锦阳不锈钢制品有限公司 | 一种高精度抛光液的制备方法 |
CN106467970A (zh) * | 2016-08-30 | 2017-03-01 | 宁波市鄞州伴佰精密机械有限公司 | 用于精密机械不锈钢零件的抛光液的制备方法 |
EP3710549A4 (en) * | 2017-11-15 | 2021-08-18 | Saint-Gobain Ceramics&Plastics, Inc. | COMPOSITION FOR THE PERFORMANCE OF MATERIAL DISPOSAL OPERATIONS AND ITS PROCESS FOR ITS FORMATION |
CN115247026A (zh) * | 2021-04-26 | 2022-10-28 | 福建晶安光电有限公司 | 一种蓝宝石抛光液及其制备方法 |
CN117904636A (zh) * | 2024-01-19 | 2024-04-19 | 揭阳市潜信不锈钢制品有限公司 | 一种五金餐具高效抛光工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001310256A (ja) * | 2000-04-26 | 2001-11-06 | Hitachi Chem Co Ltd | 半導体用基板の研磨方法 |
US20020032989A1 (en) * | 1998-12-21 | 2002-03-21 | Showa Denko K.K. | Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry |
US6428721B1 (en) * | 1998-12-01 | 2002-08-06 | Fujimi Incorporated | Polishing composition and polishing method employing it |
CN101302404A (zh) * | 2008-07-01 | 2008-11-12 | 上海大学 | 纳米氧化铈复合磨粒抛光液的制备方法 |
EP2063461A1 (en) * | 2006-09-13 | 2009-05-27 | Asahi Glass Company, Limited | Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device |
CN101857775A (zh) * | 2010-06-13 | 2010-10-13 | 北京国瑞升科技有限公司 | 一种铌酸锂晶体抛光液及制备方法 |
CN102533124A (zh) * | 2010-12-31 | 2012-07-04 | 上海硅酸盐研究所中试基地 | 碳化硅衬底用抛光液 |
-
2014
- 2014-07-01 CN CN201410308710.0A patent/CN104130714B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US6428721B1 (en) * | 1998-12-01 | 2002-08-06 | Fujimi Incorporated | Polishing composition and polishing method employing it |
US20020032989A1 (en) * | 1998-12-21 | 2002-03-21 | Showa Denko K.K. | Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry |
JP2001310256A (ja) * | 2000-04-26 | 2001-11-06 | Hitachi Chem Co Ltd | 半導体用基板の研磨方法 |
EP2063461A1 (en) * | 2006-09-13 | 2009-05-27 | Asahi Glass Company, Limited | Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device |
CN101302404A (zh) * | 2008-07-01 | 2008-11-12 | 上海大学 | 纳米氧化铈复合磨粒抛光液的制备方法 |
CN101857775A (zh) * | 2010-06-13 | 2010-10-13 | 北京国瑞升科技有限公司 | 一种铌酸锂晶体抛光液及制备方法 |
CN102533124A (zh) * | 2010-12-31 | 2012-07-04 | 上海硅酸盐研究所中试基地 | 碳化硅衬底用抛光液 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105385412A (zh) * | 2015-10-16 | 2016-03-09 | 珠海东锦石英科技有限公司 | 研磨液、研磨液制备工艺及研磨液的使用添加方法 |
CN106318220A (zh) * | 2016-08-18 | 2017-01-11 | 江苏锦阳不锈钢制品有限公司 | 一种不锈钢表面加工用抛光液 |
CN106318222A (zh) * | 2016-08-18 | 2017-01-11 | 江苏锦阳不锈钢制品有限公司 | 一种高精度抛光液的制备方法 |
CN106467970A (zh) * | 2016-08-30 | 2017-03-01 | 宁波市鄞州伴佰精密机械有限公司 | 用于精密机械不锈钢零件的抛光液的制备方法 |
EP3710549A4 (en) * | 2017-11-15 | 2021-08-18 | Saint-Gobain Ceramics&Plastics, Inc. | COMPOSITION FOR THE PERFORMANCE OF MATERIAL DISPOSAL OPERATIONS AND ITS PROCESS FOR ITS FORMATION |
US11161751B2 (en) | 2017-11-15 | 2021-11-02 | Saint-Gobain Ceramics & Plastics, Inc. | Composition for conducting material removal operations and method for forming same |
CN115247026A (zh) * | 2021-04-26 | 2022-10-28 | 福建晶安光电有限公司 | 一种蓝宝石抛光液及其制备方法 |
CN117904636A (zh) * | 2024-01-19 | 2024-04-19 | 揭阳市潜信不锈钢制品有限公司 | 一种五金餐具高效抛光工艺 |
CN117904636B (zh) * | 2024-01-19 | 2024-07-02 | 揭阳市潜信不锈钢制品有限公司 | 一种五金餐具高效抛光工艺 |
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Address after: 233000 Bengbu province high and new technology development zone, prosperous road, No. 717, Anhui Patentee after: BENGBU GAOHUA ELECTRONIC Co.,Ltd. Address before: 233000 Bengbu province high and new technology development zone, prosperous road, No. 717, Anhui Patentee before: HIGH GROUP DISPLAY CO.,LTD. |
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Denomination of invention: Abrasive-containing mixed polishing solution for metals and preparation method thereof Effective date of registration: 20200612 Granted publication date: 20151028 Pledgee: Merchants Bank Bengbu branch of Limited by Share Ltd. Pledgor: BENGBU GAOHUA ELECTRONIC Co.,Ltd. Registration number: Y2020980003040 |
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