CN104124147A - An etching machine and a method for cleaning crystals of the etching machine - Google Patents

An etching machine and a method for cleaning crystals of the etching machine Download PDF

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Publication number
CN104124147A
CN104124147A CN201310153849.8A CN201310153849A CN104124147A CN 104124147 A CN104124147 A CN 104124147A CN 201310153849 A CN201310153849 A CN 201310153849A CN 104124147 A CN104124147 A CN 104124147A
Authority
CN
China
Prior art keywords
etching
etching machine
substrate
water pipe
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310153849.8A
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Chinese (zh)
Inventor
黄于维
林志明
林信安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EverDisplay Optronics Shanghai Co Ltd
Original Assignee
EverDisplay Optronics Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EverDisplay Optronics Shanghai Co Ltd filed Critical EverDisplay Optronics Shanghai Co Ltd
Priority to CN201310153849.8A priority Critical patent/CN104124147A/en
Priority to TW102119612A priority patent/TW201440908A/en
Publication of CN104124147A publication Critical patent/CN104124147A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/04Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto specially adapted for plate glass, e.g. prior to manufacture of windshields

Abstract

The invention provides an etching machine and a method for cleaning crystals of the etching machine. The etching machine comprises an etching chamber which comprises an entrance and an exit; a liquid medicine tank which is located in the etching chamber and which contains liquid medicine; and a concentration controller which comprises a water-replenishing pipeline. A substrate is entered from the entrance of the etching chamber and is transported to the exit of the etching chamber; the substrate makes contact with liquid medicine in the liquid medicine tank in the etching chamber during the transport process; and the water-replenishing pipeline can inject water to the liquid medicine tank through the exit, and the water from the water-replenishing pipeline can adjust the concentration of the liquid medicine in the liquid medicine tank, and can clean the liquid medicine crystals at the exit. According to the etching machine and the method for cleaning the crystals of the etching machine, the easy-to-crystallize place, such as the exit, where an air curtain is formed, of the etching machine can be cleaned at the same time the water is added, thereby increasing the cleaning time and frequency of the easy-to-crystallize place, reducing the generation probability of the crystals effectively, and improving the qualified rate of the products.

Description

Etching machine and for cleaning the method for crystallization of this etching machine
Technical field
The present invention relates to a kind of etching machine, particularly one has cleaning function, can remove the etching machine of crystallization.
Background technology
Existing etching machine as shown in Figure 1, comprises etching chamber 1, is positioned at dipper 2, discharge pipe line 3, water pipe 4 and the compressed air line 5 of etching chamber 1.In dipper 2, hold the liquid for substrate 10 is processed, dipper 2 is provided with the conveyer 6 for delivery of substrate 10, in conveying substrate 10, substrate 10 is contacted with the liquid in dipper 2.Finally, substrate 10 is transmitted device 6 and is delivered to the outlet of etching chamber 1, leaves thus, enters subsequent processing.Wherein, water pipe 4 one end are connected with consistency controller (not shown), and the other end is communicated with discharge pipe line 3, in the time that valve 7 is opened, enter dipper 2 from the water of consistency controller via water pipe 4, to regulate the concentration of liquid.In addition, carry liquid for fear of substrate 10 and leave etching chamber 1, cause the waste of liquid, exit at etching chamber 1 is also connected with compressed air line 5, in the time that valve 8 is opened, compressed air line 5, to the exit ejection pressure-air of etching chamber 1, forms gas curtain A, so that the liquid that is attached to substrate 10 surfaces is swept away.
There is the problem of liquid crystallization in existing etching machine: particularly in the outlet of etching chamber 1, i.e. and gas curtain A place, crystallisation problems is particularly serious.The mode of existing processing crystallization is: etching machine is shut down, manually clean.But this mode not only affects the duration, and complicated operation, and efficiency is low.
Summary of the invention
The object of the invention is to, a kind of etching machine is provided, there is cleaning function, can remove easily the crystallization of liquid.
The present invention also aims to provide a kind of for cleaning the method for crystallization of this etching machine, to remove easily the crystallization of etching machine inner liquid medicine.
The invention provides a kind of etching machine, it comprises:
Etching chamber, it comprises entrance and outlet;
Dipper, it is positioned at this etching chamber, receiving medical liquids in this dipper; And
Consistency controller, it comprises water pipe;
Wherein, substrate enters from the entrance of this etching chamber, be transported to the outlet of this etching chamber, in the course of conveying of this substrate in this etching chamber, contact with the liquid in this dipper, this water pipe can be via this outlet to water filling in this dipper, the concentration of this dipper inner liquid medicine can be regulated from the water of this water pipe, and the liquid crystallization in this exit can be cleaned.
The invention provides that a kind of wherein, the method is carried out in above-mentioned etching machine for cleaning the method for crystallization of etching machine, the method comprises: this water pipe via this outlet to the liquid crystallization of cleaning this exit when water filling in this dipper.
The ingenious change of the water pipe of the present invention by consistency controller, not only can reach to liquid moisturizing it, with the function of controlled concentration, and when moisturizing, can for easy crystallization place of board, for example, form the exit of gas curtain, cleans.The present invention effectively utilizes the moisturizing mechanism of consistency controller, increase scavenging period and the number of times of easy crystallization place, can effectively reduce the generation of crystallization, improve conforming product rate, and, needn't must stop work and clean as prior art, but carry out with moisturizing simultaneously, therefore, enhance productivity, simplify cleaning operation.
Brief description of the drawings
Fig. 1 is the schematic diagram of existing etching machine.
Fig. 2 is the schematic diagram of the etching machine of one embodiment of the invention.
Fig. 3 is the schematic diagram of the etching machine of further embodiment of this invention.
Fig. 4 is the schematic diagram of the etching machine of yet another embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is elaborated.Should be understood that, embodiment described herein only, for description and interpretation the present invention, is not limited to the present invention.
As shown in Figure 2, the etching machine of the present embodiment comprises: etching chamber 20, dipper 30, conveyer 40, compressed air line 50 and consistency controller (not shown).Etching chamber 20 comprises entrance 21 and outlet 22; Dipper 30 is positioned at this etching chamber 20, the interior receiving medical liquids of dipper 20; Compressed air line 50 leads to this outlet 22 places, and can, at outlet 22 place's ejection pressure-airs, form gas curtain A; Consistency controller comprises water pipe 60, and factory's business end has the pure water of certain pressure (being for example 0.25Mpa) to water pipe 60 supplies.Wherein, substrate 10 enters from the entrance 21 of this etching chamber 20, in the course of conveying of substrate 10 in this etching chamber 20, contact with the liquid in this dipper 20, then be transmitted the outlet 22 that device 40 is delivered to this etching chamber 20, and be subject to exporting the washing away of gas curtain A at 22 places, the liquid that is attached to substrate 10 surfaces is swept away.This water pipe 60 can, via this outlet 22 to the interior water filling of this dipper 30, not only can mix with liquid from the water of this water pipe 60, regulates the concentration of liquid, the liquid crystallization that can also simultaneously clean these outlet 22 places.
This etching machine has mode of operation and moisturizing cleaning model, in this mode of operation, has substrate 10 by this outlet 22 in this etching chamber 20, and in this moisturizing cleaning model, this etching chamber 20 is interior passes through this outlet 22 without substrate 10.That is to say, during by this outlet 22, can carry out moisturizing, cleaning operation without substrate 10 when etching chamber 20 is interior.
In the present embodiment, water pipe 60 is controlled by the first valve V1, and this compressed air line 50 is controlled by the second valve V2.This etching machine also comprises substrate detecting sensor (not shown) and valve control device (not shown), this substrate detecting sensor has or not substrate 10 by this outlet 22 in order to judgement, this valve control device is connected with this substrate detecting sensor, by the switch of this first valve of this judged result control V1.
Under mode of operation, the second valve V2 opens all the time.Pass through outlet 22 if the substrate detecting sensor in board judges without substrate, valve control device control the second valve V2 closes, and the first valve V1 opens, and starts moisturizing cleaning model.Certainly, under moisturizing cleaning model, also can make the second valve V2 open, that is, under mode of operation and moisturizing cleaning model, the second valve V2 is open mode, and compressed air line 50 forms gas curtain A at outlet 22 places all the time.
Fig. 3 shows the schematic diagram of the etching machine of another embodiment of the present invention, in itself and Fig. 2, the difference of embodiment is, the delivery port of this water pipe 60 is connected with compressed air line 50, mixes and discharged to these outlet 22 places from the water of this water pipe 60 with from the pressure-air of this compressed air line 50.Be preferably, compressed air line 50 is positioned at the upstream of this water pipe 60, can promote water from this water pipe 50 discharged to these outlet 22 places, thereby improve water intake velocity from the pressure-air of this compressed air line 50, promotes cleaning performance.And in the situation that the first valve V1 closes, if 60 li of retain liquid of water pipe, compressed air line 50 inner high voltage gases can enter board with retain liquid, clean.
Fig. 4 shows the schematic diagram of the etching machine of an embodiment more of the present invention, in itself and Fig. 3, the difference of embodiment is, pressure-air from this compressed air line 50 is supplied from the top down, be connected with the water pipe 60 of below again, because compressed air line 50 and water pipe 60 exist difference in height, thereby can avoid being back to compressed air line 50 from the water of water pipe 60.
The ingenious change of the water pipe of the present invention by consistency controller, not only can reach to liquid moisturizing it, with the function of controlled concentration, and when moisturizing, can for easy crystallization place of board, for example, form the exit of gas curtain, cleans.The present invention effectively utilizes the moisturizing mechanism of consistency controller, increase scavenging period and the number of times of easy crystallization place, can effectively reduce the generation of crystallization, improve conforming product rate, and, needn't must stop work and clean as prior art, but carry out with moisturizing simultaneously, therefore, enhance productivity, simplify cleaning operation.
Although described the present invention with reference to several exemplary embodiments, should be appreciated that term used is explanation and exemplary and nonrestrictive term.Because can specifically implementing in a variety of forms, the present invention do not depart from spirit or the essence of invention, so be to be understood that, above-described embodiment is not limited to any aforesaid details, and explain widely in the spirit and scope that should limit in the claim of enclosing, therefore fall into whole variations in claim or its equivalent scope and remodeling and all should be the claim of enclosing and contain.

Claims (13)

1. an etching machine, it comprises:
Etching chamber, it comprises entrance and outlet;
Dipper, it is positioned at this etching chamber, receiving medical liquids in this dipper; And
Consistency controller, it comprises water pipe;
Wherein, substrate enters from the entrance of this etching chamber, be transported to the outlet of this etching chamber, in the course of conveying of this substrate in this etching chamber, contact with the liquid in this dipper, this water pipe can be via this outlet to water filling in this dipper, the concentration of this dipper inner liquid medicine can be regulated from the water of this water pipe, and the liquid crystallization in this exit can be cleaned.
2. etching machine as claimed in claim 1, wherein: this etching machine has mode of operation and moisturizing cleaning model, in this mode of operation, has substrate to pass through this outlet in this etching chamber, in this moisturizing cleaning model, in this etching chamber, pass through this outlet without substrate.
3. etching machine as claimed in claim 2, wherein: this etching machine also comprises compressed air line, this compressed air line leads to this exit, and can be at this exit ejection pressure-air, form gas curtain, so that the liquid that is attached to this substrate surface is swept away.
4. etching machine as claimed in claim 3, wherein: the delivery port of this water pipe is connected with this compressed air line, mixes with from the pressure-air of this compressed air line from the water of this water pipe and discharged to this exit.
5. etching machine as claimed in claim 4, wherein: this compressed air line is positioned at the upstream of this water pipe, can promote water from this water pipe discharged to this exit from the pressure-air of this compressed air line.
6. etching machine as claimed in claim 5, wherein: the pressure-air from this compressed air line is supplied from the top down.
7. etching machine as claimed in claim 4, wherein: this water pipe is by the first valve control, this compressed air hose route second valve gate control.
8. etching machine as claimed in claim 3, wherein: this water pipe is by the first valve control, this compressed air hose route second valve gate control.
9. etching machine as claimed in claim 7, wherein: in this mode of operation, this second valve open, this first valve closing.
10. etching machine as claimed in claim 7, wherein: in this moisturizing cleaning model, this second valve opens or closes, this first valve open.
11. etching machines as described in claim 9 or 10, wherein: this etching machine also comprises substrate detecting sensor and valve control device, this substrate detecting sensor has or not substrate to pass through this outlet in order to judgement, this valve control device is connected with this substrate detecting sensor, by the switch of this this first valve of judged result control.
12. etching machines as claimed in claim 1, wherein: this etching machine also comprises conveyer, and it is for delivery of substrate.
13. 1 kinds for cleaning the method for crystallization of etching machine, and wherein, the method is carried out in the etching machine as described in any one in claim 1 to 12, and the method comprises:
This water pipe via this outlet to the liquid crystallization of cleaning this exit when water filling in this dipper.
CN201310153849.8A 2013-04-27 2013-04-27 An etching machine and a method for cleaning crystals of the etching machine Pending CN104124147A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201310153849.8A CN104124147A (en) 2013-04-27 2013-04-27 An etching machine and a method for cleaning crystals of the etching machine
TW102119612A TW201440908A (en) 2013-04-27 2013-06-03 Etching machine and method for cleaning crystal of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310153849.8A CN104124147A (en) 2013-04-27 2013-04-27 An etching machine and a method for cleaning crystals of the etching machine

Publications (1)

Publication Number Publication Date
CN104124147A true CN104124147A (en) 2014-10-29

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TW (1) TW201440908A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106647164A (en) * 2015-11-04 2017-05-10 常州瑞择微电子科技有限公司 Method for avoiding crystallization of etching solution conveying pipelines
CN107564842A (en) * 2017-09-21 2018-01-09 常州捷佳创精密机械有限公司 A kind of silicon chip processing device and its dipper, the discharge method of dipper
CN108212883A (en) * 2017-12-29 2018-06-29 深圳市华星光电技术有限公司 For the device and method of the shutter of the buffer cell of clean wet-method etching machine

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI699843B (en) * 2019-08-13 2020-07-21 台灣積體電路製造股份有限公司 Process system including withdrawing device and method of monitoring the system

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Publication number Priority date Publication date Assignee Title
CN2492564Y (en) * 2001-08-16 2002-05-22 铼宝科技股份有限公司 Electrochemical etching flattening device for indium-tin oxide electrode on organic electroluminescent display panel
CN201204199Y (en) * 2008-03-21 2009-03-04 深超光电(深圳)有限公司 Apparatus for etching and soaking liquid crystal display substrate
CN201381279Y (en) * 2009-03-16 2010-01-13 亚智科技股份有限公司 Etching equipment
CN102163543A (en) * 2010-12-15 2011-08-24 友达光电股份有限公司 Etching apparatus and control method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2492564Y (en) * 2001-08-16 2002-05-22 铼宝科技股份有限公司 Electrochemical etching flattening device for indium-tin oxide electrode on organic electroluminescent display panel
CN201204199Y (en) * 2008-03-21 2009-03-04 深超光电(深圳)有限公司 Apparatus for etching and soaking liquid crystal display substrate
CN201381279Y (en) * 2009-03-16 2010-01-13 亚智科技股份有限公司 Etching equipment
CN102163543A (en) * 2010-12-15 2011-08-24 友达光电股份有限公司 Etching apparatus and control method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106647164A (en) * 2015-11-04 2017-05-10 常州瑞择微电子科技有限公司 Method for avoiding crystallization of etching solution conveying pipelines
CN106647164B (en) * 2015-11-04 2020-04-14 常州瑞择微电子科技有限公司 Method for preventing etching solution conveying pipeline from crystallizing
CN107564842A (en) * 2017-09-21 2018-01-09 常州捷佳创精密机械有限公司 A kind of silicon chip processing device and its dipper, the discharge method of dipper
WO2019056632A1 (en) * 2017-09-21 2019-03-28 常州捷佳创精密机械有限公司 Wafer processing device, solution tank thereof, and discharge method for solution tank
CN107564842B (en) * 2017-09-21 2019-06-14 常州捷佳创精密机械有限公司 A kind of discharge method of silicon chip processing device and its dipper, dipper
CN108212883A (en) * 2017-12-29 2018-06-29 深圳市华星光电技术有限公司 For the device and method of the shutter of the buffer cell of clean wet-method etching machine

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Publication number Publication date
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Application publication date: 20141029