TW201440908A - Etching machine and method for cleaning crystal of the same - Google Patents

Abstract

The present invention provides an etching machine and a method for cleaning crystals of the etching machine. The etching machine includes: an etching chamber including an inlet and an outlet, a liquid tank located inside the etching chamber and accommodating the chemical liquid, and a concentration controller including a water supply pipe. A substrate is transited from the inlet to the outlet in the etching chamber, and the substrate is contacted with the chemical liquid of the liquid tank during the process of transiting the substrate in the etching chamber. The water supply pipe can inject water to the liquid tank via the outlet, and the water injected from the water supply pipe can adjust the concentration of the chemical liquid in the liquid tank and can clean the crystals of the in the outlet of the etching chamber.

Description

Etching machine and method for cleaning crystals of the etching machine

The present invention relates to an etching machine, and more particularly to an etching machine having a cleaning function capable of removing crystals.

As shown in FIG. 1, the conventional etching machine includes an etching chamber 1, a chemical tank 2 located in the etching chamber 1, a drain line 3, a water supply line 4, and a compressed air line 5. The chemical solution tank 2 contains a chemical solution for processing the substrate 10, and the chemical liquid tank 2 is provided with a transport device 6 for transporting the substrate 10. The substrate 10 and the liquid chemical tank 2 are simultaneously transported while the substrate 10 is transported. The liquid is in contact. Finally, the substrate 10 is transported by the transport device 6 to the exit of the etching chamber 1, thereby leaving, and proceeds to the next process. Wherein, one end of the water supply pipeline 4 is connected with the concentration controller 9, and the other end is connected with the drain pipeline 3. When the valve 7 is opened, the water from the concentration controller 9 enters the liquid tank 2 via the water supply pipeline 4 to regulate the medicine. The concentration of the liquid. In addition, in order to prevent the substrate 10 from carrying the chemical solution away from the etching chamber 1, causing waste of the chemical solution, a compressed air line 5 is also connected at the outlet of the etching chamber 1, and when the valve 8 is opened, the compressed air line 5 is directed to the etching chamber. 1 The outlet is sprayed with high-pressure air to form an air curtain A to flush the liquid medicine attached to the surface of the substrate 10.

The existing etching machine has a problem of crystallization of the chemical liquid: particularly at the outlet of the etching chamber 1, that is, at the air curtain A, the problem of crystallization is particularly serious. The existing way of processing crystallization is to stop the etching machine and perform manual cleaning. However, this method not only affects the construction period, but also has complicated operation and low efficiency.

It is an object of the present invention to provide an etching machine having a cleaning function and capable of easily removing crystals of a chemical liquid.

It is still another object of the present invention to provide a method for cleaning crystals of the etching machine to facilitate removal of crystals of the chemical liquid in the etching machine.

The present invention provides an etching machine comprising: an etching chamber including an inlet and an outlet; a chemical liquid tank located in the etching chamber, the chemical tank containing the chemical liquid; and a concentration controller including a water supply line. Wherein, the substrate enters from the inlet of the etching chamber and is transported to the outlet of the etching chamber. The substrate is in contact with the liquid medicine in the liquid medicine tank during the conveying process in the etching chamber, and the water filling pipeline can inject water into the liquid medicine tank through the outlet. The water in the hydration line can adjust the concentration of the liquid in the liquid tank, and can clean the liquid crystal at the outlet.

The present invention provides a method for cleaning crystallization of an etching machine, wherein the method is carried out in the etching machine described above, the method comprising: cleaning the water supply pipe by injecting water into the liquid chemical tank through the outlet The liquid at the outlet is crystallized.

The invention adopts the subtle change of the water supply pipeline of the concentration controller Moreover, it can not only achieve the hydration of the liquid medicine, but also control the concentration, and at the same time as hydrating, it can be cleaned at the outlet where the machine is easy to crystallize, for example, at the exit of the air curtain. The invention effectively utilizes the water replenishing mechanism of the concentration controller, increases the cleaning time and the number of times of the crystallization, can effectively reduce the occurrence of crystallization, improve the product qualification rate, and does not have to be shut down for cleaning as in the prior art, but simultaneously with the hydration This is done, therefore, to increase production efficiency and simplify cleaning operations.

1, 20‧‧ ‧ etching chamber

2, 30‧‧ ‧ liquid tank

3‧‧‧Drainage line

6, 40‧‧‧ conveyor

5, 50‧‧‧Compressed air line

4, 60‧‧‧ water supply pipeline

7~8‧‧‧ valve

9, 90‧‧‧ concentration controller

10‧‧‧Substrate

21‧‧‧ entrance

22‧‧‧Export

70‧‧‧Substrate detection sensor

80‧‧‧ valve control device

A‧‧‧Air curtain

V1‧‧‧ first valve

V2‧‧‧Second valve

Figure 1 is a schematic view of a conventional etching machine.

Fig. 2 is a schematic view of an etching machine according to an embodiment of the present invention.

Figure 3 is a schematic view of an etching machine according to still another embodiment of the present invention.

Fig. 4 is a schematic view showing an etching machine according to still another embodiment of the present invention.

The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative and not restrictive.

As shown in FIG. 2, the etching machine of the present embodiment includes an etching chamber 20, a chemical tank 30, a conveying device 40, a compressed air line 50, and a concentration controller 90. The etching chamber 20 includes an inlet 21 and an outlet 22; the chemical tank 30 is located in the etching chamber 20, and the chemical tank 30 contains the liquid medicine; the compressed air line 50 leads to the outlet 22, and can discharge the high pressure at the outlet 22. air, The air curtain A is formed; the concentration controller 90 includes a water supply line 60, and the factory side supplies the purified water line 60 with pure water having a certain pressure (for example, 0.25 MPa). The substrate 10 enters from the inlet 21 of the etching chamber 20, and the substrate 10 contacts the liquid medicine in the liquid medicine tank 30 during the transportation in the etching chamber 20, and is then transported to the etching chamber 20 by the conveying device 40. The outlet 22 is flushed by the air curtain A at the outlet 22, and the chemical liquid adhering to the surface of the substrate 10 is washed down. The water supply line 60 can inject water into the chemical solution tank 30 through the outlet 22, and the water from the water supply line 60 can not only mix with the chemical liquid, but also adjust the concentration of the chemical liquid, and simultaneously wash the medicine at the outlet 22 Liquid crystallizes.

The etching machine has an operating mode and a hydration cleaning mode in which the substrate 10 passes through the outlet 22 in the etching chamber 20. In the hydration cleaning mode, no substrate 10 passes through the outlet 22 in the etching chamber 20. That is, when no substrate 10 passes through the outlet 22 in the etching chamber 20, a water replenishing and cleaning operation can be performed.

In the present embodiment, the water supply line 60 is controlled by a first valve V1, which is controlled by a second valve V2. The etching machine further includes a substrate detecting sensor 70 and a valve control device 80 for determining whether the substrate 10 passes through the outlet 22, and the valve control device 80 is connected to the substrate detecting sensor 70. The switch of the first valve V1 is controlled by the result of the determination.

In the operating mode, the second valve V2 is always open. If the substrate detecting sensor 70 in the machine determines that no substrate passes through the outlet 22, the valve control device 80 controls the second valve V2 to close, and the first valve V1 is opened to activate the hydration cleaning mode. Of course, in the hydration cleaning mode, the second valve can also be used. The door V2 is opened, that is, in the operating mode and the hydration cleaning mode, the second valve V2 is open, and the compressed air line 50 always forms the air curtain A at the outlet 22.

Figure 3 illustrates an etching machine of still another embodiment of the present invention. The schematic diagram differs from the embodiment in FIG. 2 in that the water outlet of the water supply line 60 is connected to the compressed air line 50, the water from the water supply line 60 and the high pressure air from the compressed air line 50. Mix and line up to the exit 22. Preferably, the compressed air line 50 is located upstream of the water supply line 60, and the high pressure air from the compressed air line 50 can push the water from the water supply line 50 to the outlet 22, thereby increasing the water inlet speed. Improve the cleaning effect. Further, in the case where the first valve V1 is closed, if liquid remains in the water supply line 60, the high-pressure gas in the compressed air line 50 can enter the machine with the retained liquid to perform cleaning.

4 is a view showing an etching machine according to still another embodiment of the present invention. The schematic diagram differs from the embodiment in FIG. 3 in that the high-pressure air from the compressed air line 50 is supplied from the top to the bottom, and is connected to the lower water supply line 60, due to the compressed air line 50 and the water supply pipe. The road 60 has a height difference so that water from the makeup water line 60 can be prevented from flowing back to the compressed air line 50.

The invention adopts the subtle change of the water supply pipeline of the concentration controller In addition, it can not only achieve the hydration of the liquid, to control the concentration of the function, and hydration, at the same time, the machine can be easily crystallized, for example, the outlet of the air curtain is cleaned. The invention effectively utilizes the water replenishing mechanism of the concentration controller, increases the cleaning time and the number of times of easy crystallization, and can effectively reduce the crystallization The production rate is improved, and it is not necessary to stop the cleaning as in the prior art, but at the same time as the hydration, thereby improving the production efficiency and simplifying the cleaning operation.

While the invention has been described with respect to the exemplary embodiments illustrated embodiments The present invention may be embodied in a variety of forms without departing from the spirit or scope of the invention. It is to be understood that the invention is not limited to the details. It is to be understood that all changes and modifications that fall within the scope of the patent application or its equivalents should be covered by the accompanying claims.

10‧‧‧Substrate

20‧‧ ‧ etching chamber

21‧‧‧ entrance

22‧‧‧Export

30‧‧‧ drug tank

40‧‧‧Transfer

50‧‧‧Compressed air line

60‧‧‧Hydration pipeline

90‧‧‧Concentration controller

A‧‧‧Air curtain

V1‧‧‧ first valve

V2‧‧‧Second valve

Claims (13)

An etching machine comprising: an etching chamber including an inlet and an outlet; a chemical liquid tank located in the etching chamber, the liquid medicine tank containing the chemical liquid; and a concentration controller including a water supply line; wherein the substrate Entering from the inlet of the etching chamber, being sent to the outlet of the etching chamber, the substrate is in contact with the liquid medicine in the liquid medicine tank during the conveying process in the etching chamber, and the water supply line can pass through the outlet Water is injected into the liquid tank, and water from the water supply line can adjust the concentration of the liquid in the liquid tank, and can clean the liquid crystal at the outlet. The etching machine of claim 1, wherein: the etching machine has an operation mode and a hydration cleaning mode, wherein the etching chamber has the substrate passing through the outlet, and in the hydration cleaning mode, the etching chamber has no The substrate passes through the outlet. The etching machine of claim 2, wherein: the etching machine further comprises a compressed air line leading to the outlet, and capable of ejecting high-pressure air at the outlet to form an air curtain to The liquid medicine attached to the surface of the substrate is washed down. An etching machine according to claim 3, wherein: the water supply line is out A nozzle is connected to the compressed air line, and water from the makeup line is mixed with high pressure air from the compressed air line and discharged to the outlet. The etching machine of claim 4, wherein: the compressed air line is located upstream of the water supply line, and high pressure air from the compressed air line can push water from the water supply line to the outlet. The etching machine of claim 5, wherein: the high pressure air from the compressed air line is supplied from the top to the bottom. The etching machine of claim 4, wherein: the makeup pipe routes a first valve control, and the compressed air pipe routes the second valve control. The etching machine of claim 3, wherein: the makeup pipe routes the first valve control, and the compressed air pipe routes the second valve control. The etching machine of claim 7, wherein: in the operating mode, the second valve is open and the first valve is closed. The etching machine of claim 7, wherein: in the hydration cleaning mode, the second valve is opened or closed, and the first valve is opened. The etching machine of claim 9 or 10, wherein the etching machine further comprises a substrate detecting sensor and a valve control device, the substrate detecting sense The detector is configured to determine whether the substrate passes through the outlet, and the valve control device is connected to the substrate detecting sensor, and the switch of the first valve is controlled by the determination result. The etching machine of claim 1, wherein the etching machine further comprises a conveying device for conveying the substrate. A method for cleaning crystallization of an etching machine, wherein the method is carried out in an etching machine according to claim 1, the method comprising: the water supply pipe injecting water into the liquid storage tank through the outlet The liquid crystal at the outlet is washed and crystallized.