CN102163543A - Etching apparatus and control method thereof - Google Patents
Etching apparatus and control method thereof Download PDFInfo
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- CN102163543A CN102163543A CN 201110009638 CN201110009638A CN102163543A CN 102163543 A CN102163543 A CN 102163543A CN 201110009638 CN201110009638 CN 201110009638 CN 201110009638 A CN201110009638 A CN 201110009638A CN 102163543 A CN102163543 A CN 102163543A
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- 238000005530 etching Methods 0.000 title claims abstract description 219
- 238000000034 method Methods 0.000 title claims description 25
- 239000012530 fluid Substances 0.000 claims abstract description 50
- 239000007788 liquid Substances 0.000 claims abstract description 49
- 238000004140 cleaning Methods 0.000 claims abstract description 16
- 230000008676 import Effects 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 abstract description 4
- 238000012806 monitoring device Methods 0.000 abstract 2
- 239000000243 solution Substances 0.000 description 120
- 238000002425 crystallisation Methods 0.000 description 12
- 230000008025 crystallization Effects 0.000 description 12
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000001039 wet etching Methods 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000004575 stone Substances 0.000 description 4
- 235000006408 oxalic acid Nutrition 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- KSOWEPLNZXOTOM-UHFFFAOYSA-N indium;oxalic acid Chemical compound [In].OC(=O)C(O)=O KSOWEPLNZXOTOM-UHFFFAOYSA-N 0.000 description 2
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000001839 systemic circulation Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Weting (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
An etching apparatus includes an etching chamber, an etching solution storage tank, a cleaning device, and a conductivity monitoring device. The cleaning device is provided with an air knife, a first fluid pipeline, a liquid pump and a first valve, wherein the air knife is arranged in the etching chamber, one end of the first fluid pipeline is connected and communicated with the air knife, the other end of the first fluid pipeline is communicated with the liquid pump, and in addition, the first valve is arranged on the first fluid pipeline. The conductivity monitoring device is coupled to the first valve and the etching solution storage tank, respectively, for monitoring the conductivity in the etching solution storage tank and controlling the on/off of the first valve.
Description
Technical field
The present invention relates to a kind of process equipment, particularly a kind of etching machines and control method thereof.
Background technology
In the production technology of LCD panel, there is one procedure the plate surface not to be had conducting metal or the nonmetal corrosion that concerns circuit with etching mode, with reserved line partly, and practiced at present, be generally wet etching.
The principle of wet etch techniques is to utilize etching solution and desire the chemical reaction that etch thin film produces, and at first the reactant in the etching solution will utilize diffusion effect to pass through the quite thin boundary layer of a layer thickness, to arrive the surface of etched film.Behind etching work procedure, then must be blown down with the etching solution that air knife will residue on the plate.
Owing to be operation in the wet type environment, make the crystallization meeting that produces etching solution through the etching chemistry reaction be attached on the edge of a knife of air knife.Therefore, when blowing, the crystallization meeting causes the blast inequality, easily the photoresistance of plate surface conductance metal film is rejected, or crystallization stops up the edge of a knife of air knife fully, and reduce the cleaning effect of removing the etching solution that residues in plate, and then cause product bad, demand urgently improving.
Therefore, in the face of the crystallization of this air knife mouth, must regularly be removed usually, this removes operation, be generally once in a week, and the machine that must stop etching, disassemble air knife, restart etching machine and refill air knife after removing, its about 2 to 3 people of institute's palpus manpower, and take time is 4-5 hour, therefore, cause outside manpower expends, and influence production capacity.
Summary of the invention
Technical problem to be solved by this invention provides a kind of etching machines and the control method thereof that need not shut down with manpower cleaning air knife.
To achieve these goals, the invention provides a kind of etching machines, comprise etching chamber, etching solution accumulator tank, cleaning device and electrical conductivity supervising device.Cleaning device has air knife, first fluid pipeline, liquor pump and first valve, wherein air knife is arranged in the etching chamber, and an end of first fluid pipeline is connected with air knife and communicates, and the other end then is communicated with liquor pump, in addition, first valve is arranged on the first fluid pipeline.The electrical conductivity supervising device couples first valve and etching solution accumulator tank respectively, in order to the electrical conductivity in the monitoring etching liquid accumulator tank and control the keying of first valve.By this, if during first valve opening, the first fluid pipeline is able to liquid with liquor pump and is directed into and is provided with the air knife part in the etching chamber, and then removes the crystallization on the air knife, need not shut down with manpower and clean air knife.
In order to realize above-mentioned purpose better, the present invention also provides a kind of control method of etching machines, wherein etching machines comprises an etching chamber and an etching solution accumulator tank, when carrying out this control method, can detect the electrical conductivity of etching solution in the etching solution accumulator tank earlier, when electrical conductivity is higher than a predetermined upper limit value, the liquid of a liquor pump is directed into is provided with an air knife part in the etching chamber, the liquid that will flow into then in the etching chamber imports the etching solution accumulator tank.By this, when the electrical conductivity of etching solution in the etching solution accumulator tank was too high, the liquid of liquor pump can be used for cleaning air knife earlier, flows into the etching solution accumulator tank again, will hang down the concentration of etching solution, and to reach the effect of killing two birds with one stone.
Technique effect of the present invention is: during first valve opening of the present invention, the first fluid pipeline is able to liquid with liquor pump and is directed into and is provided with the air knife part in the etching chamber, and then removes the crystallization on the air knife, need not shut down with manpower and clean air knife.In addition, when the electrical conductivity of etching solution in the etching solution accumulator tank was too high, the liquid of liquor pump can be used for cleaning air knife earlier, flows into the etching solution accumulator tank again, will hang down the concentration of etching solution, and to reach the effect of killing two birds with one stone.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the schematic diagram according to a kind of etching machines of one embodiment of the invention;
Fig. 2 is the block diagram of the electrical conductivity supervising device of Fig. 1;
Fig. 3 is the flow chart according to the control method of a kind of etching machines of another embodiment of the present invention.
Wherein, Reference numeral
100 etching machines, 110 etching chambers
120 etching solution accumulator tanks, 130 cleaning devices
131 air knives, 132 first fluid pipelines
133 liquor pumps, 134 first valves
136 the 3rd valves, 140 electrical conductivity supervising devices
150 fluid conduit systems, 160 etching solution make-up pumps
162 second fluid circuits, 164 second valves
166 the 4th valves, 170 three-fluid pipelines
171 control valves, 172 control valves
173 help Pu 182 to help the Pu
183 the 4th fluid circuits, 184 nozzles
210 detecting units, 220 main control units
230 electrical conductivity detecting units, 240 timing units
250 driver elements, 260 automatic switch units
The 310-350 step
Embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and operation principle are done concrete description:
In order to make narration of the present invention more detailed and complete, can be with reference to accompanying drawing and the various embodiment of the following stated, identical number is represented same or analogous assembly among the figure.On the other hand, well-known assembly and step are not described among the embodiment, to avoid that the present invention is caused unnecessary restriction.
In execution mode and claim, unless limit to some extent especially for article in the interior literary composition, " one " can make a general reference single or a plurality of with " being somebody's turn to do ".
" pact " used herein, " approximately " or " roughly " but in order to modifying the quantity of any slight variations, but this slight variations can't change its essence.Unless otherwise noted, then representing the error in value scope of being modified with " pact ", " approximately " or " roughly " generally is to allow in 20 percent, is preferably in 10, more preferably then is in 5 percent in execution mode.
Please refer to Fig. 1, Fig. 1 is the schematic diagram according to a kind of etching machines 100 of one embodiment of the invention.As shown in Figure 1, etching machines 100 comprises etching chamber 110, etching solution accumulator tank 120 and fluid conduit systems 150, and wherein an end of fluid conduit systems 150 is communicated with etching chamber 110, and the other end then is communicated with etching solution accumulator tank 120.
Etching solution accumulator tank 120 can store etching solution (as: oxalic acid aqueous solution, aqueous solution of hydrogen bromide, hydrochloric acid and nitric acid mixed aqueous solution or other appropriate solution or above-mentioned combination).For etching solution being supplied to etching chamber 110 carry out wet etching process, etching machines 100 can comprise pump 182, the 4th fluid circuit 183 and nozzle 184, wherein pump 180 combines with the 4th fluid circuit 183, one end of the 4th fluid circuit 183 is communicated with etching solution accumulator tank 120, and the other end of the 4th fluid circuit 183 then is provided with nozzle 184 and is disposed in the etching chamber 110.In use, pump 182 is extracted the etching solution in the etching solution accumulator tank 120 out from an end of the 4th fluid circuit 183, the nozzle 184 of etching solution via the 4th fluid circuit 183 other ends is sprayed in the etching chamber 110, so that carry out wet etching process again.In the wet etching process of display panels, cover transparency conducting layer on the substrate with a screen, for example the transparency conducting layer that constitutes of tin indium oxide immerses substrate in the etching solution again, removing on the substrate transparency conducting layer that conductively-closed layer not covers, and on substrate, define pixel electrode.
In use, the etching solution that will residue on the substrate with air knife 131 is blown down.For instance, the slot that air knife 131 tools are narrow and small, this slot can be a straight line, and therefore, when air-supply, blast can be blown out by this slot, forms air curtain, and substrate promptly can vertical direction pass through air knife 131, to blow down raffinate.
Yet, in wet etch process, understand crystallization, and be attached on the edge of a knife of air knife 131 because of etching solution and transparency conducting layer reaction.Therefore, in cleaning device 130, if when first valve 134 is opened with the 3rd valve 136, first fluid pipeline 132 is able to liquid with liquor pump 133 and is directed into and is provided with air knife 131 places in the etching chamber 100, and then the crystallization on the removing air knife 131.By this, need not shut down with manpower cleaning air knife 131.
For instance, etching solution can be oxalic acid aqueous solution, but oxalic acid and tin indium oxide reaction can generate oxalic acid indium crystallization (In2 (C204) 3), and splash causes air knife 131 to block in air knife 131.So, with the liquid wash air knife 131 of liquor pump 133,, impose water liquid because that water is met in the crystallization of oxalic acid indium is instant, then can make its dissolving and break away from from the edge of a knife of air knife 131.
Because wet etching is a chemical reaction, so etchant concentration is very big for the reaction rate influence, excessive concentration can cause etch-rate too fast, and then the pattern generating undercut phenomenon that causes desire to define, influence the rate of finished products of subsequent technique, and, will cause the pixel electrode quality unstable and influence rate of finished products if the concentration instability of etching solution then can't effectively be controlled etching reaction.
Therefore, etching machines 100 also comprises electrical conductivity supervising device 140, learns the concentration height of etching solution by monitoring the big I of etching solution electrical conductivity, if etchant concentration is higher, then electrical conductivity heals high relatively.Electrical conductivity supervising device 140 couples first valve 134 and etching solution accumulator tank 120 respectively, in order to the electrical conductivity of etching solutions in the monitoring etching liquid accumulator tank 120 and control the keying of first valve 134.
In the present embodiment, first valve 134 is an automatic valve, and it is controlled by electrical conductivity supervising device 140, and the 3rd valve 136 can be hand-operated valve, and this hand-operated valve is held open state usually.If first valve, 134 faults, first fluid pipeline 132 breaks or other unusual condition when taking place, just the 3rd valve 136 is closed.
If electrical conductivity supervising device 140 monitors electrical conductivity when being higher than a predetermined upper limit value, it can open first valve 134.So first fluid pipeline 132 is able to liquid with liquor pump 133 and is directed into and is provided with air knife 131 parts in the etching chamber 110, and then removes the crystallization on the air knife 131, though this crystallization can flow into etching chamber 110 subsequently, can not influence technology basically.Then, fluid conduit systems 150 will flow into the liquid importing etching solution accumulator tank 120 in the etching chamber 110.By this, when the electrical conductivity of etching solution in the etching solution accumulator tank 120 was too high, the liquid of liquor pump 133 can be used for cleaning air knife 131 earlier, flows into etching solution accumulator tank 120 again, will hang down the concentration of etching solution, and to reach the effect of killing two birds with one stone.
In the practice, above-mentioned predetermined upper limit value is about the arbitrary numerical value from the scope of 68ms/cm to 85ms/cm.If the electrical conductivity of etching solution surpasses 85ms/cm, then represent etchant concentration too high, excessive concentration can cause etch-rate too fast, thereby causes the pattern generating undercut phenomenon of desire definition on the substrate.
In addition, etching machines 100 can comprise etching solution make-up pump 160, second fluid circuit 162, second valve 164 and the 4th valve 166.One end of second fluid circuit 162 is communicated with etching solution accumulator tank 120, and the other end of second fluid circuit 162 then is communicated with etching solution make-up pump 160.Second valve 164 and the 4th valve 166 are arranged on second fluid circuit 162, and wherein second valve 164 couples electrical conductivity supervising device 140.
In the present embodiment, second valve 164 is an automatic valve, and it is controlled by electrical conductivity supervising device 140, and the 4th valve 166 can be hand-operated valve, and this hand-operated valve is held open state usually.If second valve, 164 faults, second fluid circuit 162 break or other unusual condition when taking place, and just the 4th valve 166 are closed.
If electrical conductivity supervising device 140 monitors electrical conductivity when being lower than a predetermined lower bound value, it can open second valve 164, and closes first valve 134.So second fluid circuit 162 is able to the etching solution of etching solution make-up pump 160 is imported etching solution accumulator tank 120.By this, cross when low when the electrical conductivity of etching solution in the etching solution accumulator tank 120, etching solution make-up pump 160 is mended new etching solution into etching solution accumulator tank 120 in real time, will improve the concentration of etching solution.
In the practice, above-mentioned predetermined lower bound value is about the arbitrary numerical value from the scope of 44ms/cm to 55ms/cm.If the electrical conductivity of etching solution surpasses 55ms/cm, then represent etchant concentration low excessively, concentration is crossed and lowly can be caused etch-rate slow excessively, thereby elongates the process time, even allows the pattern of desire definition is difficult to form on the substrate.
In addition, the etching solution temperature is high more, and etch-rate is fast more, when etching, if the etching solution non-uniform temperature will cause the live width difference in each corner of substrate easily.Take place for fear of this class situation, etching machines 100 can comprise three-fluid pipeline 170, control valve 171, control valve 172 and pump 173.The two ends of three-fluid pipeline 170 all are communicated with etching solution accumulator tank 120, and control valve 171,172 is arranged on the three-fluid pipeline 170, and pump 173 combines with three-fluid pipeline 170.
When if control valve 171,172 is opened, pump 173 is extracted the etching solution in the etching solution accumulator tank 120 out from an end of three-fluid pipeline 170, again etching solution is back to etching solution accumulator tank 120 by the other end of three-fluid pipeline 170, stir the etching solution of etching solution accumulator tank 120 by this, make etching solution temperature-averaging, this program be referred to herein as " temperature control partial circulating ".
Perhaps, in etching machines 100, at set intervals, can etching solution be thrown in the etching chamber 110 by the 4th fluid circuit 183 and nozzle 184 by pump 182, etching solution flows back to etching solution accumulator tank 120 itself by fluid conduit systems 150 more then, the pipeline that makes etching solution flow through is maintained default temperature, and this program is referred to herein as " temperature control systemic circulation ".
Please refer to Fig. 2, Fig. 2 is the block diagram of electrical conductivity supervising device 140.As shown in Figure 2, electrical conductivity supervising device 140 comprises detecting unit 210, main control unit 220, electrical conductivity detecting unit 230, timing unit 240, driver element 250 and automatic switch unit 260.
Too high for fear of etchant concentration, detecting unit 210 can detect the electrical conductivity of the etching solution of etching solution accumulator tank 120, and electrical conductivity detecting unit 230 can detect electrical conductivity and whether be higher than a predetermined upper limit value.When electrical conductivity was higher than predetermined upper limit value, main control unit 220 can make timing unit 240 calculate a liquid prolongation, and produces a liquid supplementary signal.Driver element 250 can be based on liquid prolongation and liquid supplementary signal, drive automatic switch unit 260, flow into etching solution accumulator tank 120 so that automatic switch unit 260 is closed second valve 164 with the etching solution that stops etching solution make-up pump 160, and open first valve 134 in the prolongation in liquid and be directed into liquid and be provided with air knife 131 places in the etching chamber 110 liquor pump 133.
So, pre-estimating one section replenishes etching solution accumulator tank 120 again and is allowed the moderate required appropriate time of etchant concentration (promptly through air knife 131 with flow of liquid, the liquid prolongation), liquid make-up in this time too much causes the low excessively phenomenon of etchant concentration to take place to avoid liquid to replenish on the contrary again.
On the other hand, electrical conductivity detecting unit 230 can detect electrical conductivity and whether is lower than a predetermined lower bound value.When electrical conductivity is lower than the predetermined lower bound value, main control unit 220 can make timing unit 240 calculate an etching solution prolongation, and produce an etching solution supplementary signal, driver element 250 can be based on etching solution prolongation and etching solution supplementary signal to drive automatic switch unit 260, be directed into the liquid that stops liquor pump 133 and be provided with air knife 131 places in the etching chamber 110 so that automatic switch unit 260 is closed first valve 134, and opens second valve 164 in the prolongation with etching solution importing etching solution accumulator tank 120 etching solution make-up pump 160 in etching solution.
So, pre-estimating one section replenishes etching solution accumulator tank 120 and is allowed the moderate required appropriate time of etchant concentration (promptly with etching solution, the etching solution prolongation), in this time, replenish etching solution again, too much cause the too high phenomenon of etchant concentration to take place on the contrary to avoid etching solution to replenish.
Aforesaid detecting unit 210, main control unit 220, electrical conductivity detecting unit 230, timing unit 240, driver element 250 and automatic switch unit 260 etc., its embodiment can be software, hardware and/or firmware.For instance, if be overriding concern with execution speed and accuracy, then can to select hardware and firmware basically for use be main in these unit; If is overriding concern with the design flexibility, then can to select software basically for use be main in these unit; Perhaps, these unit can adopt software, hardware and firmware work compound simultaneously.Should be appreciated that, more than for the not so-called branch which is better and which is worse of these examples, be not that those skilled in the art needed when looking at that time in order to restriction the present invention yet, elasticity is selected the embodiment of these unit.
In addition, have in the affiliated technical field and know the knowledgeable usually when understanding, above-mentioned each unit is named according to the function of its execution, only in order to allow the technology of this case become apparent more, is not in order to limit these unit.Each unit is integrated into same unit or is split into a plurality of unit, perhaps the function of arbitrary unit is changed in another unit and carry out, all still belonged to the execution mode of present disclosure.
Please refer to Fig. 3, Fig. 3 is the flow chart according to the control method of a kind of etching machines of another embodiment of the present invention.As shown in Figure 3, this control method comprises step 310-350 (should be appreciated that mentioned in the present embodiment step except that chatting bright its order person especially, all can be adjusted its front and back order according to actual needs, even can carry out simultaneously simultaneously or partly).
Whether the electrical conductivity that detects etching solution in the etching solution accumulator tank in step 310 is higher than a predetermined upper limit value or is lower than a predetermined lower bound value.When electrical conductivity is higher than predetermined upper limit value, in step 330 liquid of a liquor pump is directed into and is provided with an air knife place in the etching chamber, the liquid that then will flow in the etched cavity imports the etching solution accumulator tank.By this, when the electrical conductivity of etching solution in the etching solution accumulator tank 120 was too high, the liquid of liquor pump 133 can be used for cleaning air knife 131 earlier, flows into etching solution accumulator tank 120 again, to reduce the concentration of etching solution, reached the effect of killing two birds with one stone.
Moreover, in step 330, when electrical conductivity is higher than predetermined upper limit value, calculate a liquid prolongation, the liquid of liquor pump 133 is directed in the prolongation in liquid and is provided with air knife 131 places in the etching chamber 110, and stop the etching solution of etching solution make-up pump 160 to flow into etching solution accumulator tank 120.So, pre-estimating one section replenishes etching solution accumulator tank 120 again and is allowed the moderate required appropriate time of etchant concentration (promptly through air knife 131 with flow of liquid, the liquid prolongation), liquid make-up in this time too much causes the low excessively phenomenon of etchant concentration to take place to avoid liquid to replenish on the contrary again.
On the other hand, when electrical conductivity is lower than the predetermined lower bound value, in the etching solution importing etching solution accumulator tank of step 350 with an etching solution make-up pump.By this, cross when low, in real time new etching solution is mended into etching solution accumulator tank 120, will improve the concentration of liquid at quarter when the electrical conductivity of etching solution in the etching solution accumulator tank 120.
In addition, in step 350, when electrical conductivity is lower than the predetermined lower bound value, calculate an etching solution prolongation, in prolongation the etching solution of etching solution make-up pump 160 is imported etching solution accumulator tank 120 in etching solution, and stop the liquid of liquor pump 133 to be directed into to be provided with this air knife 131 places in the etching chamber 110.So, pre-estimate one section and replenish etching solution accumulator tank 120 with etching solution, and allowed the moderate required appropriate time of etchant concentration (promptly, the etching solution prolongation), in this time, replenish etching solution again, too much cause the too high phenomenon of etchant concentration to take place on the contrary to avoid etching solution to replenish.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (10)
1. an etching machines is characterized in that, comprises:
One etching chamber;
One etching solution accumulator tank;
One cleaning device, have an air knife, a first fluid pipeline, a liquor pump and one first valve, wherein this air knife is arranged in this etching chamber, and an end of this first fluid pipeline is connected with this air knife and communicates, the other end then is communicated with this liquor pump, in addition, this first valve is arranged on this first fluid pipeline; And
One electrical conductivity supervising device couples this first valve and this etching solution accumulator tank respectively, in order to monitor the electrical conductivity in this etching solution accumulator tank and to control the keying of this first valve.
2. etching machines as claimed in claim 1 is characterized in that, also comprises:
One fluid conduit systems, the one end is communicated with this etching chamber, and the other end then is communicated with this etching solution accumulator tank.
3. etching machines as claimed in claim 2 is characterized in that, also comprises:
One etching solution make-up pump;
One second fluid circuit, the one end is communicated with this etching solution accumulator tank, and the other end then is communicated with this etching solution make-up pump; And
One second valve is arranged on this second fluid circuit, couples this electrical conductivity supervising device.
4. etching machines as claimed in claim 3 is characterized in that, this electrical conductivity supervising device comprises:
One timing unit;
One automatic switch unit;
One detecting unit is in order to detect this electrical conductivity;
Whether one electrical conductivity detecting unit is higher than a predetermined upper limit value or is lower than a predetermined lower bound value in order to detect this electrical conductivity;
One main control unit in order to controlling this timing unit, and produces a supplementary signal, wherein when this electrical conductivity is higher than this predetermined upper limit value, makes this timing unit calculate a liquid prolongation, and produces a liquid supplementary signal; And when this electrical conductivity is lower than this predetermined lower bound value, make this timing unit calculate an etching solution prolongation, and produce an etching solution supplementary signal; And
One driver element by this supplementary signal of this main control unit, in order to drive this automatic switch unit, wherein when this liquid supplementary signal, makes this automatic switch unit close this second valve, and opens this first valve in the prolongation in this liquid; When this etching solution supplementary signal, make this automatic switch unit close this first valve, and open this second valve in the prolongation in this etching solution.
5. etching machines as claimed in claim 4 is characterized in that, when this electrical conductivity was between this predetermined upper limit value and this predetermined lower bound value, this automatic switch unit was closed this first, second valve.
6. etching machines as claimed in claim 5 is characterized in that, this predetermined lower bound value is 55ms/cm, and this predetermined upper limit value is 85ms/cm.
7. the control method of an etching machines is characterized in that, this etching machines comprises an etching chamber and an etching solution accumulator tank, and this control method comprises:
A, detect the electrical conductivity of etching solution in this etching solution accumulator tank;
B, when this electrical conductivity is higher than a predetermined upper limit value, the liquid of a liquor pump is directed into is provided with an air knife part in this etching chamber; And
C, the liquid that will flow in this this etching chamber import this etching solution accumulator tank.
8. control method as claimed in claim 7 is characterized in that, also comprises:
D, when this electrical conductivity is lower than a predetermined lower bound value, the etching solution of an etching solution make-up pump is imported this etching solution accumulator tank.
9. control method as claimed in claim 8 is characterized in that step b comprises:
When this electrical conductivity is higher than this predetermined upper limit value, calculate a liquid prolongation; And
The liquid of this liquor pump is directed in the prolongation in this liquid and is provided with this air knife place in this etching chamber, and stop the etching solution of this etching solution make-up pump to flow into this etching solution accumulator tank.
10. control method as claimed in claim 8 is characterized in that steps d comprises:
When this electrical conductivity is lower than this predetermined lower bound value, calculate an etching solution prolongation; And
In prolongation the etching solution of this etching solution make-up pump is imported this etching solution accumulator tank in this etching solution, and stop the liquid of this liquor pump to be directed into to be provided with this air knife part in this etching chamber.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99144006A TWI417693B (en) | 2010-12-15 | 2010-12-15 | Etching apparatus and method of controlling the same |
| TW099144006 | 2010-12-15 |
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| Publication Number | Publication Date |
|---|---|
| CN102163543A true CN102163543A (en) | 2011-08-24 |
| CN102163543B CN102163543B (en) | 2013-01-02 |
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| CN 201110009638 Expired - Fee Related CN102163543B (en) | 2010-12-15 | 2011-01-12 | Etching apparatus and control method thereof |
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| CN (1) | CN102163543B (en) |
| TW (1) | TWI417693B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104124147A (en) * | 2013-04-27 | 2014-10-29 | 上海和辉光电有限公司 | An etching machine and a method for cleaning crystals of the etching machine |
| CN104681471A (en) * | 2015-03-12 | 2015-06-03 | 京东方科技集团股份有限公司 | Wet etching equipment |
| WO2015188412A1 (en) * | 2014-06-11 | 2015-12-17 | 深圳市华星光电技术有限公司 | Photoresist stripping method and photoresist stripping device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI576634B (en) * | 2016-03-18 | 2017-04-01 | 盟立自動化股份有限公司 | Integral chemical tank for wet type manufacturing process |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1532305A (en) * | 2002-10-15 | 2004-09-29 | 长濑产业株式会社 | Etching liquid managing method and etching liquid managing device |
| CN1523451A (en) * | 2003-02-18 | 2004-08-25 | 友达光电股份有限公司 | An etching process |
| US20070122551A1 (en) * | 2004-01-07 | 2007-05-31 | Tokyo Electron Limited | Coater/developer and coating/developing method |
| US20060000494A1 (en) * | 2004-06-30 | 2006-01-05 | Lam Research Corporation | Self-draining edge wheel system and method |
| US20070223342A1 (en) * | 2004-10-12 | 2007-09-27 | Takehiko Orii | Substrate Processing Method and Substrate Processing Apparatus |
| CN101034223A (en) * | 2007-05-14 | 2007-09-12 | 友达光电股份有限公司 | Substrate cleaning device, substrate technical equipment and cleaning method of substrate cleaning device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104124147A (en) * | 2013-04-27 | 2014-10-29 | 上海和辉光电有限公司 | An etching machine and a method for cleaning crystals of the etching machine |
| WO2015188412A1 (en) * | 2014-06-11 | 2015-12-17 | 深圳市华星光电技术有限公司 | Photoresist stripping method and photoresist stripping device |
| CN104681471A (en) * | 2015-03-12 | 2015-06-03 | 京东方科技集团股份有限公司 | Wet etching equipment |
| CN104681471B (en) * | 2015-03-12 | 2017-09-15 | 京东方科技集团股份有限公司 | Wet-method etching equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI417693B (en) | 2013-12-01 |
| TW201224692A (en) | 2012-06-16 |
| CN102163543B (en) | 2013-01-02 |
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