CN1523451A - An etching process - Google Patents
An etching process Download PDFInfo
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- CN1523451A CN1523451A CNA03104493XA CN03104493A CN1523451A CN 1523451 A CN1523451 A CN 1523451A CN A03104493X A CNA03104493X A CN A03104493XA CN 03104493 A CN03104493 A CN 03104493A CN 1523451 A CN1523451 A CN 1523451A
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- oxalic acid
- concentration
- electrical conductivity
- etching solution
- engraving method
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Abstract
The invention is a kind of light mantle for contact window process, the mantle has a contact window pattern, and there has a border pattern on edge of the contact window pattern, the border pattern is a semi-exposure area. Because that the border of contact window pattern is semi-exposure pattern, the contact angle between the side wall of aperture of contact window which is patterned and the conducting layer under it can be reduced.
Description
Technical field
The invention provides a kind of engraving method of display panels transparency conducting layer, especially refer to that a kind of electrical conductivity (conductivity) meter that utilizes detects the electrical conductivity of oxalic acid etching solution, and utilize water-adding system to keep the skin wet to control the engraving method of this oxalic acid etchant concentration.
Background technology
In each element of LCD, pixel electrode is played the part of very important role for the color performance of display.In the processing procedure of display panels, the making of pixel electrode is to utilize wet etch techniques, cover transparency conducting layer on the substrate with mask layer, tin indium oxide (indium tin oxied for example, ITO) transparency conducting layer of Gou Chenging, again substrate is immersed in the etching solution, to remove the transparency conducting layer that is not covered on the substrate, on substrate, to define pixel electrode by mask layer.
The principle of wet etch techniques is the chemical reaction that utilizes etching solution and etched film (solid) to produce, and at first the reactant in the etching solution will utilize diffusional effect to pass through the quite thin boundary layer of a layer thickness, to arrive the surface of etched film.These reactants will produce chemical reaction with the molecule of film surface then, and generate various products.These products that are arranged in film surface also will utilize diffusional effect and by the boundary layer to solution, then along with solution is discharged from.Because wet etching is a chemical reaction, so etchant concentration is very big for the reaction rate influence, excessive concentration can cause etch-rate too fast, and then the pattern generating undercut phenomenon (under cut) that causes desire to define, influence the effect of successive process, and, will cause pixel electrode quality instability and impact effect if the concentration instability of etching solution then can't effectively be controlled etching reaction.
Known in the wet etching processing procedure of definition pixel electrode structure, common etching solution includes oxalic acid aqueous solution, aqueous solution of hydrogen bromide, hydrochloric acid and nitric acid mixed aqueous solution etc.Carrying out wet etching with oxalic acid as etching solution is example; because oxalic acid has volatile characteristic; so its concentration is higher because of the volatilization of moisture through regular meeting; and also can cause the change of oxalic acid solution concentration by the slaine that etching reaction generated; therefore for fear of the quality of the anomalous effects pixel electrode of etchant concentration; known engraving method is to carry out the etching solution sampling in etching bath; learn the concentration of oxalic acid again in the mode of acid base titration; afterwards again according to measured concentration value; suitably add moisture; keeping the stable of concentration of oxalic acid, even when the etching liquid measure reaches deterioration concentration degree, need take the step of complete batch of replacing.
Because known employing acid base titration is measured the overlong time of solution concentration, even therefore after measuring solution concentration, find concentration abnormality, and need in etching solution, add water so that etchant concentration returns back to normal range, yet because the concentration of oxalic acid in the etching bath may change because of moisture evaporation in the process of measuring solution concentration once again, therefore the method for utilizing acid base titration to measure solution concentration also can't provide the immediately monitoring (inline monitor) of effect, and then make maintaining in the predetermined concentration range that the concentration of oxalic acid can't be stable, and cause the problem of etching inequality, influence the effect of whole processing procedure.
Therefore how to design a cover etchant concentration control system, can more effectively detect etchant concentration immediately, and can be according to detected concentration, being adjusted the concentration of oxalic acid that makes the oxalic acid etching solution at once can maintain in the stable scope, to guarantee the quality of etch process, just become the important topic of current research.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of engraving method of pixel electrode of display panels, utilize the electrical conductivity of monitoring oxalic acid solution in the etching bath to adjust the concentration of oxalic acid immediately, fail to adjust immediately to improve prior art mesoxalic acid concentration, thereby influence the shortcoming of etching quality.
According to purpose of the present invention, this display panels includes substrate, transparency conducting layer is located at this substrate surface, and mask layer is covered in this transparency conducting layer, this method is earlier this substrate immersion to be carried out etching in the oxalic acid etching solution, detect the electrical conductivity of this oxalic acid etching solution afterwards and adjust this oxalic acid etchant concentration according to this electrical conductivity, so that this oxalic acid etchant concentration maintains in the predetermined concentration scope, utilize this oxalic acid etching solution to remove this transparency conducting layer that is not covered then, to form this pixel electrode by this mask layer.
Because the present invention is the linear relationship of utilizing between oxalic acid etchant concentration and its electric conductivity, utilize electrical conductivity meter immediately monitoring oxalic acid etching solution electrical conductivity, therefore can make accurate immediately monitoring to the oxalic acid etchant concentration at the variation of oxalic acid etching solution electrical conductivity count value.In addition, the present invention can see through the water-adding system that designs on the etching machine immediately according to monitored results and adjust the oxalic acid etchant concentration, so can effectively the oxalic acid etchant concentration be maintained in the predetermined concentration scope, carries out to guarantee the stable of etch process.
Description of drawings
Fig. 1 is the relation of experiment gained concentration of oxalic acid and electrical conductivity among the present invention.
Fig. 2 is the relation of concentration of oxalic acid and electrical conductivity in the different etching periods of actual measurement among the present invention.
Embodiment
In preferred embodiment of the present invention, display panels at first is provided, it includes glass substrate, and this substrate surface is provided with transparency conducting layer, and mask layer is covered in layer at transparent layer, is used for defining the pattern of this pixel electrode.Subsequently this glass substrate is immersed in the oxalic acid etching solution, utilize the electrical conductivity meter to detect the electrical conductivity of oxalic acid etching solution, and according to this electrical conductivity adjustment concentration of oxalic acid, its concentration is maintained in the preset range, to utilize this oxalic acid etching solution to remove the transparency conducting layer that is not covered, define pixel electrode by mask layer.Wherein the material of this transparency conducting layer is tin indium oxide (ITO), and this oxalic acid etchant concentration maintains 3.4wt% approximately.
Because in the ITO etch process, in the etching solution except that containing oxalic acid and micro-surfactant (surfactant), all the other major parts are all moisture, the present invention utilizes the nonconducting characteristic of water, in the laboratory, measure under different oxalic acid solution concentration, the variation relation of its electrical conductivity and concentration of oxalic acid, and utilize this relation to keep the stable of etch process mesoxalic acid etchant concentration.
Fig. 1 is the concentration of oxalic acid and the electrical conductivity graph of a relation of experiment gained, can be known by Fig. 1 and learn that concentration of oxalic acid and its electrical conductivity present a positive line sexual intercourse.And experimental data can utilize linear regression method to try to achieve following linear relationship equation thus:
Y＝11.025X+13.703????R
2＝0.9915????????????????(1)
Wherein X represents concentration of oxalic acid (wt%), and Y represents electrical conductivity (ms/cm);
Owing to contain low quantity of surfactant in the etching solution,, the influence of surfactant can be removed in addition in order to try to achieve the relation of concentration of oxalic acid and electrical conductivity more accurately.Table 1 is the relation table of surfactant concentration and electrical conductivity.By the relation of table 1 surfactant concentration and electrical conductivity, but that the relational expression of update equation formula (1) concentration of oxalic acid and electrical conductivity obtains equation (2) is as follows:
X＝[(Y-0.533)-13.703]/11.025??????????????????(2)
Can learn the concentration of oxalic acid of oxalic acid etching solution and the linear relationship of electrical conductivity by equation (2), can utilize oxalic acid solution concentration change situation in the etching bath of electrical conductivity meter immediately monitoring at this characteristic of oxalic acid etching solution, and utilize the water-adding system that is arranged on the etching machine, keep the skin wet immediately to keep the oxalic acid solution steady concentration.
Equation (2) is to utilize the relation of the concentration of oxalic acid of experiment gained to electrical conductivity.Utilize the oxalic acid etchant concentration in the etching bath on this characteristic actual measurement etching machine and the relation of electrical conductivity, can be as the graph of a relation of Fig. 2.Oxalic acid etchant concentration and electrical conductivity in the etching bath has certain linear in different time as shown in Figure 2, therefore electrical conductivity can be used as the index of at-once monitor concentration of oxalic acid really, and utilizes the water-adding system that designs on etching machine effectively to keep concentration of oxalic acid.
Table 1 is the relation of surfactant concentration and electrical conductivity
| Surfactant concentration | ??1000ppm | ????500ppm | ??100ppm |
| Electrical conductivity (ms/cm) | ??0.533 | ????0.311 | ??0.125 |
Compared to the known method of monitoring oxalic acid solution concentration in the acid base titration mode, the present invention utilizes the linear relationship between oxalic acid and its electrical conductivity, see through the electrical conductivity value that the electrical conductivity meter is monitored, and design suitable water-adding system and keep the skin wet, but just immediately monitoring oxalic acid solution steady concentration, effectively improving prior art can't the immediately monitoring concentration of oxalic acid, and causes the shortcoming of etching bad.
The above only is the preferred embodiments of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to the covering scope of patent of the present invention.
Claims (6)
1. the engraving method of the pixel electrode of a display panels, this display panels includes substrate, and transparency conducting layer is located at this substrate surface, and mask layer is covered in this layer at transparent layer, to be used for defining the pattern of this pixel electrode, this engraving method comprises the following step:
Make this substrate immersion in the oxalic acid etching solution;
Detect the electrical conductivity of this oxalic acid etching solution, and adjust this oxalic acid etchant concentration, so that this oxalic acid etchant concentration maintains in the predetermined concentration scope according to this electrical conductivity; And
Utilize this oxalic acid etching solution to remove this transparency conducting layer that is not covered, to form this pixel electrode by this mask layer.
2. engraving method as claimed in claim 1, wherein this transparency conducting layer is made of tin indium oxide.
3. engraving method as claimed in claim 1, wherein this oxalic acid etchant concentration is 3.4wt%.
4. engraving method as claimed in claim 1, wherein in this predetermined concentration scope, this etchant concentration and this electrical conductivity be rough to have linear relationship.
5. engraving method as claimed in claim 1, wherein this method is to utilize real-time monitoring system to detect the electrical conductivity of this etching solution in removing the process of this transparency conducting layer.
6. engraving method as claimed in claim 5, wherein this real-time monitoring system is to be connected in water-adding system, keeps the skin wet in this etching solution with this electrical conductivity that records according to this real-time monitoring system, adjusts this etchant concentration immediately.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA03104493XA CN1523451A (en) | 2003-02-18 | 2003-02-18 | An etching process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA03104493XA CN1523451A (en) | 2003-02-18 | 2003-02-18 | An etching process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1523451A true CN1523451A (en) | 2004-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA03104493XA Pending CN1523451A (en) | 2003-02-18 | 2003-02-18 | An etching process |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163543A (en) * | 2010-12-15 | 2011-08-24 | 友达光电股份有限公司 | Etching apparatus and control method thereof |
| CN102534621A (en) * | 2012-02-21 | 2012-07-04 | 上海正帆科技有限公司 | Method for treating acidic etching solution |
| CN110850812A (en) * | 2019-11-18 | 2020-02-28 | 北京邮电大学 | Ion beam etching rate control method and device based on model |
-
2003
- 2003-02-18 CN CNA03104493XA patent/CN1523451A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163543A (en) * | 2010-12-15 | 2011-08-24 | 友达光电股份有限公司 | Etching apparatus and control method thereof |
| CN102534621A (en) * | 2012-02-21 | 2012-07-04 | 上海正帆科技有限公司 | Method for treating acidic etching solution |
| CN110850812A (en) * | 2019-11-18 | 2020-02-28 | 北京邮电大学 | Ion beam etching rate control method and device based on model |
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