CN104123978A - 导电颗粒和包含该导电颗粒的显示装置 - Google Patents

导电颗粒和包含该导电颗粒的显示装置 Download PDF

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Publication number
CN104123978A
CN104123978A CN201310687617.0A CN201310687617A CN104123978A CN 104123978 A CN104123978 A CN 104123978A CN 201310687617 A CN201310687617 A CN 201310687617A CN 104123978 A CN104123978 A CN 104123978A
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conductive particle
display unit
electrode
film
polyhedron
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李大根
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4855—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by their physical properties, e.g. being electrically-conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
    • B29C65/487—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical
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Abstract

本申请涉及一种包括多面体形状的导电颗粒，其中，多个面中的两个相邻的面形成交叉线，且会合于所述交叉线上会合的两个面形成角度。本申请还涉及包含该导电颗粒的显示装置。

Description

导电颗粒和包含该导电颗粒的显示装置
技术领域
本发明公开涉及导电颗粒和包含该导电颗粒的显示装置。
背景技术
随着单片集成电路（IC）等密度的增加，越来越希望提供IC（或等同物）和可操作地安装并电连结IC的基板之间的高密度相互连接。在一方面的尝试中，提供电路接入材料（例如各向异性导电膜或简写为ACF）具有包埋在绝缘膜中的导电颗粒分散，该绝缘膜还包含粘合剂。这样的ACF可用于高密度电路元件的相互连接，如提供液晶显示器（LCD）的基板上的电连接焊盘和带载封装（TCP）的相应终端之间的相互连接。这样的ACF可替代地或另外地用于提供柔性印刷电路（FPC）和带载封装（TCP）之间的高密度相互连接通路，或柔性印刷电路（FPC）和印刷导线板（例如印刷电路板）之间的通路。
电路接入材料必须通过ACF-穿透电极电配合。更具体地，可在显示面板的基板上，或以IC封装终端（例如IC隆起物）的形态和/或作为柔性印刷电路（FPC）的相互连接部分，提供这样的穿透电极。更具体地，例如被氧化的膜的穿透绝缘膜形成在电极的表面上以用作穿透连接屏障，然后提供合适的方式分别在需要或不需电连接的各个位置导电穿透连接屏障或者未导电穿透连接屏障。
应理解，背景技术部分旨在提供用于理解本文公开的技术的有用的背景，因此背景技术部分可包括观点、概念或认可，这些不是本文公开的主题的相应发明日期之前，相关领域中的普通技术人员已知或理解的部分。
发明内容
根据本发明的公开，提供了有锋利边缘并因此膜-穿透的多面体导电颗粒作为各向异性导电膜（ACF）的部分，分别在需要或不需电连接的各个位置用于导电穿透ACF下提供的连接屏障或者不导电穿透。根据本公开还提供了包含具有所述多面体导电颗粒（PCP）的ACF的显示装置。
本教导的示例性实施方式提供了导电颗粒，所述导电颗粒包括多面体形状，其中，多个面中的两个相邻的面（可为平面或凸面）会合形成交叉线。所述两个相邻的面的会合线的各个切线形成角。
在一个实施方式中，显示所述导电颗粒的多面体形状的表面暴露于外。
所述导电颗粒的截面可包括多边形的面。
所述导电颗粒可为四面体和六面体中的一种。
另一个示例性实施方式提供了显示装置，包含：第一电极；在所述第一电极上提供的阻挡层；在所述阻挡层上提供的导电膜，所述导电膜包含通过形成所述导电膜的主体的绝缘粘合剂材料而分散的多个基本相同的导电颗粒；和在所述导电膜上提供的第二电极，其中，在每个所述导电颗粒中，多个侧面中的两个相邻的面会合以形成交叉线，且由所述两个面会合限定的角是形成多面体形状的角。
所述导电颗粒中所述交叉线的至少一部分直接接触所述第一电极。
在所述导电颗粒中有多个交叉线，还有所述交叉线会合的交叉点，其中该尖的交叉点可直接接触所述第一电极。
所述的显示装置可包含包括所述导电颗粒的多个导电颗粒，其中，所述导电膜包含布置在所述导电颗粒之间的电绝缘膜。
显示所述导电颗粒的多面体形状的表面可接触所述绝缘膜。
所述阻挡层可为氧化物膜。
根据本发明的公开的实施方式的方法，由于所述多面体形状的导电颗粒的构型，通过被安装的IC或其它这样的部件施加的结合压力由压缩部分上的会合面的楔形而集中，从而无论电极（例如基板焊盘（pad））周围是否形成的阻挡层都能将接触力和可靠性提高至足够的水平以确保穿透。
附图说明
图1显示了根据本发明的公开的示例性实施方式的显示装置的俯视图。
图2显示了相对于图1的线II-II的截面视图。
图3显示了图1的X区放大图。
图4显示了图2的放大的P区的导电颗粒的截面视图。
图5显示了根据示例性实施方式的导电颗粒的另一个实例的三维图。
图6至图11显示了用于制造根据示例性实施方式的多个基本相同的导电颗粒的方法。
具体实施方式
下文将参照其中显示示例性实施方式的附图更全面地提供本发明的公开。然而，应理解本教导不限于公开的实施方式，而是相反，本教导旨在覆盖各种修改。正如本领域的普通技术人员根据本公开会认识到，可以各种不同的方式修改说明的实施方式，全部不背离本教导的精神或范围。
在附图中，为了清楚，放大了层、膜、面板、区域等的厚度。将理解当将例如层、膜、区域或基板的元件称作在另一个元件“上”时，该元件可直接在另一个元件上，或可存在介于中间的元件。整个说明书中相同的附图标记中表示相同的元件。
图1显示了根据示例性实施方式的显示装置（例如液晶显示器（LCD）装置）的俯视图。图2显示了相对于图1的线II-II的截面视图。图3显示了图1的X区的放大图。
参照图1至图3，显示装置100包括基板101、在所述基板上布置的一个或多个相互连接的焊盘120、在所述相互连接的焊盘上布置的图案化的绝缘层115、具有布置在各向异性导电膜（ACF）160上并穿透ACF160的ACF-穿透终端152的驱动电路150，各向异性导电膜（ACF）160插入驱动电路150和基板101之间。
基板101由透光的电绝缘材料（例如具有二氧化硅（SiO2）作为主要组分的透明玻璃材料）制造。然而，基板101的材料不限于此，并可用透明塑料形成。塑料基板用绝缘的有机材料形成，并可用选自包括聚醚砜（PES）、聚丙烯酸酯（PAR）、聚醚酰亚胺（PEI）、聚萘二甲酸乙二醇酯（PEN）、聚对苯二甲酸乙二醇酯（PET）、聚苯硫醚（PPS）、聚芳酯、聚酰亚胺、聚碳酸酯（PC）、三醋酸纤维素（TAC）和醋酸丙酸纤维素（CAP）的组中的有机材料形成。同样，基板101可由金属制造，或可形成箔的形状。
图像显示区A1和非显示区A2限定在显示装置的基板101上。图1显示了布置在显示区A1的第一边缘的非显示区A2。然而，本教导不限于这个结构。即，非显示区域A2可在显示区A1的第一边缘和面对第一边缘的另一边缘提供，并可布置为包裹显示区A1。
用于输出光的电控制点的多个像素（未显示）（例如控制的R、G、B源点）形成在显示区A1中，以使用户可察觉和运用电子限定图像。可形成用于产生电场的电极结构或用于通过电流将电转化成光的发光元件，以使像素可输出所需光的量和/或颜色。
多个间隔开的相互连接的焊盘120布置在非显示区A2中。至少一些焊盘120可用于传输各个电信号和/或功率信号至显示区A1或从显示区A1传输各个电信号和/或功率信号。例如，由驱动电路150产生并通过焊盘120传输到显示区A1的一些电信号可包括数据线驱动信号和/或栅极线驱动信号。作为另一个实例，用于由驱动电路150处理的从显示区A1接收的一些电信号可包括触摸传感信号。
各个焊盘120通过包含在各向异性导电膜160中的导电颗粒162电连接至驱动电路150的相应终端152。更具体地，各向异性导电膜160包含具有导电颗粒162分布其中的绝缘材料的膜161。这里，绝缘膜161可包括热粘合剂材料或其他可激活的（例如压力）粘合剂材料。绝缘膜161的粘合剂材料可粘附到基板101的上表面（通过如下将说明的允许粘附的槽115g），并且它还可粘附到驱动电路150的封装的下表面（例如封装的IC）。
可用一个或多个各种导电材料形成焊盘120。虽然图2中未显示，每个焊盘可包含可穿透的连接阻挡层125（参见图4）。
较硬的和图案化的绝缘层115布置在焊盘120的顶部上，并对准焊盘120。使绝缘层115形成图案以包含分别位于要被接触的焊盘的非边缘部分之上的接触孔115c和位于间隔开的焊盘之间区域的粘附-增强槽115g。
更具体地，形成通过绝缘层115的接触孔115c与各个焊盘120的上面重叠。如图2中显示，在这种情况下，形成绝缘层115，以保护性地覆盖焊盘120的侧边缘部分，从而防止焊盘120的边缘被损坏，例如使各个焊盘开始不需要的剥离。更具体地，具有合适的防腐蚀材料（例如和无机绝缘体）的绝缘层115的形成防止在制造显示装置100的过程中出现的由电化学腐蚀引起的对焊盘120的面的损坏或在制造后出现的各种类型的腐蚀。
图3和4的绝缘层115的槽115g布置在相邻的接触孔115c之间。参照图2，槽115g透过绝缘层115，从绝缘层115去除了一部分绝缘层115的厚度。然而，本教导不限于这个结构。可使用各种其它结构，通过这些结构槽115g可提供增强的粘附功能性。
即，槽115g可形成为以下形状，绝缘层115的厚度的一部分因该形状去除，以使ACF160内的粘合剂可接触基底基板101的上表面。
如图3的平面图显示，槽115g具有不与接触孔115c的区域交叠的封闭的边界形状，例如矩形（或圆形等）。即，通过环绕绝缘层材料115的包装环绕（wrappingthere-around）限定槽115g的内部面。由于在ACF160内的粘合剂可通过槽115g接触基底基板101的上表面，提高绝缘层115和基板101之间的粘合，从而有助于防止绝缘层115从基板101剥离。虽然未显示，即使当形成另一个元件（例如另一层）以插入绝缘层115和基底基板101之间时，通过穿过粘附增强槽115g延伸的粘合剂也可加强绝缘层115和它的下层之间的粘合，以帮助防止绝缘层115剥落。
布置驱动电路150到它的各个焊盘120上。驱动电路150可为芯片类型，并包含主体151和多个隆起物152或其它ACF-穿透终端。隆起物152附着到主体151的底面。各向异性导电膜（ACF）160布置在焊盘120和驱动电路150之间。
参照图2，在绝缘层115上形成各向异性导电膜160（例如涂布的）。各向异性导电膜160包括绝缘膜材料161和嵌入绝缘膜材料161和分布遍及绝缘膜材料161的多个正常间隔开的导电颗粒162。即使不是在它的粘合剂固化之后，至少也是在固化之前，ACF160的绝缘膜材料161被ACF-穿透终端（例如隆起物）152穿透，以使穿透终端152的底端施压到焊盘120的顶部，同时在其间插入有导电颗粒162。
换句话说，布置一些导电颗粒162在各个隆起物152的底部导电表面和各个焊盘120的导电近顶部表面之间的接触接合。当通过例如热压缩方法加压隆起物152和焊盘120时，激活导电颗粒162（例如它们周围的绝缘薄膜破裂），产生了导电接触接合，并且焊盘120电连接到驱动电路150的各个隆起物152。
同样，通过各向异性导电膜160的加压和热活化，驱动电路150粘附于基板101。详细地，绝缘膜161结合到绝缘层115和驱动电路150，因此驱动电路150粘附于基板101，同时电连接到它的各个相互连接的焊盘120。
在加压热活化过程中，在槽115g中接收一些导电颗粒162以及ACF膜160的粘合剂材料。为此目的，需要槽115g大于一个或多个导电颗粒162（或者相反，确保导电颗粒162在直径方向小于槽115g的宽度）。具体地，槽115g的深度大于导电颗粒162至少平均的直径。在一个实施方式中，如图2显示，槽115g的深度可接收并在其中包含至少两个并排的导电颗粒162。相似地，槽115g的宽度使它接收和在其中包含至少两个并排的导电颗粒162。换句话说，当导电颗粒162接收到槽115g中时（例如在ACF膜160的加压热激活过程中），可接收一个导电颗粒162的至少一部分，该部分为颗粒的下部，并且更优选地，需要形成槽115g大于预定的大小，所以在槽115g的容积区中可全部接收导电颗粒162的至少一个的全部体积，更优选数个（例如2至5个）。
如上述，通过热压缩方法使置于焊盘120和隆起物152之间的至少一些导电颗粒162形成焊盘120和隆起物152之间的电接触连接，并且焊盘120因此电连接到驱动电路150的相应部分（152）。虽然在ACF160的预压缩形态中的导电颗粒162的分布密度需要足够大以确保至少一个或数个导电颗粒162在加压热激活的过程中陷入焊盘120和隆起物152之间，它不能大到阻止ACF160的粘合功能同时发生。更具体地，如果它们的大小和体积密度太大，布置在介于焊盘120和隆起物152之间的区域之外的导电颗粒162可干扰驱动电路150对基板101的所需粘接。即，当只有导电颗粒162而非其它一些绝缘膜161的粘合部分布置在驱动电路150和绝缘层115之间的具体结合区域时，或者导电颗粒162在这个区域特别地聚集到一起（集聚）时，由于在所需粘合剂接触驱动电路150和基板101的一个或两个的区域（例如115g）中导电颗粒162的过高浓度的干扰，将减小驱动电路150对基板101的粘结强度。
然而，根据本教导，接触孔115c分隔开，并且槽115g分别形成在接触孔115c之间，以在加压热活化过程中，ACF材料161的过多部分流入槽115g中，因而可在槽115g中接收过多的导电颗粒162，从而有效地防止导电颗粒162的聚集，这样的聚集可干扰驱动电路150粘性结合到基板101。在一个实施方式中，如图2中显示，接收过量的槽115g的宽度同时足够小以防止或阻止隆起物152的宽度容易进入槽115g中，同时接触孔115c具有相对缓的侧壁斜坡和较大的顶宽，以使在接触孔115c中容易接收隆起物152的宽度，并且导向与接触焊盘120和插入的导电颗粒162的集中接合。
现将参照图4说明根据本公开的示例性实施方式的导电颗粒。
图4显示了图2的放大的P区的导电颗粒的截面视图。
参照图4，在导电的下方紧挨着的焊盘120（例如在焊盘120的形成过程中通过表面氧化或用外部杂质材料涂布）的上面形成电绝缘但可穿透的阻挡层125，所以需要通过可穿透的阻挡层125的穿透以建立电接触。
在一个实施方式中，导电颗粒162形成为边缘锋利的或尖锐棱角的规则的3维物体，例如，具有多面体形状，该形状的多个面各自确定为多边形。即，多面体形状的多个面中的两个相邻的面形成尖的交叉线（a），并且在交叉线（a）会合的两个面各自具有多边形的形状，并且它们在其会合处形成尖的交叉角。有多个这样的交叉线（a），并且多个交叉线（同样为a）会合以形成交叉点（b）或尖的角。可有多个这样的尖的交叉点（b）。如图4显示，至少交叉点（b）使它们易于穿透可穿透的阻挡层125。
更具体地，图4显示了示例性导电颗粒162的截面形状，其中，导电颗粒162具有上述多面体形状（例如二十面体的形状），并接触第一电极120，并且它在截面显示为六边形。导电颗粒162的多面体形状具有统一的框架。
显示导电颗粒162的多面体形状的表面暴露于外，并且从外看时可看到它们的形状。然而，如参照图2说明，当绝缘膜161形成在导电颗粒162之间时，上述形状可被遮盖。换句话说，表示导电颗粒162的多面体形状的表面可接触绝缘膜161。
至少一部分导电颗粒162的交叉线（a）可穿透过并直接接触第一电极120。此外，在形成于导电颗粒162上的交叉线（a）会合处的交叉点（b）可直接接触第一电极120。图4显示了其中导电颗粒162的交叉点（b）直接接触各个第一电极120并且还穿透可穿透的阻挡层125的示例性实施方式。
换句话说，由于导电颗粒的外部形状具有相对锋利的边缘的多面体结构，所以在形成阻挡层125后，压缩压力可作为放大的力传输到接触第一电极120的导电颗粒162的尖锐部分。因此，由于根据本示例性实施方式的导电颗粒的结构特征，可克服由常规的圆形导电颗粒产生的压缩损失的问题。
虽然未显示，导电颗粒162可形成为塑性聚合物核和覆盖该塑性聚合物核的导电的、边缘锋利的壳。该导电的、边缘锋利的壳可为金属膜或镀上的导电塑性聚合物。
可使用微流体控制方法大量制造上述形状的导电颗粒。可通过使用FAB方法在有机基板中形成微管而制造具有所需导电颗粒形状的模板。这里，可通过所谓铸造方法制造通过注入原材料形成的与模板相同的导电颗粒，并将参照图6至图10说明。
图5显示了根据本公开的其他示例性实施方式的各个导电颗粒的其他实例的三维图。
更具体地，上述导电颗粒可为四面体、六面体、八面体、十二面体和二十面体中的一种。
上述导电颗粒可用于电连接焊盘电极和驱动电路，它可应用于电路元件之间的各种类型的电连接，不限于示例性实施方式。
图6至图11显示了用于大规模生产根据示例性实施方式的导电颗粒的方法。图6显示了具有一系列凹陷（例如相同的凹陷）的图案化的玻璃块200的平面图，每个凹陷具有用于形成相应的导电颗粒（162）的形状。图7显示了相对于图6的线VII-VII的截面视图。图8显示了用于连续注入液体原料（前体）的平面图，其中未显示覆盖玻璃板。图9显示了进行前体注入过程的图8的水平方向的截面视图。图10显示了从图6至9的示例性实施方式获得的多个多面体聚合物立方体的透视图，图6至9中所述玻璃块200中的凹陷210各自具有基本为立方体形状。图11显示了根据本示例性实施方式的示例性导电颗粒的截面视图，该导电颗粒具有塑性的核。
参照图6和图7，一个或多个注入接收微管210（各自包含重复的根据所需导电颗粒形状而确定形状的凹陷（腔））在玻璃块200中形成。微管210成为与所需导电颗粒的形状相同铸件的模板。相同铸件的模板根据要生产的显示装置或其他这样相互连接的使用装置的目标槽（115g）和接触孔（115c）的尺寸的确定大小。这里，将说明其中导电颗粒具有六面体形状的示例性实施方式。然而，导电颗粒的形状不限于六面体，并且如上述，由多边形的面围成的多面体形状是可变化的。在一个实施方式中，像200的两个玻璃块可连接以限定所需注入接收微管210。
参照图8和图9，沿微管210注入液体原料。液体原料可包括用于形成塑性聚合物核的可硬化的聚合物组分。
参照图10，当注入的液体原料凝固（例如被热固化）时，在稀疏地互相连接的模本破裂后，形成和收集对应于所需导电颗粒的模板的多面体塑性聚合物核262a。可通过在玻璃块200中形成的微管型开口而分离多个这样的在玻璃块200中连接的塑性聚合物核262a，形成多面体塑性聚合物核262a。在使用两个玻璃块限定注入接收微管210的情况下，在聚合后分离玻璃块，并且稀疏地相互连接的模本剥离并断裂成塑性聚合物核262a的单个模本。
接下来，参照图11，通过将其镀到塑性聚合物核262a的成形的外部而形成金属膜262b。在这种情况下，形成包含塑性聚合物核262a和相应的金属皮262b的导电颗粒262。在替代的实施方式中，化学处理或涂布塑性聚合物核262a的外层，以限定导电的相应的皮262b。在任一种情况下，导电的相应的皮262b由具有充足的硬度的材料制造，以穿透可穿透的阻挡层125。
尽管已结合目前认为是实用的示例性实施方式提供了本发明的公开，但应理解的是，本教导不限于公开的实施方式，而是相反，本公开旨在涵盖本教导的精神和范围内包括的各种修改和等效装置。

Claims (10)

1.一种导电颗粒，所述导电颗粒包括多面体形状，其中，多个面中的两个相邻的面形成交叉线，且在所述交叉线上会合的两个相邻的面形成角。
2.根据权利要求1所述的导电颗粒，其中，显示所述导电颗粒的多面体形状的表面暴露于外。
3.根据权利要求2所述的导电颗粒，其中，所述导电颗粒的截面包括多边形的面。
4.根据权利要求1所述的导电颗粒，其中，所述导电颗粒的形状为四面体和六面体中的一种。
5.一种显示装置，包含：
第一电极；
在所述第一电极上布置的阻挡层；
在所述阻挡层上布置并包含导电颗粒的导电膜；和
在所述导电膜上布置的第二电极，
其中，所述导电颗粒包括多面体形状，其中，多个面中的两个相邻的面形成交叉线，且在所述交叉线上会合的两个面形成角。
6.根据权利要求5所述的显示装置，其中，所述导电颗粒中所述交叉线的至少一部分直接接触所述第一电极。
7.根据权利要求6所述的显示装置，其中，在所述导电颗粒中有多个交叉线，所述交叉线会合的交叉点直接接触所述第一电极。
8.根据权利要求7所述的显示装置，进一步包含包括所述导电颗粒的多个导电颗粒，
其中，所述导电膜包含布置在所述导电颗粒之间的电绝缘膜。
9.根据权利要求8所述的显示装置，其中，显示所述导电颗粒的多面体形状的表面接触所述绝缘膜。
10.根据权利要求6所述的显示装置，其中，所述阻挡层为氧化物膜。
CN201310687617.0A 2013-04-29 2013-12-16 导电颗粒和包含该导电颗粒的显示装置 Pending CN104123978A (zh)

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