CN104114747A - 金属材料、表面处理方法及装置 - Google Patents
金属材料、表面处理方法及装置 Download PDFInfo
- Publication number
- CN104114747A CN104114747A CN201380009686.4A CN201380009686A CN104114747A CN 104114747 A CN104114747 A CN 104114747A CN 201380009686 A CN201380009686 A CN 201380009686A CN 104114747 A CN104114747 A CN 104114747A
- Authority
- CN
- China
- Prior art keywords
- metallic substance
- cathode electrode
- pending
- base material
- anode electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/06—Etching of iron or steel
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- ing And Chemical Polishing (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-038553 | 2012-02-24 | ||
| JP2012038557 | 2012-02-24 | ||
| JP2012-038557 | 2012-02-24 | ||
| JP2012038555 | 2012-02-24 | ||
| JP2012-038555 | 2012-02-24 | ||
| JP2012038553 | 2012-02-24 | ||
| PCT/JP2013/054413 WO2013125658A1 (ja) | 2012-02-24 | 2013-02-21 | 金属材料、表面処理方法及び装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104114747A true CN104114747A (zh) | 2014-10-22 |
Family
ID=49005835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380009686.4A Pending CN104114747A (zh) | 2012-02-24 | 2013-02-21 | 金属材料、表面处理方法及装置 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP2818579A4 (https=) |
| JP (1) | JP5817907B2 (https=) |
| KR (1) | KR101687462B1 (https=) |
| CN (1) | CN104114747A (https=) |
| IN (1) | IN2014KN01697A (https=) |
| TW (1) | TWI472424B (https=) |
| WO (1) | WO2013125658A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111805022A (zh) * | 2020-06-04 | 2020-10-23 | 南方科技大学 | 等离子体辅助电解加工方法及实施装置 |
| CN112548922A (zh) * | 2019-09-25 | 2021-03-26 | 施耐宝公司 | 紧固件保持和防滑脱工具钻头 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6498091B2 (ja) * | 2015-09-25 | 2019-04-10 | Jx金属株式会社 | 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0218043B2 (https=) * | 1983-06-09 | 1990-04-24 | Taishi Shokuhin Kogyo Kk | |
| JPH04136198A (ja) * | 1990-09-26 | 1992-05-11 | Nau Chem:Yugen | 電気めっき方法 |
| JPH09241865A (ja) * | 1996-03-01 | 1997-09-16 | Kawasaki Steel Corp | フィルム密着性、耐食性に優れたラミネート鋼板 |
| CN1559081A (zh) * | 2000-08-10 | 2004-12-29 | ж� | 利用外部影响在工件的上表面和空腔表面放置的添加剂之间产生差别的电镀方法和设备 |
| US20100089759A1 (en) * | 2007-02-15 | 2010-04-15 | National University Corporation Hokkaido University | Method for producing conductor fine particles |
| JP2010287648A (ja) * | 2009-06-10 | 2010-12-24 | Seiko Epson Corp | 半導体装置の製造方法 |
| CN102041540A (zh) * | 2011-01-13 | 2011-05-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | 三维渐变孔阵列纳米结构阳极氧化铝模板及其制备方法 |
| CN103124809A (zh) * | 2010-08-26 | 2013-05-29 | 杰富意钢铁株式会社 | 表面改性的导电性材料的制造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06297252A (ja) * | 1993-04-09 | 1994-10-25 | Sony Corp | 微細加工方法及びその装置 |
| AUPR129900A0 (en) * | 2000-11-08 | 2000-11-30 | Chang, Chak Man Thomas | Plasma electroplating |
| EP1371748A4 (en) * | 2001-03-14 | 2009-07-29 | Nippon Mining Co | SPUTTERTARGET, WHICH PRODUCES VERY LITTLE PARTICLES, BACK PLATE OR APPARATUS IN SPUTTER DEVICE, AND SPARKLING METHOD THROUGH SPARK EROSION |
| JP2005329451A (ja) * | 2004-05-21 | 2005-12-02 | Fuji Photo Film Co Ltd | アルミニウム板の表面加工方法及び平版印刷版用支持体並びに平版印刷版 |
| JP5010966B2 (ja) * | 2006-08-21 | 2012-08-29 | 株式会社神戸製鋼所 | 撥水性塗料および撥水金属板 |
| JP5323677B2 (ja) * | 2007-03-02 | 2013-10-23 | 古河電気工業株式会社 | 表面粗化銅板の製造方法及び装置、並びに表面粗化銅板 |
-
2013
- 2013-02-21 WO PCT/JP2013/054413 patent/WO2013125658A1/ja not_active Ceased
- 2013-02-21 CN CN201380009686.4A patent/CN104114747A/zh active Pending
- 2013-02-21 EP EP13752521.8A patent/EP2818579A4/en not_active Withdrawn
- 2013-02-21 IN IN1697KON2014 patent/IN2014KN01697A/en unknown
- 2013-02-21 JP JP2014500933A patent/JP5817907B2/ja active Active
- 2013-02-21 KR KR1020147022776A patent/KR101687462B1/ko not_active Expired - Fee Related
- 2013-02-23 TW TW102106374A patent/TWI472424B/zh not_active IP Right Cessation
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0218043B2 (https=) * | 1983-06-09 | 1990-04-24 | Taishi Shokuhin Kogyo Kk | |
| JPH04136198A (ja) * | 1990-09-26 | 1992-05-11 | Nau Chem:Yugen | 電気めっき方法 |
| JPH09241865A (ja) * | 1996-03-01 | 1997-09-16 | Kawasaki Steel Corp | フィルム密着性、耐食性に優れたラミネート鋼板 |
| CN1559081A (zh) * | 2000-08-10 | 2004-12-29 | ж� | 利用外部影响在工件的上表面和空腔表面放置的添加剂之间产生差别的电镀方法和设备 |
| US20100089759A1 (en) * | 2007-02-15 | 2010-04-15 | National University Corporation Hokkaido University | Method for producing conductor fine particles |
| JP2010287648A (ja) * | 2009-06-10 | 2010-12-24 | Seiko Epson Corp | 半導体装置の製造方法 |
| CN103124809A (zh) * | 2010-08-26 | 2013-05-29 | 杰富意钢铁株式会社 | 表面改性的导电性材料的制造方法 |
| CN102041540A (zh) * | 2011-01-13 | 2011-05-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | 三维渐变孔阵列纳米结构阳极氧化铝模板及其制备方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112548922A (zh) * | 2019-09-25 | 2021-03-26 | 施耐宝公司 | 紧固件保持和防滑脱工具钻头 |
| CN112548922B (zh) * | 2019-09-25 | 2023-08-25 | 施耐宝公司 | 紧固件保持和防滑脱工具钻头 |
| CN111805022A (zh) * | 2020-06-04 | 2020-10-23 | 南方科技大学 | 等离子体辅助电解加工方法及实施装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI472424B (zh) | 2015-02-11 |
| WO2013125658A1 (ja) | 2013-08-29 |
| EP2818579A4 (en) | 2015-11-11 |
| TW201341176A (zh) | 2013-10-16 |
| IN2014KN01697A (https=) | 2015-10-23 |
| KR101687462B1 (ko) | 2016-12-16 |
| EP2818579A1 (en) | 2014-12-31 |
| KR20140112559A (ko) | 2014-09-23 |
| JP5817907B2 (ja) | 2015-11-18 |
| JPWO2013125658A1 (ja) | 2015-07-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141022 |