CN104051289A - 引线接合装置和方法 - Google Patents

引线接合装置和方法 Download PDF

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Publication number
CN104051289A
CN104051289A CN201410090701.9A CN201410090701A CN104051289A CN 104051289 A CN104051289 A CN 104051289A CN 201410090701 A CN201410090701 A CN 201410090701A CN 104051289 A CN104051289 A CN 104051289A
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CN
China
Prior art keywords
wire
lead
closing line
insulator pin
bonded
Prior art date
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Pending
Application number
CN201410090701.9A
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English (en)
Inventor
叶嘉琳
区彦敬
尤宝琳
梁杏茵
莫德·鲁斯利·易卜拉欣
纳瓦斯·可汗·奥拉蒂·卡兰达尔
莫德·费扎尔·祖尔-基弗里
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NXP USA Inc
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Freescale Semiconductor Inc
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Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of CN104051289A publication Critical patent/CN104051289A/zh
Pending legal-status Critical Current

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Abstract

本发明公开了引线接合装置和方法。一种制作电连接的方法包括通过具有引线抛光器和引线接合工具的引线接合系统传送接合线。所述引线抛光器从所述接合线的第一部分移除污染物。然后通过将所述接合线的所述第一部分接合到第一触点来形成第一接合，使得所述接合线和所述第一器件被电连接。然后通过将所述接合线的第二部分接合到第二触点来形成第二接合，使得所述第一触点和所述第二触点被电连接。

Description

引线接合装置和方法
技术领域
本发明针对半导体封装，并且更具体地涉及用于引线接合裸露的和绝缘引线的装置和方法。
背景技术
集成电路（IC）管芯是形成于诸如硅晶圆的半导体晶圆上的小器件。这种管芯通常从晶圆切断并附着到衬底或基底载体以用于互连再分布。管芯上的焊盘经由引线接合利用引线被电连接到衬底上的载体导线。即，引线接合装置将接合线的第一端附着到管芯焊盘上的第一接合，并且将接合线的第二端附着到载体导线的第二接合。引线也可以被用于交叉连接管芯的焊盘或交叉连接衬底的导线。管芯、引线和衬底然后被封装以形成封装器件。
持续需求更多的高密度IC，但却没有相应增加封装器件的尺寸或脚位（footprint）。也期望有更多到IC的输入和输出，从而导致IC管芯和衬底之间互连的高密度，并且需要细间距和超细间距引线接合。接合线的直径也减小了。例如，63微米间距的应用使用25微米直径的引线，而52微米和44微米间距的应用使用20.3微米直径的引线。正在开发使用17微米直径的引线的37微米间距的应用。
用于制作这种互连的接合线可以是裸露的或无涂层的金属线，诸如裸露的或无涂层的铜引线。替代地，接合线可以由绝缘或镀金属线形成。
裸铜线是经济的并且表现出电性质，诸如自电感和自电容，其类似于金的自电感和自电容，这是一种更昂贵的替代。
绝缘或包覆引线也有利于减少引线偏移和引线短路。具体来说，间距和引线直径的减小对处理及引线接合造成了困难。例如，引线可能会无意地对封装器件的其它导电结构短路，例如其它引线、盘、导线或管芯。这样的短路可能在封装过程中发生，例如，从“偏移”发生，其中液态模塑密封剂的注入或转移向着另一个导电结构移动引线。使用较小直径的引线的部分倾向于具有较高的引线偏移不良品。然而，由导电芯绝缘的或被有机材料包覆而形成的引线有效降低了这些负面影响。
然而，这两种类型的接合线在常规的引线接合装置和方法中也具有一些弊端。具体来讲，裸铜线的表面很容易受到氧化的污染物的影响，这导致了铜氧化物形成于铜接合线的表面上。这些污染物，即铜氧化物，对第一接合和第二接合处的接合形成和强度产生了不利影响。例如，盘上的不粘（NSOP）、导线上的不粘（NSOL）和短尾巴缺陷都是与裸铜线的表面氧化污染物相关联的常见问题。因此，裸露的或无涂层的铜接合线对于这些类型的互连的应用具有相对短的保存期限，特别是5-7天。
绝缘或包覆引线通常不受到这种污染，但是当使用包覆引线，特别是第二接合（即针脚式接合）的时候，难以获得高质量接合。NSOL是与绝缘引线相关联的常见问题，因为引线和导线之间的引线绝缘防止了良好的粘附性。
弱粘附在引线剥离试验结果中得到证实。在引线剥离试验中，吊钩被放置在靠近第二接合的引线下面并且施加升力，从而测试了第二接合粘附到导线/标杆的强度。绝缘细引线和绝缘超细引线通常表现出非常低的引线剥离强度。为了增加剥离强度，绝缘引线通常必须受到高度的洗涤，但是这通常会导致接合工艺生产量的下降。
因此，提供一种用于引线接合裸露的和绝缘引线的装置和方法将是有利的，这改进了第一接合和第二接合的接合质量，同时也保持了高水平的生产量。
附图说明
本发明通过举例的方式说明并且不受限于附图中所示的本发明的实施例，在附图中类似的参考符号表示相同的元件。附图中的元件是为了简便以及清晰而被图示，并且不一定按比例绘制。注意，某些垂直尺寸相对于某些水平尺寸被夸大。
图1是根据本发明的第一实施例的图示引线接合装置的各种示例性配置的示意图；
图2A是根据本发明的第一实施例的电连接的放大的侧视图；
图2B是根据本发明的第二实施例的电连接的放大的侧视图；
图3是根据本发明的第一实施例的引线接合装置的引线抛光器的立体图；
图4是根据本发明的第二实施例的引线接合装置的示例性配置的示意图；以及
图5是用于在本发明的第二实施例中使用的绝缘引线的截面图。
具体实施方式
参照附图，其中相同的参考符号在全部数个附图中被用于指定相同组件，根据本发明的第一实施例，图1中所示的是引线接合系统或引线接合装置10。图4示出了根据本发明的第二实施例的引线接合系统或引线接合装置110。
如图2A-图2B中所示的，在封装之前，引线接合装置10、110被用于利用接合线30、130将第一器件26电连接到第二器件28。第一器件26可以是半导体管芯，诸如形成在硅衬底上的IC。第二器件28也可以是半导体管芯，诸如在堆叠管芯配置中的底部或下部管芯。然而，在当前优选实施例中，第二器件28是载体、衬底或引线框。
更特别地，如图2A-图2B中所示，接合线30、130将第一器件26的第一焊盘26a电连接到第二器件28的第二焊盘或导线指28a，在这种情况下是导线框。第一和第二器件26、28及它们各自的焊盘26a和28a是本领域普通技术人员已知的类型，并且其详细描述对于本发明的完整理解不是必须的。
在第一器件26的第一焊盘26a处的接合线30、130的连接在本发明中被称为第一接合，并且在第二器件28的焊盘28a处的接合线30、130的连接在本发明中被称为第二接合。在当前优选实施例中，第一接合是球形接合以及第二接合是针脚式接合。
术语“引线接合”被普遍接受为意指芯片和衬底经由引线的互连。将引线结合到盘的最常用方法是经由热超声或超声接合。超声引线接合使用振动和力的组合来摩擦引线和焊盘之间的接口，从而造成局部温度上升，这就促进了分子跨边界的扩散。除了振动，热超声接合使用了热量，这进一步促进了材料的迁移。
在球形接合中，毛细管保持了引线。自由空气球（FAB）形成于引线的一端上并挤压毛细管的表面。FAB可以由氢火焰或火花形成。毛细管靠着第一焊盘推FAB，并且然后，在靠着第一盘保持FAB时，施加了超声振动，这将引线接合到管芯，从而形成了第一接合。一旦FAB被接合到第一焊盘，则仍保持了引线的毛细管被移动到第二焊盘上，其中第一焊盘被电连接到第二焊盘。引线被压在第二焊盘上并且再次施加了超声能量，直到引线被接合到第二焊盘，从而形成了第二接合。毛细管然后被抬离该接合，从而摆脱了该引线。针脚式接合和球形接合是本领域所属技术人员公知的。
在第一优选实施例中，如图1中所示，引线接合装置10包括接合馈引线12，并且尤其是接合线30的卷轴12、空气引导件14、引线拉紧器16、引线夹18、电子火焰熄灭（EFO）器件20以及引线接合工具22。空气引导件14可以被提供以确保将引线平稳和连续地提供给引线接合工具22。在引线接合周期的预定时间帧期间，拉紧器16可以给接合线30提供恒定的预先确定量的拉力。引线夹18可以可控制地夹紧接合线30并且可以被配置成与引线接合工具22一起移动，或独立于引线接合工具22移动，以在制作第二接合（例如，针脚式接合）之后，通过引线接合工具22提供接合线30和/或使引线接合工具22摆脱接合线30。
接合线30可以通过引线接合工具22被可移除地插入，使得通过EFO器件20（即，自由空气球）形成于接合线30的一端的球从引线接合工具22伸出。特别地，EFO器件20在接合线30的末端生成了火花以产生这样的FAB。在FAB形成之后，上述球形接合和针脚式接合过程被执行。
将了解，本发明并不局限于图1中所示的引线接合装置10的特定配置。也就是说，可以以与图1中所图示的不同的次序顺序提供带有一些或全部引线接合装置组件（即，空气引导件14、拉紧器16、引线夹18和引线接合工具22）的各种其它配置。
图1中所示的引线接合装置10特别地被配置用于与从裸露的或无涂层的金属线形成的接合线30一起使用，所述金属线诸如裸铜线、铜合金、银、银合金、铝、铝合金等等。在当前优选实施例中，接合线30是裸露的或无涂层的铜引线。
引线接合装置10进一步包括引线清洁器件或抛光器24。引线抛光器24优选地从引线接合装置10是可移除的，并且可以可操作地部署在引线卷轴12和引线接合工具22之间的任何位置的引线接合路径中，以在接合线30进入引线接合工具22之前选择性地移除存在于接合线30的表面上的污染物，诸如铜氧化物。
例如，在图1中所示的示例性配置中，引线抛光器24位于拉紧器16的上方，并且更特别地位于空气引导件14和拉紧器16之间。在替代示例性配置中，如图1中的虚线所示，引线抛光器24位于拉紧器16的下方，并且更特别地位于拉紧器16和引线夹18之间。在图1中的虚线所示的另一个替代示例性配置中，引线抛光器24位于引线夹18的下方，并且更特别地位于引线夹18和引线接合工具22之间。
引线抛光器24优选地是机械抛光器。更特别地，在第一实施例中，如图1中所示，引线抛光器24是微型抛光器。
引线接合装置10优选地还包括在微型抛光器24内包含（如图1中的实线所示）或紧随其后被放置在引线接合路径中（如图1中的虚线所示）的真空器件32，真空器件32疏散了从引线接合装置10移除污染物的颗粒。更特别地，在示例性实施例中，真空器件32优选地是真空超声振动器32，真空超声振动器32给接合线30提供了超声振动，因为它被微型抛光器24抛光，或紧随其后，并且通常同时抽吸真空以疏散或从引线接合装置10移除任何释放的残余污染物颗粒。
将了解，微型抛光器24可以具有任何适当的配置和结构，只要它基本上或完全圆周地围绕接合线30以从中移除污染物。
微型抛光器24的示例性实施例的放大视图在图3中被示出。微型抛光器24优选地具有大致圆柱形配置、被配置成接触接合线30的第一内表面24a、和第二相对的外表面24b。在这样的示例性实施例中，微型抛光器24的内、外表面24a和24b形成了大致管形侧壁34。微型抛光器24进一步包括第一开口端36、第二相对的开口端38和形成于其间以用于接收接合线30的圆柱形腔40。圆柱形腔40的直径（即，微型抛光器24的内径）优选地仅稍微大于穿过其中被接收的接合线30的外径，使得当其穿过微型抛光器24的空腔40的时候，可以实现接合线30的成功微型抛光。
更特别地，在示例性实施例中，至少微型抛光器24的内接触表面24a优选地由研磨材料形成，诸如陶瓷、金刚石砂砾、二氧化硅、碳化硅等类似研磨材料。优选地，微型抛光器24的接触面24a的材料有足够的研磨性以从接合线30的表面移除污染物，而不损坏引线30。而且，在经过微型抛光器24之后，接合线30的表面优选地不仅不含污染物，而且也被抛光成大致光面型。
在示例性实施例中，如图1和图3中所示的，微型抛光器24可从第一收缩位置移动，其中微型抛光器24的内表面24a接触接合线30以用于将表面污染物移除到第二展开位置，其中微型抛光器24的内表面24a不接触接合线30，并且反之亦然。因此，在示例性实施例中，微型抛光器24的内径可以有选择地变化。而且，示例性实施例的微型抛光器24可以选择性地收缩和展开，以抛光和仅从接合线30的选择部分移除污染物，同时使接合线30的其它部分保持不变或不受干扰。
在示例性优选实施例中，微型抛光器24被配置成在整个引线接合过程中保持在展开位置并且过渡到仅作为将用于穿过其中形成第一接合的接合线30的部分的收缩位置。在示例性实施例中，微型抛光器24也过渡到作为将用于穿过其中形成第二接合的接合线30的部分的收缩位置。
更特别地，微型抛光器24优选地与处理器（未示出）可操作互通，所述处理器被编程或配置成计算形成每个互连所必需的接合线30的长度，标识接合线30沿着所计算的长度的哪些部分将被用于形成第一和第二接合，并提示微型抛光器24从展开位置移动到作为所标识的穿过其中的部分的收缩位置。
在示例性实施例中，如图3中所示的，微型抛光器24优选地包括从第一开口端36延伸到第二开口端38的纵向狭缝42。因此，微型抛光器24可以很容易地展开（经由狭缝42），并从引线接合装置10移除以用于清洁及其它维护活动。
本发明还涉及一种使用引线接合装置10将第一器件26电连接到第二器件28的方法。所述方法包括通过引线接合装置10馈送接合线30，直到引线30延伸通过接合工具22。当接合线30穿过引线接合装置10时，接合线30的外表面的至少第一部分是被微型抛光以用于移除表面污染物。第一部分对应于接合线30的一部分，其中处理器所确定的该部分将被用于形成第一接合。然而，优选地，微型抛光器24还从接合线30的第二部分移除污染物，其中处理器所确定的该部分将被用于形成第二接合。
接合线的清洁的第一部分然后被用于形成带有氢火焰或火花的球。球通过接合工具22被压在第一器件26的第一焊盘26a上。接着，热压、热超声或超声引线接合被执行以形成电连接了接合线30和第一器件26的第一接合（即，球形接合）。
第二接合然后同样通过将引线30的清洁的第二部分通过接合工具22压在第二器件28的第二焊盘28a上，并执行热压、热超声或将引线30的清洁的第二部分超声引线接合到第二器件28的第二焊盘28a以形成第二接合（例如，针脚式接合）。形成第二接合不需要自由空气球。第一器件26和第二器件28由此彼此被电连接。接合工具22然后被抬离第二焊盘28a，这破坏了该接合处的引线30。
因此，根据本发明，用于自由空气球形成的接合线30的部分以及第一和第二接合被抛光或清洁，意指它们基本上或完全没有表面污染物。因此，由于NSOP和NSOL而造成存在接近消除抑制部件的不良品。而且，基本上或完全避免尾短缺陷。引线接合装置10也增加了接合线30的保存期限，这是因为仍然可以利用甚至已开始氧化的引线。
图4示出了根据本发明的引线接合系统或引线接合装置110的第二实施例。第二实施例类似于上述的第一实施例。类似的符号已被用于相同的元件，除了100系列符号已被用于第二实施例。因此，已省略了第二实施例的完整描述，而只描述了差异。
引线接合装置110特别地被配置用于与绝缘的或包覆接合线130一起使用。示例性绝缘引线130的截面图在图5中被示出。参照图5，绝缘接合线130包括圆周上被涂有诸如有机涂层的一层电绝缘材料146的导电金属芯144。绝缘引线130适合于细间距和超细间距引线接合。绝缘材料层146防止了绝缘引线130对其它引线或其它导电结构短路。
一般而言，金和铝是制作接合线130的导电芯144最常用的元素。金和铝是强韧且柔软的，并在大多数环境中具有类似的阻力。金引线有时掺杂有掺杂剂，诸如铍、钙，以便使其稳定。小直径铝引线通常掺杂有硅或有时掺杂有镁以提高其断裂负荷和伸长率的参数。除了金和铝，铜、钯合金、铂以及银接合线也因用于制作绝缘或包覆接合线的导电芯而出名。
如本领域所属技术人员已知的，各种尺寸的引线可用于将管芯连接到衬底，其中引线的尺寸除了别的之外，基于盘间距被选择。本发明第二实施例的绝缘引线130具有在大约15微米至大约55微米之间的直径，虽然可以使用其它直径接合线，并且本发明不应被局限于特定接合线直径。在优选实施例中，绝缘引线130的直径小于大约25微米。绝缘涂层146优选地是具有在自由空气球形成期间可以被热分解的大约0.1微米至大约2.0微米厚度的有机绝缘涂层。此外，绝缘引线130优选地具有大约180℃至大约350℃的熔化温度（Tg）。
在图4中所示的本发明的实施例中，代替引线抛光器24，引线接合装置110被提供有剥线器124。
剥线器124可以被部署在绝缘引线130的卷轴和引线接合工具122之间的位置处的引线接合路径中，以在绝缘引线130进入引线接合工具122之前选择性地从绝缘引线130的部分移除绝缘层或涂层146并暴露底层导电芯144。
引线接合装置10优选地还包括真空器件32，真空器件32包含在剥线器124内（如图4中的实线所述）或紧随其后被放置在引线接合路径中（如图4中的虚线所示）的。在示例性实施例中，真空器件32抽吸真空以疏散或从引线接合装置110吸入剥离的绝缘材料。
将了解，剥线器124可以可操作地被部署在引线卷轴112和引线接合工具122之间的任何地方。例如，在图4中所示的示例性实施例中，剥线器124被放置在拉紧器116的下方，并且更特别地被放置在拉紧器116和夹线118之间。
剥线器124优选地是机械剥离器。将了解，剥线器124可以是能够从绝缘引线130的导电芯144移除绝缘涂层146的任何机械剥离。在示例性实施例中，剥线器124优选地是包括了一个或多个切割或剥离刀片（未示出）的微型剪刀，其切割或修剪了围绕导电芯144的绝缘146的至少一部分。在另一个示例性实施例中，剥线器124是带有被配置成将接合线绝缘146撕裂远离导电芯144的研磨接触表面（未示出）的洗涤器。
在图4中所示的示例性实施例中，剥线器124仅从绝缘引线130的选择部分移除了绝缘材料146，同时使绝缘引线的其它部分130不受干扰。更特别地，剥线器124移除了围绕在绝缘引线130的选择部分处的导电芯144的一些并且优选地是全部的绝缘材料146，使得导电金属芯144的至少一部分，并且更优选地是整个导电金属芯144被暴露在绝缘引线130的剥离部分处。
优选地，绝缘材料146从将被用于形成第二接合的接合线130的部分移除。优选地，绝缘材料146从将被用于形成第一和第二接合的接合线130的部分移除。
在示例性实施例中，剥线器124优选地与处理器（未示出）可操作互通，所述处理器被配置成计算形成每个互连所必需的绝缘引线130的长度，并且标识绝缘引线130沿着所计算的长度的哪个部分将被用于形成第二接合。处理器还被配置成提示剥线器124的操作以移除绝缘材料146并且至少部分地暴露仅所标识的部分的导电芯144。因此，在随后的引线接合过程期间，绝缘引线130的导电金属芯144的至少一部分接触第二器件28的第二焊盘28a以用于形成第二接合。
优选地，处理器还标识了将被用于形成第一接合的绝缘引线130的部分，并且提示剥线器124也从绝缘引线130的这些部分移除绝缘材料146。因此，在随后的引线接合过程期间，第一接合处的自由空气球由裸金属形成，并且绝缘引线130的导电金属芯的至少一部分接触第一焊盘26a以用于形成第一接合。
在可选实施例中，剥线器件124可以通过本地的热源（未示出）被加热，以便增加被器件124切割或撕裂的绝缘有效性。
本发明还涉及一种使用引线接合装置110将第一器件26电连接到第二器件28的方法。所述方法包括步骤：通过引线接合装置110馈送绝缘引线130，直到绝缘引线130延伸通过接合工具122。当绝缘引线130穿过引线接合装置110时，处理器标识绝缘引线130的哪些部分将被用于形成第一接合以及哪些部分将被用于形成第二接合。剥线器124然后从绝缘引线130的至少所述部分剥离或移除绝缘材料146，其将被用于形成第二接合，使得底层导电金属芯144的至少一部分被暴露。然而，更优选地，剥线器124还从绝缘引线130的所述部分剥离或移除绝缘材料146，其将被用于第一接合的自由空气球形成，使得底层导电金属芯144的至少一部分被暴露。
第一接合（例如，球形接合）然后通过在绝缘引线130的一个末端形成带有氢火焰或火花的球并且通过接合工具22将其压在第一器件26的第一焊盘26a上被形成。接着，热压、热超声或超声引线接合被执行以将绝缘引线130电连接到第一器件26的第一焊盘26a。更优选地，球是由绝缘引线130的剥离部分形成，使得剥离部分的暴露的金属芯146被引线接合到第一焊盘26a。绝缘引线130和第一器件26因而被电连接。
第二接合（例如，针脚式接合）然后通过将引线130的剥离部分通过接合工具122压在第二器件28上，并执行热压、热超声或超声引线接合以将引线130的剥离部分的暴露金属芯146接合到第二焊盘28a而被形成。第一器件26和第二器件28从而彼此被电连接。接合工具22然后被抬离焊盘28a，这破坏了该接合处的引线130。
已发现本发明提供了以下优点：（a）由于第二接合处的NSOL而造成接近消除部件的不良品；（b）增强了第二接合处的绝缘引线的接合性，其中带有增加的引线拉力/引线剥离强度；（c）不需要新的或修改的引线接合装置，除了包含引线接合线路径中的机械剥离器；（d）模具处的引线短路不良品下降；（e）不需要具有极细填料的昂贵的塑封材料；（f）使用细涂层引线使得能够进行交叉接合；（g）盘/管芯设计规则不需仅限于外围盘；以及（h）减少了电开短路不良品。
本发明优选实施例的描述是为了说明及描述的目的而提出的，而不旨在是穷举或将本发明限定于所公开的形式。本领域所属技术人员将了解，可以在不脱离本发明的宽发明概念的情况下对上述的实施例做出改变。本发明适用于所有引线接合封装类型，包括但不限于球栅阵列（BGA）、载带球栅阵列（TBGA）、塑料球栅阵列（PBGA）、四方扁平无引线（QFN）、四方扁平封装（QFP）、小外形集成电路（SOIC）以及芯片级封装（CSP）。此外，无涂层或涂层/绝缘引线也可被用于在封装IC中连接其它类型的导电结构。
在前面的说明书中，参照本发明实施例的特定示例已经对本发明进行了描述。然而，将明显的是，在不脱离如所附权利要求中阐述的本发明的更宽范围的情况下，可在其中做出各种修改和变化。
在说明书和权利要求中的术语“前面”、“后面”、“顶部”、“底部”、“上面”、“下面”等等，如果有的话，是用于描述性的目的并且不一定用于描述永久性的相对位置。应了解，术语的这种用法在适当的情况下是可以互换的，使得本发明所描述的实施例例如能够在其它方向而不是本发明所说明的或在其它方面进行操作。
在权利要求中，词语“包括”或“含有”不排除其它元件或权利要求中列出的步骤的存在。此外，如在此使用的词语“一”或“一个”被定义为一个或不止一个。而且，即使当同一权利要求包括介绍性短语“一个或多个”或“至少一个”以及诸如“一”或“一个”的不定冠词时，在权利要求中诸如“至少一个”以及“一个或多个”的介绍性短语的使用也不应该被解释成暗示通过不定冠词“一”或“一个”引入的其它权利要求元素将包括这样介绍的权利要求元素的任何特定权利要求限制成仅包含这样的元素的发明。对于定冠词的使用也是如此。除非另有说明，使用诸如“第一”以及“第二”的术语来任意地区分这样的术语描述的元素。因此，这些术语不一定旨在指示这样的元素的时间或其它优先次序。在相互不同的权利要求中记载某些措施的事实并不指示这些措施的组合不能被用于获取优势。

Claims (20)

1.一种制作电连接的方法，包括：
通过包括引线抛光器和引线接合工具的引线接合系统传送接合线；
使用所述引线抛光器从所述接合线的至少第一部分移除污染物；
通过将所述接合线的所述第一部分引线接合到第一触点来形成第一接合，使得所述接合线和所述第一触点被电连接；以及
通过将所述接合线的第二部分引线接合到第二触点来形成第二接合，使得所述第一触点和所述第二触点被电连接。
2.根据权利要求1所述的方法，其中所述污染物移除步骤包括：将所述抛光器件的研磨面与所述接合线的至少所述第一部分的外表面接触。
3.根据权利要求1所述的方法，进一步包括：从所述接合线的所述第二部分移除污染物。
4.根据权利要求3所述的方法，其中所述污染物是通过将所述抛光器件的研磨面与所述接合线的所述第二部分的外表面接触而从所述接合线的所述第二部分移除的。
5.根据权利要求1所述的方法，其中所述污染物是通过将所述抛光器件的研磨面与所述接合线的外表面接触而基本上从所述接合线的整个表面移除的。
6.根据权利要求1所述的方法，其中所述接合线是无涂层的金属线。
7.根据权利要求6所述的方法，其中所述接合线是裸铜线。
8.根据权利要求7所述的方法，其中所移除的污染包括铜氧化物。
9.根据权利要求1所述的方法，其中所述第一接合是球形接合，并且所述第二接合是针脚式接合。
10.一种引线接合系统，包括：
接合送丝器，一卷接合线能够耦合到所述接合送丝器；
引线接合工具；以及
引线抛光器，所述引线抛光器被放置在所述接合送丝器和所述引线接合工具之间，所述引线抛光器被配置成从所述接合线移除污染物。
11.根据权利要求10所述的引线接合系统，其中所述引线抛光器是具有至少一个研磨面的微型抛光器。
12.根据权利要求11所述的引线接合系统，进一步包括靠近所述引线抛光器的真空器件，所述真空器件疏散了从所述引线接合系统移除的污染物的颗粒。
13.根据权利要求12所述的引线接合系统，其中所述引线接合工具包括毛细管和电子火焰熄灭器件。
14.根据权利要求10的所述的引线接合系统，进一步包括：空气引导件和引线拉紧器中的至少一个。
15.一种将第一器件电连接到第二器件的方法，包括：
通过引线接合系统传送绝缘引线，所述绝缘引线具有金属芯和覆盖所述金属芯的绝缘材料；
标识所述绝缘引线的第一部分以用于形成第一接合，并且标识所述绝缘引线的第二部分以用于形成第二接合；
使用剥线器从所述绝缘引线的所述第一部分和第二部分移除绝缘材料，以暴露所述金属芯的至少所述第一部分和第二部分；
通过将所述绝缘引线的所述第一部分的所暴露的金属芯引线接合到所述第一器件的第一焊盘来形成第一接合，使得所述绝缘引线和所述第一器件被电连接；以及
通过将所述绝缘引线的所述第二部分的所暴露的金属芯引线接合到所述第二器件的第二焊盘来形成第二接合，使得所述第一器件和所述第二器件被电连接。
16.根据权利要求15所述的方法，其中所述剥线器是微型剪刀和洗涤器中的一个。
17.根据权利要求15所述的方法，进一步包括：使用所述剥线器从所述绝缘引线的所述第一部分移除绝缘材料。
18.一种用于接合绝缘引线的引线接合系统，所述绝缘引线具有金属芯和覆盖所述金属芯的绝缘材料，所述系统包括：
剥线器，一卷绝缘引线能够耦合到所述剥线器，其中所述剥线器被配置成接收所述绝缘引线并且从所述绝缘引线选择性地移除所述绝缘材料的部分；以及
引线接合工具，所述引线接合工具接收已经从所述剥线器移除所述绝缘材料的所选择的部分的所述绝缘引线。
19.根据权利要求18的引线接合系统，其中所述剥线器是微型剪刀和洗涤器中的一个。
20.根据权利要求18所述的引线接合系统，其中所述引线接合工具包括毛细管和电子火焰熄灭器件。
CN201410090701.9A 2013-03-12 2014-03-12 引线接合装置和方法 Pending CN104051289A (zh)

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