CN105632952A - 导线键合装置的绕线盘系统 - Google Patents

导线键合装置的绕线盘系统 Download PDF

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CN105632952A
CN105632952A CN201510809762.0A CN201510809762A CN105632952A CN 105632952 A CN105632952 A CN 105632952A CN 201510809762 A CN201510809762 A CN 201510809762A CN 105632952 A CN105632952 A CN 105632952A
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lead
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conductive path
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CN105632952B (zh
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郑志华
吴汉淦
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ASMPT Singapore Pte Ltd
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Abstract

本发明公开了一种导线键合装置的绕线盘系统，包括：设置用于接收引线的引线盘；用于将所述引线的自由端送入所述导线键合装置的键合头的引线导引部；和用于将所述引线拉紧以在所述引线盘和所述引线导引部之间确定引线路径的拉紧机构。所述绕线盘系统包括具有包含图像传感器的照相机的成像模块。所述成像模块还包括图像处理单元。所述照相机被设置通过所述图像传感器将所述引线路径的至少一部分成像以产生图像数据。所述图像处理单元被配置为处理所述图像数据以确定所述引线路径的至少一部分的几何形状和/或几何形状的变化。

Description

导线键合装置的绕线盘系统
技术领域
本发明涉及半导体组装和封装领域，特别的涉及导线键合装置的绕线盘系统。
背景技术
键合机被使用在半导体组装和封装过程中，以在半导体晶元上的电触点和基板之间，或不同半导体晶元上的电触点之间形成电连接。引线从包含引线的绕线盘送入键合工具，如用于执行引线键合的毛细管。
一种用于将引线粘接或焊接到连接垫的典型方法是通过热、压和/或超声能的组合。它是一种固相焊接工艺，其中两种金属材料（引线和垫的表面）被密切接触。一旦所述表面密切接触，就发生电子共享或原子内部扩散，导致引线键合的形成。引线键合的两种主要类型是球型键合和楔型键合。
例如，楔型键合器使用由超声换能器产生的超声能连接引线。所述超声换能器产生超声震荡。所述震荡穿过所述楔型键合器焊头处的楔子，然后被传输到所述楔子下面的引线。
引线由所述绕线盘系统从所述引线盘输出。已知的绕线盘在图1中显示。所述绕线盘通常包括以下特征：固定所述引线卷盘的阀芯轴101、张紧器102，以预装从所述盘输出的引线、用于维持所述引线连续输出的引线缓冲区域103、用于将所述引线输出到焊头的引线路径104，和用于检测键合之后引线的移动，以确定键合是否粘住的引线损耗检测器105。
所述引线损耗检测器105能够通过检测所述引线的移动来确定所述键合的粘性。通常成功的键合之后，所述键合头将向上移动并且所述引线将从键合尖松出以进一步处理如形成弯曲或切割。松出的引线的数量可在所述绕线盘的出口处确定。如果所述数量比预设的阈值大，所述键合可被认为是已经粘住的键合。
有两种类型的引线损耗检测器：接触和非接触类型。接触类型的检测机构的一个例子在图2中显示。所述接触类型的检测机构包括：可操作地连接到一对压轮202的旋转编码器201。所述压轮将所述引线203在中间压紧以提供摩擦接触。当引线203被送入时，所述轮202将被旋转并因此所述旋转编码器201将能够记录表示已经被松出的所述引线长度的信号。
非接触引线损耗检测器的例子在图3中显示。所述非接触引线损耗检测器包括具有一排光敏元件301的传感器模块。所述传感器模块通常被设置在所述引线缓冲区域内（例如图1中的缓冲区域103）。当引线302被送入，缓冲区域的引线弯曲部将位移（在303的方向上）并触发所述光敏元件301。检测线上哪个传感器被触发了将允许确定所述引线位置并因此检测引线的移动。
上述的每一个装置具有特定的缺陷。对于接触类型的引线损耗检测器，检测敏感度非常低，因为其被所述编码器的分辨率所限制。并且，所述轮子的惯性将提供额外的摩擦到所述引线，并将在焊接过程中当所述引线弯曲部被送入时影响其连贯性。另外，由于引线和轮子的接触力，所述轮子将会磨损，从而引起检测不一致和引线的污染。
所述非接触类型引线损耗检测器解决了在接触类型检测器中发现的大部分问题，因为其消除了引线和轮子之间的接触界面。然而，其检测灵敏度依然有限，因为其被光敏元件阵列301的传感器间距304所限制。因此，其不能够检测出小的引线移动。
由于现有检测器的低灵敏度，有时，对于送入细微引线的键合不能有效的执行引线损耗检测。例如，在小直径键合应用中，切割之前的引线送入大约是所述键合工具尖的长度——一百微米量级——通常不能被检测到。
仍然需要一种能够克服或减轻前述困难或至少提供一种有用的替代的绕线盘系统。
发明内容
本发明特定实施例涉及用于导线键合装置的绕线盘系统，包括：
设置用于接收引线的引线盘；
用于将所述引线的自由端送入所述导线键合装置的键合头的导线孔；
用于将所述引线拉紧以在所述引线盘和所述引线导引部之间确定引线路径的拉紧机构；和
包括具有图像传感器的照相机的成像模块，和图像处理单元；
其中所述照相机被设置通过所述图像传感器将所述引线的至少一部分成像以产生图像数据，并且其中所述图像处理单元被配置为处理所述图像数据以确定所述引线的至少一部分的几何形状和/或几何形状的变化。
通过提供具有图像传感器的照相机，可能检测小的引线移动，例如在楔型键合过程中切割之前的引线送入。这允许引线损耗检测以比已知的接触或非接触引线损耗检测机构更高的精度执行。
所述绕线盘可包括在所述拉紧机构和所述引线导引部之间的缓冲区域，并且所述照相机可设置在所述缓冲区域内。
所述图像数据可表现在所述键合头移动之前捕获的第一图像，和在所述键合头移动之后捕获的第二图像；并且所述图像处理单元可被配置由所述第一和第二图像确定所述引线的至少一部分是否作为所述键合头移动的结果而移动。在特定的实施例中，所述图像处理单元被配置以确定作为所述键合头移动的结果而松出的引线的长度。通过比较在所述键合头移动之前和之后所述引线路径图样，送入的引线的数量可被精确地检测到。
所述图像处理单元可被配置为由所述图像数据确定所述引线的截面图形和/或直径。有利地，通过自动检测所述引线的直径和/或形状，可能检查当前选择的导线键合装置的焊接参数对实际使用的引线是否合适，或基于检测到的引线特征自动加载合适的焊接参数。
在特定实施例中，所述照相机具有能够检测引线的100μm或更少的移动的分辨率。
本发明的其他实施例涉及检测线键合粘性的方法，所述方法包括步骤：
将引线沿着引线路径送入导线键合装置的键合头；
设置一个照相机，这样所述引线路径的至少一部分处于所述照相机的视野内，所述照相机包括图像传感器；
利用所述键合头应用引线键合之后，捕获所述引线路径的至少一部分的第一图像；
移动所述键合头；
捕获所述引线路径的至少一部分的第二图像；和
使用图像识过程将所述第二图像与所述第一图像进行比较以确定所述引线路径的至少一部分是否作为所述键合头移动的结果而移动。
本发明的其他实施例涉及确定导线键合装置的键合参数的方法，所述方法包括：
设置一个照相机这样所述引线的至少一部分处于所述照相机的视野内，所述照相机包括图像传感器；
捕获所述引线路径的至少一部分的图像；
使用图像识别过程由所述图像确定所述引线的直径和/或截面形状；和
基于所述直径和/或所述截面形状确定引线类型，并选择适合所述引线类型的键合参数。
附图说明
本发明的实施例将仅以非限制性例子的方式参考以下附图被描述。
图1是已知的绕线盘系统的示意图。
图2和图3描绘了已知的引线损耗检测机构。
图4是根据本发明实施例的绕线盘系统的示意图。
图5描述了在成功的楔型键合过程中引线路径的图像捕获。
图6描述了在楔型键合失败过程中引线路径的图像捕获。
图7描述了由根据本发明实施例的绕线盘系统确定引线几何结构。
图8显示了根据本发明实施例的绕线盘系统的成像模块。
具体实施例
首先参考附图4，显示了具有沿着引线路径输出引线W的引线卷盘410的绕线盘系统400。所述引线W穿过张力辊412形式的拉紧机构，然后到达引线导引部416，引线导引部416将引线通过绕线盘系统400的壳体的孔418送入导线键合装置（未示出）的键合头。
在张力辊412和引线导引部416之间是缓冲区域，其中引线路径基本是弧形构造。照相系统401被沿着张力辊412和引线导引部416之间的引线路径设置在所述缓冲区域中，这样，所述线路的至少一部分403在视野402之内。在一个实施例中，照相系统401被设置在其视野近似以所述弧形的最低点为中心。这能使得更容易地检测到引线移动。
照相系统401是图8中显示的成像模块800的一部分。照相系统401包括成像光学器件430（一个或多个透镜、滤光器等等）设置在具有像素阵列的图像传感器432（例如CMOS图像传感器或CCD图像传感器）之前，其输出可被读出以产生表示视野402内的引线路径的一部分403的图像的图像数据。所述照相系统401还可包括数字信号处理电器（未视出）用于图像的后处理，像本领域已知的那样。在某些实施例中，所述照相机系统401可包括标准数字照相机，例如，像素分辨率为2650x1920像素。在更长的一侧对于20mm的视野，所述系统的可检测分辨率是每像素7.5μm。这个分辨率下，小的引线移动，例如楔型键合顺序中最后的键合之后实施的引线送入（大约100μm），是可以被检测到的。总体来说，所述引线路径将偏斜近似等于所述键合头移动的一半的数量，因此，例如，键合头移动100μm将导致引线路径偏移近似50μm。
成像模块800还包括图像处理单元810，应用一个或多个图像处理算法到由图像传感器432获得的图像数据上。例如，图像处理单元810可被配置执行图像识别过程以检测图像中的弧形，对应于所述引线路径403的弧形。所述图像识别过程将所述弧形参数化以确定引线路径403的几何参数，例如其曲率、长度、线厚度或视野中的位置。所述图像识别过程可包括任何合适的图像识别算法，例如标准的基于霍夫变换的弧形检测算法、形状校准算法或二元（白/黑）图像识别算法。图像处理单元810可以是专用硬件组件例如专用集成电路（ASIC）或现场可编程门阵列（FPGA）。可替换地，至少部分可作为被配置从图像传感器432接收数据的标准计算机系统的存储器中的软件模块来执行。例如，所述计算机系统可以是与用于控制整个导线键合装置和绕线盘系统400的操作的系统相同的系统。
在键合过程中，成像模块800可捕获一个或多个引线路径403的图像，并分析所述一个或多个图像以确定键合过程。
在一个实施例中，成像模块800可以确定键合是否已经粘住，基于检测到的引线移动。键合过程中的每次键合（例如球型键合或楔型键合）之后，所述键合头将移开键合位置，以便按顺序执行后续的步骤（例如成弯曲部或送入和切割）。如果键合成功，引线的末端将被键合在键合位置上，这样当所述键合头移动，所述引线将从所述键合头送出。相反的，如果键合没有正确形成，所述引线末端将与所述键合头一起从键合位置移开并且没有引线送出发生。
在这个实施例中，照相系统401通过检测从绕线盘支出的引线实现了键合粘接性的检测，。特别地，在所述键合头接触所述键合位置之后，成像模块800捕获所述引线路径的第一图像，是在所述键合头执行下次移动之前。然后，所述键合头移动以执行键合顺序中的下一步骤，并且成像模块800捕获第二图像。之后所述第二图像与所述第一图像比较以确定所述引线路径是否移动。
图5描述了正确形成键合的例子。在左边的面板上，键合头502的尖部邻近键合垫510并且紫外能量被沿着引线501传输以在键合垫510形成键合。视野402的第一图像，包括引线路径503，被成像模块800捕获。由于键合是好的，长度为512的引线被从键合头502送出，这样使得引线路径503在视野402内移动到新的位置503’。视野402的第二图像在键合头移动完成后被捕获（右边的面板）。在移动之前和之后捕获的引线路径的第一和第二图像将会不同。图像处理单元810能够通过计算第一和第二图像中的引线位置之间的差异确定引线移动的数量。如果所述差异超出了预设的阈值，所述图像处理单元810确定引线已经被送出并且键合已经正确的形成。所述阈值可以是一个绝对或相对的数量（例如引线长度的10%），并且可根据用户偏好选择。在程序化的键合移动中引线应该被送出的长度，可由所述控制软件估算，通过键合头在程序化的移动过程中本应该遵循的轨道所得出。例如，为了在两个焊点之间形成引线弯曲部，所述键合头必须沿着预定的弯曲轨道，并且所述控制软件可以基于所述预定的轨道估算引线长度。
另一方面，如果键合没有正确形成，如图6所示，所述引线末端601将与所述键合头602一起移动而没有任何引线送出发生，并且因此，视野402中的引线路径的位置603将会保持不变。在键合头移动之前和之后捕获的图像将近似相同，所述图像处理单元810将找不到差异。
在另一个实施例中，引线的参数，例如引线的几何参数，可通过分析成像模块800捕获的单个图像700而确定。图7显示了照相系统401拍摄的图像的例子。从图像700，所述图像处理单元810可确定引线路径703，并且由此而确定几何参数例如直径701，或截面形状（例如带状引线或圆形引线）。所述几何参数的相关信息使得所述键合装置确定哪种类型的引线被安装，并且自动加载适于该种类型引线的键合参数，和/或检查任何用户输入参数以确保它们对检测到的引线类型是合适的，从而避免人为错误。
尽管本发明特定实施例被详细描述，在本发明范围之内各种修改和变化是可能的，对本领域技术人员也是清楚的。

Claims (6)

1.一种用于导线键合装置的绕线盘系统，包括：
设置用于接收引线的引线盘；
用于将所述导线的自由端送入所述导线键合装置的键合头的引线导引部；
用于将所述引线拉紧以在所述引线盘和所述引线导引部之间确定引线路径的拉紧机构；
包括具有图像传感器的照相机和图像处理单元的成像模块；
其中所述照相机被设置以通过所述图像传感器在所述引线路径的至少一部分成像以产生图像数据，并且其中所述图像处理单元被配置为处理所述图像数据以确定所述引线路径的至少一部分的几何形状和/或几何形状的变化。
2.权利要求1所述的绕线盘系统，包括在所述拉紧机构和所述引线导引部之间的缓冲区域，其中所述照相机设置在所述缓冲区域内。
3.权利要求1所述的绕线盘系统，其中所述图像数据表示在所述键合头移动之前捕获的第一图像，和在所述键合头移动之后捕获的第二图像；并且其中所述图像处理单元被配置为由所述第一和第二图像确定所述引线路径的至少一部分是否作为所述键合头移动的结果而移动。
4.权利要求3所述的绕线盘系统，其中所述图像处理单元被配置用于确定作为所述键合头移动的结果而松出的引线的长度。
5.权利要求1所述的绕线盘系统，其中所述图像处理单元被配置为由所述图像数据确定所述引线的截面形状和/或直径。
6.权利要求1所述的绕线盘系统，其中所述照相机具有能够检测引线100μm或更少的移动的分辨率。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110127460A (zh) * 2019-05-01 2019-08-16 杭州康基医疗器械股份有限公司 超声换能器的绕线结构
CN110378403A (zh) * 2019-07-10 2019-10-25 江西理工大学 一种绕线盘分类识别方法及系统

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11333613B2 (en) * 2015-04-07 2022-05-17 The Boeing Company Apparatus and methods of inspecting a wire segment

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5773780A (en) * 1993-11-16 1998-06-30 Formfactor, Inc. Method of severing bond wires and forming balls at their ends
JP2005332850A (ja) * 2004-05-18 2005-12-02 Kaijo Corp ワイヤボンディング装置
JP2006032884A (ja) * 2004-06-16 2006-02-02 Nec Kansai Ltd ワイヤボンディング装置及びワイヤボンディング方法
JP2006116636A (ja) * 2004-10-20 2006-05-11 Noritake Super Abrasive:Kk 切断装置
US20070187470A1 (en) * 2005-12-28 2007-08-16 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program, and bonding method
KR20070084867A (ko) * 2006-02-22 2007-08-27 삼성전자주식회사 와이어 고정 수단을 갖는 와이어 본딩 장치 및 그를 이용한와이어 테일 형성 방법
CN101472700A (zh) * 2006-06-14 2009-07-01 欧瑞康封装设备有限公司，施泰因豪森 在引线键合机中用来输送焊丝的、具有多个位于圆弧上能够被施以压缩空气的通道的装置
CN102054718A (zh) * 2009-10-29 2011-05-11 先进科技新加坡有限公司 用于导线键合机的自动导线进给系统
CN104051289A (zh) * 2013-03-12 2014-09-17 飞思卡尔半导体公司 引线接合装置和方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4671446A (en) * 1982-12-02 1987-06-09 Stanley Electric Company, Ltd. Method and system for automatically bonding a leadwire on a semiconductor
KR20110090344A (ko) * 2010-02-03 2011-08-10 삼성전자주식회사 본딩 구조물의 제조 장치, 본딩 구조물 및 이를 형성하는 방법

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5773780A (en) * 1993-11-16 1998-06-30 Formfactor, Inc. Method of severing bond wires and forming balls at their ends
JP2005332850A (ja) * 2004-05-18 2005-12-02 Kaijo Corp ワイヤボンディング装置
JP2006032884A (ja) * 2004-06-16 2006-02-02 Nec Kansai Ltd ワイヤボンディング装置及びワイヤボンディング方法
JP2006116636A (ja) * 2004-10-20 2006-05-11 Noritake Super Abrasive:Kk 切断装置
US20070187470A1 (en) * 2005-12-28 2007-08-16 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program, and bonding method
KR20070084867A (ko) * 2006-02-22 2007-08-27 삼성전자주식회사 와이어 고정 수단을 갖는 와이어 본딩 장치 및 그를 이용한와이어 테일 형성 방법
CN101472700A (zh) * 2006-06-14 2009-07-01 欧瑞康封装设备有限公司，施泰因豪森 在引线键合机中用来输送焊丝的、具有多个位于圆弧上能够被施以压缩空气的通道的装置
CN102054718A (zh) * 2009-10-29 2011-05-11 先进科技新加坡有限公司 用于导线键合机的自动导线进给系统
CN104051289A (zh) * 2013-03-12 2014-09-17 飞思卡尔半导体公司 引线接合装置和方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110127460A (zh) * 2019-05-01 2019-08-16 杭州康基医疗器械股份有限公司 超声换能器的绕线结构
CN110127460B (zh) * 2019-05-01 2024-03-15 杭州康基医疗器械有限公司 超声换能器的绕线结构
CN110378403A (zh) * 2019-07-10 2019-10-25 江西理工大学 一种绕线盘分类识别方法及系统
CN110378403B (zh) * 2019-07-10 2024-04-26 江西理工大学 一种绕线盘分类识别方法及系统

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