CN104037280A - 一种全无机贴片led封装方法及封装结构 - Google Patents
一种全无机贴片led封装方法及封装结构 Download PDFInfo
- Publication number
- CN104037280A CN104037280A CN201410311600.XA CN201410311600A CN104037280A CN 104037280 A CN104037280 A CN 104037280A CN 201410311600 A CN201410311600 A CN 201410311600A CN 104037280 A CN104037280 A CN 104037280A
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- metal
- glass cover
- support
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 85
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 229910052751 metal Inorganic materials 0.000 claims abstract description 116
- 239000002184 metal Substances 0.000 claims abstract description 116
- 239000000919 ceramic Substances 0.000 claims abstract description 102
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 239000011521 glass Substances 0.000 claims abstract description 63
- 229910052709 silver Inorganic materials 0.000 claims abstract description 20
- 239000004332 silver Substances 0.000 claims abstract description 20
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 7
- 239000011147 inorganic material Substances 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims description 27
- 239000002002 slurry Substances 0.000 claims description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 17
- 230000005496 eutectics Effects 0.000 claims description 13
- 239000011268 mixed slurry Substances 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000002905 metal composite material Substances 0.000 claims description 8
- 238000012856 packing Methods 0.000 claims description 8
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 229910052593 corundum Inorganic materials 0.000 claims description 4
- 239000010431 corundum Substances 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 238000009835 boiling Methods 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 239000006059 cover glass Substances 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 229920000126 latex Polymers 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 230000002000 scavenging effect Effects 0.000 claims description 3
- 238000013022 venting Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 3
- 238000007791 dehumidification Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 20
- 238000005538 encapsulation Methods 0.000 description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000011368 organic material Substances 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 229910002027 silica gel Inorganic materials 0.000 description 7
- 239000000741 silica gel Substances 0.000 description 7
- 229910052582 BN Inorganic materials 0.000 description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 230000002411 adverse Effects 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 229910052727 yttrium Inorganic materials 0.000 description 4
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 4
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012188 paraffin wax Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010946 fine silver Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- 230000006750 UV protection Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410311600.XA CN104037280B (zh) | 2014-07-02 | 一种全无机贴片led封装方法及封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410311600.XA CN104037280B (zh) | 2014-07-02 | 一种全无机贴片led封装方法及封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104037280A true CN104037280A (zh) | 2014-09-10 |
CN104037280B CN104037280B (zh) | 2016-11-30 |
Family
ID=
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105280783A (zh) * | 2015-11-18 | 2016-01-27 | 佛山市南海区联合广东新光源产业创新中心 | 一种紫外led器件 |
CN105428472A (zh) * | 2015-11-18 | 2016-03-23 | 佛山市南海区联合广东新光源产业创新中心 | 一种紫外led器件的制造方法 |
EP3026717A1 (en) * | 2014-11-28 | 2016-06-01 | LG Innotek Co., Ltd. | Light emitting device package |
CN105845813A (zh) * | 2016-04-25 | 2016-08-10 | 陈海英 | 一种led发光器件及led光源 |
CN105845814A (zh) * | 2016-05-04 | 2016-08-10 | 华中科技大学 | 一种紫外led封装结构及其制作方法 |
CN105938790A (zh) * | 2015-03-05 | 2016-09-14 | 瑞萨电子株式会社 | 制造半导体器件的方法 |
CN106449942A (zh) * | 2016-11-28 | 2017-02-22 | 贵州万泰弘发科技股份有限公司 | Led倒装晶片陶瓷基板模组及其制备方法 |
CN106601889A (zh) * | 2016-05-17 | 2017-04-26 | 陈秋胜 | 一种窗口气密无硅胶的半导体发光芯片封装结构 |
CN107785470A (zh) * | 2016-08-24 | 2018-03-09 | 浙江德汇电子陶瓷有限公司 | Uv‑led附框陶瓷基板及其制造方法 |
CN107919426A (zh) * | 2016-08-24 | 2018-04-17 | 浙江德汇电子陶瓷有限公司 | Uv led无机封装用陶瓷基座及其制作方法 |
CN108662452A (zh) * | 2018-05-16 | 2018-10-16 | 木林森股份有限公司 | 一种led灯具 |
WO2018201837A1 (zh) * | 2017-05-04 | 2018-11-08 | 深圳市瑞丰光电子股份有限公司 | 一种半导体封装结构 |
CN109244224A (zh) * | 2017-07-11 | 2019-01-18 | Lg 伊诺特有限公司 | 发光器件封装 |
CN109742221A (zh) * | 2018-12-07 | 2019-05-10 | 湖北深紫科技有限公司 | 一种全无机led封装方法与封装结构 |
CN110828630A (zh) * | 2018-08-10 | 2020-02-21 | 合肥彩虹蓝光科技有限公司 | 一种发光二极管灯珠的封装方法 |
CN111584702A (zh) * | 2020-05-11 | 2020-08-25 | 北京大学东莞光电研究院 | Led光源的封装结构及封装方法 |
CN111769057A (zh) * | 2020-07-13 | 2020-10-13 | 杭州很美网络科技有限公司 | 一种用于电子元件贴片的装置及其使用方法 |
CN111916435A (zh) * | 2020-08-14 | 2020-11-10 | 盐城东山精密制造有限公司 | 一种倒装led封装器件及其制备方法和应用 |
CN112838077A (zh) * | 2021-01-08 | 2021-05-25 | 厦门市信达光电科技有限公司 | 一种led封装结构、制备工艺及显示模块 |
CN113130730A (zh) * | 2020-01-16 | 2021-07-16 | 深圳市聚飞光电股份有限公司 | 发光器件封装方法及发光器件 |
CN113299814A (zh) * | 2021-05-20 | 2021-08-24 | 中国科学院半导体研究所 | Led陶瓷封装基板及其制备方法 |
CN113646908A (zh) * | 2019-07-25 | 2021-11-12 | 株式会社大真空 | 发光装置的盖构件、盖构件的制造方法及发光装置 |
CN113675316A (zh) * | 2021-07-05 | 2021-11-19 | 深圳大道半导体有限公司 | Uv-led器件及其制造方法 |
JP7009950B2 (ja) | 2017-11-21 | 2022-01-26 | 日本電気硝子株式会社 | 光素子用窓部品 |
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9673357B2 (en) | 2014-11-28 | 2017-06-06 | Lg Innotek Co., Ltd. | Light emitting device package |
EP3026717A1 (en) * | 2014-11-28 | 2016-06-01 | LG Innotek Co., Ltd. | Light emitting device package |
CN105938790A (zh) * | 2015-03-05 | 2016-09-14 | 瑞萨电子株式会社 | 制造半导体器件的方法 |
CN105938790B (zh) * | 2015-03-05 | 2021-01-01 | 瑞萨电子株式会社 | 制造半导体器件的方法 |
CN105428472A (zh) * | 2015-11-18 | 2016-03-23 | 佛山市南海区联合广东新光源产业创新中心 | 一种紫外led器件的制造方法 |
CN105280783A (zh) * | 2015-11-18 | 2016-01-27 | 佛山市南海区联合广东新光源产业创新中心 | 一种紫外led器件 |
CN105845813A (zh) * | 2016-04-25 | 2016-08-10 | 陈海英 | 一种led发光器件及led光源 |
CN105845813B (zh) * | 2016-04-25 | 2018-10-26 | 陈海英 | 一种led发光器件及led光源 |
CN105845814B (zh) * | 2016-05-04 | 2019-03-05 | 华中科技大学 | 一种紫外led封装结构及其制作方法 |
CN105845814A (zh) * | 2016-05-04 | 2016-08-10 | 华中科技大学 | 一种紫外led封装结构及其制作方法 |
CN106601889A (zh) * | 2016-05-17 | 2017-04-26 | 陈秋胜 | 一种窗口气密无硅胶的半导体发光芯片封装结构 |
CN107785470B (zh) * | 2016-08-24 | 2020-06-05 | 浙江德汇电子陶瓷有限公司 | Uv-led附框陶瓷基板及其制造方法 |
CN107919426A (zh) * | 2016-08-24 | 2018-04-17 | 浙江德汇电子陶瓷有限公司 | Uv led无机封装用陶瓷基座及其制作方法 |
CN107785470A (zh) * | 2016-08-24 | 2018-03-09 | 浙江德汇电子陶瓷有限公司 | Uv‑led附框陶瓷基板及其制造方法 |
CN106449942A (zh) * | 2016-11-28 | 2017-02-22 | 贵州万泰弘发科技股份有限公司 | Led倒装晶片陶瓷基板模组及其制备方法 |
WO2018201837A1 (zh) * | 2017-05-04 | 2018-11-08 | 深圳市瑞丰光电子股份有限公司 | 一种半导体封装结构 |
US10998201B2 (en) | 2017-05-04 | 2021-05-04 | Shenzhen Refond Optoelectronics Co., Ltd. | Semiconductor encapsulation structure |
CN109244224A (zh) * | 2017-07-11 | 2019-01-18 | Lg 伊诺特有限公司 | 发光器件封装 |
CN109244224B (zh) * | 2017-07-11 | 2023-02-21 | 苏州立琻半导体有限公司 | 发光器件封装 |
JP7009950B2 (ja) | 2017-11-21 | 2022-01-26 | 日本電気硝子株式会社 | 光素子用窓部品 |
CN108662452A (zh) * | 2018-05-16 | 2018-10-16 | 木林森股份有限公司 | 一种led灯具 |
CN110828630A (zh) * | 2018-08-10 | 2020-02-21 | 合肥彩虹蓝光科技有限公司 | 一种发光二极管灯珠的封装方法 |
CN109742221A (zh) * | 2018-12-07 | 2019-05-10 | 湖北深紫科技有限公司 | 一种全无机led封装方法与封装结构 |
CN113646908A (zh) * | 2019-07-25 | 2021-11-12 | 株式会社大真空 | 发光装置的盖构件、盖构件的制造方法及发光装置 |
CN113130730A (zh) * | 2020-01-16 | 2021-07-16 | 深圳市聚飞光电股份有限公司 | 发光器件封装方法及发光器件 |
CN111584702A (zh) * | 2020-05-11 | 2020-08-25 | 北京大学东莞光电研究院 | Led光源的封装结构及封装方法 |
CN111769057B (zh) * | 2020-07-13 | 2021-12-24 | 惠州大亚湾鸿通工业有限公司 | 一种用于电子元件贴片的装置及其使用方法 |
CN111769057A (zh) * | 2020-07-13 | 2020-10-13 | 杭州很美网络科技有限公司 | 一种用于电子元件贴片的装置及其使用方法 |
CN111916435A (zh) * | 2020-08-14 | 2020-11-10 | 盐城东山精密制造有限公司 | 一种倒装led封装器件及其制备方法和应用 |
CN112838077A (zh) * | 2021-01-08 | 2021-05-25 | 厦门市信达光电科技有限公司 | 一种led封装结构、制备工艺及显示模块 |
CN113299814A (zh) * | 2021-05-20 | 2021-08-24 | 中国科学院半导体研究所 | Led陶瓷封装基板及其制备方法 |
CN113675316A (zh) * | 2021-07-05 | 2021-11-19 | 深圳大道半导体有限公司 | Uv-led器件及其制造方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN203910858U (zh) | 一种全无机贴片led封装结构 | |
US10002855B2 (en) | LED module with hermetic seal of wavelength conversion material | |
CN106784243B (zh) | 一种深紫外led封装器件及其制备方法 | |
CN104037316B (zh) | 一种led无机封装支架及其封装方法 | |
CN204375790U (zh) | 一种全无机白光贴片led封装结构 | |
CN103325923B (zh) | 一种led及其封装方法 | |
CN202094175U (zh) | 一种远荧光粉的led封装结构 | |
CN105161599B (zh) | 一种led灯丝灯灯丝基板材料的制备方法 | |
CN101696786A (zh) | 大功率led散热封装结构 | |
CN103500787A (zh) | 一种底部可直接焊接于散热器的陶瓷cob封装led光源 | |
CN108922869A (zh) | 一种带tec-氮化铝-金属三元结构的smd封装基座 | |
CN202405323U (zh) | 一种将led芯片直接封装在均温板的结构及其灯具 | |
CN104183686B (zh) | 发光二极管器件及其制作方法 | |
CN101414655A (zh) | 大功率发光二极管及封装方法 | |
CN107845722A (zh) | 一种led车灯导热封装结构、led车灯及制造方法 | |
CN106252338A (zh) | 一种高导热mcob的封装方法 | |
CN106764560B (zh) | 一种led灯的制造方法 | |
CN101794857B (zh) | 一种高效散热led封装及其制备方法 | |
CN104037306A (zh) | 一种全无机集成led封装方法和结构 | |
CN104037280A (zh) | 一种全无机贴片led封装方法及封装结构 | |
CN203910859U (zh) | 一种全无机集成led封装结构 | |
CN104037280B (zh) | 一种全无机贴片led封装方法及封装结构 | |
CN105202393A (zh) | 一种led球泡灯及其制备方法 | |
CN203932103U (zh) | 一种led无机封装支架 | |
CN103107264A (zh) | 集成led光源封装支架 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: All-inorganic SMD LED packaging method and structure Effective date of registration: 20190918 Granted publication date: 20161130 Pledgee: Xiamen finance Company limited by guarantee Pledgor: Xiamen Colorful Optoelectronics Technology Co.,Ltd. Registration number: Y2019990000252 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220221 Granted publication date: 20161130 Pledgee: Xiamen finance Company limited by guarantee Pledgor: XIAMEN DACOL PHOTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2019990000252 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |