CN104024448A - 电气、电子设备用的Pd合金 - Google Patents
电气、电子设备用的Pd合金 Download PDFInfo
- Publication number
- CN104024448A CN104024448A CN201280064660.5A CN201280064660A CN104024448A CN 104024448 A CN104024448 A CN 104024448A CN 201280064660 A CN201280064660 A CN 201280064660A CN 104024448 A CN104024448 A CN 104024448A
- Authority
- CN
- China
- Prior art keywords
- alloy
- quality
- hardness
- electric
- bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/06—Alloys containing less than 50% by weight of each constituent containing zinc
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Contacts (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011286293 | 2011-12-27 | ||
JP2011-286293 | 2011-12-27 | ||
PCT/JP2012/082712 WO2013099682A1 (fr) | 2011-12-27 | 2012-12-17 | ALLIAGE DE Pd POUR DES DISPOSITIFS ÉLECTRIQUES/ÉLECTRONIQUES |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104024448A true CN104024448A (zh) | 2014-09-03 |
Family
ID=48697174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280064660.5A Pending CN104024448A (zh) | 2011-12-27 | 2012-12-17 | 电气、电子设备用的Pd合金 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20140377129A1 (fr) |
JP (1) | JPWO2013099682A1 (fr) |
KR (1) | KR20140113920A (fr) |
CN (1) | CN104024448A (fr) |
TW (1) | TW201333225A (fr) |
WO (1) | WO2013099682A1 (fr) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI567207B (zh) * | 2015-03-31 | 2017-01-21 | 日本發條股份有限公司 | 合金材料、接觸探針及連接端子 |
CN108699629A (zh) * | 2016-01-29 | 2018-10-23 | 德林爵-内股份有限公司 | 钯基合金 |
CN110983147A (zh) * | 2019-12-20 | 2020-04-10 | 有研亿金新材料有限公司 | 一种高强度钯基弱电接触材料及其制备方法 |
CN111511939A (zh) * | 2017-12-27 | 2020-08-07 | 株式会社德力本店 | 析出硬化型Ag-Pd-Cu-In-B系合金 |
CN112063879A (zh) * | 2020-08-28 | 2020-12-11 | 昆明贵研新材料科技有限公司 | 一种高导电高弹性钯基合金、热处理工艺及用途 |
CN112739836A (zh) * | 2018-11-06 | 2021-04-30 | 株式会社德力本店 | 电气电子设备用的Pd合金、Pd合金材料、探针和制造方法 |
CN114107721A (zh) * | 2020-09-01 | 2022-03-01 | 贺利氏德国有限两合公司 | 钯-铜-银-钌合金 |
CN117026055A (zh) * | 2023-10-09 | 2023-11-10 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试探针用钯合金及其制备方法 |
CN117604361A (zh) * | 2023-11-23 | 2024-02-27 | 浙江金连接科技股份有限公司 | 一种芯片测试探针套筒用钯合金棒及其制造方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG10201610940SA (en) * | 2012-08-03 | 2017-02-27 | Yamamoto Precious Metal Co Ltd | Alloy material, contact probe, and connection terminal |
JP6647075B2 (ja) * | 2016-02-19 | 2020-02-14 | 日本発條株式会社 | 合金材料、コンタクトプローブおよび接続端子 |
CH714594A1 (fr) * | 2018-01-26 | 2019-07-31 | Richemont Int Sa | Axe de pivotement d'un organe réglant de mouvement mécanique horloger. |
JP7260910B2 (ja) * | 2019-11-22 | 2023-04-19 | 石福金属興業株式会社 | プローブピン用材料およびプローブピン |
US11990252B2 (en) * | 2020-04-17 | 2024-05-21 | National Technology & Engineering Solutions Of Sandia, Llc | Hermetic electrical feedthrough comprising a Pt—Ni-based pin alloy |
EP4234733A1 (fr) | 2022-02-28 | 2023-08-30 | Heraeus Deutschland GmbH & Co. KG | Alliage palladium cuivre argent |
JP2023145888A (ja) * | 2022-03-29 | 2023-10-12 | 石福金属興業株式会社 | プローブピン用合金材料 |
JP2023145917A (ja) * | 2022-03-29 | 2023-10-12 | 株式会社ヨコオ | プローブ |
TWI797023B (zh) * | 2022-06-14 | 2023-03-21 | 大亞電線電纜股份有限公司 | 鈀銀銅合金線材及其製法 |
EP4325227A1 (fr) | 2022-08-16 | 2024-02-21 | Heraeus Precious Metals GmbH & Co. KG | Matière composite en forme de ruban pour aiguilles de contrôle |
KR20240077633A (ko) * | 2022-11-24 | 2024-06-03 | 신영금속 (주) | 전기저항 및 내마모성이 개선된 Ag-Pd-Cu계 합금재 및 이를 이용하여 제조된 전기전자 부품 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260737B2 (fr) * | 1982-12-09 | 1990-12-18 | Tanaka Precious Metal Ind | |
JPH0260739B2 (fr) * | 1982-12-09 | 1990-12-18 | Tanaka Precious Metal Ind | |
JPH07258809A (ja) * | 1994-03-23 | 1995-10-09 | Tanaka Kikinzoku Kogyo Kk | 摺動接点材料の製造方法 |
US5833774A (en) * | 1997-04-10 | 1998-11-10 | The J. M. Ney Company | High strength silver palladium alloy |
JP2011122194A (ja) * | 2009-12-09 | 2011-06-23 | Tokuriki Honten Co Ltd | 電機・電子機器用Pd合金 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60127093A (ja) * | 1983-12-12 | 1985-07-06 | Tanaka Kikinzoku Kogyo Kk | ろう材 |
US20130292008A1 (en) * | 2010-12-09 | 2013-11-07 | Tokuriki Honten Co., Ltd. | Material for Electrical/Electronic Use |
-
2012
- 2012-12-17 CN CN201280064660.5A patent/CN104024448A/zh active Pending
- 2012-12-17 US US14/369,544 patent/US20140377129A1/en not_active Abandoned
- 2012-12-17 WO PCT/JP2012/082712 patent/WO2013099682A1/fr active Application Filing
- 2012-12-17 JP JP2013551622A patent/JPWO2013099682A1/ja active Pending
- 2012-12-17 KR KR1020147017265A patent/KR20140113920A/ko not_active Application Discontinuation
- 2012-12-24 TW TW101149466A patent/TW201333225A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260737B2 (fr) * | 1982-12-09 | 1990-12-18 | Tanaka Precious Metal Ind | |
JPH0260739B2 (fr) * | 1982-12-09 | 1990-12-18 | Tanaka Precious Metal Ind | |
JPH07258809A (ja) * | 1994-03-23 | 1995-10-09 | Tanaka Kikinzoku Kogyo Kk | 摺動接点材料の製造方法 |
US5833774A (en) * | 1997-04-10 | 1998-11-10 | The J. M. Ney Company | High strength silver palladium alloy |
JP2011122194A (ja) * | 2009-12-09 | 2011-06-23 | Tokuriki Honten Co Ltd | 電機・電子機器用Pd合金 |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI567207B (zh) * | 2015-03-31 | 2017-01-21 | 日本發條股份有限公司 | 合金材料、接觸探針及連接端子 |
CN108699629A (zh) * | 2016-01-29 | 2018-10-23 | 德林爵-内股份有限公司 | 钯基合金 |
CN108699629B (zh) * | 2016-01-29 | 2021-06-01 | 德林爵-内股份有限公司 | 钯基合金 |
US11041228B2 (en) | 2016-01-29 | 2021-06-22 | Deringer-Ney, Inc. | Palladium-based alloys |
CN113249608A (zh) * | 2016-01-29 | 2021-08-13 | 德林爵-内股份有限公司 | 钯基合金 |
TWI743947B (zh) * | 2016-01-29 | 2021-10-21 | 美商德林傑奈股份有限公司 | 以鈀為主的合金 |
CN111511939A (zh) * | 2017-12-27 | 2020-08-07 | 株式会社德力本店 | 析出硬化型Ag-Pd-Cu-In-B系合金 |
CN111511939B (zh) * | 2017-12-27 | 2021-09-14 | 株式会社德力本店 | 析出硬化型Ag-Pd-Cu-In-B系合金 |
US11920227B2 (en) | 2018-11-06 | 2024-03-05 | Tokuriki Honten Co., Ltd. | PD alloy, PD alloy material and probe pin for electric and electronic devices, and methods for manufacturing the same |
CN112739836A (zh) * | 2018-11-06 | 2021-04-30 | 株式会社德力本店 | 电气电子设备用的Pd合金、Pd合金材料、探针和制造方法 |
CN110983147A (zh) * | 2019-12-20 | 2020-04-10 | 有研亿金新材料有限公司 | 一种高强度钯基弱电接触材料及其制备方法 |
CN110983147B (zh) * | 2019-12-20 | 2021-05-11 | 有研亿金新材料有限公司 | 一种高强度钯基弱电接触材料及其制备方法 |
CN112063879A (zh) * | 2020-08-28 | 2020-12-11 | 昆明贵研新材料科技有限公司 | 一种高导电高弹性钯基合金、热处理工艺及用途 |
CN112063879B (zh) * | 2020-08-28 | 2022-02-18 | 昆明贵研新材料科技有限公司 | 一种高导电高弹性钯基合金、热处理工艺及用途 |
CN114107721A (zh) * | 2020-09-01 | 2022-03-01 | 贺利氏德国有限两合公司 | 钯-铜-银-钌合金 |
CN117026055A (zh) * | 2023-10-09 | 2023-11-10 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试探针用钯合金及其制备方法 |
CN117026055B (zh) * | 2023-10-09 | 2024-01-12 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试探针用钯合金及其制备方法 |
CN117604361A (zh) * | 2023-11-23 | 2024-02-27 | 浙江金连接科技股份有限公司 | 一种芯片测试探针套筒用钯合金棒及其制造方法 |
CN117604361B (zh) * | 2023-11-23 | 2024-06-07 | 浙江金连接科技股份有限公司 | 一种芯片测试探针套筒用钯合金棒及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2013099682A1 (fr) | 2013-07-04 |
JPWO2013099682A1 (ja) | 2015-05-07 |
TW201333225A (zh) | 2013-08-16 |
KR20140113920A (ko) | 2014-09-25 |
US20140377129A1 (en) | 2014-12-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140903 |
|
WD01 | Invention patent application deemed withdrawn after publication |