CN103972373B - A kind of LED metal lead wire frames and its manufacture method - Google Patents
A kind of LED metal lead wire frames and its manufacture method Download PDFInfo
- Publication number
- CN103972373B CN103972373B CN201310044640.8A CN201310044640A CN103972373B CN 103972373 B CN103972373 B CN 103972373B CN 201310044640 A CN201310044640 A CN 201310044640A CN 103972373 B CN103972373 B CN 103972373B
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- Prior art keywords
- lead wire
- metal lead
- wire frame
- silver layer
- manufacture method
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The present invention relates to a kind of LED metal lead wire frames and its manufacture method.The manufacture method of the metallized metal lead frame includes step S10：Metal tape is corroded, metal lead wire frame is formed；Step S20：Roughening treatment is carried out to metal lead wire frame.Wherein described step S10 includes step：Yangjing metal tape, covers one corrosion protection mould of a lumarith or covering in metal tape front and rear surfaces, then the metal tape beyond the lumarith or corrosion protection mould is etched, metal lead wire frame is formed.The step S20 includes step：The lumarith or corrosion protection mould are not removed, and roughening treatment is carried out to the side of the metal lead wire frame.The manufacture method of the present invention realizes the effect of side roughening and front-back holding flat smooth, can greatly improve the air-tightness of the LED component based on the support, and then improves the reliability of LED component, extends the service life of device.
Description
Technical field
The present invention relates to a kind of LED metal lead wire frames and its manufacture method, more particularly to a kind of it is roughened with side
LED metal lead wire frames and its manufacture method.
Background technology
Existing LED EMC（Epoxy Molding Compound）Support, by metal lead wire frame and thermosetting material
Material is constituted, and because metal lead wire frame surface is smooth, when thermosets and metal lead wire frame are combined, both contact position
The air-tightness put is not high, in follow-up deflashing, crosses in the techniques such as reflow ovens, lead frame is easier out with thermosets
Existing lamination, the reliability for being so easily caused the LED component for applying EMC supports is not high, so as to influence the use of LED component
Life-span.
The low problem of air-tightness is solved, typically by being roughened to metal lead wire frame surface, to increase thermosets
With the conjugation of metal lead wire frame, and then improve LED component air-tightness.Therefore, prior art passes through to LED metal lead wires
Framework does surface coarsening processing, to increase the conjugation of thermosets and metal lead wire frame.But, at present to LED metals
Lead frame, which does surface coarsening processing method, can be such that the front and rear surfaces of metal lead wire frame and side is roughened simultaneously, higher side
Roughening can improve the air-tightness of lead frame, but the front and rear surfaces roughening produced simultaneously can influence the light extraction efficiency of LED component.And
And after being roughened due to metal lead wire frame, front and rear surfaces out-of-flatness has space, easily follow-up by thermosets and metal
In the plastic package process that lead frame is combined, cause thermosets to be overflowed from the space of metal front and rear surfaces, that is, cause serious
The generation of flash phenomena, covers the positions such as chip installation portion, substantially reduces the reliability of EMC supports making.
In order to solve the above problems, the present invention propose it is a kind of avoid front and rear surfaces be roughened and only side roughening LED gold
Belong to the manufacture method of lead frame, after making technique of the metal lead wire frame by the present invention, the side only in metal lead wire frame
With roughening effect.
The content of the invention
It is an object of the invention to overcome shortcoming and deficiency of the prior art there is provided one kind to avoid front and rear surfaces from being roughened
And only side roughening LED metal lead wire frames manufacture method.
The present invention is realized using following technical scheme：A kind of manufacture method of LED metal lead wire frames, including such as
Lower step：
Step S10：Metal tape is corroded, metal lead wire frame is formed；
Step S20：Roughening treatment is carried out to metal lead wire frame；
Wherein described step S10 includes step：Yangjing metal tape, a lumarith or covering are covered in metal tape front and rear surfaces
One corrosion protection mould, is then etched to the metal tape beyond the lumarith or corrosion protection mould, forms metal lead wire frame；Institute
Stating step S20 includes step：The lumarith or corrosion protection mould are not removed, and the side of the metal lead wire frame is roughened
Processing.
By above-mentioned steps, the front-back of metal lead wire frame covers thick to avoid by lumarith or corrosion protection mould
Change, it is achieved thereby that side is roughened and the effect of front-back holding flat smooth.
Further, in addition to step S30：Electrosilvering processing is carried out to the metal lead wire frame.The step is convenient follow-up
Kind Wiring technology, while being conducive to the light extraction of device.
Further, step S30 is specially to electroplate one first silver layer to the metal lead wire frame first, then again this
The silver layer of electroplating surface one second of one silver layer, the thickness of second silver layer is more than first silver layer.One layer of first silver layer formation
Cushion, plays barrier function, can effectively prevent the metallic atom of metal framework to be diffused into the second silver layer surface because heated.
In addition, the present invention also provides a kind of LED metal lead wire frames manufactured according to above-mentioned manufacture method, its side is formed
Micro- roughening structure of peak valley shape, micro- roughening structure of the peak valley shape is maximum distance values between two peaks in 5-20 μ ms
Interior, the average headway value between two peaks is in 1-5 μ ms.
Relative to prior art, the metal lead wire frame that the manufacture methods of LED metal lead wire frames of the invention is obtained
Side has roughening effect, and its front and rear surfaces keeps flat smooth.
In order to be able to the apparent understanding present invention, the embodiment of the present invention is illustrated below with reference to brief description of the drawings.
Brief description of the drawings
Fig. 1 is the manufacture Structure and Process schematic diagram of metal lead wire frame of the present invention
Fig. 2 is the side roughening treatment manufacture Structure and Process schematic diagram of metal lead wire frame.
Fig. 3 is the enlarged drawing of the a-quadrant after the side roughening of metal lead wire frame shown in Fig. 2.
Embodiment
Embodiment 1
The manufacture method of the LED metal lead wire frames of the present invention comprises the following steps：
Step S10：Metal tape is corroded, metal lead wire frame 11 is formed.In the present embodiment, the metal tape is copper
Band.Referring to Fig. 1, it is the manufacture structural representation of metal lead wire frame of the present invention.Step S10 specifically includes following step
Suddenly：
Step S11：Yangjing copper strips 1, early stage processing is carried out to copper strips.Specifically include the processing of the early stages such as degreasing, cleaning.
Step S12：One layer of lumarith 2 is covered each by the front and rear surfaces of copper strips.The lumarith 2 is covered on the copper strips
The region that need not be corroded, the pattern of the lumarith 2 is consistent with the pattern of pre-designed metal lead wire frame drawing.
Step S13：Copper strips 1 of the etching with lumarith 2, forms metal lead wire frame.Specifically, copper strips 1 is put into corruption
It is etched in erosion liquid, in the region of the covering of lumarith 2 because the protective effect of lumarith 2 is without the corrosion that is corroded, so that
The copper strips 1 is set to obtain the metal lead wire frame 11 being made up of multiple carrier units after corroding in corrosive liquid.In the present embodiment
In, corrosive liquid uses ferric chloride solution.
Step S20：To carrying out roughening treatment by the side of the step S10 metal lead wire frames 11 obtained.Referring to Fig. 2,
It is the side roughening treatment manufacture Structure and Process schematic diagram of metal lead wire frame of the present invention.Step S20 specifically includes as follows
Step：
Step S21：The side of metal lead wire frame 11 of the etching with lumarith 2.Specifically, by with lumarith 2
Metal lead wire frame 11 is put into micro-etching agent, because the front and rear surfaces of metal lead wire frame 11 have the protection of lumarith 2, microetch
Agent can only corrode to the side of the metal lead wire frame 11 beyond lumarith 2.In the present embodiment, the micro-etching agent is sulphur
The mixed solution of the components such as acid, hydrogen peroxide.The etching time in micro-etching agent of metal lead wire frame 11 is about 30s, in metal
The side of lead frame 11 forms micro- roughening effect of peak valley shape, as shown in figure 3, it is the side roughening of metal lead wire frame 11
The enlarged drawing of a-quadrant afterwards.Micro- roughening effect of the peak valley shape is specifically：Two peaks（Or two paddy）Between maximum distance values in 5-
In 20 μ ms, two peaks（Or two paddy）Between average headway value in 1-5 μ ms.
Step S22：Remove lumarith 2.In the present embodiment, the lumarith is removed by alkaline solution.
Step S23：Metal lead wire frame 11 is cleaned, air-dried, so that the side for completing metal lead wire frame 11 is thick
Change is handled.
Step S30：Electrosilvering processing is carried out to metal lead wire frame 11.It specifically includes following steps：
Step S31：Metal lead wire frame 11 is put into alkaline solution and cleaned, to remove the oil reservoir on its surface.In this reality
Apply in example, the step is repeated twice, to remove the impurity on the surface of metal lead wire frame 11.
Step S32：Metal lead wire frame 11 is put into acid solution and cleaned, to remove the oxide layer on its surface.At this
In embodiment, metal lead wire frame 11 is put into weakly acidic solution and cleaned.
Step S33：Metal lead wire frame 11 is put into progress immersion activation process in activator solution, so that it is follow-up
Electroplating technology in, make electrodeposited coating and the metal lead wire frame 11 be easier to combine.
Step S34：A thin copper layer is electroplated in the front and rear surfaces of metal lead wire frame 11.The thin copper layer is a transition zone, its
The metal lead wire frame 11 is set to be easier to be combined with follow-up electrodeposited coating.
Step S35：In the silver layer of thin copper layer electroplating surface first.The thickness of first silver layer is between 1 ~ 1.5 μm.Specifically
Ground, in the present embodiment, the density that electroplating current is controlled in electroplating process are 0.2-0.5A/dm2, the temperature of plating solution for 40 ~
80 DEG C, the preferably density of electroplating current is 0.3A/dm2, plating solution temperature be 50 DEG C, so as to obtain a layer thickness for 1 ~ 1.5 μm
Silver layer.The purpose for plating first silver layer is in order to form one layer of cushion, play barrier function, effectively to prevent copper because heated
And it is diffused into silver layer surface.In this step, electroplating current can not be excessive, and otherwise the thickness of the first silver layer can be blocked up, it is impossible to reaches
To the effect above.
Step S36：In the silver layer of electroplating surface second of the first silver layer.The thickness of second silver layer is more than the thickness of the first silver layer
Degree, its thickness is between 1.5 ~ 2 μm.Specifically, in the present embodiment, the density that electroplating current is controlled in electroplating process is
0.5-2A/dm2, the temperature of plating solution is 40-80 DEG C, and preferably the density of electroplating current is 0.7A/dm2, plating solution temperature be 50 DEG C,
So as to obtain the silver layer that a layer thickness is 1.5 ~ 2 μm.Second silver layer can improve the reflectivity of silver coating, make device light extraction efficiency
It is higher.
Relative to prior art, the manufacture method of LED metal lead wire frames of the invention is in the side to metal lead wire frame
When side is roughened, the front and rear surfaces of metal lead wire frame are covered by lumarith to avoid being roughened, it is achieved thereby that side
It is roughened and the effect of front and rear surfaces holding flat smooth.Further, follow-up kind Wiring technology for convenience, while being conducive to device
Light extraction, need to metal lead wire frame carry out electroplating processes.The present invention is using first one first silver layer of plating, then plate one second silver layer
Mode.First silver layer plays buffer stop layer effect, effectively prevents copper to be diffused into the second silver layer surface because heated.And this
Two silver layers then improve the reflectivity of silver coating, make device light extraction efficiency higher.
The metal lead wire frame obtained by the manufacture method of the LED metal lead wire frames of the present invention includes the side being roughened
Side and smooth front and rear surfaces.Wherein, there is peak valley shape structure after the roughening of the side, micro- roughening effect of the peak valley shape is specific
It is：Two peaks（Or two paddy）Between maximum distance values in 5-20 μ ms, two peaks（Or two paddy）Between average headway value exist
In 1-5 μ ms.The front and rear surfaces of the metal lead wire frame cover the second silver medal covered with the first silver layer, first silver layer surface
Layer.The thickness of first silver layer is less than the thickness of second silver layer.In the present embodiment, the thickness of first silver layer is 1 ~ 1.5 μ
M, the thickness of second silver layer is 1.5 ~ 2 μm.Further, between the front and rear surfaces and the first silver layer of the metal lead wire frame also
One thin copper layer can be set as transition zone.
Relative to prior art, there is the metal lead wire frame that manufacture method of the invention is obtained side to be roughened and front and rear table
Face keeps the effect of flat smooth.Its first silver layer plays buffer stop layer effect, effectively prevents copper to be diffused into the because heated
Two silver layer surfaces.And second silver layer then improves the reflectivity of silver coating, make device light extraction efficiency higher.Gold produced by the present invention
Belong to lead frame and be applied to LED EMC（Epoxy Molding Compound）Support, has roughening effect by lead frame
Side and thermosets can combine closely, and this EMC stent applications can be such that the air-tightness of device carries significantly in LED component
Height, and then the reliability of LED component is improved, extend the service life of device.
Embodiment 2
The method of the embodiment of the present invention 2 is roughly the same with embodiment 1, and it is differed only in：Gold is compressed using corrosion protection mould
The lumarith that the front and rear surfaces of category lead frame are come in alternate embodiment 1.Specifically, comprise the following steps：
Step S10：Metal tape is corroded, metal lead wire frame is formed.In the present embodiment, the metal tape is copper
Band.Step S10 specifically includes following steps：
Step S11：Yangjing copper strips, early stage processing is carried out to copper strips.Specifically include the processing of the early stages such as degreasing, cleaning.
Step S12：Copper strips is put into mould, mold compresses are covered in the area that need not be corroded on the copper strips
Domain, exposes the position that copper strips needs to etch.The pattern of the pattern of the mould and pre-designed metal lead wire frame drawing
Unanimously.
Step S13：Copper strips of the etching with mould, forms metal lead wire frame.Specifically, copper strips is put into corrosive liquid
It is etched, in the region of mould covering because the protective effect of mould is without the corrosion that is corroded, so that the copper strips is in corruption
The metal lead wire frame being made up of multiple carrier units is obtained after corroding in erosion liquid.In the present embodiment, corrosive liquid is used
It is ferric chloride solution.
Step S20：To carrying out roughening treatment by the side of the step S10 metal lead wire frames obtained.Step S20 is specific
Comprise the following steps：
Step S21：The side of metal lead wire frame of the etching with mould.
Step S22：Remove mould.
Step S23：Metal lead wire frame is cleaned, air-dried, so as to complete at the side roughening of metal lead wire frame
Reason.
The step of the present embodiment step S30 is with embodiment 1 is consistent, will not be repeated here.
Further, the metallic lead frame structure phase of the structure and embodiment 1 of the metal lead wire frame that the present embodiment is obtained
Together, it will not be repeated here.
The invention is not limited in above-mentioned embodiment, if the various changes or deformation to the present invention do not depart from the present invention
Spirit and scope, if these are changed and deformation belongs within the scope of the claim and equivalent technologies of the present invention, then this hair
It is bright to be also intended to comprising these changes and deform.
Claims (7)
1. a kind of manufacture method of LED metal lead wire frames, comprises the following steps：
Step S10：Metal tape is corroded, metal lead wire frame is formed；
Step S20：Roughening treatment is carried out to metal lead wire frame；
It is characterized in that：The step S10 includes step：Yangjing metal tape, metal tape front and rear surfaces cover a lumarith or
A corrosion protection mould is covered, then the metal tape beyond the lumarith or corrosion protection mould is etched, die-attach area is formed
Frame；The step S20 includes step：The lumarith or corrosion protection mould are not removed, and the side of the metal lead wire frame is entered
Row roughening treatment, then removes the lumarith or corrosion protection mould；Also include step S30：First to metal lead wire frame electricity
Plate one first silver layer, then again in the silver layer of electroplating surface one second of first silver layer, the thickness of second silver layer be more than this
One silver layer；
The density that the electroplating current of the first silver layer is electroplated in step S30 is 0.2-0.5A/dm2, the temperature of plating solution is 40-80 DEG C；
Or/and electroplated in step S30 the second silver layer electroplating current density be 0.5-2A/dm2, the temperature of plating solution is 40-80 DEG C.
2. the manufacture method of LED metal lead wire frames according to claim 1, it is characterised in that：The thickness of first silver layer
Spend between 1~1.5 μm.
3. the manufacture method of LED metal lead wire frames according to claim 1, it is characterised in that：The thickness of second silver layer
Spend between 1.5~2 μm.
4. the manufacture method of LED metal lead wire frames according to claim 1, it is characterised in that：In step S10,
Corrosive liquid is used to etch the metal tape to form metal lead wire frame；In step S20, the lumarith or corrosion protection will be carried
The metal lead wire frame of mould, which is put into micro-etching agent, carries out roughening treatment.
5. the manufacture method of LED metal lead wire frames according to claim 4, it is characterised in that：The material of the metal tape
For copper, the corrosive liquid of etching metal tape is ferric chloride solution in step S10.
6. the manufacture method of LED metal lead wire frames according to claim 4, it is characterised in that：It is micro- in step S20
Losing agent includes sulfuric acid and hydrogen peroxide component.
7. according to the LED metal lead wire frames that any described manufacture method is manufactured in claim 1-6, it is characterised in that：Institute
State micro- roughening structure that metal lead wire frame side forms peak valley shape, micro- roughening structure of the peak valley shape be between two peaks most
Big distance values are in 5-20 μ ms, and the average headway value between two peaks is in 1-5 μ ms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310044640.8A CN103972373B (en) | 2013-02-04 | 2013-02-04 | A kind of LED metal lead wire frames and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310044640.8A CN103972373B (en) | 2013-02-04 | 2013-02-04 | A kind of LED metal lead wire frames and its manufacture method |
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| Publication Number | Publication Date |
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| CN103972373A CN103972373A (en) | 2014-08-06 |
| CN103972373B true CN103972373B (en) | 2017-08-18 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6270052B2 (en) * | 2014-12-05 | 2018-01-31 | Ｓｈマテリアル株式会社 | Lead frame and manufacturing method thereof |
| CN108730928B (en) * | 2018-07-16 | 2024-03-26 | 安徽芯瑞达科技股份有限公司 | LED bracket and manufacturing method thereof |
| CN109817785A (en) * | 2018-12-25 | 2019-05-28 | 广东晶科电子股份有限公司 | A kind of light emitting diode and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101064993A (en) * | 2006-04-27 | 2007-10-31 | 三洋电机株式会社 | Circuit apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008187045A (en) * | 2007-01-30 | 2008-08-14 | Matsushita Electric Ind Co Ltd | Lead frame for semiconductor device, manufacturing method therefor, and the semiconductor device |
| CN201265836Y (en) * | 2008-08-08 | 2009-07-01 | 湖北匡通电子有限公司 | LED lead frame with novel coating |
| JP5010693B2 (en) * | 2010-01-29 | 2012-08-29 | 株式会社東芝 | LED package |
| JP5602578B2 (en) * | 2010-10-19 | 2014-10-08 | 株式会社神戸製鋼所 | LED lead frame |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101064993A (en) * | 2006-04-27 | 2007-10-31 | 三洋电机株式会社 | Circuit apparatus |
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