CN103946767B - 诸如调制解调器等包括多个风冷处理器的电子装置 - Google Patents

诸如调制解调器等包括多个风冷处理器的电子装置 Download PDF

Info

Publication number
CN103946767B
CN103946767B CN201280056483.6A CN201280056483A CN103946767B CN 103946767 B CN103946767 B CN 103946767B CN 201280056483 A CN201280056483 A CN 201280056483A CN 103946767 B CN103946767 B CN 103946767B
Authority
CN
China
Prior art keywords
fan
air
shell
integrated circuits
airflow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280056483.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN103946767A (zh
Inventor
S·科恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagemcom Broadband SAS
Original Assignee
Sagemcom Broadband SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagemcom Broadband SAS filed Critical Sagemcom Broadband SAS
Publication of CN103946767A publication Critical patent/CN103946767A/zh
Application granted granted Critical
Publication of CN103946767B publication Critical patent/CN103946767B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201280056483.6A 2011-11-18 2012-10-30 诸如调制解调器等包括多个风冷处理器的电子装置 Expired - Fee Related CN103946767B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1160549A FR2983013B1 (fr) 2011-11-18 2011-11-18 Appareil electronique de type modem ou analogue comportant plusieurs processeurs refroidis par air
FR1160549 2011-11-18
PCT/EP2012/071451 WO2013072180A1 (fr) 2011-11-18 2012-10-30 Appareil electronique de type modem ou analogue comportant plusieurs processeurs refroidis par air

Publications (2)

Publication Number Publication Date
CN103946767A CN103946767A (zh) 2014-07-23
CN103946767B true CN103946767B (zh) 2018-12-14

Family

ID=47080532

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280056483.6A Expired - Fee Related CN103946767B (zh) 2011-11-18 2012-10-30 诸如调制解调器等包括多个风冷处理器的电子装置

Country Status (6)

Country Link
US (1) US9648779B2 (https=)
EP (1) EP2780774B1 (https=)
CN (1) CN103946767B (https=)
BR (1) BR112014007544B1 (https=)
FR (1) FR2983013B1 (https=)
WO (1) WO2013072180A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9075581B2 (en) * 2011-04-19 2015-07-07 Germane Systems, Llc Apparatus and method for cooling electrical components of a computer
JP6559771B2 (ja) * 2014-09-16 2019-08-14 エスゼット ディージェイアイ テクノロジー カンパニー リミテッドＳｚ Ｄｊｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ 放熱装置及びこの放熱装置を用いるｕａｖ
JP6048607B1 (ja) * 2016-04-15 2016-12-21 富士電機株式会社 鉄道車両用電力変換装置
CN206674410U (zh) * 2017-03-21 2017-11-24 深圳市大疆创新科技有限公司 遥控器
JP6891600B2 (ja) * 2017-03-31 2021-06-18 富士通株式会社 情報処理装置
JP7027140B2 (ja) * 2017-12-04 2022-03-01 株式会社東芝 電力変換装置及び鉄道車両
CN119095336A (zh) * 2019-01-18 2024-12-06 比泽尔电子股份公司 电子功率设备和冷却回路
US10908657B2 (en) * 2019-02-15 2021-02-02 Pensando Systems Inc. Methods and systems for thermal control
EP4130933A4 (en) 2020-03-27 2024-04-10 Sony Interactive Entertainment Inc. ELECTRONIC INSTRUMENT AND ITS EXTERIOR PANEL
JP7203784B2 (ja) 2020-03-27 2023-01-13 株式会社ソニー・インタラクティブエンタテインメント 電子機器及びその外装パネル
EP4008477A1 (de) * 2020-12-04 2022-06-08 Hilti Aktiengesellschaft Werkzeugmaschine mit einer luftkühlung und verfahren zur kühlung von komponenten einer werkzeugmaschine
US12133352B2 (en) * 2021-07-28 2024-10-29 Dell Products L.P. Dual parallel path cooling system for dual socket information handling systems
CN115826699B (zh) * 2023-01-04 2023-05-05 苏州浪潮智能科技有限公司 一种机箱架构及包含其的服务器
DE102023202837A1 (de) * 2023-03-28 2024-10-02 Siemens Aktiengesellschaft Elektronikanordnung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1244002A2 (en) * 2001-03-22 2002-09-25 Kabushiki Kaisha Toshiba Information processing apparatus having cooling air passage with a plurality of heat generating components interposed
US20030218850A1 (en) * 2000-12-11 2003-11-27 Fujitsu Limited Electronics device unit
US20060087810A1 (en) * 2004-10-25 2006-04-27 Uwe Rockenfeller Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection
US20080041562A1 (en) * 2006-08-18 2008-02-21 Sun Microsystems, Inc. Airflow bypass and cooling of processors in series

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4103737A (en) * 1976-12-16 1978-08-01 Marantz Company, Inc. Heat exchanger structure for electronic apparatus
US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
JPH07202464A (ja) * 1993-12-28 1995-08-04 Toshiba Corp 電子機器装置並びに電子機器装置用冷却方法及びファン装置
US5986882A (en) * 1997-10-16 1999-11-16 Compaq Computer Corporation Electronic apparatus having removable processor/heat pipe cooling device modules therein
US6377459B1 (en) * 2000-08-04 2002-04-23 Sun Microsystems, Inc. Chip cooling management
US8472181B2 (en) * 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
CN102339109B (zh) * 2010-07-23 2016-02-24 赛恩倍吉科技顾问（深圳）有限公司 导风罩
US9075581B2 (en) * 2011-04-19 2015-07-07 Germane Systems, Llc Apparatus and method for cooling electrical components of a computer
US8964385B2 (en) * 2012-10-05 2015-02-24 Cisco Technology, Inc. Air flow system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030218850A1 (en) * 2000-12-11 2003-11-27 Fujitsu Limited Electronics device unit
EP1244002A2 (en) * 2001-03-22 2002-09-25 Kabushiki Kaisha Toshiba Information processing apparatus having cooling air passage with a plurality of heat generating components interposed
US20060087810A1 (en) * 2004-10-25 2006-04-27 Uwe Rockenfeller Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection
US20080041562A1 (en) * 2006-08-18 2008-02-21 Sun Microsystems, Inc. Airflow bypass and cooling of processors in series

Also Published As

Publication number Publication date
US20140254097A1 (en) 2014-09-11
BR112014007544B1 (pt) 2022-04-12
FR2983013A1 (fr) 2013-05-24
CN103946767A (zh) 2014-07-23
EP2780774A1 (fr) 2014-09-24
FR2983013B1 (fr) 2013-11-08
EP2780774B1 (fr) 2018-12-05
US9648779B2 (en) 2017-05-09
BR112014007544A2 (https=) 2017-04-04
WO2013072180A1 (fr) 2013-05-23

Similar Documents

Publication Publication Date Title
CN103946767B (zh) 诸如调制解调器等包括多个风冷处理器的电子装置
US6477044B2 (en) Flow guide
US7215543B2 (en) Duct for cooling multiple components in a processor-based device
CN103809711B (zh) 电子装置
CN102958324B (zh) 电子装置
US8243445B2 (en) Electronic apparatus
US20100294463A1 (en) Heat dissipation device having a fan thereon
CN104165413B (zh) 机柜空调器
CN107477684A (zh) 风管机
TW201202651A (en) Air duct for cooling a plurality of electronic components and electronic device using the same
WO2016054927A1 (zh) 一种服务器
JP6167506B2 (ja) 空気調和機の室外機
KR20140053597A (ko) 전자기기의 냉각장치
CN101201680A (zh) 电脑机箱的通风散热系统
CN109539656A (zh) 冰箱
JP6269882B1 (ja) 屋外盤
CN115087310A (zh) 高效率壳体散热装置及域控制器主机
CN115190734A (zh) 散热装置
CN1956176A (zh) 整流装置
US20210318000A1 (en) Outdoor unit
JP5754917B2 (ja) 車両輸送用冷凍ユニット
TWI465009B (zh) 散熱裝置及其採用的離心風扇
CN203537687U (zh) 机箱
CN103135719A (zh) 电子装置
CN102298430A (zh) 用于记忆卡散热的导风罩和使用该导风罩的电子装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20181214