BR112014007544A2 - - Google Patents
Info
- Publication number
- BR112014007544A2 BR112014007544A2 BR112014007544A BR112014007544A BR112014007544A2 BR 112014007544 A2 BR112014007544 A2 BR 112014007544A2 BR 112014007544 A BR112014007544 A BR 112014007544A BR 112014007544 A BR112014007544 A BR 112014007544A BR 112014007544 A2 BR112014007544 A2 BR 112014007544A2
- Authority
- BR
- Brazil
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1160549A FR2983013B1 (fr) | 2011-11-18 | 2011-11-18 | Appareil electronique de type modem ou analogue comportant plusieurs processeurs refroidis par air |
| FR1160549 | 2011-11-18 | ||
| PCT/EP2012/071451 WO2013072180A1 (fr) | 2011-11-18 | 2012-10-30 | Appareil electronique de type modem ou analogue comportant plusieurs processeurs refroidis par air |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BR112014007544A2 true BR112014007544A2 (https=) | 2017-04-04 |
| BR112014007544B1 BR112014007544B1 (pt) | 2022-04-12 |
Family
ID=47080532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR112014007544-1A BR112014007544B1 (pt) | 2011-11-18 | 2012-10-30 | Aparelho eletrônico de tipo modem, decodificador ou análogo que compreende uma ventoinha e um cárter interno que canaliza o fluxo de ar gerado pela ventoinha |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9648779B2 (https=) |
| EP (1) | EP2780774B1 (https=) |
| CN (1) | CN103946767B (https=) |
| BR (1) | BR112014007544B1 (https=) |
| FR (1) | FR2983013B1 (https=) |
| WO (1) | WO2013072180A1 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9075581B2 (en) * | 2011-04-19 | 2015-07-07 | Germane Systems, Llc | Apparatus and method for cooling electrical components of a computer |
| JP6559771B2 (ja) * | 2014-09-16 | 2019-08-14 | エスゼット ディージェイアイ テクノロジー カンパニー リミテッドＳｚ Ｄｊｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ | 放熱装置及びこの放熱装置を用いるｕａｖ |
| JP6048607B1 (ja) * | 2016-04-15 | 2016-12-21 | 富士電機株式会社 | 鉄道車両用電力変換装置 |
| CN206674410U (zh) * | 2017-03-21 | 2017-11-24 | 深圳市大疆创新科技有限公司 | 遥控器 |
| JP6891600B2 (ja) * | 2017-03-31 | 2021-06-18 | 富士通株式会社 | 情報処理装置 |
| JP7027140B2 (ja) * | 2017-12-04 | 2022-03-01 | 株式会社東芝 | 電力変換装置及び鉄道車両 |
| CN119095336A (zh) * | 2019-01-18 | 2024-12-06 | 比泽尔电子股份公司 | 电子功率设备和冷却回路 |
| US10908657B2 (en) * | 2019-02-15 | 2021-02-02 | Pensando Systems Inc. | Methods and systems for thermal control |
| EP4130933A4 (en) | 2020-03-27 | 2024-04-10 | Sony Interactive Entertainment Inc. | ELECTRONIC INSTRUMENT AND ITS EXTERIOR PANEL |
| JP7203784B2 (ja) | 2020-03-27 | 2023-01-13 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器及びその外装パネル |
| EP4008477A1 (de) * | 2020-12-04 | 2022-06-08 | Hilti Aktiengesellschaft | Werkzeugmaschine mit einer luftkühlung und verfahren zur kühlung von komponenten einer werkzeugmaschine |
| US12133352B2 (en) * | 2021-07-28 | 2024-10-29 | Dell Products L.P. | Dual parallel path cooling system for dual socket information handling systems |
| CN115826699B (zh) * | 2023-01-04 | 2023-05-05 | 苏州浪潮智能科技有限公司 | 一种机箱架构及包含其的服务器 |
| DE102023202837A1 (de) * | 2023-03-28 | 2024-10-02 | Siemens Aktiengesellschaft | Elektronikanordnung |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4103737A (en) * | 1976-12-16 | 1978-08-01 | Marantz Company, Inc. | Heat exchanger structure for electronic apparatus |
| US5077601A (en) * | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
| JPH07202464A (ja) * | 1993-12-28 | 1995-08-04 | Toshiba Corp | 電子機器装置並びに電子機器装置用冷却方法及びファン装置 |
| US5986882A (en) * | 1997-10-16 | 1999-11-16 | Compaq Computer Corporation | Electronic apparatus having removable processor/heat pipe cooling device modules therein |
| US6377459B1 (en) * | 2000-08-04 | 2002-04-23 | Sun Microsystems, Inc. | Chip cooling management |
| WO2002049106A1 (fr) * | 2000-12-11 | 2002-06-20 | Fujitsu Limited | Module électronique |
| JP3513116B2 (ja) * | 2001-03-22 | 2004-03-31 | 株式会社東芝 | 情報処理装置 |
| US7212403B2 (en) * | 2004-10-25 | 2007-05-01 | Rocky Research | Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection |
| US20080041562A1 (en) * | 2006-08-18 | 2008-02-21 | Sun Microsystems, Inc. | Airflow bypass and cooling of processors in series |
| US8472181B2 (en) * | 2010-04-20 | 2013-06-25 | Cray Inc. | Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use |
| CN102339109B (zh) * | 2010-07-23 | 2016-02-24 | 赛恩倍吉科技顾问（深圳）有限公司 | 导风罩 |
| US9075581B2 (en) * | 2011-04-19 | 2015-07-07 | Germane Systems, Llc | Apparatus and method for cooling electrical components of a computer |
| US8964385B2 (en) * | 2012-10-05 | 2015-02-24 | Cisco Technology, Inc. | Air flow system |
-
2011
- 2011-11-18 FR FR1160549A patent/FR2983013B1/fr not_active Expired - Fee Related
-
2012
- 2012-10-30 EP EP12778743.0A patent/EP2780774B1/fr active Active
- 2012-10-30 WO PCT/EP2012/071451 patent/WO2013072180A1/fr not_active Ceased
- 2012-10-30 CN CN201280056483.6A patent/CN103946767B/zh not_active Expired - Fee Related
- 2012-10-30 BR BR112014007544-1A patent/BR112014007544B1/pt active IP Right Grant
- 2012-10-30 US US14/349,993 patent/US9648779B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20140254097A1 (en) | 2014-09-11 |
| BR112014007544B1 (pt) | 2022-04-12 |
| FR2983013A1 (fr) | 2013-05-24 |
| CN103946767A (zh) | 2014-07-23 |
| EP2780774A1 (fr) | 2014-09-24 |
| FR2983013B1 (fr) | 2013-11-08 |
| CN103946767B (zh) | 2018-12-14 |
| EP2780774B1 (fr) | 2018-12-05 |
| US9648779B2 (en) | 2017-05-09 |
| WO2013072180A1 (fr) | 2013-05-23 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
| B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
| B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
| B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 30/10/2012, OBSERVADAS AS CONDICOES LEGAIS. |