CN102958324B - 电子装置 - Google Patents
电子装置 Download PDFInfo
- Publication number
- CN102958324B CN102958324B CN201110250795.8A CN201110250795A CN102958324B CN 102958324 B CN102958324 B CN 102958324B CN 201110250795 A CN201110250795 A CN 201110250795A CN 102958324 B CN102958324 B CN 102958324B
- Authority
- CN
- China
- Prior art keywords
- radiator
- hole
- radiating fin
- fin group
- adjacent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009434 installation Methods 0.000 claims description 20
- 239000006096 absorbing agent Substances 0.000 claims description 13
- 230000005855 radiation Effects 0.000 claims description 13
- 239000000428 dust Substances 0.000 abstract description 10
- 238000009825 accumulation Methods 0.000 abstract description 5
- 239000006185 dispersion Substances 0.000 description 4
- 239000011469 building brick Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
Abstract
Description
电子装置 | 100 |
壳体 | 10 |
底板 | 11 |
侧板 | 13 |
第一通孔组合 | 15 |
第二通孔组合 | 16 |
散热模组 | 20 |
第一吸热板 | 30 |
第二吸热板 | 40 |
散热器 | 50 |
凹槽 | 500 |
第一散热鳍片组 | 51 |
第一散热片 | 52 |
第一气流通道 | 54 |
第二散热鳍片组 | 53 |
第二散热片 | 56 |
第二气流通道 | 58 |
第一热管 | 60 |
第二热管 | 70 |
散热风扇 | 80 |
底座 | 81 |
叶轮 | 82 |
盖板 | 83 |
底板 | 84 |
侧壁 | 85 |
入风口 | 86 |
出风口 | 87 |
舌部 | 88 |
强风区 | 89 |
弱风区 | 90 |
第一通孔 | 150 |
第二通孔 | 160 |
本体 | 520、560 |
折边 | 522、562 |
Claims (7)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110250795.8A CN102958324B (zh) | 2011-08-29 | 2011-08-29 | 电子装置 |
TW100131185A TWI463939B (zh) | 2011-08-29 | 2011-08-31 | 電子裝置 |
US13/335,967 US8553415B2 (en) | 2011-08-29 | 2011-12-23 | Electronic device with heat dissipation module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110250795.8A CN102958324B (zh) | 2011-08-29 | 2011-08-29 | 电子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102958324A CN102958324A (zh) | 2013-03-06 |
CN102958324B true CN102958324B (zh) | 2015-03-25 |
Family
ID=47743451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110250795.8A Active CN102958324B (zh) | 2011-08-29 | 2011-08-29 | 电子装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8553415B2 (zh) |
CN (1) | CN102958324B (zh) |
TW (1) | TWI463939B (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5383740B2 (ja) * | 2011-04-18 | 2014-01-08 | 株式会社ソニー・コンピュータエンタテインメント | 電子機器 |
TW201403295A (zh) * | 2012-07-11 | 2014-01-16 | Foxconn Tech Co Ltd | 電子裝置 |
US9459669B2 (en) * | 2014-01-28 | 2016-10-04 | Dell Products L.P. | Multi-component shared cooling system |
DE102014101898B3 (de) * | 2014-02-14 | 2015-06-25 | Fujitsu Technology Solutions Intellectual Property Gmbh | Kühlanordnung für ein Computersystem |
US9746888B2 (en) | 2014-09-12 | 2017-08-29 | Microsoft Technology Licensing, Llc | Uniform flow heat sink |
GB2533596A (en) * | 2014-12-22 | 2016-06-29 | Vent-Axia Group Ltd | Heat exchanger |
TWM525399U (zh) | 2015-11-27 | 2016-07-11 | 宏碁股份有限公司 | 風扇模組及電子裝置 |
CN107023517B (zh) * | 2016-02-02 | 2019-02-01 | 宏碁股份有限公司 | 风扇模块及电子装置 |
TWI635248B (zh) * | 2016-09-02 | 2018-09-11 | 宏碁股份有限公司 | 蒸發器及其製作方法 |
CN107061312B (zh) * | 2017-03-31 | 2019-07-26 | 联想(北京)有限公司 | 一种风扇模组及电子设备 |
CN107589592B (zh) * | 2017-09-08 | 2020-06-23 | 深圳市华星光电技术有限公司 | 用于背光模组的散热结构及背光模组 |
EP3756430B1 (en) * | 2018-05-31 | 2023-11-08 | Hewlett-Packard Development Company, L.P. | Thermal modules for electronic devices |
CN110621138A (zh) * | 2018-06-20 | 2019-12-27 | 鸿富锦精密工业(武汉)有限公司 | 液冷散热装置及应用所述液冷散热装置的电子装置 |
CN108681384B (zh) * | 2018-08-03 | 2024-02-20 | 昆山品岱电子有限公司 | 具有辅助散热功能的军用散热器 |
CN109688768A (zh) * | 2018-12-29 | 2019-04-26 | 青岛小鸟看看科技有限公司 | 一种智能交互设备 |
CN115942724B (zh) * | 2023-03-15 | 2023-06-30 | 安徽百信信息技术有限公司 | 一种液冷散热板 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101641002A (zh) * | 2008-07-28 | 2010-02-03 | 富准精密工业(深圳)有限公司 | 散热器及使用该散热器的散热装置 |
CN102026522A (zh) * | 2009-09-17 | 2011-04-20 | 富准精密工业(深圳)有限公司 | 散热模组 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5758089A (en) * | 1980-09-26 | 1982-04-07 | Hitachi Ltd | Heat exchanger for air conditioner |
US6039532A (en) * | 1996-07-18 | 2000-03-21 | Iowa State University Research Foundation, Inc. | Blower fan blade passage rate noise control scheme |
US20060078423A1 (en) * | 2004-10-08 | 2006-04-13 | Nonlinear Tech, Inc. | Bi-directional Blowers for Cooling Laptop Computers |
US20070227707A1 (en) * | 2006-03-31 | 2007-10-04 | Machiroutu Sridhar V | Method, apparatus and system for providing for optimized heat exchanger fin spacing |
US7370692B2 (en) * | 2006-04-19 | 2008-05-13 | Wen-Chen Wei | Heat dissipating structure having different compactness |
US20080105410A1 (en) * | 2006-11-03 | 2008-05-08 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
TW200826824A (en) * | 2006-12-08 | 2008-06-16 | Inventec Corp | Heat dissipation module |
JP2009015385A (ja) * | 2007-06-29 | 2009-01-22 | Fujitsu Ltd | 電子機器 |
US20090183863A1 (en) * | 2008-01-20 | 2009-07-23 | Cheng-Kun Shu | Connecting Structure for Connecting Heat Radiation Fins |
TWI458928B (zh) * | 2009-08-21 | 2014-11-01 | Foxconn Tech Co Ltd | 散熱模組 |
CN102833979B (zh) * | 2011-06-17 | 2016-08-03 | 富瑞精密组件(昆山)有限公司 | 散热装置 |
CN102958325A (zh) * | 2011-08-29 | 2013-03-06 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
-
2011
- 2011-08-29 CN CN201110250795.8A patent/CN102958324B/zh active Active
- 2011-08-31 TW TW100131185A patent/TWI463939B/zh not_active IP Right Cessation
- 2011-12-23 US US13/335,967 patent/US8553415B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101641002A (zh) * | 2008-07-28 | 2010-02-03 | 富准精密工业(深圳)有限公司 | 散热器及使用该散热器的散热装置 |
CN102026522A (zh) * | 2009-09-17 | 2011-04-20 | 富准精密工业(深圳)有限公司 | 散热模组 |
Also Published As
Publication number | Publication date |
---|---|
CN102958324A (zh) | 2013-03-06 |
TWI463939B (zh) | 2014-12-01 |
US20130050941A1 (en) | 2013-02-28 |
US8553415B2 (en) | 2013-10-08 |
TW201311129A (zh) | 2013-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160413 Address after: 510630, room 689, 2303 Tianhe North Road, Guangzhou, Tianhe District, Guangdong Patentee after: Guangzhou Kai Yao Asset Management Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee before: Hon Hai Precision Industry Co., Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191119 Address after: Wuzhong Economic Development Zone in Suzhou City, Jiangsu Province, the River Street 215000 Wuzhong Road No. 1368 Building 1 Patentee after: Suzhou Wei you Intellectual Property Operation Co., Ltd. Address before: 510630, room 689, 2303 Tianhe North Road, Guangzhou, Tianhe District, Guangdong Patentee before: Guangzhou Kai Yao Asset Management Co., Ltd. |