CN103946006A - 层压方法及层压装置 - Google Patents
层压方法及层压装置 Download PDFInfo
- Publication number
- CN103946006A CN103946006A CN201280057213.7A CN201280057213A CN103946006A CN 103946006 A CN103946006 A CN 103946006A CN 201280057213 A CN201280057213 A CN 201280057213A CN 103946006 A CN103946006 A CN 103946006A
- Authority
- CN
- China
- Prior art keywords
- vacuum
- lower chambers
- machined object
- laminating method
- laminater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 91
- 238000003475 lamination Methods 0.000 title claims abstract description 67
- 238000010030 laminating Methods 0.000 title claims abstract description 48
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 238000003825 pressing Methods 0.000 claims description 8
- 230000007115 recruitment Effects 0.000 claims description 2
- 238000007796 conventional method Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 26
- 238000012856 packing Methods 0.000 description 21
- 239000006059 cover glass Substances 0.000 description 9
- 239000010409 thin film Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 239000007844 bleaching agent Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000010061 rubber shaping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-213625 | 2011-09-29 | ||
| JP2011213625A JP5781412B2 (ja) | 2011-09-29 | 2011-09-29 | ラミネート方法 |
| PCT/JP2012/070781 WO2013046979A1 (ja) | 2011-09-29 | 2012-08-09 | ラミネート方法及びラミネート装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103946006A true CN103946006A (zh) | 2014-07-23 |
Family
ID=47995030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280057213.7A Pending CN103946006A (zh) | 2011-09-29 | 2012-08-09 | 层压方法及层压装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5781412B2 (ja) |
| KR (1) | KR20140070635A (ja) |
| CN (1) | CN103946006A (ja) |
| TW (1) | TW201345725A (ja) |
| WO (1) | WO2013046979A1 (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104827742A (zh) * | 2014-09-10 | 2015-08-12 | 安阳高新区生产力促进中心 | 一种光伏组件层压机及层压工艺 |
| CN107283988A (zh) * | 2016-03-30 | 2017-10-24 | 上海渤明机电设备有限公司 | 一种太阳能电池层压工艺及层压阶段下腔充气系统 |
| CN107399140A (zh) * | 2017-08-17 | 2017-11-28 | 衡水英利新能源有限公司 | 一种太阳能光伏组件的层压方法及层压机 |
| CN107833942A (zh) * | 2017-11-24 | 2018-03-23 | 河北羿珩科技有限责任公司 | 多功能层压机及其使用方法 |
| CN109904267A (zh) * | 2019-04-12 | 2019-06-18 | 徐圣最 | 一种真空层压机的层压结构 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015037135A1 (ja) * | 2013-09-13 | 2015-03-19 | 株式会社エヌ・ピー・シー | 曲面モジュールの積層化装置および積層化方法 |
| JP6403159B2 (ja) * | 2015-02-26 | 2018-10-10 | 株式会社日立プラントメカニクス | フィルムの真空ラミネート装置 |
| CN105415858B (zh) * | 2015-12-28 | 2017-09-29 | 合肥晶澳太阳能科技有限公司 | 一种具有报警提示功能的光伏组件用层压机 |
| WO2020121036A1 (en) | 2018-12-13 | 2020-06-18 | Arcelormittal | Lamination device and process thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0755080A2 (en) * | 1995-07-19 | 1997-01-22 | Canon Kabushiki Kaisha | A semiconductor device and a process for the production thereof |
| CN1507077A (zh) * | 2002-12-13 | 2004-06-23 | ������������ʽ���� | 太阳能电池组件的制造方法 |
| US20050056363A1 (en) * | 2003-09-16 | 2005-03-17 | Canon Kabushiki Kaisha | Thermal contact-bonding method and thermal contact-bonding apparatus |
| JP4023961B2 (ja) * | 1999-09-27 | 2007-12-19 | 日清紡績株式会社 | 太陽電池におけるラミネート方法及びそのラミネート装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6389327A (ja) * | 1986-10-02 | 1988-04-20 | Stanley Electric Co Ltd | 熱圧着装置 |
| JP3890206B2 (ja) * | 2001-05-22 | 2007-03-07 | 日清紡績株式会社 | ラミネート装置におけるダイヤフラムの取付方法とこの方法を用いたラミネート装置 |
| JP2008047765A (ja) * | 2006-08-18 | 2008-02-28 | Npc Inc | ラミネート装置 |
| JP5448728B2 (ja) * | 2008-11-26 | 2014-03-19 | 京セラ株式会社 | 太陽電池モジュールのラミネータ及びこれにより製造された太陽電池モジュール |
| JP2011135068A (ja) * | 2009-11-26 | 2011-07-07 | Kyocera Corp | 太陽電池モジュールの製造方法 |
-
2011
- 2011-09-29 JP JP2011213625A patent/JP5781412B2/ja not_active Expired - Fee Related
-
2012
- 2012-08-09 CN CN201280057213.7A patent/CN103946006A/zh active Pending
- 2012-08-09 KR KR1020147011339A patent/KR20140070635A/ko not_active Application Discontinuation
- 2012-08-09 WO PCT/JP2012/070781 patent/WO2013046979A1/ja active Application Filing
- 2012-09-28 TW TW101135694A patent/TW201345725A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0755080A2 (en) * | 1995-07-19 | 1997-01-22 | Canon Kabushiki Kaisha | A semiconductor device and a process for the production thereof |
| JP4023961B2 (ja) * | 1999-09-27 | 2007-12-19 | 日清紡績株式会社 | 太陽電池におけるラミネート方法及びそのラミネート装置 |
| CN1507077A (zh) * | 2002-12-13 | 2004-06-23 | ������������ʽ���� | 太阳能电池组件的制造方法 |
| US20050056363A1 (en) * | 2003-09-16 | 2005-03-17 | Canon Kabushiki Kaisha | Thermal contact-bonding method and thermal contact-bonding apparatus |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104827742A (zh) * | 2014-09-10 | 2015-08-12 | 安阳高新区生产力促进中心 | 一种光伏组件层压机及层压工艺 |
| CN107283988A (zh) * | 2016-03-30 | 2017-10-24 | 上海渤明机电设备有限公司 | 一种太阳能电池层压工艺及层压阶段下腔充气系统 |
| CN107399140A (zh) * | 2017-08-17 | 2017-11-28 | 衡水英利新能源有限公司 | 一种太阳能光伏组件的层压方法及层压机 |
| CN107833942A (zh) * | 2017-11-24 | 2018-03-23 | 河北羿珩科技有限责任公司 | 多功能层压机及其使用方法 |
| CN107833942B (zh) * | 2017-11-24 | 2024-01-23 | 河北羿珩科技有限责任公司 | 多功能层压机及其使用方法 |
| CN109904267A (zh) * | 2019-04-12 | 2019-06-18 | 徐圣最 | 一种真空层压机的层压结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013071387A (ja) | 2013-04-22 |
| WO2013046979A1 (ja) | 2013-04-04 |
| TW201345725A (zh) | 2013-11-16 |
| JP5781412B2 (ja) | 2015-09-24 |
| KR20140070635A (ko) | 2014-06-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20170517 |