CN103945641A - 高导热线路板及其制作方法 - Google Patents
高导热线路板及其制作方法 Download PDFInfo
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- CN103945641A CN103945641A CN201410200168.7A CN201410200168A CN103945641A CN 103945641 A CN103945641 A CN 103945641A CN 201410200168 A CN201410200168 A CN 201410200168A CN 103945641 A CN103945641 A CN 103945641A
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- circuit board
- thermal conductive
- high thermal
- high heat
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000005530 etching Methods 0.000 claims abstract description 18
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- 238000007731 hot pressing Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 48
- 238000011161 development Methods 0.000 claims description 28
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 239000003292 glue Substances 0.000 claims description 21
- 238000012545 processing Methods 0.000 claims description 17
- 238000003466 welding Methods 0.000 claims description 14
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 12
- 239000000047 product Substances 0.000 claims description 12
- 238000013461 design Methods 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 10
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 9
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 7
- 239000006227 byproduct Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims description 6
- 238000005470 impregnation Methods 0.000 claims description 6
- 239000012046 mixed solvent Substances 0.000 claims description 6
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
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- 238000005260 corrosion Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229910001431 copper ion Inorganic materials 0.000 claims description 3
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 238000004090 dissolution Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 230000005484 gravity Effects 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 238000010023 transfer printing Methods 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- 238000011017 operating method Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 abstract 1
- 230000018109 developmental process Effects 0.000 description 20
- 238000005516 engineering process Methods 0.000 description 16
- 239000002585 base Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 230000005855 radiation Effects 0.000 description 6
- 239000011190 CEM-3 Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
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- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 239000003513 alkali Substances 0.000 description 2
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- 238000001514 detection method Methods 0.000 description 2
- 238000007750 plasma spraying Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
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- 230000002708 enhancing effect Effects 0.000 description 1
- 230000027950 fever generation Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
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- 239000012774 insulation material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- RLBIQVVOMOPOHC-UHFFFAOYSA-N parathion-methyl Chemical compound COP(=S)(OC)OC1=CC=C([N+]([O-])=O)C=C1 RLBIQVVOMOPOHC-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410200168.7A CN103945641B (zh) | 2014-05-13 | 2014-05-13 | 高导热线路板及其制作方法 |
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CN201410200168.7A CN103945641B (zh) | 2014-05-13 | 2014-05-13 | 高导热线路板及其制作方法 |
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CN103945641A true CN103945641A (zh) | 2014-07-23 |
CN103945641B CN103945641B (zh) | 2016-08-31 |
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CN201410200168.7A Expired - Fee Related CN103945641B (zh) | 2014-05-13 | 2014-05-13 | 高导热线路板及其制作方法 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105304504A (zh) * | 2015-09-21 | 2016-02-03 | 杰群电子科技(东莞)有限公司 | 一种半导体器件用基板的制造方法 |
CN105305008A (zh) * | 2015-09-11 | 2016-02-03 | 安徽协创物联网技术有限公司 | 一种笔记本电脑的天线安装结构 |
CN105618354A (zh) * | 2014-11-06 | 2016-06-01 | 联想(北京)有限公司 | 一种弹性涂层上的纹理制作方法和装置 |
CN107371323A (zh) * | 2017-08-07 | 2017-11-21 | 绵阳市维博电子有限责任公司 | 一种适用于汽车电子水泵功率器件的散热方法 |
CN107734857A (zh) * | 2017-11-15 | 2018-02-23 | 江苏苏杭电子有限公司 | 高精密度双面多层单侧铝基板加工工艺 |
CN107969069A (zh) * | 2018-01-12 | 2018-04-27 | 深圳恒宝士线路板有限公司 | 一种热电分离的金属基板的制作方法 |
CN108285613A (zh) * | 2017-01-10 | 2018-07-17 | 联茂电子股份有限公司 | 具有无机填料的散热基板 |
CN112757724A (zh) * | 2020-12-29 | 2021-05-07 | 宁波世一科技有限责任公司 | 一种挠性金属基石墨烯电热材料及其制备方法 |
CN113551816A (zh) * | 2021-07-21 | 2021-10-26 | 深圳市众航电测仪器有限公司 | 一种半固化电阻应变计及其制造方法 |
CN117004270A (zh) * | 2023-08-10 | 2023-11-07 | 鹤山市炎墨科技有限公司 | 一种基于聚苯醚树脂的防焊油墨及其制备方法和应用 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03257077A (ja) * | 1990-03-06 | 1991-11-15 | Sumitomo Electric Ind Ltd | 高放熱絶縁基板およびその製造方法 |
US20130040120A1 (en) * | 2011-01-07 | 2013-02-14 | Aisa Electronic Material Co., Ltd | Thin metal substrate having high thermal conductivity |
CN103214795A (zh) * | 2013-04-07 | 2013-07-24 | 西安科技大学 | 一种高绝缘导热覆铜板的组方及其制备工艺 |
CN203872427U (zh) * | 2014-05-13 | 2014-10-08 | 张伯平 | 高导热线路板 |
-
2014
- 2014-05-13 CN CN201410200168.7A patent/CN103945641B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03257077A (ja) * | 1990-03-06 | 1991-11-15 | Sumitomo Electric Ind Ltd | 高放熱絶縁基板およびその製造方法 |
US20130040120A1 (en) * | 2011-01-07 | 2013-02-14 | Aisa Electronic Material Co., Ltd | Thin metal substrate having high thermal conductivity |
CN103214795A (zh) * | 2013-04-07 | 2013-07-24 | 西安科技大学 | 一种高绝缘导热覆铜板的组方及其制备工艺 |
CN203872427U (zh) * | 2014-05-13 | 2014-10-08 | 张伯平 | 高导热线路板 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105618354B (zh) * | 2014-11-06 | 2018-07-06 | 联想(北京)有限公司 | 一种弹性涂层上的纹理制作方法和装置 |
CN105618354A (zh) * | 2014-11-06 | 2016-06-01 | 联想(北京)有限公司 | 一种弹性涂层上的纹理制作方法和装置 |
CN105305008A (zh) * | 2015-09-11 | 2016-02-03 | 安徽协创物联网技术有限公司 | 一种笔记本电脑的天线安装结构 |
CN105304504A (zh) * | 2015-09-21 | 2016-02-03 | 杰群电子科技(东莞)有限公司 | 一种半导体器件用基板的制造方法 |
CN108285613A (zh) * | 2017-01-10 | 2018-07-17 | 联茂电子股份有限公司 | 具有无机填料的散热基板 |
CN107371323A (zh) * | 2017-08-07 | 2017-11-21 | 绵阳市维博电子有限责任公司 | 一种适用于汽车电子水泵功率器件的散热方法 |
CN107734857A (zh) * | 2017-11-15 | 2018-02-23 | 江苏苏杭电子有限公司 | 高精密度双面多层单侧铝基板加工工艺 |
CN107969069A (zh) * | 2018-01-12 | 2018-04-27 | 深圳恒宝士线路板有限公司 | 一种热电分离的金属基板的制作方法 |
CN112757724A (zh) * | 2020-12-29 | 2021-05-07 | 宁波世一科技有限责任公司 | 一种挠性金属基石墨烯电热材料及其制备方法 |
CN112757724B (zh) * | 2020-12-29 | 2022-05-20 | 杭州宜联研仿科技有限公司 | 一种挠性金属基石墨烯电热材料的制备方法 |
CN113551816A (zh) * | 2021-07-21 | 2021-10-26 | 深圳市众航电测仪器有限公司 | 一种半固化电阻应变计及其制造方法 |
CN117004270A (zh) * | 2023-08-10 | 2023-11-07 | 鹤山市炎墨科技有限公司 | 一种基于聚苯醚树脂的防焊油墨及其制备方法和应用 |
CN117004270B (zh) * | 2023-08-10 | 2024-01-05 | 鹤山市炎墨科技有限公司 | 一种基于聚苯醚树脂的防焊油墨及其制备方法和应用 |
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CN103945641B (zh) | 2016-08-31 |
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Owner name: XINGTAI HAINA ELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHANG BOPING Effective date: 20150127 |
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Effective date of registration: 20150127 Address after: 054700 Weixian County Economic Development Zone, Hebei Province, open road, No. 3, No. Applicant after: Xingtai Haina Electronics Technology Co., Ltd Address before: 054000 Weixian County Hebei Xingtai Open Road No. 1 Haina electronics company Applicant before: Zhang Boping |
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