WO2015078345A1 - 凸台式金属基夹芯刚挠板及其制备方法 - Google Patents

凸台式金属基夹芯刚挠板及其制备方法 Download PDF

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WO2015078345A1
WO2015078345A1 PCT/CN2014/092105 CN2014092105W WO2015078345A1 WO 2015078345 A1 WO2015078345 A1 WO 2015078345A1 CN 2014092105 W CN2014092105 W CN 2014092105W WO 2015078345 A1 WO2015078345 A1 WO 2015078345A1
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metal
board
rigid
boss
plate
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PCT/CN2014/092105
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English (en)
French (fr)
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徐波
莫欣满
陈蓓
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广州兴森快捷电路科技有限公司
深圳市兴森快捷电路科技股份有限公司
宜兴硅谷电子科技有限公司
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Priority to US15/039,492 priority Critical patent/US9942976B2/en
Publication of WO2015078345A1 publication Critical patent/WO2015078345A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the invention relates to the technical field of printed circuit boards, in particular to a convex metal base sandwich rigid plate and a preparation method thereof.
  • the heat density of electronic products has been continuously improved, and the heat dissipation performance of products has become a performance index that people are paying more and more attention to.
  • the poor heat dissipation of the rigid-flex board products will cause the electrical performance of the components to drop or even be damaged. Therefore, the rigid-flex board products with good heat dissipation performance determine the importance of their application in the application.
  • Plates with copper seat, aluminum base and PCB Single or multi-layer PCB can be grafted together with copper or aluminum seat, which can only dissipate heat from the PCB contact parts;
  • Aluminum-based and copper substrates mainly single-panel, one-side lines, one side of heat dissipation, and the number of circuit layers is limited;
  • Buried copper block PCB embedded copper block in the multilayer PCB, local heat dissipation, copper block and PCB dielectric layer CTE do not match, reliability is limited;
  • Metal-based sandwich PCB The developed version of the buried copper PCB, as a separate non-circuit layer and the PCB circuit layer are pressed together, the heat is radiated from the periphery of the board, the metal core is difficult to process as a single layer, and the reliability is difficult to guarantee. .
  • a convex metal-based sandwich rigid rigid plate comprising a rigid daughter plate, a flexible daughter plate, a dielectric layer and a metal core layer, wherein the metal core layer is provided with at least one metal boss on each of the front and back surfaces At least one heat dissipating region, the dielectric layer and the rigid sub-board and/or the flexible sub-board are sequentially laminated on the front and back surfaces of the metal core layer, respectively, and the rigid sub-board, the flexible sub-board and the dielectric layer are respectively provided with metal bosses a matching first window opening area and a second window opening area corresponding to the heat dissipation area.
  • the length of each side of the first window opening region is 0.1-0.2 mm larger than the dimension of each side of the metal boss.
  • the difference between the thickness of the metal boss and the total thickness of the nested dielectric layer and the rigid daughterboard and/or the flexible daughterboard is controlled within ⁇ 20 ⁇ m.
  • the rigid daughterboard is a single layer rigid board or a plurality of rigid boards; the flexible daughter board is a single layer flexible board or a multilayer flexible board.
  • Another object of the present invention is to provide a method of preparing the above-described raised metal-based sandwich rigid plate.
  • the method for preparing the above convex metal-based sandwich rigid plate comprises the following steps:
  • step 2 front control deep milling: the metal core plate obtained in step 1 is subjected to depth-controlled milling, and a metal boss is formed on the front surface of the metal core plate;
  • Step 2 is obtained by nesting a backing plate on the front side of the metal core board, and then performing reverse surface controlled deep milling processing to form a metal boss on the reverse side of the metal core board, that is, the metal core layer is obtained;
  • the thickness of the backing plate is consistent with the thickness of the metal boss, and the backing plate is provided with a grooved area that cooperates with the metal boss.
  • the dimension of each side of the through-groove area is 0.1-0.2 mm larger than the dimension of each side of the metal boss.
  • the precision of the controlled deep milling process is 0.1 mm.
  • the convex metal-based sandwich rigid-flex plate prepared by the invention adopts a metal core layer (metal bumps and heat-dissipating regions on the front and back sides) for heat dissipation, and the heat dissipation method can not only satisfy the heat dissipation of the local heat-generating electronic components (through the metal bumps) Taiwan) can meet the heat dissipation (through the metal core layer and heat dissipation area) during high-density line operation, and has excellent reliability.
  • Figure 1 is a cross-sectional view of a convex metal base sandwich rigid plate of the present invention
  • FIG. 2 is a schematic view showing a preparation process of a convex metal-based sandwich rigid plate according to the present invention
  • 3 is a flow chart of preparing a metal core layer
  • FIG. 4 is a view showing a product of a convex metal-based sandwich rigid plate produced by the embodiment.
  • this embodiment is a convex metal base sandwich rigid plate, and the rigid plate includes just a slab 101, a flexible daughter board 103, a dielectric layer 105, and a metal core layer 104.
  • the metal core layer is respectively provided with at least one metal boss 102 (the metal core layer and the metal boss are integrated structures) and at least a heat dissipating region 106, wherein the dielectric layer and the rigid sub-board and/or the flexible sub-board are sequentially stacked on the front and back surfaces of the metal core layer, respectively, and the rigid sub-board, the flexible sub-board and the dielectric layer are respectively provided with metal bosses a matching first window opening area and a second window opening area corresponding to the heat dissipation area.
  • each side of the first window opening area is 0.1-0.2 mm larger than the dimension of each side of the metal boss.
  • the difference between the thickness of the metal boss and the total thickness of the nested dielectric layer and the rigid daughterboard and/or the flexible daughterboard is controlled within ⁇ 20 ⁇ m.
  • the rigid daughterboard is a single-layer rigid board or a multi-layer rigid board;
  • the flexible daughter board is a single-layer flexible board or a multi-layer flexible board.
  • the method for preparing the above convex metal-based sandwich rigid plate comprises the following steps:
  • step 2 front control deep milling: the metal core plate obtained in step 1 is subjected to depth-controlled milling, and a metal boss is formed on the front surface of the metal core plate;
  • Step 2 is obtained by nesting a metal plate on the front side of the metal plate, the thickness of the pad is consistent with the thickness of the metal boss, and the pad plate is provided with a groove matching the metal boss. a region, wherein a dimension of each side of the through-groove area is 0.1-0.2 mm larger than a dimension of each side of the metal boss, and then performing a reverse-face-controlled deep milling process to form a metal boss on a reverse side of the metal core board, that is, The metal core layer;
  • the backing plate is made of materials with good dimensional stability, such as bakelite.
  • the precision of the controlled deep milling process is 0.1 mm.
  • the metal core layer is treated with a strip before the lamination, the front strip is pulled, the back strip is pushed, the strip is plated with metal
  • the core layers are connected by tape, the thickness of the strip is ⁇ the sum of the height of the upper and lower bosses and the thickness of the metal core layer, and the material of the strip board is selected from materials which do not react with the pretreatment syrup, such as FR4.
  • the convex metal-based sandwich rigid plate of the present embodiment is heat-dissipated by a metal core layer (metal bumps on the front and back sides), and the metal core layer is sandwiched between any adjacent inner layers, and the heat dissipation method is not only It can meet the heat dissipation of local heating electronic components (through metal bumps), and can also meet the heat dissipation during high-density line operation (through the metal core layer and heat dissipation area). The heat dissipation efficiency is greatly improved compared with ordinary metal sandwich printed boards.
  • the heat dissipation efficiency of ordinary metal sandwich rigid plate is about 0.8-1.0W/(mk), the convex metal sandwich rigid plate can be increased to 180W/(mk), the lifting range is nearly two hundred times), and the reliability Excellent (1 according to the method of the rigid board country military standard test standard (GJB326A-96), temperature environment (-55 ° C ⁇ 125 ° C) under the hot and cold cycle conditions 200 cycles, resistance change ⁇ 5%, and no hole wall Separation, separation of plug pore resin and copper base; 2 IST test according to the method of IPC-TM-6502.6.26, the test conditions are 100 times at room temperature to 150 ° C, resistance change ⁇ 5%, and no pore walls appear Separation, plug hole resin and copper base separation .).

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种凸台式金属基夹芯刚挠板及其制备方法，其中刚挠板包括刚性子板（101）、柔性子板（103）、介质层（105）以及金属芯层（104），金属芯层的正反面上分别设有至少一个金属凸台（102）和至少一个散热区域（106），金属芯层的正反面上分别依次层叠介质层（105）与刚性子板（101）和/或柔性子板（103），刚性子板（101）、柔性子板（103）以及介质层（105）上分别设有与金属凸台（102）相配合的第一开窗区域及与散热区域（106）相对应的第二开窗区域。制备得到的凸台式金属基夹芯刚挠板采用正反面设有金属凸台的金属芯层进行散热，不仅能通过金属凸台满足局部发热电子元器件的散热，又能通过金属芯层及散热区域满足高密度线路工作时的散热，并且可靠性优良。

Description

凸台式金属基夹芯刚挠板及其制备方法 技术领域
本发明涉及印制线路板技术领域，特别是涉及一种凸台式金属基夹芯刚挠板及其制备方法。
背景技术
随着电子产品的高速传输、精密小型设计的发展，电子产品的发热密度不断的提升，产品的散热性能成为人们越来越关注的性能指标。作为电子产品元器件重要一员的刚挠板产品散热不良将造成元器件电气性能的下降甚至损毁，因此具有良好散热性能的刚挠板产品决定了其在应用中的重要性更显卓著。
为了解决散热问题，目前有以下几种方法在PCB产品上应用，这些方法都有其不足点，难以满足高效散热需求的刚挠板产品：
(1)铜座、铝座与PCB结合的板：单层或者多层PCB与铜座或铝座嫁接一起，只能起到PCB接触部位散热；
(2)铝基、铜基板：主要是单面板，一面线路，一面散热，线路层数受限；
(3)导电散热银浆、铜浆板：使用具有一定导热性能的铜浆和银浆通过塞孔的方式，将表面电子元器件的热量快速的传输到相应的接地大铜面进行散热，尤其是表层的大铜面，成本高；
(4)埋铜块PCB：在多层PCB内部埋嵌铜块，局部散热，铜块与PCB介质层CTE不匹配，可靠性受限；
(5)金属基夹芯PCB：埋铜块PCB发展版本，作为单独的非线路层与PCB线路层一起压合，热量从板子四周散热，金属芯作为单独一层加工困难，且可靠性难以保证。
发明内容
基于此，本发明的目的是提供一种凸台式金属基夹芯刚挠板。
具体的技术方案如下：
一种凸台式金属基夹芯刚挠板，该刚挠板包括刚性子板、柔性子板、介质层以及金属芯层，所述金属芯层的正反面上分别设有至少一个金属凸台和至少一个散热区域，所述金属芯层的正反面上分别依次层叠介质层与刚性子板和/或柔性子板，所述刚性子板、柔性子板以及介质层上分别设有与金属凸台相配合的第一开窗区域及与散热区域相对应的第二开窗区域。
在其中一个实施例中，所述第一开窗区域各边长的尺寸比金属凸台各边长的尺寸大0.1-0.2mm。
在其中一个实施例中，所述金属凸台的厚度与所嵌套的介质层与刚性子板和/或柔性子板的总厚度之差控制在±20μm以内。
在其中一个实施例中，所述刚性子板为单层刚性板或多层刚性板；所述柔性子板为单层柔性板或多层柔性板。
本发明的另一目的是提供上述凸台式金属基夹芯刚挠板的制备方法。
具体的技术方案如下：
上述凸台式金属基夹芯刚挠板的制备方法，包括如下步骤：
(1)柔性子板的制作：将柔性板材按常规方法进行内层线路制作、开窗，即得；
(2)刚性子板的制作：将刚性板材按常规方法进行内层线路制作、开窗，即得；
(3)介质层的制作：将介质层材料按常规方法进行开窗操作即得；
(4)金属芯层的制作：
①将金属芯板进行钻孔、塞孔、冲定位孔操作；
②正面控深铣：将步骤①的到的金属芯板进行控深铣加工，在金属芯板的正面形成金属凸台；
③反面控深铣：将步骤②得到金属芯板正面嵌套一个垫板，然后进行反面控深铣加工，在金属芯板的反面形成金属凸台，即得所述金属芯层；
(5)将刚性子板、柔性子板、介质层以及金属芯层按设计要求依次层叠，然后进行层压操作；
(6)按常规进行后续工序，并在阻焊操作后，对第二开窗区域进行控深铣开盖操作，即得所述凸台式金属基夹芯刚挠板。
在其中一个实施例中，步骤(4)中，所述垫板的厚度与金属凸台的厚度一致，所述垫板上设有与金属凸台相配合的通槽区域。
在其中一个实施例中，所述通槽区域各边长的尺寸比所述金属凸台各边长的尺寸大0.1-0.2mm。
在其中一个实施例中，步骤(4)和(6)中，所述控深铣加工的精度为0.1mm。
本发明的优点如下：
本发明制备得到的凸台式金属基夹芯刚挠板采用金属芯层(正反面设有金属凸台及散热区域)进行散热，该散热方式不仅能满足局部发热电子元器件的散热(通过金属凸台)，又能满足高密度线路工作时的散热(通过金属芯层及散热区域)，并且可靠性优良。
附图说明
图1为本发明凸台式金属基夹芯刚挠板剖面图；
图2为本发明凸台式金属基夹芯刚挠板制备流程示意图；
图3为金属芯层制备流程图；
图4为实施例制备得到的凸台式金属基夹芯刚挠板产品图。
附图标记说明：
101、刚性子板；102、金属凸台；103、柔性子板；104、金属芯层；105、介质层；106、散热区域。
具体实施方式
以下结合附图和实施例对本申请做进一步阐述。
参考图1和图2，本实施例一种凸台式金属基夹芯刚挠板，该刚挠板包括刚 性子板101、柔性子板103、介质层105以及金属芯层104，所述金属芯层的正反面上分别设有至少一个金属凸台102(金属芯层与金属凸台是一体结构)和至少一个散热区域106，所述金属芯层的正反面上分别依次层叠介质层与刚性子板和/或柔性子板，所述刚性子板、柔性子板以及介质层上分别设有与金属凸台相配合的第一开窗区域及与散热区域相对应的第二开窗区域。
所述第一开窗区域各边长的尺寸比金属凸台各边长的尺寸大0.1-0.2mm。
所述金属凸台的厚度与所嵌套的介质层与刚性子板和/或柔性子板的总厚度之差控制在±20μm以内。
所述刚性子板为单层刚性板或多层刚性板；所述柔性子板为单层柔性板或多层柔性板。
上述凸台式金属基夹芯刚挠板的制备方法，包括如下步骤：
(1)柔性子板的制作：将柔性板材按常规方法进行内层线路制作、开窗，即得；
(2)刚性子板的制作：将刚性板材按常规方法进行内层线路制作、开窗，即得；
(3)介质层的制作：将介质层材料按常规方法进行开窗操作即得；
(4)金属芯层的制作(参考图3)：
①将金属芯板进行钻孔、塞孔、冲定位孔操作；
②正面控深铣：将步骤①的到的金属芯板进行控深铣加工，在金属芯板的正面形成金属凸台；
③反面控深铣：将步骤②得到金属芯板正面嵌套一个垫板，所述垫板的厚度与金属凸台的厚度一致，所述垫板上设有与金属凸台相配合的通槽区域，所述通槽区域各边长的尺寸比所述金属凸台各边长的尺寸大0.1-0.2mm，然后进行反面控深铣加工，在金属芯板的反面形成金属凸台，即得所述金属芯层；
垫板所以材料为尺寸稳定性好的材料，如电木板。
所述控深铣加工的精度为0.1mm。
金属芯层在层压前处理时，采用带板，前带板拉，后带板推，带板与金属 芯层之间靠胶带相连，带板厚度≥上下凸台高度和金属芯层厚度之和，带板材质选用与前处理药水没有反应的材料，如FR4。
(5)将刚性子板、柔性子板、介质层以及金属芯层按设计要求依次层叠，然后进行层压操作；
(6)按常规进行后续工序，并阻焊操作后，对第二开窗区域进行控深铣开盖操作，即得所述凸台式金属基夹芯刚挠板(参考图4)。
本实施例制备得到的凸台式金属基夹芯刚挠板采用金属芯层(正反面设有金属凸台)进行散热，该金属芯层夹在任一相邻的内层之间，该散热方式不仅能满足局部发热电子元器件的散热(通过金属凸台)，又能满足高密度线路工作时的散热(通过金属芯层及散热区域)，散热效率相比普通金属夹芯印制板得到极大提高(普通金属夹芯刚挠板散热效率为0.8-1.0W/(m.k)左右，凸台式金属夹芯刚挠板可以提高到180W/(m.k)左右，提升幅度近两百倍)，并且可靠性优良(①按照刚性板国军标的测试标准(GJB326A-96)中的方法，温度环境(-55℃～125℃)冷热循环条件下循环200次，电阻变化≤5％，并且未出现孔壁分离，塞孔树脂与铜基分离现象；②参照IPC-TM-6502.6.26的方法进行IST测试，测试条件为室温～150℃条件下循环100次，电阻变化≤5％，并且未出现孔壁分离，塞孔树脂与铜基分离现象。)。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (8)

  1. 一种凸台式金属基夹芯刚挠板，其特征在于，该刚挠板包括刚性子板、柔性子板、介质层以及金属芯层，所述金属芯层的正反面上分别设有至少一个金属凸台和至少一个散热区域，所述金属芯层的正反面上分别依次层叠介质层与刚性子板和/或柔性子板，所述刚性子板、柔性子板以及介质层上分别设有与金属凸台相配合的第一开窗区域及与散热区域相对应的第二开窗区域。
  2. 根据权利要求1所述的凸台式金属基夹芯刚挠板，其特征在于，所述第一开窗区域各边长的尺寸比金属凸台各边长的尺寸大0.1-0.2mm。
  3. 根据权利要求1所述的凸台式金属基夹芯刚挠板，其特征在于，所述金属凸台的厚度与所嵌套的介质层与刚性子板和/或柔性子板的总厚度之差控制在±20μm以内。
  4. 根据权利要求1-3任一项所述的凸台式金属基夹芯刚挠板，其特征在于，所述刚性子板为单层刚性板或多层刚性板；所述柔性子板为单层柔性板或多层柔性板。
  5. 权利要求1-4任一项所述的凸台式金属基夹芯刚挠板的制备方法，其特征在于，包括如下步骤：
    (1)柔性子板的制作：将柔性板材按常规方法进行内层线路制作、开窗，即得；
    (2)刚性子板的制作：将刚性板材按常规方法进行内层线路制作、开窗，即得；
    (3)介质层的制作：将介质层材料按常规方法进行开窗操作即得；
    (4)金属芯层的制作：
    ①将金属芯板进行钻孔、塞孔、冲定位孔操作；
    ②正面控深铣：将步骤①的到的金属芯板进行控深铣加工，在金属芯板的正面形成金属凸台；
    ③反面控深铣：将步骤②得到金属芯板正面嵌套一个垫板，然后进行反面 控深铣加工，在金属芯板的反面形成金属凸台，即得所述金属芯层；
    (5)将刚性子板、柔性子板、介质层以及金属芯层按设计要求依次层叠，然后进行层压操作；
    (6)按常规进行后续工序，并在阻焊操作后，对第二开窗区域进行控深铣开盖操作，即得所述凸台式金属基夹芯刚挠板。
  6. 根据权利要求5所述的凸台式金属基夹芯刚挠板的制备方法，其特征在于，步骤(4)中，所述垫板的厚度与金属凸台的厚度一致，所述垫板上设有与金属凸台相配合的通槽区域。
  7. 根据权利要求5所述的凸台式金属基夹芯刚挠板的制备方法，其特征在于，所述通槽区域各边长的尺寸比所述金属凸台各边长的尺寸大0.1-0.2mm。
  8. 根据权利要求5所述的凸台式金属基夹芯刚挠板的制备方法，其特征在于，步骤(4)和(6)中，所述控深铣加工的精度为0.1mm。
PCT/CN2014/092105 2013-11-26 2014-11-25 凸台式金属基夹芯刚挠板及其制备方法 WO2015078345A1 (zh)

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