CN103887067A - Multilayer ceramic electronic component and manufacturing method thereof - Google Patents

Multilayer ceramic electronic component and manufacturing method thereof Download PDF

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Publication number
CN103887067A
CN103887067A CN201310088537.3A CN201310088537A CN103887067A CN 103887067 A CN103887067 A CN 103887067A CN 201310088537 A CN201310088537 A CN 201310088537A CN 103887067 A CN103887067 A CN 103887067A
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internal electrode
internal electrodes
ceramic
lamination
internal
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CN103887067B (en
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金亨俊
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics

Abstract

There is provided a multilayer ceramic electronic component including: a ceramic body including a plurality of dielectric layers; and a plurality of first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body and having different widths, wherein three or more of the plurality of first and second internal electrodes form a single block, the blocks are iteratively laminated, and when the longest distance between the uppermost internal electrode and the lowermost internal electrode, among the plurality of first and second internal electrodes 121 and 122, is T1 and the shortest distance therebetween is T2, 0.76<=T2/T1<=0.97 is satisfied.

Description

Laminated ceramic electronic component and manufacture method thereof
The cross reference of related application
The application requires the priority of the korean patent application No.10-2012-0149936 submitting to from December 20th, 2012 to Department of Intellectual Property of Korea S, and its disclosure is incorporated into this by quoting as proof.
Technical field
The present invention relates to a kind of laminated ceramic electronic component and manufacture method thereof with fabulous reliability.
Background technology
In recent years, owing to reducing the size of electronic product, so laminated ceramic electronic component also needs to reduce size and have large capacity.
Therefore, people attempt by the whole bag of tricks dielectric layer and internal electrode system is thin and stacked in large quantities, and in recent years, by reducing the thickness of dielectric layer, have produced the laminated ceramic electronic component with greater amount laminar structure.
Simultaneously, on potsherd or substrate, printing is less and have an internal electrode of predetermined thickness than the area of potsherd or substrate, and these sheets of lamination, thereby manufacture laminated ceramic electronic component, especially manufacture multilayer ceramic capacitor, and because lamination amount increases, so the step (step that marginal portion forms, ladder, step) increase.
Therefore, the step forming due to marginal portion is along with lamination amount increases, so dielectric layer and internal electrode imbalance cause the degeneration of electrical characteristic.
And, along with lamination amount increases, due to these steps, cause the electrode in multilayer ceramic capacitor can be bending on the end direction of ceramic body, therefore, when ceramic cutting body, there is layering.
Following correlation technique document discloses a kind of technology of lamination internal electrode, thus the position of internal electrode on the Width of ceramic body, depart from, but this is not the basic solution of the problems referred to above.
Therefore, need a kind of method, the step that when lamination problem while cutting for solving and cutting, marginal portion forms increases caused problem.
[correlation technique document]
[patent documentation 1] Japanese Patent Laid-Open No.2004-022859
Summary of the invention
One aspect of the present invention provides a kind of laminated ceramic electronic component and manufacture method thereof with fabulous reliability.
According to an aspect of the present invention, provide a kind of laminated ceramic electronic component, having comprised: ceramic body, it comprises multiple dielectric layers, and multiple the first and second internal electrodes, it is arranged to face with each other and have different width in ceramic body, dielectric layer is between the first and second internal electrodes, wherein, three or more in multiple the first and second internal electrodes form single block (single block), these blocks are by (iteratively repeatedly, iteratively, lamination repeatedly), and when the highest internal electrode among multiple the first and second internal electrodes and the longest distance between minimum internal electrode are T1, and when beeline is therebetween T2, meet 0.76≤T2/T1≤0.97.
The quantity of described block can be 5 or more.
When the highest internal electrode among multiple the first and second internal electrodes and the longest distance between minimum internal electrode are T1 and beeline therebetween while being T2, can meet 0.85≤T2/T1≤0.90.
The lamination amount of multiple the first and second internal electrodes can be 150 layers or more multi-layered.
Described internal electrode can comprise the one or more of metals in the group of selecting free palladium (Pd), palladium-Yin (Pd-Ag) alloy, nickel (Ni) and copper (Cu) formation.
According to another aspect of the present invention, provide a kind of method of manufacturing laminated ceramic electronic component, the method comprises: utilize the slurry that comprises ceramic powders to prepare multiple ceramic green sheets (ceramic green sheet, ceramic green); By comprising the conductive paste of metal dust, on multiple ceramic green sheets, form first and second internal electrode patterns with different in width; Three or more in the multiple ceramic green sheets of lamination, to form multiple course of blocks laminated structures (block laminates, course of blocks pressing plate); And lamination and fire multiple course of blocks laminated structures, to form the ceramic body that comprises multiple the first and second internal electrodes, wherein, in described ceramic body, when the highest internal electrode among multiple the first and second internal electrodes and the longest distance between minimum internal electrode are T1 and beeline therebetween while being T2, meet 0.76≤T2/T1≤0.97.
Described method is compressed these course of blocks laminated structures after can being further included in and forming multiple course of blocks laminated structures.
The first and second internal electrode patterns can be arranged in has identical form (form, shape) in each block.
The quantity of course of blocks laminated structure can be 5 or more.
When the highest internal electrode among multiple the first and second internal electrodes and the longest distance between minimum internal electrode are T1 and beeline therebetween while being T2, can meet 0.85≤T2/T1≤0.90.
The lamination amount of multiple the first and second internal electrodes can be 150 layers or more multi-layered.
Above-mentioned metal dust can comprise one or more in the group of selecting free palladium (Pd), palladium-Yin (Pd-Ag) alloy, nickel (Ni) and copper (Cu) formation.
Brief description of the drawings
The following detailed description of carrying out in conjunction with the drawings, will more clearly understand above and other aspect of the present invention, feature and other advantages, in the accompanying drawings:
Fig. 1 is the perspective schematic view of multilayer ceramic capacitor according to an embodiment of the invention (MLCC);
Fig. 2 is the perspective schematic view of the ceramic body of MLCC according to an embodiment of the invention;
Fig. 3 is the viewgraph of cross-section intercepting along the line A-A ' in Fig. 2;
Fig. 4 is the perspective schematic view of the ceramic body of MLCC according to another embodiment of the invention;
Fig. 5 is the viewgraph of cross-section intercepting along the line A-A ' in Fig. 4; And
Fig. 6 is the flow chart that the process of a kind of manufacture MLCC is according to another embodiment of the invention shown.
Embodiment
Referring now to accompanying drawing, will describe embodiments of the invention in detail.But, can embody the present invention by multiple different form, and the present invention should not be construed as and is limited to the embodiment that proposed herein.Exactly, provide these embodiment, thereby the disclosure is by abundant and complete, and scope of the present invention is conveyed to those skilled in the art fully.In the drawings, for clarity, can amplify the shape and size of some elements, and in the text, use identical reference number to represent same or analogous parts.
Fig. 1 is the perspective schematic view of multilayer ceramic capacitor according to an embodiment of the invention (MLCC).
Fig. 2 is the perspective schematic view of the ceramic body of MLCC according to an embodiment of the invention.
Fig. 3 is the viewgraph of cross-section intercepting along the line A-A ' in Fig. 2.
Fig. 4 is the perspective schematic view of the ceramic body of MLCC according to another embodiment of the invention.
Fig. 5 is the viewgraph of cross-section intercepting along the line A-A ' in Fig. 4.
Fig. 6 is the flow chart that the process of a kind of manufacture MLCC is according to another embodiment of the invention shown.
Referring to figs. 1 through Fig. 5, laminated ceramic electronic component according to an embodiment of the invention can comprise: ceramic body 110, and it comprises multiple dielectric layers 111, and multiple the first and second internal electrodes 121 and 122, it is arranged to face with each other and have different width in ceramic body 110, described dielectric layer 111 inserts between the first and second internal electrodes, wherein, three or more in multiple the first and second internal electrodes 121 and 122 form single block, repeatedly lamination of these blocks, and when the highest internal electrode among multiple the first and second internal electrodes 121 and 122 and the longest distance between minimum internal electrode are T1, and when beeline is therebetween T2, meet 0.76≤T2/T1≤0.97.
Hereinafter, laminated ceramic electronic component according to an embodiment of the invention will be described.In particular, a kind of multilayer ceramic capacitor (MLCC) is described as an example, but the invention is not restricted to this.
Be not specially limited ceramic body 110, and described ceramic body can have such as hexahedral shape.
Meanwhile, in multilayer ceramic capacitor according to an embodiment of the invention (MLCC), in Fig. 1, limiting " length direction " is " L direction ", and " Width " is " W direction ", and " thickness direction " is " T direction ".In this article, " thickness direction " can be used for having identical concept with " laminating direction (lamination direction) " in lamination dielectric layer.
MLCC according to an embodiment of the invention can comprise: ceramic body 110, and it comprises multiple dielectric layers 111; And multiple the first and second internal electrodes 121 and 122, it is arranged to face with each other and have different width in ceramic body, and described dielectric layer 111 inserts between the first and second internal electrodes.
According to one embodiment of present invention, by the multiple dielectric layers of lamination, can form ceramic body 110.Form multiple dielectric layers 111 of ceramic body 110 in sintering state, wherein, adjacent dielectric layer combines, thereby boundary therebetween may be not fairly obvious.
By firing the ceramic green sheet that comprises ceramic powders, organic solvent and organic binder bond, can form dielectric layer 111.Ceramic powders is for having the material of high K-dielectric constant (or high-dielectric constant), and such as, can be by based on barium titanate (BaTiO 3) material, based on strontium titanates (SrTiO 3) material etc. as ceramic powders, but the invention is not restricted to this.
Use conductive paste, can form multiple the first and second internal electrodes 121 and 122, described conductive paste comprises such as one or more materials among noble metal (such as palladium (Pd), palladium-Yin (Pd-Ag) alloy etc.) and nickel (Ni) and copper (Cu), but is not specially limited the present invention.
In order to form electric capacity, the first and second outer electrodes 131 and 132 can be formed on the outer surface of ceramic body 110, and are electrically connected with multiple the first and second internal electrodes 121 and 122.
The first and second outer electrodes 131 can be made up of the electric conducting material identical with the material of internal electrode with 132, but the invention is not restricted to this, and the first and second outer electrodes 131 and 132 can be by such as copper (Cu), silver (Ag), nickel (Ni) etc. are made.
By frit being added in metal dust and firing, thereby prepare conductive paste, use this conductive paste, can form the first and second outer electrodes 131 and 132.
According to one embodiment of present invention, multiple the first and second internal electrodes 121 and 122 can have different width.
As mentioned above, by forming the first and second internal electrodes 121 and 122, thereby these internal electrodes have different width, the step of marginal portion can be minimized, and do not form any internal electrode in marginal portion on the Width of ceramic body 110.
Therefore, implement to have the MLCC of fabulous reliability, can solve the imbalance between dielectric layer 111 and multiple the first and second internal electrodes 121 and 122.
According to one embodiment of present invention, three or more in multiple the first and second internal electrodes 121 and 122 form single block B, and these blocks of lamination repeatedly.When the highest internal electrode among multiple the first and second internal electrodes 121 and 122 and the longest distance between minimum internal electrode are T1, and beeline is therebetween while being T2, can meet 0.76≤T2/T1≤0.97.
Three or more in multiple the first and second internal electrodes 121 and 122 form single block B, but the invention is not restricted to this, and the first and second internal electrodes 121 and 122 of varying number can be defined as to single block B.
The quantity of block can be 5 or more, but the invention is not restricted to this, and according to the electric capacity of MLCC, can determine the quantity of block.
And, repeatedly lamination block B, and can form ceramic body 110 by lamination block B repeatedly.
Fig. 2 and Fig. 3 show single block and comprise the situation of three the first and second internal electrodes 121 and 122 altogether, and the single block that Fig. 4 and Fig. 5 show according to another embodiment of the invention comprises the situation of five the first and second internal electrodes 121 and 122 altogether.
With reference to Fig. 2 and Fig. 3, the first and second internal electrodes 121 and 122 that comprise in single block add up at 3 o'clock, lamination the first internal electrode, the second internal electrode and the first internal electrode in order, and in this case, the width of the second internal electrode can be greater than the width of the first internal electrode.
With reference to Fig. 4 and Fig. 5, the first and second internal electrodes 121 and 122 that comprise in single block add up at 5 o'clock, lamination the first internal electrode, the second internal electrode, the first internal electrode, the second internal electrode and the first internal electrode in order, and in this case, the first middle internal electrode can have maximum width, on the upper and lower of the first internal electrode of width maximum, the second electrode of lamination can have less width, and outmost the first internal electrode can have minimum width.
Due to by 3 to 5 or be morely defined as single block B altogether in the first and second internal electrodes 121 and 122, and the multiple such block B of lamination, to form ceramic body 110, so implement to have the MLCC of fabulous reliability, can solve the imbalance between dielectric layer 111 and multiple the first and second internal electrodes 121 and 122.
Do not limit especially the lamination amount of multiple the first and second internal electrodes 121 and 122.Such as, it can be 150 layers or more multi-layered.
In particular, due to three or more the single block B of formation in multiple the first and second internal electrodes 121 and 122, and repeatedly these blocks of lamination B, so when the highest internal electrode among multiple the first and second internal electrodes 121 and 122 and the longest distance between minimum internal electrode are T1 and beeline therebetween while being T2, can meet 0.76≤T2/T1≤0.97.
Conventionally, when lamination amount in MLCC increases, on the Width of ceramic body, electrode forming section and step increase as between the marginal portion of the non-formation part of electrode.
In the time of ceramic cutting body, this step can cause layering, and the reliability of MLCC is seriously reduced.
According to one embodiment of present invention, when the highest internal electrode among multiple the first and second internal electrodes 121 and 122 and the longest distance between minimum internal electrode are that T1 and beeline are therebetween while being T2, regulate T1 and T2, to meet 0.76≤T2/T1≤0.97, thereby at the Width of ceramic body, the step between the non-formation part of electrode forming section and electrode reduces.
Therefore, implement to have the MLCC of fabulous reliability, can improve the lamination defect problem producing in the time of ceramic cutting body.
With reference to Fig. 3, the highest internal electrode among multiple the first and second internal electrodes 121 and 122 and the longest distance T1 between minimum internal electrode can be defined as the longest distance on thickness direction between the outmost internal electrode among multiple first and second internal electrodes 121 and 122 of ceramic body 110 interior laminations.
Multiple the first and second internal electrodes 121 and 122 are bending on the thickness direction of ceramic body 110, and in this case, on the thickness direction of ceramic body 110, between the outmost internal electrode among multiple the first and second internal electrodes 121 and 122, there is longest distance and beeline.
According to one embodiment of present invention, T1 can be defined as the longest distance between the outmost internal electrode among multiple the first and second internal electrodes 121 and 122 that are laminated on thickness direction in ceramic body 110.
Meanwhile, because multiple the first and second internal electrodes 121 and 122 are bending on the thickness direction of ceramic body 110, so the highest and minimum internal electrode can have respectively highs and lows on the thickness direction of ceramic body 110.
According to one embodiment of present invention, in the highest and minimum internal electrode, the spacing between the minimum point on the thickness direction of ceramic body 110 can be defined as T2.
In the method for described manufacture multilayer ceramic capacitor (MLCC) according to another embodiment of the invention, will describe a kind of T2 and T1 of regulating in detail to meet the method for 0.76≤T2/T1≤0.97 hereinafter.In manufacture process, by forming these course of blocks laminated structures of multiple course of blocks laminated structures and lamination, can implement MLCC according to an embodiment of the invention.
These course of blocks laminated structures can form like this: by 3 in the first and second internal electrodes 121 and 122 or be morely defined as single block B, and in the multiple ceramic green sheets of lamination 3 or more, wherein on ceramic green sheet, be formed with in the same way the first and second internal electrode patterns of different in width.
Therefore, MLCC according to an embodiment of the invention can meet 0.76≤T2/T1≤0.97, and can prevent layering, improves reliability.
If the value of T2/T1 is less than 0.76, difference between the highest internal electrode among multiple the first and second internal electrodes 121 and 122 and longest distance T1 and beeline T2 between minimum internal electrode increases so, thereby cause layering etc., reliability is reduced.
If the value of T2/T1 exceedes 0.97, difference between the highest internal electrode among multiple the first and second internal electrodes 121 and 122 and longest distance T1 and beeline T2 between minimum internal electrode is very little so, thereby cause layering etc., reliability is reduced.
In particular, according to one embodiment of present invention, if the highest internal electrode among multiple the first and second internal electrodes 121 and 122 and the longest distance between minimum internal electrode are T1, and beeline is therebetween T2, in the time meeting 0.85≤T2/T1≤0.90, can further improve reliability so.
Fig. 6 is the flow chart that the process of a kind of manufacture MLCC is according to another embodiment of the invention shown.
With reference to Fig. 6, a kind of method of manufacture laminated ceramic electronic component according to another embodiment of the invention can comprise: utilize the slurry that comprises ceramic powders to prepare multiple ceramic green sheets; By comprising the conductive paste of metal dust, on multiple ceramic green sheets, form first and second internal electrode patterns with different in width; Three or more in the multiple ceramic green sheets of lamination, to form multiple course of blocks laminated structures; And lamination and fire multiple course of blocks laminated structures, to form the ceramic body that comprises multiple the first and second internal electrodes, wherein, in described ceramic body, when the highest internal electrode among multiple the first and second internal electrodes 121 and 122 and the longest distance between minimum internal electrode are T1, and when beeline is therebetween T2, meet 0.76≤T2/T1≤0.97.
To describe the method for manufacturing laminated ceramic electronic component according to another embodiment of the invention, and do not describe the feature of above-mentioned laminated ceramic electronic component according to an embodiment of the invention, and in particular, MLCC is described as an example.
Manufacturing in the method for MLCC according to an embodiment of the invention, first, can use the slurry that comprises ceramic powders to prepare multiple ceramic green sheets.
Do not limit especially ceramic powders, and ceramic powders is such as can be barium titanate (BaTiO 3).
Next, on multiple ceramic green sheets, can form respectively first and second internal electrode patterns with different in width by the conductive paste that comprises metal dust.
Metal dust can comprise one or more in the group of selecting free palladium (Pd), palladium-Yin (Pd-Ag) alloy, nickel (Ni) and copper (Cu) formation.
Then, in can the multiple ceramic green sheets of lamination three or more, to form multiple course of blocks laminated structures.
The first and second internal electrode patterns that form on multiple ceramic green sheets of the multiple course of blocks laminated structures of formation can have different width.
And the first and second internal electrode patterns can be arranged in has identical form in each block.
; in the time forming multiple course of blocks laminated structure by three raw cooks of lamination; lamination the first internal electrode, the second internal electrode and the first internal electrode in order; and in this case, the width of the second internal electrode can be greater than the width of the first internal electrode of going up lamination at an upper portion thereof and at a lower portion thereof.
Meanwhile, after forming multiple course of blocks laminated structures, can carry out the multiple course of blocks laminated structures of compression, but the invention is not restricted to this.
Compress respectively multiple course of blocks laminated structures, and lamination subsequently.Therefore,, in ceramic body, when the highest internal electrode among multiple the first and second internal electrodes 121 and 122 and the longest distance between minimum internal electrode are T1, and beeline is therebetween while being T2, can meet 0.76≤T2/T1≤0.97.
; compared with the situation of multiple first and second internal electrodes of lamination, compression and firing ceramics body fully; formed the ceramic green sheet of the first and second internal electrode patterns with different in width and be divided into three or more parts when going up; to form course of blocks laminated structure; and when it is compressed, can solve step problem.
Then, lamination and fire multiple course of blocks laminated structures, to form the ceramic body that comprises multiple the first and second internal electrodes.
Can form ceramic body by said process, and in this case, the lamination amount of multiple the first and second internal electrodes can be 150 layers or more multi-layered, but the invention is not restricted to this.
Hereinafter, will describe in more detail one embodiment of the present of invention, but the invention is not restricted to this.
Manufacture according to the MLCC of the present embodiment as follows.
First, will comprise such as barium titanate (BaTiO 3) etc. average grain diameter be that the slurry of the powder of 0.1 μ m puts in carrier film, and be dried, with prepare thickness range at 1.05 μ m the multiple ceramic green sheets to 0.95 μ m, thereby form dielectric layer.
Next, for the preparation of the conductive paste of internal electrode, it comprises nickel by powder, the mean particle size range of nickel by powder at 0.1 μ m to 0.2 μ m.
For the preparation of the conductive paste of internal electrode, so that except nickel by powder, also further comprise barium titanate (BaTiO 3).
By silk screen print method, on raw cook, apply for the conductive paste of internal electrode, to form the internal electrode with different in width, and three or more ceramic green sheets of lamination subsequently, to form multiple course of blocks laminated structures.
Then, the multiple course of blocks laminated structures of lamination, and in this article, the lamination amount of the first and second internal electrodes is 300, and total number of plies of the first and second internal electrodes of each course of blocks laminated structure is 10.
Then, compression and ceramic cutting body, to form 0603 cake core, and under the temperature range of 1050 to 1200 DEG C, at H 2reducing atmosphere be 0.1% or when following, fire this chip (chip).
Then, the process of execution formation outer electrode, plating process etc., to manufacture multilayer ceramic capacitor (MLCC).
According to general MLCC manufacture process, manufacture a comparative example.
The result of carrying out zonal testing on this embodiment and comparative example shows, the in the situation that of embodiments of the invention, 100 samples do not have lamination defect, and the in the situation that of comparative example, among 100 samples, have 38 samples to have lamination defect.
As mentioned above, according to embodiments of the invention, implement lamination defect still less and the laminated ceramic electronic component of reliability excellence, solved increasing of step in the marginal portion of laminated ceramic electronic component.
Owing to illustrating and having described the present invention in conjunction with the embodiments, so for a person skilled in the art, in the case of not deviating from the spirit and scope of the present invention that limited by claims, obviously can modify and change.

Claims (12)

1. a laminated ceramic electronic component, comprising:
Ceramic body, described ceramic body comprises multiple dielectric layers; And
Multiple the first and second internal electrodes, described multiple the first and second internal electrodes are arranged to face with each other and have different width in described ceramic body, described dielectric layer between described the first and second internal electrodes,
Wherein, three or more in described multiple the first and second internal electrodes form single block, described block is by lamination repeatedly, and when the highest internal electrode among described multiple the first and second internal electrodes and the longest distance between minimum internal electrode are beeline between T1 and the highest described internal electrode and described minimum internal electrode while being T2, meet 0.76≤T2/T1≤0.97.
2. laminated ceramic electronic component according to claim 1, wherein, the quantity of described block is 5 or more.
3. laminated ceramic electronic component according to claim 1, wherein, when the highest internal electrode among described multiple the first and second internal electrodes and the longest distance between minimum internal electrode are beeline between T1 and the highest described internal electrode and described minimum internal electrode while being T2, meet 0.85≤T2/T1≤0.90.
4. laminated ceramic electronic component according to claim 1, wherein, the lamination amount of described multiple the first and second internal electrodes is 150 layers or more multi-layered.
5. laminated ceramic electronic component according to claim 1, wherein, described internal electrode comprises the one or more of metals in the group of selecting free palladium (Pd), palladium-Yin (Pd-Ag) alloy, nickel (Ni) and copper (Cu) formation.
6. for the manufacture of a method for laminated ceramic electronic component, described method comprises:
The slurry that utilization comprises ceramic powders is prepared multiple ceramic green sheets;
On described multiple ceramic green sheets, utilize the conductive paste that comprises metal dust to form first and second internal electrode patterns with different in width;
Three or more described in lamination in multiple ceramic green sheets, to form multiple course of blocks laminated structures; And
Multiple course of blocks laminated structures and fire described multiple course of blocks laminated structure described in lamination, to form the ceramic body that comprises multiple the first and second internal electrodes,
Wherein, in described ceramic body, when the highest internal electrode among described multiple the first and second internal electrodes and the longest distance between minimum internal electrode are beeline between T1 and the highest described internal electrode and described minimum internal electrode while being T2, meet 0.76≤T2/T1≤0.97.
7. method according to claim 6, further comprises: after forming described multiple course of blocks laminated structures, compress described course of blocks laminated structure.
8. method according to claim 6, wherein, is arranged in described the first and second internal electrode patterns in each block, to have identical form.
9. method according to claim 6, wherein, the quantity of described course of blocks laminated structure is 5 or more.
10. method according to claim 6, wherein, when the highest described internal electrode among described multiple the first and second internal electrodes and the longest distance between described minimum internal electrode are beeline between T1 and the highest described internal electrode and described minimum internal electrode while being T2, meet 0.85≤T2/T1≤0.90.
11. methods according to claim 6, wherein, the lamination amount of described multiple the first and second internal electrodes is 150 layers or more multi-layered.
12. methods according to claim 6, wherein, described metal dust comprises and selects one or more of in the group that free palladium (Pd), palladium-Yin (Pd-Ag) alloy, nickel (Ni) and copper (Cu) forms.
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JP2015026841A (en) * 2013-10-25 2015-02-05 株式会社村田製作所 Multilayer ceramic capacitor
JP2015026837A (en) * 2013-10-30 2015-02-05 株式会社村田製作所 Manufacturing method of multilayer ceramic electronic component and multilayer ceramic electronic component
JP6522549B2 (en) * 2016-06-07 2019-05-29 太陽誘電株式会社 Multilayer ceramic capacitor
JP2018006627A (en) 2016-07-05 2018-01-11 太陽誘電株式会社 Multilayer ceramic capacitor
TWI665691B (en) * 2017-01-25 2019-07-11 禾伸堂企業股份有限公司 Multilayer ceramic capacitor and its manufacturing method
US10777359B2 (en) 2017-01-25 2020-09-15 Holy Stone Enterprise Co., Ltd. Multilayer ceramic capacitor
KR102070234B1 (en) * 2018-08-23 2020-01-28 삼성전기주식회사 Capacitor component

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214244A (en) * 1998-01-28 1999-08-06 Murata Mfg Co Ltd Monolithic ceramic capacitor
CN1781170A (en) * 2003-03-31 2006-05-31 Tdk株式会社 Production method for laminated ceramic electronic component
CN1870190A (en) * 2005-05-25 2006-11-29 Tdk株式会社 Laminated ceramic capacitor and manufacturing method therefor
JP2007173725A (en) * 2005-12-26 2007-07-05 Tdk Corp Laminated electronic component and manufacturing method thereof

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56140614A (en) * 1980-04-03 1981-11-04 Murata Manufacturing Co Capacitor and method of manufacturing same
JPH0373421U (en) * 1989-07-20 1991-07-24
JPH03207273A (en) * 1990-01-09 1991-09-10 Daikin Ind Ltd Controller for modulating pulse width of inverter
JP2784862B2 (en) * 1992-08-31 1998-08-06 太陽誘電株式会社 Multilayer capacitors
JP3470830B2 (en) * 1994-09-26 2003-11-25 株式会社村田製作所 Manufacturing method of multilayer capacitor
JPH08273973A (en) * 1995-03-29 1996-10-18 Murata Mfg Co Ltd Method for manufacturing laminated ceramic electronic component
JPH09129486A (en) 1995-10-30 1997-05-16 Murata Mfg Co Ltd Manufacture of laminated ceramic electronic part
JPH09260202A (en) 1996-03-26 1997-10-03 Taiyo Yuden Co Ltd Laminated capacitor
JPH11297566A (en) 1998-04-07 1999-10-29 Murata Mfg Co Ltd Multilayer ceramic electronic component
JP2000040634A (en) * 1998-07-24 2000-02-08 Matsushita Electric Ind Co Ltd Manufacture of laminated ceramic capacitor
JP2000124057A (en) * 1998-10-12 2000-04-28 Tdk Corp Multilayer ceramic capacitor
JP2001044059A (en) * 1999-07-29 2001-02-16 Kyocera Corp Multilayer ceramic capacitor
JP4577951B2 (en) 2000-06-29 2010-11-10 京セラ株式会社 Multilayer electronic components
JP3922436B2 (en) * 2002-03-08 2007-05-30 Ｔｄｋ株式会社 Multilayer ceramic electronic component, multilayer ceramic electronic component manufacturing method, and multilayer ceramic electronic component manufacturing apparatus
JP2004022859A (en) 2002-06-18 2004-01-22 Murata Mfg Co Ltd Laminated ceramic capacitor and its manufacturing method
JP4305808B2 (en) * 2002-07-03 2009-07-29 太陽誘電株式会社 Multilayer capacitor
JP2008091400A (en) * 2006-09-29 2008-04-17 Tdk Corp Laminated ceramic capacitor and its manufacturing method
JP2008103448A (en) 2006-10-18 2008-05-01 Matsushita Electric Ind Co Ltd Laminated electronic component and method for manufacturing the same
KR101843182B1 (en) * 2011-05-31 2018-03-28 삼성전기주식회사 Multilayer ceramic electronic component
KR20130106120A (en) * 2012-03-19 2013-09-27 삼성전기주식회사 Laminated ceramic electronic parts and fabrication method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214244A (en) * 1998-01-28 1999-08-06 Murata Mfg Co Ltd Monolithic ceramic capacitor
CN1781170A (en) * 2003-03-31 2006-05-31 Tdk株式会社 Production method for laminated ceramic electronic component
CN1870190A (en) * 2005-05-25 2006-11-29 Tdk株式会社 Laminated ceramic capacitor and manufacturing method therefor
JP2007173725A (en) * 2005-12-26 2007-07-05 Tdk Corp Laminated electronic component and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105374554A (en) * 2014-08-13 2016-03-02 株式会社村田制作所 Multilayer ceramic capacitor, multilayer ceramic capacitor mount series including the same and multilayer ceramic capacitor mount body including the same
CN105374554B (en) * 2014-08-13 2018-05-18 株式会社村田制作所 Laminated ceramic capacitor, the laminated ceramic capacitor string comprising it, its fixing body
CN109119246A (en) * 2017-06-22 2019-01-01 太阳诱电株式会社 Multilayer ceramic capacitor

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