JP2008103448A - Laminated electronic component and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve stability during the mounting of a circuit board in a method for manufacturing a laminated electronic component such as a ceramic capacitor. <P>SOLUTION: The laminated electronic component includes a main body 1, a plurality of internal electrodes 3 laminated in the vertical direction keeping predetermined intervals via an insulating layer 2 in the main body 1, and an external electrode 4 connected to the plurality of internal electrodes 3 and provided in the vertical direction of the external circumferential surface of the main body 1. An internal part in the vertical direction of the main body 1 is recessed to the internal side of upper and lower portions in the vertical direction of the main body 1 and an internal part in the vertical direction of the external electrode 4 provided in the vertical direction of the external surface of the main body 1 is formed thicker in its horizontal direction than the upper and lower portions. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a multilayer electronic component such as a ceramic capacitor and a manufacturing method thereof.

  A ceramic capacitor structure as an example of a conventional multilayer electronic component of this type is connected to a main body, a plurality of internal electrodes vertically stacked at a predetermined interval in the main body, and connected to the plurality of internal electrodes. It has a structure provided with external electrodes provided over the vertical direction of the outer surface of the main body.

In such a ceramic capacitor, in order to increase the electrostatic capacity, several hundreds of internal electrodes have been stacked (for example, Patent Document 1 below).
Japanese Patent Laid-Open No. 7-122457

  In the above conventional example, when several hundreds of internal electrodes and insulating layers are stacked, a large positional shift occurs in the upper and lower directions. Therefore, a plurality of stacked blocks in which a plurality of internal electrodes are stacked in the upper and lower directions via the insulating layers are formed. Then, a plurality of laminated blocks are laminated to form a main body, and then external electrodes connected to the internal electrodes are provided over the outer surface of the main body in the vertical direction.

  As a result, the positional deviation in the upper and lower directions is certainly eliminated, but the horizontal dimension is different at the upper and lower parts of the main body, and as a result, the stability when mounted on the circuit board is lost. There was a fear.

  That is, when this capacitor is mounted on the circuit board with the smaller dimension down, the sitting of the capacitor on the circuit board becomes worse, and as a result, the stability when mounted on the circuit board is as described above. There was a risk of disappearing.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to improve stability when a circuit board is mounted.

  And in order to achieve this object, the present invention is connected to the main body, a plurality of internal electrodes stacked in the vertical direction at a predetermined interval through the insulating layer in the main body, and connected to the plurality of internal electrodes, External electrodes provided over the vertical direction of the outer surface of the main body, and the middle part of the upper and lower sides of the main body has a shape that is recessed inward from the upper and lower parts of the main body. The upper and lower middle portions of the external electrodes provided on the outer surface in the vertical direction are thicker in the horizontal direction than the upper and lower portions.

  As described above, according to the present invention, the middle part in the upper and lower direction of the main body has a shape recessed inwardly from the upper and lower parts of the main body, and the external electrode provided over the outer surface of the main body. The middle part in the upper and lower directions is thicker in the horizontal direction than the upper and lower parts. The middle part in the upper and lower parts of the main body is more inward than the upper and lower parts of the main body. In other words, the upper part and the lower part project outward from the middle part, so that the body can be mounted on the circuit board in either direction. Stability increases and mounting reliability becomes high.

  As shown in FIGS. 1 to 4, the ceramic capacitor according to the present embodiment includes a main body 1, a plurality of internal electrodes 3 stacked in a vertical direction at a predetermined interval in the main body 1 with an insulating layer 2 interposed therebetween, And an external electrode 4 provided in the vertical direction of the outer surface of the main body 1.

  As shown in FIG. 3, the main body 1 has a rectangular shape which is placed horizontally, the short side 1a of the outer peripheral surface is as shown in FIG. 3, and the long side 1b of the outer surface is as shown in FIG. The middle part in the direction has a shape recessed inward from the upper and lower parts of the main body in the vertical direction.

  Furthermore, among the external electrodes 4 provided on the outer surface (provided over the outer surface and the upper and lower surfaces) of the main body 1, above and below the portions of the main body 1 provided on the short side 1a and the long side 1b. As is understood from FIGS. 3 and 4, the middle part in the direction is thicker in the horizontal direction than in the upper part and the lower part.

  That is, the middle part in the upper and lower direction of the outer peripheral surface of the main body 1 has a shape recessed inwardly from the upper and lower parts of the main body 1, that is, the upper and lower parts are outside the middle part. By adopting a shape that protrudes in the direction, the mounting stability on the circuit board is increased and the mounting reliability is high, regardless of whether the main body 1 is mounted on the circuit board in the upward or downward direction. is there.

  Further, the middle part in the upper and lower direction of the main body 1 has a shape that is recessed inwardly from the upper and lower parts of the main body, and the external electrodes provided over the vertical direction of the outer peripheral surface of the main body 1. The upper and lower middle portions of 4 can be made thicker in the horizontal direction than the upper and lower portions. As a result, the resistance value of the external electrode 4 can be reduced.

  FIG. 5 shows a method for manufacturing the ceramic capacitor.

  First, as shown in FIG. 5 (a), a plurality of internal electrodes 3 are laminated upward and downward via an insulating layer 2, and the laminated block 5 (in the case of a, five laminated bodies are horizontally arranged). A plurality of layers are prepared.

  Next, as shown in (b) and (c), the plurality of laminated blocks 5 are laminated to form five main bodies 1. In this case, the laminated block 5 placed on the upper side is inverted so that the upper sides in FIG. 5A are opposed to each other, and the upper side in FIG. Are stacked and pressed.

  That is, the lower side of the laminated block 5 in FIG. 5A is extended in the horizontal direction little by little as the plurality of internal electrodes 3 are laminated upward and downward via the insulating layer 2 and pressed. Therefore, as described above, the laminated block 5 placed on the upper side is inverted and laminated on the lower laminated block 5 so that the upper side in FIG. The middle part in the upper and lower direction of the outer peripheral surface has a shape that is recessed inwardly from the upper and lower parts of the main body 1, that is, the upper and lower parts project outward from the middle part. As a result, even when the main body 1 is mounted on the circuit board in either the upward or downward direction, the mounting stability on the circuit board is increased and the mounting reliability is high.

  Thereafter, cutting is performed at the cutting line 7 of (d) to form the individual body 1 as shown in (e), and then firing, and then the end of the internal electrode 3 is exposed on the outer peripheral surface of the body 1. In this state, the external electrode 4 connected to the internal electrode 3 is provided over the vertical direction of the outer surface of the main body 1, thereby obtaining the finished product shown in FIGS. 1 to 4.

  As described above, according to the present invention, the middle part in the upper and lower direction of the main body has a shape recessed inwardly from the upper and lower parts of the main body, and the outer electrode provided on the outer surface of the main body. The middle part in the upper and lower directions is thicker in the horizontal direction than the upper and lower parts, and the middle part in the upper and lower parts of the main body is more inward than the upper and lower parts of the main body. In other words, the upper part and the lower part protrude outward from the middle part, so that the body can be mounted on the circuit board in either direction. Stability increases, mounting reliability becomes high, and it becomes useful as a laminated electronic component.

The perspective view which shows one Embodiment of this invention The perspective view which shows one Embodiment of this invention Sectional drawing from the front side which shows one Embodiment of this invention Sectional drawing from the side showing the embodiment of the present invention Sectional drawing which shows the manufacturing method of one Embodiment of this invention

Explanation of symbols

1 Body 2 Insulating layer 3 Internal electrode 4 External electrode

Claims (2)

A main body, a plurality of internal electrodes stacked in a vertical direction at predetermined intervals through an insulating layer in the main body, and an external portion connected to the plurality of internal electrodes and provided in the vertical direction of the outer surface of the main body An upper portion of the main body, and a middle portion in the upper and lower direction of the main body has a shape recessed inward from the upper and lower portions of the main body, and the upper portion of the outer electrode provided on the outer surface of the main body. The lower middle part is a laminated electronic component that is thicker in the horizontal direction than the upper and lower parts. Prepare a plurality of laminated blocks in which a plurality of internal electrodes are laminated in an upward and downward direction via an insulating layer, and then form a main body by laminating the plurality of laminated blocks, and then extend in the vertical direction on the outer surface of the main body. In the method for manufacturing a laminated electronic component in which an external electrode connected to an internal electrode is provided, each laminated block is assumed to have a difference in horizontal dimension in the upper and lower directions, and the laminated block constituting the upper part of the main body Are stacked such that the upper side is the longer side in the horizontal direction, and the stacked block constituting the lower part of the main body is stacked so that the lower side is the longer side in the horizontal direction. A method of manufacturing a laminated electronic component.

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