CN103874549A - Device for cleaning an encapsulating device for electronic components - Google Patents
Device for cleaning an encapsulating device for electronic components Download PDFInfo
- Publication number
- CN103874549A CN103874549A CN201280043523.3A CN201280043523A CN103874549A CN 103874549 A CN103874549 A CN 103874549A CN 201280043523 A CN201280043523 A CN 201280043523A CN 103874549 A CN103874549 A CN 103874549A
- Authority
- CN
- China
- Prior art keywords
- brush
- contact
- outstanding
- cleaning assemblies
- outstanding contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 claims description 21
- 230000000712 assembly Effects 0.000 claims description 17
- 238000000429 assembly Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 10
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 description 16
- 239000000428 dust Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007786 electrostatic charging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B17/00—Accessories for brushes
- A46B17/02—Devices for holding brushes in use
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B5/00—Brush bodies; Handles integral with brushware
- A46B5/0004—Additional brush head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/54—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using mechanical tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B2200/00—Brushes characterized by their functions, uses or applications
- A46B2200/30—Brushes for cleaning or polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention relates to an assembly (2) for cleaning an encapsulating device (1) for electronic components which consists of a brush (13) with brush elements (14), a drive (16) for displacing the brush (13), a protruding contact element (10) and a suction device (12). The invention further also relates to an encapsulating device (1) for electronic components provided with such a cleaning assembly (2) and to a method for cleaning an encapsulating device (1) for electronic components.
Description
Technical field
The present invention relates to a kind of assembly for clean electronic package device, it has been equipped with the be shifted brush with brush unit, and relates to a kind of packaging system of being furnished with this cleaning assemblies.The invention still further relates to a kind of method of utilizing brush to clean the contact side of the mould portion of electronic package device.
Background technology
In the time manufacturing electronic component, more specifically, in the time manufacturing semiconductor, they completely or partially encapsulate with encapsulating material conventionally.Here encapsulating material is normally made up of heat-curable epoxy resin or the resin that comprises filler.In encapsulation process, can for example,, by being installed in semiconductor card on carrier (lead frame or wiring board) between mould portion, after blocking, just define die cavity to encapsulate at component ambient like this.Then liquid encapsulating material is introduced in these die cavitys, after it solidifies at least partly, mould portion is moved apart, and removes the carrier with the electronic component of encapsulation.In the new production cycle starts, remove residual encapsulating material particle in mould portion very important, because these particles may destroy the controlled encapsulation of electronic component.According to prior art, under the Light Condition of opening, clean mould portion with brush for this purpose.
Summary of the invention
The present invention provides a kind of improvement cleaning equipment and method of electronic package device for its object.
The present invention provides a kind of assembly for clean electronic package device for this purpose.Comprise: be provided with the brush of some brush unit, for make described brush with respect to the driver of described electronic package device displacement, be connected in the outstanding contact of described packaging system and be provided with the aspirator that is positioned near at least one pump orifice described outstanding contact, wherein said driver is suitable for moving described brush along described outstanding contact, by described outstanding contact, described outstanding brush unit is relative to each other shifted like this.In a specific embodiment modification, brush unit described here is formed by bristle.With the residue itself that brush unit cleans in mould portion be known.Utilize brush unit can remove loose (dust) particle, also can remove the retained material that adheres in mould portion.Because the present invention provides a kind of contact now, brush can move along it, thereby outstanding brush unit relative to each other moves, and the particle being therefore clipped between brush unit (bristle) can more easily be released.Brush unit can be launched partly in its relative motion process, thereby the space between brush unit increases partly.Particularly can be like this from brush release particles (dust) near contact.Exactly be provided with pump orifice in this position exactly now, (dust) particle of release can be sucked away by this pump orifice.(dust) particle is moved to/is discharged to known location by aspirator.Therefore can remove (dust) particle on brush, these particles are particularly made up of the residue of (solidifying) encapsulating material, but also may comprise for example, material from other sources (carrier).The clean meeting of brush improves the sweeping efficiency of follow-up clean operation; Cleaner brush can improve the cleaning action of brush, therefore makes the contact side of mould portion cleaner, and improves the quality level of the electronic component of encapsulation.
In order to limit wearing and tearing and to realize good cleaning action in the case of not damaging the contact side of mould portion, can be made of plastics bristle.And reaching minimum 200 DEG C by heat resisting temperature here, it is desirable that the material that preferably reaches 250 DEG C or 300 DEG C is made bristle.For example, a kind of suitable material is plastics PEEK.
In another embodiment variant, outstanding contact is elongated shape, and/or is provided with pump orifice at the opposite side of outstanding contact.This embodiment makes likely to make brush for example, along contact displacement (moving linearly) in simple mode.That both sides discharge (dust) particle and can be sucked away thus in the advantage of the couple positioned opposite pump orifice of outstanding contact, therefore prevented from the pollutant of brush undesirable lateral dispersion danger.Outstanding contact can also take various forms according to the mode that comprises multiple neighboring edges.Another kind of selection is that outstanding contact is provided with special-shaped contour edge, for example, be corrugated contour edge.Outstanding contact also can for example, be made up of the sheet material (sheet material of perforation) that is provided with opening, to therefore can improve the suction of releasable material.
In a specific embodiment modification, brush is elongated shape, so that it can only clean the relatively large surf zone of the contact side of mould portion thus by the motion of limited number of times.And, this elongate brush advantageously with respect to outstanding contact longitudinally removable, thereby contact can have limited size, and wherein pump orifice also can have limited length.Brush preferably mechanically or is automatically shifted, and driver can be made up of motor here.Alternately, also have likely brush laterally can be shifted with respect to outstanding contact.
In another embodiment variant, brush is provided with at least one air supply opening.In the process being shifted along contact at brush, from brush blow gas, can realize the clean of further improvement brush, and further can improve the control of the air-flow that makes (dust) particle discharge discharging.This further improves clean result.The another kind of formation of selecting is that (dust) particle of making to discharge from brush can not freely scatter but the mode that is directed to pump orifice arranges one or more air knives.Here particularly advantageously air knife partially or even wholly limits a space, and this space is connected to pump orifice, and brush can move along contact in this space.Therefore (or substantially fully) discharge by fully through pump orifice of the particle discharging.
Discharge from brush with controlled manner in order further to simplify (dust) particle, this assembly also can be provided with ionization device.Ionization device can increase to brush negative electrical charge and the positive charge of equivalent conventionally, thereby can repid discharge such as the insulator such as PVC, teflon.Can prevent or at least reduce brush by electrostatic charging controllably undesirably or not by ionization.
The present invention also provides a kind of packaging system of being furnished with cleaning assemblies as above, and wherein said packaging system is provided with: at least two mould portions, and it relative to each other can be shifted and be suitable for to engage the electronic component that will encapsulate; And encapsulating material conveying device, its be connected to limited by described mould portion and the die cavity of sealing electronic parts to encapsulate.Cleaning assemblies according to the present invention is integrated in this packaging system.In order to limit the cleaned necessary motion of brush, can make contact protrude from mode outside the contact surface of one of them mould portion and will give prominence to contact and be located in packaging system.Packaging system also can be provided with multiple outstanding contacts, to therefore shorten or otherwise simplify brush and need to advance to the path of contact.Here the elongated outstanding contact of an optional majority different orientation also.
In addition, the present invention also provides a kind of method for clean electronic package device, comprise following treatment step: A) clean the contact side of the mould portion of packaging system by brush relative shift, B) make the outstanding contact of brush contact and brush is moved with respect to outstanding contact, make like this brush unit of brush be touched that part touches and brush unit is relative to each other shifted, and C) at least carrying out treatment step B) time siphon away surrounding air, make like this to discharge air in the position of the brush unit of displacement each other.
By repeatedly carrying out this process, brush conventionally can be more clean well than be only transferred situation once along outstanding contact.Therefore can be chosen in treatment step B) process in carry off and on brush along outstanding contact.In order not extend the total cycle time of encapsulation process, when preferably during near the contact side to be cleaned of the mould portion of packaging system and/or the clean contact side from the mould portion of packaging system is being removed brush at brush, carry out treatment step B) and C).Therefore just brush cleaning can be incorporated in the production cycle of electronic package, the total cycle time that makes like this encapsulation operation not (or hardly) be subject to the impact of extra clean process.This can or at least ensure by cleaning brush outside critical path that cleaning brush does not extend and limit the critical path of production cycle length and realize.
Brief description of the drawings
Non-limiting exemplary embodiment based on shown in the following drawings is further illustrated to the present invention.Here:
Fig. 1 is according to the perspective view of a part for electronic package device of the present invention;
Fig. 2 is according to the top view of the alternate embodiment modification of a part for electronic package device of the present invention;
Fig. 3 is according to the perspective view of cleaning assemblies of the present invention in the cleaned process of brush;
Fig. 4 shows in the cleaned process of brush according to the cross section of the alternate embodiment modification of cleaning assemblies of the present invention; And
Fig. 5 is the perspective view of the outstanding contact with pump orifice that takes various forms.
Detailed description of the invention
Fig. 1 shows a part for the electronic package device 1 that is provided with cleaning assemblies 2.Shown in packaging system 1, part is provided with lower mold portion 3, and this lower mold portion is to be assembled by the permanent mould part 5 of commutative mould part 4 and this commutative mould part 4 of clamping.Also show a part for post 6, upper mold portion (not shown here) can be directed to lower mold portion 3 along these posts.Further illustrate in die cavity 7, running channel 8 and the recessed commutative mould part 4 of plunger housing 9.Liquid encapsulating material can be called again encapsulating material conveying device through running channel 8(together from plunger housing 9) be delivered to die cavity 7.At the upside (towards that side of upper mold portion) of lower permanent mould part 5, two outstanding contacts 10 protrude from the top of contact-making surface 11.Outstanding contact 10 is sucked mouthful 12 encirclements, and the dirt of release can be sucked away through pump orifice.
In Fig. 1, the rear side of lower mold portion 3 shows two brush units 13, and this unit has formed part packaging system 1 equally.Brush unit 13 is provided with two brushes 14 with bristle 15.Can pass through motor 16 drive spindles 17, thereby the brush 14 of (at the open position of packaging system 1) brush unit 13 can clean down die cavity 7, running channel 8 and/or plunger housing 9.Then in the time of the rear side of brush 15 retraction lower mold portion 3, brush 14 is at least one times through outstanding contact 10, thereby bristle 15 is moved apart by part, result at least some be clipped in particle between bristle 15 can be released with after be sucked away through pump orifice 12.Also can carry off and on brush 14 along outstanding contact 10 in addition, so that therefore cleaning brush 14 better.For example, but brush 14 just in time return after having cleaned mould portion 3 after, clean these brushes, although also can select one or more other clean orders.
Fig. 2 is the top view of lower mold portion 20, and the lower mold portion 3 shown in this lower mold portion and Fig. 1 is to be assembled by the permanent mould part 22 of commutative mould part 21 and this commutative mould part 21 of clamping similarly.Be also shown in equally post 23.Die cavity 7, running channel 8 and the plunger housing 9 of recessed commutative mould part 21 indicate the label identical with Fig. 1.Compare with the embodiment variant shown in Fig. 1, lower mold portion 20 is provided with two elongated outstanding contacts 24,25 now, and the two is all surrounded by the pump orifice 26,27 of different orientation.This provides more cleaning brush to select, thereby can optimize better clean result and therefore optimize required time.
Fig. 3 is the perspective view that has definitely the brush 30 of bristle 31 at brush along outstanding contact 32 in the situation being transferred according to the longitudinal direction of arrow P 1.Clearly show that bristle 31 is moved and separates in the position contacting with outstanding contact 32.Outlet 33 is positioned at the either side of outstanding contact 32, is sucked away together with the dirt of surrounding air and release through outlet 33.In brush 30, be also provided with channel system 34, shown in broken lines here, upside has opening 35, and gas can be blown in opening 35 along arrow P 2.Therefore the gas being blown into can be blown between bristle 31, to therefore further support the clean of brush 30.Can expect only further improving this blower system in the mode of the position blow gas of giving prominence to contact 32.Here schematically show, driver 36 is positioned at the upside of brush,, for brush 30 is shifted.From described here different, certainly also can make outstanding contact 32 be shifted with respect to brush 30, to obtain thus identical effect (this is the relative mutual displacement of brush 30 and outstanding contact 32 after all).
The cross section of a cleaning assemblies part shown in Fig. 4 shows the outstanding contact 41 of either side with pump orifice 42, and gas is sucked away through pump orifice 42 along arrow P 3.What be positioned in addition outstanding contact 41 either sides (distance than pump orifice 42 is large) is two blow guns 43, can utilize blow gun to produce air knife along arrow P 4 directions.Therefore prevented from scattering in undesirable direction owing to contacting with outstanding contact 41 dirt discharging.
Fig. 5 shows outstanding contact 50, and this contact takes various forms and limited by three parallel arrangements and the board 52,53,54 outstanding with respect to plane 51.Here surface 51 preferably with the contact surface of mould portion that will be clean in line, or be positioned at and the contact side of this mould portion that will clean similar At The Height at least more or less.Board 52,53, is provided with two suction seams 55,56 between 54, (dust) particle can sew and siphon away through suction.
Claims (17)
1. for an assembly for clean electronic package device, comprising:
-be provided with the brush of some brush unit,
-for making the driver of described brush with respect to described electronic package device displacement,
-be connected in the outstanding contact of described packaging system, and
-be provided with the aspirator that is positioned near at least one pump orifice described outstanding contact,
Wherein said driver is suitable for moving described brush along described outstanding contact, by described outstanding contact, described outstanding brush unit is relative to each other shifted like this.
2. cleaning assemblies as claimed in claim 1, is characterized in that described brush unit is bristle.
3. cleaning assemblies as claimed in claim 2, is characterized in that described bristle is to be made of plastics.
4. cleaning assemblies according to any one of the preceding claims, is characterized in that described outstanding contact is elongated shape.
5. cleaning assemblies according to any one of the preceding claims, is characterized in that described outstanding contact takes various forms.
6. according to the cleaning assemblies described in any one of the preceding claims, it is characterized in that described pump orifice is arranged on the opposite side of described outstanding contact.
7. cleaning assemblies according to any one of the preceding claims, it is characterized in that described brush is elongated shape and with respect to described outstanding contact longitudinally removable.
8. cleaning assemblies according to any one of the preceding claims, is characterized in that described driver comprises at least one motor.
9. cleaning assemblies according to any one of the preceding claims, is characterized in that described brush is provided with at least one air supply opening.
10. according to the cleaning assemblies described in any one of the preceding claims, it is characterized in that described assembly also can be provided with ionization device.
11. are furnished with the electronic package device of cleaning assemblies according to any one of the preceding claims, and wherein said packaging system is provided with:
-at least two mould portions, it relative to each other can be shifted and be suitable for to engage the electronic component that will encapsulate; And-encapsulating material conveying device, its be connected to limited by described mould portion and the die cavity of sealing electronic parts to encapsulate.
12. packaging systems as claimed in claim 11, is characterized in that described outstanding contact protrudes from outside the contact surface of mould portion described in one of them.
13. packaging systems as described in claim 11 or 12, is characterized in that described packaging system comprises multiple outstanding contacts.
14. 1 kinds of methods for clean electronic package device, comprise following treatment step:
A) clean the contact side of the mould portion of described packaging system by brush relative shift,
B) make the outstanding contact of described brush contact and described brush is moved with respect to described outstanding contact, making like this brush unit of described brush be touched by described contact and described brush unit is relative to each other shifted, and
C) at least carrying out treatment step B) time siphon away surrounding air, make like this to discharge air in the position of the described brush unit of displacement each other.
15. methods as claimed in claim 14, is characterized in that at treatment step B) process in carry off and on described brush along described outstanding contact.
16. methods as described in claims 14 or 15, is characterized in that carrying out during near the contact side to be cleaned of the mould portion of described packaging system at described brush described treatment step B) and C).
17. methods as described in claims 14 or 15, is characterized in that carrying out described treatment step B when the clean contact side of the mould portion from described packaging system is removed described brush) and C).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2007110 | 2011-07-14 | ||
| NL2007110A NL2007110C2 (en) | 2011-07-14 | 2011-07-14 | DEVICE FOR CLEANING AN ENCLOSURE DEVICE FOR ELECTRONIC COMPONENTS. |
| PCT/NL2012/050500 WO2013009180A1 (en) | 2011-07-14 | 2012-07-12 | Device for cleaning an encapsulating device for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103874549A true CN103874549A (en) | 2014-06-18 |
| CN103874549B CN103874549B (en) | 2015-11-25 |
Family
ID=46639653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280043523.3A Active CN103874549B (en) | 2011-07-14 | 2012-07-12 | For the equipment of clean electronic package device |
Country Status (7)
| Country | Link |
|---|---|
| KR (1) | KR102032866B1 (en) |
| CN (1) | CN103874549B (en) |
| MY (1) | MY166565A (en) |
| NL (1) | NL2007110C2 (en) |
| SG (1) | SG2014002612A (en) |
| TW (1) | TWI565534B (en) |
| WO (1) | WO2013009180A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107598103A (en) * | 2017-11-17 | 2018-01-19 | 洛阳华世耐磨材料制造有限公司 | A kind of assisted casting device of casting mould |
| CN108189288A (en) * | 2018-03-01 | 2018-06-22 | 日月光封装测试(上海)有限公司 | It sweeps template and sweeps mould equipment |
| TWI648106B (en) * | 2017-08-31 | 2019-01-21 | 鴻勁精密股份有限公司 | Conveying device with cleaning unit and test classification device thereof |
| CN111070528A (en) * | 2019-12-12 | 2020-04-28 | 永豪光电（中国）有限公司 | Die pressing and conveying mechanism for spherical lens |
| CN112845207A (en) * | 2020-12-23 | 2021-05-28 | 海南红塔卷烟有限责任公司 | Labeling machine for upper and lower surfaces of non-standard paper box |
| CN113276383A (en) * | 2021-07-21 | 2021-08-20 | 潍坊柯汇新材料科技有限公司 | Forming machine for producing degradable polyethylene plastic artware |
| CN114308832A (en) * | 2022-01-04 | 2022-04-12 | 中建科工集团有限公司 | Rust removal device |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9333540B2 (en) | 2012-08-30 | 2016-05-10 | Norilla Llc | Devices and methods for dispensing fluids and wiping surfaces |
| DE102013109858A1 (en) * | 2013-09-09 | 2015-03-12 | Dieffenbacher GmbH Maschinen- und Anlagenbau | Method and device for cleaning a tool in the course of the production of molded parts |
| USD739987S1 (en) | 2013-09-11 | 2015-09-29 | Norilla Llc | Surface cleaning device |
| US10052665B2 (en) | 2013-09-20 | 2018-08-21 | Norilla Llc | Devices and methods for dispensing fluids and wiping surfaces |
| CN115245928B (en) * | 2022-06-27 | 2023-06-09 | 浙江避泰电气科技有限公司 | Aluminum spraying dust removing device and process in resistor disc production |
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| JPS5825922Y2 (en) * | 1978-04-15 | 1983-06-04 | 松下電工株式会社 | hair curler curl pipe |
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2011
- 2011-07-14 NL NL2007110A patent/NL2007110C2/en active
-
2012
- 2012-07-12 SG SG2014002612A patent/SG2014002612A/en unknown
- 2012-07-12 CN CN201280043523.3A patent/CN103874549B/en active Active
- 2012-07-12 MY MYPI2014000091A patent/MY166565A/en unknown
- 2012-07-12 WO PCT/NL2012/050500 patent/WO2013009180A1/en active Application Filing
- 2012-07-12 KR KR1020147003102A patent/KR102032866B1/en active IP Right Grant
- 2012-07-13 TW TW101125255A patent/TWI565534B/en active
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| GB189405299A (en) * | 1894-03-14 | 1894-09-15 | William Rockliffe | Improvements in the Construction of Brushes for Preparing Metals for Electro-plating and for other like Cleansing Purposes. |
| JPS5825922B2 (en) * | 1975-08-18 | 1983-05-31 | ザ．バブコツク．アンド．ウイルコツクス．カンパニ− | Forced circulation fluid heating device |
| JPS5825922Y2 (en) * | 1978-04-15 | 1983-06-04 | 松下電工株式会社 | hair curler curl pipe |
| JPS5825922A (en) * | 1981-08-11 | 1983-02-16 | Toshiba Corp | Cleaning method of metal mold for sealing resin |
| JPS58191120A (en) * | 1982-04-30 | 1983-11-08 | Michio Osada | Cleaning method of face of mold for resin molding and brush member for cleaning |
| JPS6225456Y2 (en) * | 1982-06-10 | 1987-06-30 | ||
| CN1488448A (en) * | 2002-07-23 | 2004-04-14 | 美商戴尔贝斯空气动力公司 | Pressure washing machine |
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| TWI648106B (en) * | 2017-08-31 | 2019-01-21 | 鴻勁精密股份有限公司 | Conveying device with cleaning unit and test classification device thereof |
| CN107598103A (en) * | 2017-11-17 | 2018-01-19 | 洛阳华世耐磨材料制造有限公司 | A kind of assisted casting device of casting mould |
| CN108189288A (en) * | 2018-03-01 | 2018-06-22 | 日月光封装测试(上海)有限公司 | It sweeps template and sweeps mould equipment |
| CN108189288B (en) * | 2018-03-01 | 2024-04-16 | 日荣半导体(上海)有限公司 | Sweep template and sweep mould equipment |
| CN111070528A (en) * | 2019-12-12 | 2020-04-28 | 永豪光电（中国）有限公司 | Die pressing and conveying mechanism for spherical lens |
| CN112845207A (en) * | 2020-12-23 | 2021-05-28 | 海南红塔卷烟有限责任公司 | Labeling machine for upper and lower surfaces of non-standard paper box |
| CN113276383A (en) * | 2021-07-21 | 2021-08-20 | 潍坊柯汇新材料科技有限公司 | Forming machine for producing degradable polyethylene plastic artware |
| CN114308832A (en) * | 2022-01-04 | 2022-04-12 | 中建科工集团有限公司 | Rust removal device |
| CN114308832B (en) * | 2022-01-04 | 2023-03-28 | 中建科工集团有限公司 | Rust removal device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013009180A1 (en) | 2013-01-17 |
| CN103874549B (en) | 2015-11-25 |
| TW201313335A (en) | 2013-04-01 |
| MY166565A (en) | 2018-07-16 |
| KR102032866B1 (en) | 2019-11-08 |
| TWI565534B (en) | 2017-01-11 |
| SG2014002612A (en) | 2014-04-28 |
| KR20140059190A (en) | 2014-05-15 |
| NL2007110C2 (en) | 2013-01-15 |
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